TWM498842U - Conductive heat radiating substrate and reflective type radiation heat dissipation luminous piece - Google Patents

Description

Thermally conductive radiation substrate and reflective radiation heat-dissipating light-emitting member

The present invention relates to a heat-radiating radiation substrate and a reflective radiation heat-dissipating light-emitting member, and more particularly to a substrate for mounting an illuminant and using far-infrared radiation as a heat-dissipating means, and a reflective radiation-dissipating illuminating member comprising the substrate.

In recent years, a large number of light-emitting diodes have been used, which have high photoelectric conversion efficiency, use of direct current, small volume, long life, fixed wavelength and low heat generation. With the advancement of photoelectric technology, the light-emitting diode has been greatly improved. The brightness and efficiency make the LEDs widely used in the field of lighting, and also in many types of lamps. In the application of the embedded/applied luminaire, due to the limitation of the thickness of the wall, the heat dissipation fins of the conventional heat dissipation technology are limited in space. Furthermore, the embedded/applied luminaires are embedded/attached to the wall, and the heat energy dissipated by the fins is not released by the wall covering, and cannot be effectively dissipated.

For example, the patent of the "New Structure of LED Light Heat Dissipation Module" of the Republic of China, No. M460223, refers to a DBC (Direct Bonded Copper) thermal conduction structure for LED lamps. The invention comprises an LED package body, a DBC structure layer and a heat dissipation module, wherein the DBC structure layer comprises a ceramic layer, a plurality of copper layers and a plurality of metal solder layers, wherein the copper layers are respectively coated on one side of the ceramic layer And the metal soldering layers are respectively disposed on the side of the copper layer facing away from the ceramic layer, and the metal soldering layer is respectively combined with the LED package body and the heat dissipation module, and the LED package body is used for illumination by the above structure At the time, the generated waste heat will be transmitted to the heat dissipation module through the DBC structural layer, and the waste heat is extremely low through the DBC structural layer, thereby achieving high durability and rapid practical progress of heat dissipation.

Although the conventional technology can effectively solve the heat dissipation problem of the LED lamp, when it is applied to the embedded/applied lamp, it is still affected by the thickness of the wall body, is limited when the heat dissipating module is disposed, and is discharged by the main body. The heat, which is surrounded by the wall, cannot be effectively dissipated, resulting in poor heat dissipation.

Therefore, in order to solve the problem that the conventional heat dissipation technology is limited in space by application, the present invention proposes a heat conductive radiation substrate and a reflective radiation heat dissipation light-emitting member.

The thermally conductive radiation substrate of the present invention comprises: a reflective layer defining a reflective surface; a far infrared radiation radiating layer disposed on the reflective surface; an insulating layer disposed on the reflective surface; and a circuit layer corresponding to The insulating layer is disposed on the insulating layer so that the circuit layer does not contact the reflective layer.

The material of the reflective layer is aluminum.

The far infrared radiation heat dissipation layer does not contact the insulation layer and the circuit layer.

The present invention further provides a reflective radiation heat-dissipating light-emitting member including the heat-radiating radiation substrate, further comprising: at least one light-emitting diode disposed on the reflective surface; thereby, the light source generated by the light-emitting diode Projecting in a projection direction, and projecting toward the reflective layer, and reflecting the light source toward the projection direction by the reflective layer; the working heat generated by the LED is conducted to the far infrared radiation heat dissipation layer via the reflective layer. And the far-infrared radiation heat-dissipating layer is radiated by the far-infrared rays, and is reflected by the reflective layer to dissipate heat toward the projection direction.

Further, a power supply unit is connected to the foregoing circuit layer.

The effect of the present heat conductive radiation substrate is:

1. It is used in conjunction with the installation of a plurality of illuminants, which is different from the conventional technology for heat dissipation by heat conduction and heat convection. The heat-conducting radiation substrate of the present invention radiates heat toward the aforementioned projection direction by heat radiation; Knowing that the heat sink fins need to occupy a large space, the thickness of the heat-conducting radiation substrate required in the depth is small, and can be applied to a space-limited place, and the heat of work heat is radiated toward the aforementioned projection direction, and is not caused by It is blocked by the wall body and cannot be effectively dissipated, resulting in poor heat dissipation.

2. The circuit layer is disposed on the insulating layer so that the circuit layer does not contact the reflective layer, and the short circuit phenomenon can be avoided by contacting the circuit layer with the reflective layer.

3. By the far infrared ray radiation heat dissipation layer not contacting the insulation layer and the circuit layer, the short circuit phenomenon can be avoided caused by the contact between the circuit layer and the far infrared radiation heat dissipation layer.

The effect of the reflective radiation cooling illuminator of the present invention is:

1. The reflective radiation-dissipating illuminating device of the present invention can effectively project the light source generated by the illuminating diode into the projection direction, and the working heat generated by the illuminating diode can also be radiated by far infrared ray. The heat is radiated toward the aforementioned projection direction; and the conventional technique has a small thickness required for the depth, and can be applied to a space-constrained place, particularly as an embedded/applied luminaire.

2. The reflective radiation heat-dissipating light-emitting component of the present invention further comprises a power supply unit connected to the circuit layer, so that the reflective radiation heat-dissipating light-emitting component of the present invention can be set at a desired position according to the user's needs; The working heat generated by the light-emitting diode is conducted to the far-infrared radiation heat-dissipating layer by the reflective layer, and is radiated by the far-infrared radiation heat-dissipating layer by the far-infrared radiation, and is reflected by the reflective layer toward the wall body The heat dissipation in the above-mentioned projection direction makes the reflective radiation-emitting illuminating device of the present invention have a good heat dissipation effect on the wall body, and avoids the phenomenon of high temperature light decay or shortened due to high temperature life.

In combination with the above technical features, the main effects of the present thermally conductive radiation substrate and the reflective radiation heat-dissipating light-emitting member will be clearly shown in the following embodiments.

Referring to the first to third figures, the thermally conductive substrate of the present invention comprises: a reflective layer (1), a far infrared radiation heat dissipation layer (2), an insulating layer (3) and a circuit layer (4). ),among them;

The reflective layer (1) is characterized by reflected light. In the present embodiment, the reflective layer (1) is made of aluminum and defines a reflective surface (11).

The far-infrared radiation heat dissipation layer (2) is coated on the reflective surface (11) and has light transmissivity, wherein the far-infrared radiation heat dissipation coating is manufactured by the following steps: Step A. Using an inorganic metal salt such as chlorine A solution of a salt, a sulfate or a nitrate or an alkoxy compound such as tetraethoxysilane is the first material. Step B. Mixing the above first material with water, an acidic solution such as ammonium hydroxide, hydrochloric acid, acetic acid or nitric acid, and adjusting the pH to less than 3, and then forming a gel by a sol-gel method. Alternatively, the first material is mixed with water, an alkaline solution such as sodium hydroxide, and the pH is adjusted to be between 8 and 10, and then gelled by a sol-gel method. Applying the obtained gel to the reflective surface (11), calcining the reflective layer (1), wherein the calcination temperature is between 500 and 900 ° C, so that the gel forms minute crystal grains, and after cooling, The far infrared radiation radiating coating is formed.

The insulating layer (3) is made of a non-conductive material and is disposed on the reflecting surface (11).

The circuit layer (4) is correspondingly disposed on the insulating layer (3) so that the circuit layer (4) does not contact the reflective layer (1), and the circuit layer (4) can be prevented from contacting the reflective layer (1). Short circuit phenomenon. The far-infrared radiation heat dissipation layer (2) also does not contact the insulation layer (3) and the circuit layer (4), so as to avoid short-circuiting between the circuit layer (4) and the far-infrared radiation heat dissipation layer (2). .

The heat-conducting radiation substrate of the present invention has a plate shape, and the required thickness in the depth is small, and can be applied to a space-constrained place; it can be equipped with different illuminants, and is radiated by heat radiation, so it is different from the habit Knowing technology uses heat conduction and heat convection to dissipate heat. The heat sink fins used need to occupy a large space and cannot be used in places where space is limited.

Please refer to the first figure, which is a reflective radiation heat-dissipating light-emitting member comprising the heat-radiating radiation substrate, further comprising at least one light-emitting diode (5), which is a light-emitting diode The polar body (5) is implemented, the light emitting diode (5) is disposed on the reflective surface (11); wherein the circuit layer (4) comprises a positive circuit (41) and a negative circuit (42), the light emitting The pole body (5) has a positive pin (51) and a negative pin (52), and the positive pin (51) is electrically connected to the positive electrode (41), and the negative pin (52) is electrically Connecting the foregoing negative electrode circuit (42), further comprising a power supply unit (6) connected to the positive electrode circuit (41) and the negative electrode circuit (42) for providing power required for the light emitting diode (5) to generate a light source, The power supply unit (6) is implemented by a lithium battery or a household electric appliance. The embodiment is implemented by a lithium battery, and a switch (61) is provided for controlling opening and closing.

Referring to the first and fourth figures, the light source generated by the light-emitting diode (5) is projected toward a projection direction (7), and is also projected toward the reflective layer (1), and is reflected by the reflective layer ( 1) reflecting the light source toward the projection direction (7); the working heat generated by the light-emitting diode (5) is conducted to the far-infrared radiation heat dissipation layer (2) via the reflective layer (1), and The far-infrared radiation heat dissipation layer (2) radiates with far-infrared rays and is radiated toward the projection direction (7) by the reflection layer (1).

Please refer to the fifth and sixth figures, which are the implementation state diagrams of the reflective radiation-dissipating illuminating device of the present invention disposed on the wall body (A), which can be reflected by the adhesive method or by screws. The radiant heat-dissipating illuminating member is fixed on the wall body (A). Since the present invention uses the heat radiation method to dissipate heat, it is different from the conventional technology in that heat dissipation and heat convection are used for heat dissipation, and the mounting is required for the heat-dissipating fins. Large space, but limited by the thickness of the wall (A) (in-wall type) or the installation of the luminaire too protruding out of the wall (A) (adhered). Furthermore, the light source generated by the light-emitting diode (5) can be projected through the reflective layer (1) toward the projection direction (7), thereby improving the illuminance of the light-emitting diode (5), and the light can be The working heat generated by the polar body is transmitted to the far-infrared radiation heat dissipation layer (2) via the reflective layer (1), and is radiated by the far-infrared radiation heat-dissipating layer (2) by far-infrared rays, and reflected by the reflective layer (1) Dissipating heat toward the aforementioned projection direction (7), solving the problem that the conventional technology dissipates heat by the heat dissipation fins, and the heat convection path is blocked by the wall body (A), so that the reflective radiation heat dissipation member of the present invention is fixed to the wall body (A) It also has a good heat dissipation effect, and avoids the phenomenon of high temperature light decay or shortened due to high temperature life.

Although the present invention has been disclosed in the above preferred embodiments, it is not intended to limit the present invention, and anyone skilled in the art can make some changes and refinements without departing from the spirit and scope of the present invention. The scope of protection is subject to the definition of the scope of the patent application.

(1) ‧‧‧reflective layer

(11) ‧‧‧reflecting surface

(2) ‧‧‧ far infrared radiation cooling layer

(3) ‧‧‧Insulation

(4) ‧‧‧ circuit layer

(41)‧‧‧ positive circuit

(42)‧‧‧negative circuit

(5) ‧‧‧Lighting diodes

(51)‧‧‧ positive pin

(52)‧‧‧native pin

(6) ‧‧‧Power supply unit

(61)‧‧‧ switch

(7) ‧‧‧projection direction

(A) ‧ ‧ wall

[Picture 1] is a perspective view of a reflective radiation-emitting heat-emitting device.

[Second image] is a cross-sectional view of the A-A of the reflective radiation-emitting illuminating device.

[Third image] is a B-B cross-sectional view of the reflective radiation-emitting illuminating device.

[Fourth] is a schematic diagram of the heat dissipation of the reflective radiation-emitting heat-emitting component.

[Fifth image] is a perspective view of an implementation state of the present reflective radiation heat-dissipating light-emitting device.

[Sixth] is a cross-sectional view showing an implementation state of the reflective radiation heat-dissipating light-emitting device.

(1) ‧‧‧reflective layer

(11) ‧‧‧reflecting surface

(2) ‧‧‧ far infrared radiation cooling layer

(3) ‧‧‧Insulation

(4) ‧‧‧ circuit layer

(41)‧‧‧ positive circuit

(42)‧‧‧negative circuit

(5) ‧‧‧Lighting diodes

(51)‧‧‧ positive pin

(52)‧‧‧native pin

(6) ‧‧‧Power supply unit

(61)‧‧‧ switch

(7) ‧‧‧projection direction

Claims (5)

A thermally conductive radiation substrate comprising: a reflective layer defining a reflective surface; a far infrared radiation radiating layer disposed on the reflective surface; an insulating layer disposed on the reflective surface; a circuit layer correspondingly disposed on The insulating layer is such that the circuit layer does not contact the reflective layer. The thermally conductive radiation substrate of claim 1, wherein the reflective layer is made of aluminum. The thermally conductive radiation substrate of claim 1, wherein the far infrared radiation heat dissipation layer does not contact the insulation layer and the circuit layer. A reflective radiation heat-dissipating light-emitting device comprising the heat-radiating radiation substrate according to any one of claims 1 to 3, further comprising: at least one light-emitting diode disposed on the reflective surface; The light source generated by the light emitting diode is projected toward a projection direction, and is also projected toward the reflective layer, and the light source is reflected by the reflective layer toward the projection direction; the working heat generated by the light emitting diode passes through the reflection The layer is conducted to the far-infrared radiation heat dissipation layer, and is radiated by the far-infrared radiation heat-dissipating layer by far-infrared rays, and is reflected by the reflective layer to dissipate heat toward the projection direction. The reflective radiation heat-dissipating light-emitting member according to claim 4, further comprising a power supply unit connected to the circuit layer.