CN110691467B

CN110691467B - Manufacturing method of magnetically-attached and hung Pin-type thin-plate horizontal guide plate

Info

Publication number: CN110691467B
Application number: CN201910880628.8A
Authority: CN
Inventors: 钟国华; 杨志; 王辉; 胡新星; 李伯鑫; 熊星宇; 漆海波
Original assignee: Victory Giant Technology Huizhou Co Ltd
Current assignee: Victory Giant Technology Huizhou Co Ltd
Priority date: 2019-09-18
Filing date: 2019-09-18
Publication date: 2020-10-27
Anticipated expiration: 2039-09-18
Also published as: CN110691467A

Abstract

The invention relates to a method for manufacturing a magnetically-attached Pin-type thin-plate horizontal guide plate. The method comprises the steps of cutting a depth control gong substrate, gong a groove and an outer layer circuit; pressing the guide plate substrate, drilling and boring, and forming the guide plate. According to the invention, the iron sheets are embedded in the guide plate substrate in a laminating mode, the magnet clamping grooves are processed above the positions of the iron sheets in a forming blind gong mode, meanwhile, the step vertical surface and the Pin feet are utilized to position the thin plate to be processed, the thin plate is placed between the magnet and the iron sheets, the thin plate is clamped by utilizing the attraction force between the magnet and the iron sheets, and the warping can be effectively prevented from occurring in the horizontal guide process of the thin plate. And can cyclic utilization, easy operation only need with sheet metal and magnet put its position that corresponds can, can realize not producing the effect that improves production efficiency under the prerequisite that the consumptive material is with low costs.

Description

Manufacturing method of magnetically-attached and hung Pin-type thin-plate horizontal guide plate

Technical Field

The invention relates to the technical field of circuit board manufacturing, in particular to a method for manufacturing a magnetically-attached Pin-type thin-plate horizontal guide plate.

Background

Along with the development of electronic products towards miniaturization and portability, the PCB serving as a carrier of the electronic products is correspondingly highly integrated and thinned, and the thinning and thinning of the high-level PCB mean that an inner core plate in the PCB processing process is thinner and thinner (less than or equal to 2 mils), so that poor processing adaptability is shown for traditional high-rise and multi-layer processing equipment, particularly horizontal lines, auxiliary processing is often required by an auxiliary jig, and the common auxiliary jig for horizontal processing of thin plates is mainly a guide plate: firstly, fixing an inner layer thin core plate by sticking an adhesive tape on a guide plate, and driving a thin plate to smoothly pass through the traditional horizontal equipment; secondly, U-shaped grooves with equal intervals are milled on one side of the guide plate through a forming processing method, the inner layer thin plate is clamped by the aid of the elastic deformation of the guide plate which is staggered up and down through the empty grooves, and the traction effect is achieved through traditional horizontal equipment.

However, the two designs are typical schemes for the current thin plate auxiliary processing, but each of the two schemes has advantages and disadvantages, namely firstly, the scheme needs to use an adhesive tape for fixing, wherein the adhesive tape is a consumable product and is easy to generate consumption cost, and the adhesive tape is easy to fall off when being washed by high-pressure water or ultrasonic water and is easy to bleed off the adhesive residual substrate when being dried at high temperature; the jig can be recycled, extra material consumption cost is not increased, operation difficulty is high, a large amount of time is needed for clamping the thin substrate into the U-shaped groove of the guide plate, and the lower plate moving efficiency after the horizontal line is moved is not high.

Disclosure of Invention

In view of the above, the present invention provides a method for manufacturing a magnetically-attracted Pin-type horizontal guiding plate to improve production efficiency without material cost.

The purpose of the invention is realized by the following technical scheme:

a manufacturing method of a magnetically-attached Pin-type horizontal guide plate for thin plates is characterized in that a thin plate positioning piece is arranged on the guide plate, an iron sheet is embedded in the guide plate, and a magnet clamping groove is formed above the embedded iron sheet, so that positioning and horizontal guide for thin plate processing are realized.

Further, the guide board is formed by laminating after first base plate, PP board and second base plate are placed in proper order from bottom to top.

Further, the specific manufacturing method of the guide plate comprises the following steps.

The method comprises the following steps: the manufacturing of the depth control gong substrate comprises cutting, gong groove and outer layer circuit. Wherein.

Cutting, namely selecting an overdue substrate without copper, cutting the overdue substrate into a preset size, using the overdue substrate as a first substrate, namely a depth control routing substrate, drilling after cutting, and processing a positioning hole for positioning in a later manufacturing process.

And (4) routing grooves, routing rectangular grooves on the selected part of depth control routing substrates according to the depth control of the positioning holes, and routing the depth control routing grooves according to fifty percent of stacked structure selection.

And the outer layer circuit is used for film pressing exposure according to a normal flow, positioning holes are selected for alignment during exposure, exposure data only need to design tool patterns such as target holes, rivet holes and the like for the inner layer, and patterns do not need to be designed in the board and can be etched.

Step two: and (3) manufacturing a guide plate substrate, namely after placing iron sheets in the depth control routing grooves on the depth control routing substrate completed in the step one, sequentially placing the PP plate and the second substrate on the first substrate, and then performing pressing treatment to obtain the guide plate substrate, wherein the iron sheets are embedded in the guide plate substrate, so that the guide plate substrate can be adsorbed by the magnets.

And selecting an iron sheet, wherein the size of the iron sheet needs to be matched with the size of the rectangular groove formed by routing the depth control, and placing the iron sheet in the rectangular groove.

And (2) pressing, namely placing the iron sheet in the rectangular groove, sequentially stacking a PP (polypropylene) plate and a second substrate on the surface of the depth control gong substrate on which the iron sheet is placed, wherein the length and width dimensions of the PP plate and the second substrate are the same as the preset dimension of the depth control gong substrate, the thicknesses of the PP plate and the second substrate can be different, and performing thermal fusion and rivet fixation pressing after stacking is completed to manufacture a guide plate substrate.

And (4) drilling the target, and normally drilling and milling the edge by using an X-Ray target drilling machine after the pressing is finished.

And drilling, namely transferring to drilling machining after target drilling is finished, and drilling a guide groove or a guide hole, wherein the guide groove or the guide hole plays a role in promoting liquid medicine exchange, so that the contact surface of the plate to be machined and the guide plate substrate is soaked in liquid medicine in the machining process.

Step three: forming a guide plate substrate, namely processing the guide plate substrate into a step-shaped guide plate, wherein a magnet clamping groove is formed above an iron sheet and is positioned on a second-stage step; and a Pin for positioning is arranged on the step at the bottommost layer. The forming processing of the guide plate substrate is divided into two parts, specifically comprising.

The processing of second step face regards the face of guide plate base plate as first step face, and at first the accuse is deeply milled out the second step face on the first step face of guide plate base plate, then the top that has inlayed the iron sheet that corresponds on the second step face mills out the magnet draw-in groove, and this magnet draw-in groove is used for placing magnet, therefore the shape of magnet draw-in groove need with magnet phase-match. The magnet used in the invention is a square magnet, so the magnet clamping groove is in a structure with four closed surfaces and two open surfaces. The number of the magnet clamping grooves can be set to be a plurality of at intervals according to actual requirements, and the magnet clamping grooves are preferably uniformly distributed at intervals.

The processing of third step face on the guide plate base plate with the third step face is milled in the place that the magnet draw-in groove is adjacent, the bottom parallel and level of third step face and magnet draw-in groove to mill the Pin foot on the third step face simultaneously, the size of Pin foot can be adjusted according to actual demand, but the one end that the third step face was kept away from to the Pin foot must not be higher than the face of guide plate base plate, first step face promptly. In addition, the number of the Pin feet corresponds to that of the magnet clamping grooves, and meanwhile, the Pin feet are respectively positioned on the same straight line with the corresponding magnet clamping grooves.

Compared with the prior art, the invention has the beneficial effects that:

according to the invention, the iron sheets are embedded in the guide plate substrate in a laminating mode, the magnet clamping grooves are processed above the positions of the iron sheets in a forming blind gong mode, meanwhile, the step vertical surface and the Pin feet are utilized to position the thin plate to be processed, the thin plate is placed on the third step surface and is positioned between the magnet and the iron sheets, the thin plate is clamped by utilizing the attraction force between the magnet and the iron sheets, and the warping can be effectively prevented from occurring in the horizontal guide process of the thin plate. In addition, the guide plate of the invention does not need to be fixed by an adhesive tape, can be recycled, is simple to operate, only needs to put the thin plate and the magnet at the corresponding positions, and can realize the effect of improving the production efficiency on the premise of not generating material consumption and low cost.

Drawings

Fig. 1 is a schematic view of the overall structure of a guide plate according to an embodiment of the present invention.

Fig. 2 is a schematic structural diagram of a guide plate substrate according to an embodiment of the invention.

Detailed Description

To facilitate understanding of those skilled in the art, the present invention will be described in further detail below with reference to specific embodiments and the accompanying drawings.

Referring to fig. 1-2, a preferred embodiment of the present invention is shown.

A manufacturing method of a magnetically-attached Pin-type horizontal guide plate for thin plates is characterized in that a thin plate positioning piece is arranged on a guide plate 1, an iron sheet 6 is embedded in the guide plate 1, and a magnet clamping groove 2 is formed above the embedded iron sheet 6, so that positioning and horizontal guiding of thin plate machining are achieved. The guide plate 1 is formed by sequentially placing a first base plate 11, a PP plate 12 and a second base plate 13 from bottom to top and then pressing the two base plates.

Specifically, the manufacturing method of the guide plate comprises the following steps:

the method comprises the following steps: the manufacturing of the depth control gong substrate 11 comprises cutting, gong groove and outer layer circuit. Wherein the content of the first and second substances,

cutting, selecting a overdue substrate with a thickness of 1.2mm and containing no copper, cutting into a predetermined size as a first substrate 11 and a depth control gong substrate 11, wherein the predetermined size in this embodiment is

The cutting size can be designed according to the processing size of the existing horizontal equipment, the thickness of the substrate is also designed according to the processing plate thickness capability of the existing horizontal equipment in a factory, the thickness of a pressing plate is larger than or equal to 1.8mm, after cutting is completed, drilling is carried out, and a positioning hole is processed, so that the positioning of a post-processing procedure can be used conveniently.

Routing grooves, routing rectangular grooves on the selected part of depth control routing substrates 11 according to the depth control of the positioning holes, and routing the depth control routing grooves according to fifty percent of stacking selection; in this embodiment, a rectangular groove is used for placing the iron piece 6, and the size of the rectangular groove is designed

Depth of groove

. Of course, the rectangular slot may also be circular, oval or other geometric shapes, which are required to cooperate with the subsequently selected iron piece 6 and magnet.

Step two: and (3) manufacturing a guide plate substrate 1, placing an iron sheet 6 in a depth control routing groove on the depth control routing substrate 11 completed in the step one, sequentially placing a PP plate 12 and a second substrate 13 on the depth control routing substrate 11, and then performing pressing treatment to obtain the guide plate substrate. The iron sheet 6 is embedded in the guide plate substrate, so that the guide plate substrate can be attracted by the magnet.

Selecting an iron sheet 6, wherein the size of the iron sheet 6 needs to be matched with the size of a rectangular groove formed by depth control routing, and placing the iron sheet 6 in the rectangular groove.

And (3) pressing, as shown in fig. 2, after the iron sheet 6 is placed in the rectangular groove, sequentially stacking a PP plate 12 and a second substrate 13 on the side, on which the iron sheet 6 is placed, of the depth control gong substrate 11, wherein the length and width dimensions of the PP plate 12 and the second substrate 13 are the same as the preset dimensions of the depth control gong substrate 11, the thicknesses of the PP plate 12 and the second substrate 13 can be different, and after the stacking is completed, performing thermal fusion and rivet fixation pressing, so as to manufacture a guide plate substrate.

And drilling, namely transferring to drilling machining after target drilling is finished, drilling a guide groove 4 or a guide hole 3, wherein the guide groove 4 or the guide hole 3 plays a role in promoting liquid medicine exchange, and the contact surface of the plate to be machined and the guide plate substrate 1 is soaked in liquid medicine in the machining process. The present embodiment adopts a form that the diversion trench 4 and the diversion hole 3 are mutually matched, wherein the size of the diversion trench 4 is

The diameter of the diversion hole 3 is 3mm, and the sizes of the diversion trench 4 and the diversion hole 3 can be adjusted according to actual requirements.

Step three: the forming processing of guide board base plate processes guide board base plate into echelonment guide board, and the forming processing of guide board base plate divides into two parts, specifically includes.

Processing a second step surface B, namely taking the surface of the guide plate substrate as a first step surface A, firstly milling a step with the depth of 0.4mm on the guide plate substrate to form the second step surface B, and then correspondingly milling the second step surface B on the second step surface BThe magnet clamping groove 2 is milled above the embedded iron sheet 6, and the magnet clamping groove 2 is used for placing a magnet, so that the shape of the magnet clamping groove 2 needs to be matched with that of the magnet. The magnet used in the invention is a square magnet, so the magnet slot 2 is in a structure with four closed surfaces and two open surfaces, and the size of the magnet slot is

And the depth is 0.8 mm. The number of the magnet slots 2 can be set to be a plurality of spaced apart according to actual requirements, and is preferably uniformly spaced apart. As another scheme of the present invention, the magnet may be a "U" magnet, and the magnet slot 2 that is engaged with the magnet may be a structure with five closed sides and one open side. It should be noted that the height of the selected magnet should be slightly higher than the depth of the magnet slot 2, but not higher than the plate surface of the guide plate substrate, i.e. the first step surface a. The reason for this is that the guide plate 1 of the present invention needs to enter into the horizontal guide machine, the first step surface a plays a role of positioning and guiding, if the thickness of the magnet is higher than the first step surface a, a phenomenon of jamming may be caused, and the guide plate 1 may be jammed in the machine, thereby failing to achieve horizontal guide of the thin plate. The magnet of this embodiment is selected to have a size of

。

Processing of third step face C, mill third step face C with the adjacent place of magnet draw-in groove 2 on the guide board base plate, the horizontal drop of third step face C and second step face B is 0.8mm, the width of second step face B is 70mm, third step face C and magnet draw-in groove 2's bottom parallel and level, and lie in on third step face C and mill Pin foot 5 on the position of magnet draw-in groove 2 just opposite face distance 10mm simultaneously, Pin foot 5 cooperates as the setting element with the perpendicular of second step face B jointly, the size of Pin foot 5 can be adjusted according to actual demand, but the one end that Pin foot 5 kept away from third step face C must not be higher than the face of guide board base plate, first step face A promptly. The reason for this is the same as the magnet thickness must not be higher than the first step face a, i.e. blocking of the guide plate 1 is prevented. The Pin foot 5 in this embodiment is a cylinder with a diameter of 3mm and a height of 1.2 mm. In addition, the number of Pin pins 5 corresponds to the number of card slots 2, and the Pin pins 5 are respectively positioned on the same straight line with the card slots 2 corresponding to the Pin pins.

The thin plate horizontal guide plate of the present invention is used in the manner shown in fig. 1.

1. A tool hole with the diameter of 3.0mm is designed in advance at the edge of the PCB to be processed, the tool hole corresponds to the Pin Pin 5, and the round distance of the hole is 11.5mm from the edge of the PCB, namely the round distance needs to be matched with the design size of a jig and the position of the Pin Pin 5.

2. The Pin foot 5 is advanced to the hole cover that presets the sheet metal, blocks into magnet in magnet draw-in groove 2, and it needs to notice that the magnet card of selection is gone into and need extend to third step face C behind the magnet draw-in groove 2, through the iron sheet 6 of the embedded in the magnet adsorption guide board, presss from both sides the sheet metal tightly, leads to treating to process the plate and breaks away from with the guide board because of the board angle warpage when preventing the level and walk the board.

3. After the processed plate goes through the horizontal line, the magnet in the magnet clamping groove 2 is taken out and then the plate is taken out, and then the plate can be recycled.

While the invention has been described in conjunction with the specific embodiments set forth above, it is evident that many alternatives, modifications, and variations will be apparent to those skilled in the art in light of the foregoing description. Accordingly, it is intended to embrace all such alternatives, modifications, and variations that fall within the spirit and scope of the appended claims.

Claims

1. A manufacturing method of a magnetically-attached Pin-type sheet horizontal guide plate is characterized in that positioning and horizontal guiding of sheet processing are realized by arranging a sheet positioning piece on the guide plate, embedding an iron sheet in the guide plate and arranging a magnet clamping groove above the embedded iron sheet; the guide plate is formed by sequentially placing a first base plate, a PP plate and a second base plate from bottom to top and then pressing; the manufacturing method of the guide plate comprises the following steps,

the method comprises the following steps: manufacturing a depth control gong substrate, and gong a depth control gong groove on the first substrate;

step two: manufacturing a guide plate substrate with embedded iron sheets, placing the iron sheets in depth control routing grooves on the depth control routing substrate completed in the step one, sequentially placing a PP plate and a second substrate on a first substrate, and performing pressing treatment to obtain the guide plate substrate;

step three: forming a guide plate substrate, namely processing the guide plate substrate into a three-stage step-shaped guide plate, wherein a magnet clamping groove is formed above an iron sheet and is positioned on a second-stage step; and a Pin for positioning is arranged on the step at the bottommost layer.

2. The method for manufacturing the magnetically-attached Pin-type thin plate horizontal guide plate as claimed in claim 1, wherein the first step specifically comprises,

step 1.1: cutting, namely selecting a first substrate, cutting the first substrate into a preset size and drilling a positioning hole;

step 1.2: routing a groove, namely routing a depth control routing groove on the first substrate according to the positioning hole;

step 1.3: and the outer layer circuit is manufactured by adopting a film pressing, exposing and etching mode.

3. The manufacturing method of the magnetically-attached Pin-type thin plate horizontal guide plate as claimed in claim 1, wherein the second step specifically comprises,

step 2.1: selecting an iron sheet matched with the depth control routing groove, and placing the iron sheet in the depth control routing groove;

step 2.2: pressing, namely sequentially stacking a PP plate and a second substrate on the surface, on which the iron sheet is placed, of the depth control gong substrate, and then performing thermal fusion and rivet fixation pressing to manufacture a guide plate substrate;

step 2.3: drilling a target, and drilling and routing edges after the pressing is finished;

step 2.4: and drilling to process guide grooves or guide holes.

4. The method for manufacturing the magnetically-attached Pin-type thin plate horizontal guide plate as claimed in claim 1, wherein the third step specifically comprises,

step 3.1: processing a second step surface, wherein the plate surface of the guide plate substrate is used as a first step surface, the second step surface is milled on the first step surface, and then a magnet clamping groove is milled above the corresponding iron sheet on the second step surface;

step 3.2: and (3) processing a third step surface, namely milling the third step surface on the guide plate substrate at the position adjacent to the magnet clamping groove, and simultaneously milling a Pin foot on the third step surface.

5. The method as claimed in claim 3, wherein the size of the PP plate and the second substrate in step 2.2 is the same as the predetermined size in step 1.1.

6. The method for manufacturing the magnetically-attached Pin-type thin-plate horizontal guide plate as claimed in claim 4, wherein the magnet slot in step 3.1 is of a structure with four closed sides and two open sides, and the bottom of the magnet slot is flush with the third step surface.

7. The method as claimed in claim 4, wherein the Pin pins in step 3.2 correspond to the slots of the magnets, and the Pin pins and the slots are aligned with each other.

8. The method for manufacturing the magnetically-attached Pin-type thin-plate horizontal guide plate as claimed in claim 6, wherein the end of the Pin foot away from the second step surface is not higher than the first step surface.