WO2019114194A1

WO2019114194A1 - Led spotlight

Info

Publication number: WO2019114194A1
Application number: PCT/CN2018/087615
Authority: WO
Inventors: 何苗; 王成民; 熊德平; 赵韦人
Original assignee: 广东工业大学
Priority date: 2017-12-14
Filing date: 2018-05-21
Publication date: 2019-06-20
Also published as: CN107906424A

Abstract

Provided is an LED spotlight, comprising a heat dissipation component with through holes, a connection plate and a light-emitting module, wherein the heat dissipation component is laid on a surface of the connection plate, and the other surface of the connection plate is connected to the light-emitting module so as to conduct heat generated by the light-emitting module to the heat dissipation component; and an outer side face of the heat dissipation component is of a zigzag shape. The heat generated by the light-emitting module in the LED spotlight can be firstly conducted to the heat dissipation component via the connection plate, and then the transmitted heat can be dissipated by means of the heat dissipation component. Furthermore, the heat dissipation component is laid on a surface of the connection plate, the heat dissipation component is provided with through holes, and the outer side face of the heat dissipation component is of a zigzag shape, so as to facilitate ventilation, thus a heat dissipation area between the light-emitting module and the air is increased, and compared to the traditional method of directly vertically mounting a plurality of heat dissipation fins to a light-emitting module in an LED spotlight, the heat dissipation effect is better, and the heat dissipation efficiency is improved.

Description

LED spotlight

The present application claims priority to Chinese Patent Application No. 2011-11340505.2, the entire disclosure of which is incorporated herein in

Technical field

The present invention relates to the field of semiconductor light-emitting technologies, and in particular, to an LED spotlight.

Background technique

Light-emitting diode LED, as a new solid-state lighting source in the 21st century, has a large market share due to its high photoelectric conversion efficiency, environmental protection and pollution-free, high reliability, fast response time, high radiation efficiency and long life. Semiconductor lighting technology Achieve rapid development of the third generation of lighting. Spotlights are widely used in large-scale performances, sports events, exhibitions, and indoor and outdoor business activities. At the same time, because of its narrow illumination, high light intensity, and easy concentration in a specific area, it is still the most used light for photography. Traditional incandescent lamps and halogen lamps have been replaced by LED spotlights because of their high energy consumption, heat generation and short life.

The main function of the LED spotlight is to achieve the convergence of the lights and to ensure sufficient brightness, which requires the spotlight drive power to have enough power. The LED light source is a cold light source and the operating temperature cannot be too high. Therefore, the heat dissipation design is an indispensable part of the LED light source. Even the current LED flip chip can enhance heat dissipation and improve light efficiency. However, the heat dissipation effect of the LED spotlight is still not good. Because of the irrationality of the heat dissipation structure and the singleness of the composite material, the heat accumulation causes the light decay speed of the spotlight to increase during operation, so a composite material with high thermal conductivity is selected. It is particularly important to explore a reasonable heat dissipation structure. The existing heat dissipation scheme includes a fan, a heat sink, a heat pipe, etc. Taking a heat sink as an example, the conventional method is to vertically mount a plurality of heat sinks in an LED spotlight. The illuminating module adopts these methods to have low heat dissipation efficiency, and may cause the stability of the luminaire to be lowered, and the complexity is increased to affect the light effect.

It can be seen that how to overcome the problem that the conventional LED spotlight is continuously increased due to low heat dissipation efficiency during the working process is an urgent problem to be solved by those skilled in the art.

Summary of the invention

The embodiment of the present invention provides an LED spotlight to solve the problem that the conventional LED spotlight in the prior art has an increasing light decay speed due to low heat dissipation efficiency during operation.

In order to solve the above technical problem, the present invention provides an LED spotlight, comprising:

a heat dissipating member having a through hole, a connecting plate, and a light emitting module;

The heat dissipating member is laid on a surface of the connecting plate, and another surface of the connecting plate is connected to the light emitting module to conduct heat generated by the light emitting module to the heat dissipating member;

Wherein, the outer side surface of the heat dissipating component has a zigzag shape.

Preferably, the width of the root to the top of each of the teeth on the outer side of the heat dissipating member is gradually reduced.

Preferably, the light emitting module comprises:

a plurality of LED flip chip, a composite substrate and a first thermal adhesive layer, the composite substrate being located between the first thermal conductive adhesive layer and each of the LED flip chip, the first thermal conductive layer being attached to the Connection plate.

Preferably, the composite substrate comprises:

An AIN ceramic layer, a pyrolytic graphite layer and a metal copper layer, the pyrolytic graphite layer being located between the AIN ceramic layer and the metal copper layer, the AIN ceramic layer being attached to each of the LED flip chip.

Preferably, the method further comprises:

a second thermal adhesive layer between each of the LED flip chip and the composite substrate.

Preferably, the method further comprises:

a light blocking member having a plurality of light through holes respectively connected to the light emitting module and the light emitting module of the LED spotlight, wherein the light blocking member is configured to collect light emitted by each of the LED flip chips. The light through holes correspond to the LED flip chips so that light emitted by each of the LED flip chips is transmitted to the light exit module through the light through holes.

Preferably, the light exiting module comprises:

The light-emitting mirror, the light cover and the lens are disposed at the light entrance of the light cover, and the light-emitting mirror is disposed at the light exit of the light cover.

Preferably, the method further comprises:

a high temperature resistant adhesive layer, wherein the light blocking member is connected to the light exiting module through the high temperature resistant adhesive layer.

Preferably, the method further comprises:

a metallic silver layer and/or a two-dimensional photonic crystal layer applied to the inner sidewall of the globe.

Preferably, the lens is in particular a plano-convex lens.

Compared with the prior art, the present invention provides an LED spotlight comprising a heat dissipating component having a through hole, a connecting plate and a light emitting module; the heat dissipating component is laid on the surface of the connecting plate, and the other surface of the connecting plate and the light emitting module The connection is to conduct heat generated by the light emitting module to the heat dissipating component; wherein the outer side surface of the heat dissipating component is in a zigzag shape. The heat generated by the light-emitting module in the LED spotlight can be first transmitted to the heat-dissipating component through the connecting plate, and then the heat transferred from the connecting plate is dissipated by the heat-dissipating component, so that the light intensity of the LED spotlight finally is higher, and the LED spotlight is in the spotlight. The heat dissipating component has a through hole, the outer side of the heat dissipating component is in a zigzag shape, and the heat dissipating component is laid on the surface of the connecting plate to facilitate air circulation, and the heat dissipating area between the light emitting module and the air can be increased directly compared with the conventional one. Compared with the light-emitting module in which the heat sink is vertically mounted in the LED spotlight, the heat dissipation effect is better, thereby improving the heat dissipation efficiency and reducing the light decay speed of the LED spotlight.

DRAWINGS

1 is a schematic structural view of an LED spotlight according to an embodiment of the present invention;

2 is a schematic structural view of a composite substrate in an LED spotlight according to an embodiment of the present invention;

3 is a top plan view of a heat dissipating component in an LED spotlight according to an embodiment of the present invention;

FIG. 4 is a schematic diagram of an overall structure of an LED spotlight according to an embodiment of the present invention.

Detailed ways

The technical solutions in the embodiments of the present application are clearly and completely described in the following with reference to the drawings in the embodiments of the present application. It is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative efforts are within the scope of the present invention.

The core of the invention is to provide an LED spotlight, which can solve the problem that the light decay speed of the conventional LED spotlight is increased due to low heat dissipation efficiency during the working process.

The present invention will be further described in detail below in conjunction with the drawings and specific embodiments in order to provide a better understanding of the invention.

FIG. 1 is a schematic structural diagram of an LED spotlight according to an embodiment of the present invention. As shown in FIG. 1 , the method includes: a heat dissipating component 101 having a through hole, a connecting plate 102 and a light emitting module 103; and the heat dissipating component 101 is laid on the connecting board 102. The surface of the connecting plate 102 is connected to the light emitting module 103 to conduct heat generated by the light emitting module 103 to the heat dissipating member 101; wherein the outer side surface of the heat dissipating member 101 is in a zigzag shape.

In the LED spotlight provided by the present example, the heat dissipating component 101 is laid on the surface of the connecting board 102, and the other surface of the connecting board 102 is connected to the light emitting module 103, so that the heat generated when the light emitting module 103 operates can be directly transmitted to the connecting board 102. The heat dissipating member 101 has a through hole on the heat dissipating member 101, and the outer side surface of the heat dissipating member 101 has a zigzag shape. The special structure of the heat dissipating member itself can improve the heat dissipating efficiency. In FIG. 1, the through hole is covered by the connecting plate 102, so the through hole As shown in FIG. 1, the through hole is disposed on the heat dissipating component 101, in addition to dissipating the heat generated by the light emitting module 103, the driving power source in the LED lamp can be placed in the through hole, and the LED spotlight is reduced. The volume of the through hole may be set at the center of the heat dissipating member 101 or may be slightly offset from the center position. The number of the through holes may be one or more, depending on the actual situation, and there is no hard requirement. . As a preferred embodiment, the width of the root to the top of each of the teeth on the outer surface of the heat dissipating member 101 is gradually reduced, that is, the root width of each of the outer surfaces of the heat dissipating member 11 is larger than the width of the crest, and the tooth is disposed in this manner. The structure has better heat dissipation.

An LED spotlight provided by the invention comprises a heat dissipating component having a through hole, a connecting plate and a light emitting module; the heat dissipating component is laid on the surface of the connecting board, and the other surface of the connecting board is connected with the light emitting module to generate the light emitting module The heat is conducted to the heat dissipating member; wherein the outer side surface of the heat dissipating member is in a zigzag shape. The heat generated by the light-emitting module in the LED spotlight can be first transmitted to the heat-dissipating component through the connecting plate, and then the heat transferred from the connecting plate is dissipated by the heat-dissipating component, so that the light intensity of the LED spotlight finally is higher, and the LED spotlight is in the spotlight. The heat dissipating component has a through hole, and the outer side surface of the heat dissipating component is in a zigzag shape, and the heat dissipating component is laid on the surface of the connecting plate, so that the air circulation can increase the heat dissipating area between the light emitting module and the air, and the conventional direct multiple Compared with the light-emitting module in which the heat sink is vertically mounted in the LED spotlight, the heat dissipation effect is better, thereby improving the heat dissipation efficiency and reducing the light decay speed of the LED spotlight.

On the basis of the above embodiments, as a preferred implementation, the light emitting module 103 includes:

The plurality of LED flip chip, the composite substrate and the first thermal conductive adhesive layer are disposed between the first thermal conductive adhesive layer and each of the LED flip chip, and the first thermal conductive layer is attached to the connecting plate 102.

The light emitting module mainly comprises a plurality of LED flip chip, a composite substrate and a first thermal conductive adhesive layer, wherein each of the LED flip chip is evenly disposed on a surface of the composite substrate, preferably, the plurality of LED flip chips are flip-chip soldered The composite substrate is connected. One surface of the first thermal conductive adhesive layer is attached to the other surface of the composite substrate, and the other surface of the first thermal conductive adhesive layer is in close contact with the connecting plate 102. The heat generated by the LED flip chip passes through the first thermal conductive adhesive layer. The first thermal conductive adhesive layer is transferred to the connecting plate 102, and the first thermal conductive adhesive layer has high heat conduction efficiency. In the embodiment of the present application, the LED flip chip is used, the light effect is stronger, and the high power is easy to be realized. Compared with the conventional LED formal chip, the LED flip chip does not need to be wired, and the LED flip chip replaces the formal ITO with silver. As the P electrode, the current diffusion is obviously improved. The traditional LED packaged chip is cooled by sapphire, and the LED flip chip sapphire is on the top, avoiding the shortcomings of sapphire heat dissipation.

FIG. 2 is a schematic structural diagram of a composite substrate in an LED spotlight according to an embodiment of the present invention. As shown in FIG. 2, on the basis of the foregoing embodiment, as a preferred embodiment, the composite substrate includes:

The AIN ceramic layer 21, the pyrolytic graphite layer 22 and the metallic copper layer 23, the pyrolytic graphite layer 22 is located between the AIN ceramic layer 21 and the metallic copper layer 23, and the AIN ceramic layer 21 is bonded to each of the LED flip chip 6.

Compared with the conventional composite substrate, the composite substrate used in the embodiment of the present application adds a layer of pyrolytic graphite layer 22 between the original AIN ceramic layer 21 and the metal copper layer 23, and in practical applications, through various The soldering method bonds the pyrolytic graphite layer 22 to the AIN ceramic layer 21 and the metal copper layer 23, and the structure of the composite substrate can improve heat dissipation efficiency.

As shown in FIG. 2, a second thermal conductive adhesive layer 24 is preferably further disposed on the lower surface of each of the LED flip chip 6, and a metal copper layer 25 is further disposed on the upper surface of the AIN ceramic layer 21 to realize the LED flip chip 6 The wireless package is a direct copper plating method, which is formed by eutectic sintering of a ceramic substrate and a copper foil at a high temperature (about 1065 ° C), and is mainly achieved by a chemical bonding reaction between the Cu-O eutectic liquid phase and the aluminum oxide. The thickness of the metal copper layer 25 on the upper surface of the AIN ceramic layer 21 is generally about 200 μm, so that high current conduction can be ensured.

The fabrication of the pyrolytic graphite layer 22 is mainly divided into two processes. First, graphite is deposited on the substrate by pyrolysis of hydrocarbons, and the local structure of the deposited thin layer of pyrolytic graphite is chaotic, and needs to be annealed above 3000 degrees Celsius. In order to form a fully dense, highly ordered pyrolytic graphite.

It can be understood that the first thermal conductive adhesive layer and the second thermal conductive adhesive layer 24 are named according to the habit and preference, and have no other special meaning. Of course, the naming manner of the thermal conductive adhesive layer does not affect the implementation of the embodiment of the present application. .

Based on the foregoing embodiment, as a preferred implementation, the method further includes:

a light blocking member having a plurality of light through holes respectively connected to the light emitting module 103 and the light emitting module of the LED spotlight, wherein the light blocking member is used to concentrate the light emitted by each LED flip chip 6, and the light through hole and each LED are inverted. The chip 6 is mounted so that the light emitted from each LED flip chip 6 is transmitted to the light exit module through the optical via.

In the embodiment of the present application, the light blocking member is generally a round table or a conical structure, and the light blocking member may be made of a light opaque material such as a plastic having strong plasticity, and the optical through hole is opened according to the distribution of the LED flip chip 6 to ensure close proximity to the LED. The diameter of the optical via hole of the flip chip 6 is small, and the diameter of the optical via hole away from the LED flip chip 6 (close to the light output module) is large, and the angle is controlled between 15 degrees and 20 degrees. Moreover, the LED spotlight provided in this embodiment is further coated with a metallic silver layer or a two-dimensional photonic crystal layer inside the optical through hole, and the light emitted by each LED flip chip 6 can be concentrated, that is, can be concentrated.

On the basis of the foregoing embodiments, as a preferred implementation, the light-emitting module includes:

The light-emitting mirror, the lamp cover and the lens are disposed at the light entrance of the lamp cover, and the light-emitting mirror is disposed at the light exit of the lamp cover.

The lens is disposed at the light entrance of the lamp cover, and the lens is preferably a planar convex lens, which can converge the light emitted by the light emitting module 103, and can reduce the reflection of the light, and the light exiting mirror is disposed at the light exit of the light cover, and the light emitting mirror is disposed The high transmittance of the LED spotlight can increase the intensity of the light source finally emitted by the LED spotlight. The surface of the lens and the light-emitting module 103 is a frosted surface, which can reduce the reflection of light. As a preferred embodiment, the method further includes: a high temperature resistant and strong adhesive layer. The optical component is connected to the light exit module through a high temperature resistant adhesive layer. The high-temperature and high-temperature adhesive is used to cure the light-blocking component and the light-emitting module together, which can increase the connection stability of the light-blocking component and the light-emitting module, in addition to curing the light-blocking component and the light-emitting module with high-temperature resistant super glue. The light blocking member and the light exiting module may be disposed in a mold. The specific arrangement may be determined according to actual conditions, and the present invention is not limited. Preferably, the LED spotlight further includes: a metal silver layer applied to the inner side wall of the lamp cover and The two-dimensional photonic crystal layer, that is, the inner side wall of the lampshade has a highly reflective layer, which is the same material as the high-reflection layer of the inner side wall of the light-passing hole, and can achieve double convergence of the light.

In order to better understand the present solution, the following is a detailed description of the various structures of the LED spotlight. FIG. 3 is a top view of a heat dissipating component in an LED spotlight according to an embodiment of the present invention, and FIG. 4 is a view of the present invention. The overall structure of an LED spotlight provided by the embodiment is the best embodiment of the LED spotlight provided by the embodiment of FIG. 4, as shown in FIG. 4, including the light-emitting mirror 1, the lamp cover 2, the lens 3, and the optical through-hole. 5. The light blocking member 4, the LED flip chip 6, the fixing member 7, the composite substrate 8, the first heat conducting layer 9, the connecting plate 102, the heat radiating member 101, the through hole 10 on the heat radiating member 101, and the driving power source 11.

In order to prevent the mutual influence of the different LED flip chip 6 when the light is emitted, the light is more concentrated, and the light emitting module 103 (ED flip chip 6, composite substrate 8, first heat conducting layer 9) and the light emitting module (lighting mirror 1, lampshade 2) A light blocking member 4 is disposed between the lenses 3). According to the distribution of the LED flip chip 6, a light-reflecting hole 5 having a reflecting cup shape is opened in the light blocking member 4. The diameter of the light through hole 5 close to the LED flip chip 6 is small, and the diameter of the light through hole 5 away from the light through hole 5 of the LED flip chip 6 (near the lens 3) is large, and the angle is controlled between 15 degrees and 20 degrees. .

In order to fix the light blocking member 4 to the light emitting module 103, there is a fixing component 7 between the light blocking member 4 and the light emitting module 103. The thickness of the fixing component 7 is controlled within 3 mm, and is fixed to the rear end heat dissipating component 101 of the LED spotlight. together. The light emitted from the LED flip chip 6 is collected by the independent light through hole 5 to the front end of the lens 3. The lens 3 is a planar convex lens, and the plane of the light incident surface of the lens 3 is a frosted mirror surface, which can reduce the reflection of light.

The lampshade 2 tightly encloses the lens 3. The lampshade 2 adopts a hemispherical structure, and the inner side surface is coated with a highly reflective substance, which can further converge the partially divergent light collected by the lens 3, and the light can be formed by two convergences. The small angle beam is initially shot, which improves the utilization of light, that is, increases the light intensity, and also reduces light pollution. A light-emitting mirror 1 is provided on the outermost side of the globe 2, and the light-emitting mirror 1 selects a glass having a high transmittance to improve the light intensity and to protect the function of the internal structure.

The LED flip chip 6 can achieve high power and better wireless bonding stability. At the same time, the LED flip chip 6 has a high light extraction rate, which is in line with the requirement of high brightness of the spotlight, and the LED flip chip 6 is directly connected to the composite substrate 8 to have a better heat dissipation effect.

By using the special structure of the heat dissipating component 101 itself, the heat dissipation rate can be improved, and the use of the cooling fan can be avoided, the energy consumption can be reduced, and the use stability can be improved. The heat dissipating member 101 and the connecting plate 102 are both made of a double-layer metal-incorporated pyrolytic graphite composite material, and the heat dissipation effect is better. The connecting plate 102 and the heat dissipating member 101 are connected by means of a soldering of the package substrate, thereby ensuring a small thermal resistance and enhancing heat dissipation capability. The heat dissipating member 101 has a through hole 10 therein. This structure can better dissipate heat, and the driving power source 11 can be fixed in the through hole 10, so that the entire lamp volume of the LED spotlight can be reduced, and the heat dissipating member 101 and the heat dissipating member 101 can pass through. The positional relationship of the hole 10 and the driving power source 11 can be referred to FIG. 4, and the heat dissipating member 101 shown in FIG. 4 is a plan view of the heat dissipating member 101 shown in FIG. 1.

The LED spotlight provided by the present invention has been described in detail above. The principles and embodiments of the present invention are described herein with reference to a few examples, and the description of the above embodiments is only to assist in understanding the method of the present invention and its core idea; and, at the same time, one of ordinary skill in the art, in accordance with the present invention The present invention is not limited to the scope of the present invention, and the present invention is not limited to the present invention. Modifications, equivalent substitutions, improvements, etc., are intended to be included in this application.

It should also be noted that in the present specification, relational terms such as first and second, etc. are used merely to distinguish one operation from another, and do not necessarily require or imply the existence of such entities or operations. Any such actual relationship or order. Furthermore, the terms "comprises" and the like, are used to mean that a unit, device, or system that includes a plurality of elements includes not only those elements but also other elements not specifically listed or included in the unit, device, or system. Inherent elements.

Claims

An LED spotlight, characterized in that it comprises:

a heat dissipating member having a through hole, a connecting plate, and a light emitting module;

The heat dissipating member is laid on a surface of the connecting plate, and another surface of the connecting plate is connected to the light emitting module to conduct heat generated by the light emitting module to the heat dissipating member;

Wherein, the outer side surface of the heat dissipating component has a zigzag shape.
The LED spotlight according to claim 1, wherein the width of the root to the top of each of the teeth on the outer side of the heat dissipating member is gradually reduced.
The LED spotlight according to claim 1, wherein the light emitting module comprises:

a plurality of LED flip chip, a composite substrate and a first thermal adhesive layer, the composite substrate being located between the first thermal conductive adhesive layer and each of the LED flip chip, the first thermal conductive layer being attached to the Connection plate.
The LED spotlight according to claim 3, wherein the composite substrate comprises:

An AIN ceramic layer, a pyrolytic graphite layer and a metal copper layer, the pyrolytic graphite layer being located between the AIN ceramic layer and the metal copper layer, the AIN ceramic layer being attached to each of the LED flip chip.
The LED spotlight according to claim 3, further comprising:

a second thermal adhesive layer between each of the LED flip chip and the composite substrate.
The LED spotlight according to claim 3, further comprising:

a light blocking member having a plurality of light through holes respectively connected to the light emitting module and the light emitting module of the LED spotlight, wherein the light blocking member is configured to collect light emitted by each of the LED flip chips. The light through holes correspond to the LED flip chips so that light emitted by each of the LED flip chips is transmitted to the light exit module through the light through holes.
The LED spotlight according to claim 6, wherein the light exiting module comprises:

The light-emitting mirror, the light cover and the lens are disposed at the light entrance of the light cover, and the light-emitting mirror is disposed at the light exit of the light cover.
The LED spotlight according to claim 6, further comprising:

The high temperature resistant adhesive layer is connected to the light emitting module through the high temperature resistant adhesive layer.
The LED spotlight according to claim 7, further comprising:

a metallic silver layer and/or a two-dimensional photonic crystal layer applied to the inner sidewall of the globe.
The LED spotlight according to claim 7, wherein the lens is specifically a plano-convex lens.