KR100887401B1 - Module for light emitting diode - Google Patents

Module for light emitting diode Download PDF

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Publication number
KR100887401B1
KR100887401B1 KR20080107864A KR20080107864A KR100887401B1 KR 100887401 B1 KR100887401 B1 KR 100887401B1 KR 20080107864 A KR20080107864 A KR 20080107864A KR 20080107864 A KR20080107864 A KR 20080107864A KR 100887401 B1 KR100887401 B1 KR 100887401B1
Authority
KR
South Korea
Prior art keywords
light emitting
emitting diode
disposed
layer
lens
Prior art date
Application number
KR20080107864A
Other languages
Korean (ko)
Inventor
김형균
Original Assignee
위젠엘이디(주)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 위젠엘이디(주) filed Critical 위젠엘이디(주)
Priority to KR20080107864A priority Critical patent/KR100887401B1/en
Application granted granted Critical
Publication of KR100887401B1 publication Critical patent/KR100887401B1/en

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Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/51Cooling arrangements using condensation or evaporation of a fluid, e.g. heat pipes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V13/00Producing particular characteristics or distribution of the light emitted by means of a combination of elements specified in two or more of main groups F21V1/00 - F21V11/00
    • F21V13/02Combinations of only two kinds of elements
    • F21V13/04Combinations of only two kinds of elements the elements being reflectors and refractors
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/89Metals
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F21K9/64Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction using wavelength conversion means distinct or spaced from the light-generating element, e.g. a remote phosphor layer
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V15/00Protecting lighting devices from damage
    • F21V15/01Housings, e.g. material or assembling of housing parts
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00Globes; Bowls; Cover glasses
    • F21V3/04Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00Reflectors for light sources
    • F21V7/22Reflectors for light sources characterised by materials, surface treatments or coatings, e.g. dichroic reflectors
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]

Abstract

The present invention provides a first lens, a first phosphor layer applied on the first lens, a second lens disposed on the first phosphor layer, a protective layer disposed in a trapezoidal shape on the second lens, A second phosphor layer applied to the side surface of the protective layer, a reflector plate 160 disposed on the second phosphor layer, a light emitting diode element disposed on an upper surface of the protective layer, and the light emitting diode element; Provided is a light emitting diode module comprising a metal slug.

Description

Light Emitting Diode Modules {MODULE FOR LIGHT EMITTING DIODE}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light emitting diode (LED) module, and more particularly, to emit heat generated from a light emitting diode device, and to effectively increase light transmittance and waterproof ability, while generating negative ions and far infrared rays. It relates to a light emitting diode module that can be made.

In general, light emitting diodes have been developed using characteristics in which a light emitting phenomenon occurs when a voltage is applied to a compound semiconductor. The light emitting diode is smaller in size, longer in life, and has an excellent efficiency of converting electrical energy into light energy. Recently, due to the development of semiconductor technology and commercialization of high brightness white light emitting diodes, various lighting devices using the same have emerged.

In particular, by increasing the intensity per unit area by integrating a high density in the form of a plurality of light emitting diodes, the research and development of the light emitting diode module for illumination that can illuminate a sufficiently long distance has been actively made.

As the integration density of the LED module increases, heat generated in the same area also increases, which may cause damage to the LED device.

SUMMARY OF THE INVENTION The present invention has been made in an effort to provide a light emitting diode module capable of effectively dissipating heat generated from a light emitting diode device, effectively increasing light transmittance and waterproofing ability, and generating negative ions and far infrared rays.

Technical problems to be achieved by the present invention are not limited to the above-mentioned technical problems, and other technical problems not mentioned above will be clearly understood by those skilled in the art from the following description. Could be.

In order to achieve the above object, a light emitting diode module according to an exemplary embodiment of the present invention includes a first lens, a first phosphor layer coated on the first lens, and a second phosphor disposed on the first phosphor layer. A protective layer disposed in a trapezoidal shape on the lens, the second lens, a second phosphor layer applied to the side surface of the protective layer, a reflector plate 160 disposed on the second phosphor layer, and the protective layer. It includes a light emitting diode element disposed on the upper surface and a metal slug disposed on the light emitting diode element.

The light emitting diode module according to the embodiments of the present invention can effectively emit heat generated in the light emitting diode device, and can effectively raise the light transmittance and waterproof ability, and can generate negative ions or far infrared rays.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. Specific details of other embodiments are included in the detailed description and the drawings. Advantages and features of the present invention and methods for achieving them will be apparent with reference to the embodiments described below in detail with the accompanying drawings. Like reference numerals refer to like elements throughout.

1 is a cross-sectional view of a light emitting diode module according to an embodiment of the present invention.

As shown in FIG. 1, a light emitting diode module according to an embodiment of the present invention includes a first lens 110, a first phosphor layer 120, a second lens 130, a protective layer 150, and a second phosphor. The layer 140, the reflecting plate 160, the light emitting diode device 210, the metal slug 170, the insulating layer 180, the heat pipe 190, and the environmentally friendly layer 220 may be configured.

The first phosphor layer 120 is applied on the first lens 110, the second lens 130 is disposed on the first phosphor layer 120, and the protective layer 150 is formed on the second lens ( 130 is arranged in a trapezoidal shape. The protective layer 150 may be formed of a transparent silicon gal, may protect the second lens 130 or the first phosphor layer 120, and may improve light transmittance.

The second phosphor layer 140 is applied to the side surface of the protective layer 150, the reflecting plate 160 is disposed on the second phosphor layer 140, and the light emitting diode element 210 is the protective layer 150. The metal slug 170 is disposed on the light emitting diode element 210.

Here, the first phosphor layer 120 and the second phosphor layer 140 include a phosphor, and the light emitting diode element 210 is a blue light emitting diode element 210. The first phosphor layer 120, the second phosphor layer 140, and the light emitting diode device 210 may be used as white light sources.

In addition, since the reflecting plate 160 surrounds the first phosphor layer 120 and the second phosphor layer 140, the waterproof performance may be improved.

Meanwhile, the metal slug 170 is copper, and silver is plated to facilitate adhesion to the light emitting diode element 210, and the light emitting diode element 210 is in contact with the metal slug 170 using solder. As a result, heat generated in the light emitting diode device 210 may be effectively released through the metal slug 170.

In addition, a groove is formed in an upper surface of the metal slug 170, an insulating layer 180 is formed along the surface of the groove, and a heat pipe 190 is disposed on the insulating layer 180. Here, the insulating layer 180 includes AlN, BN or Al 2 O 3, and the heat pipe 190 is preferably copper. The heat of the metal slug 170 may be transferred to the heat pipe 190 through the insulating layer 180.

On the other hand, the heat pipe 190 is disposed on the environmentally friendly layer 220 for generating negative ions or far infrared rays, such an environmentally friendly layer 220 includes a mixture of magic stone, tourmaline, kaolin and elvan. When heat is transferred to the eco-friendly layer 220 through the heat pipe 190, not only can emit heat through the eco-friendly layer 220, but also the eco-friendly layer 220 generates anion or far infrared rays, thereby creating a pleasant environment. can do.

While the invention has been described and illustrated in connection with a preferred embodiment for illustrating the principles of the invention, the invention is not limited to the configuration and operation as such is shown and described.

Rather, those skilled in the art will appreciate that many modifications and variations of the present invention are possible without departing from the spirit and scope of the appended claims.

Accordingly, all such suitable changes and modifications and equivalents should be considered to be within the scope of the present invention.

1 is a cross-sectional view of a light emitting diode module according to an embodiment of the present invention.

Claims (9)

  1. A first lens;
    A first phosphor layer coated on the first lens;
    A second lens disposed on the first phosphor layer;
    A protective layer disposed on the second lens in a trapezoidal shape;
    A second phosphor layer applied to side surfaces of the protective layer;
    A reflector disposed on the second phosphor layer;
    A light emitting diode element disposed on an upper surface of the protective layer; And
    A light emitting diode module comprising a metal slug disposed on the light emitting diode element.
  2. The method of claim 1,
    The protective layer is a light emitting diode module, characterized in that formed of silicon gal.
  3. The method of claim 1,
    The light emitting diode device is a blue light emitting diode device, wherein the first and the second phosphor layer comprises a phosphor (phosphor).
  4. The method of claim 1,
    The metal slug is copper, characterized in that the light emitting diode module.
  5. The method of claim 1,
    And a groove is formed on an upper surface of the metal slug, an insulating layer is formed along the surface of the groove, and a heat pipe is disposed on the insulating layer.
  6. The method of claim 5,
    The insulating layer is a light emitting diode module comprising AlN, BN or Al2O3.
  7. The method of claim 5,
    The heat pipe is a light emitting diode module, characterized in that the copper.
  8. The method of claim 1,
    The light emitting diode module, characterized in that the environmentally friendly layer for generating anion or far infrared rays is disposed on the metal slug.
  9. The method of claim 8,
    The eco-friendly layer is a light emitting diode module, characterized in that the mixture of magic stone, tourmaline, kaolin and elvan.
KR20080107864A 2008-10-31 2008-10-31 Module for light emitting diode KR100887401B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR20080107864A KR100887401B1 (en) 2008-10-31 2008-10-31 Module for light emitting diode

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR20080107864A KR100887401B1 (en) 2008-10-31 2008-10-31 Module for light emitting diode
PCT/KR2008/007288 WO2010050644A1 (en) 2008-10-31 2008-12-10 Module for light emitting diode

Publications (1)

Publication Number Publication Date
KR100887401B1 true KR100887401B1 (en) 2009-03-11

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR20080107864A KR100887401B1 (en) 2008-10-31 2008-10-31 Module for light emitting diode

Country Status (2)

Country Link
KR (1) KR100887401B1 (en)
WO (1) WO2010050644A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2532946A1 (en) * 2010-02-05 2012-12-12 Society With Limited Liability "Dis Plus" Method for producing a light-radiating surface and a lighting device for implementing the method

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN202534688U (en) * 2012-03-23 2012-11-14 深圳市瑞丰光电子股份有限公司 LED module structure with remote phosphor powder

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030038295A1 (en) 2001-08-22 2003-02-27 Nichia Corporation Light emitting device with fluorescent member excited by semiconductor light emitting element
KR100826411B1 (en) 2006-10-31 2008-04-29 삼성전기주식회사 Wavelength-converted light emitting device package
US20080149962A1 (en) 2006-12-21 2008-06-26 Lg Electronics Inc. Light emitting device package and method for manufacturing the same
US20080169752A1 (en) 2007-01-16 2008-07-17 Kabushiki Kaisha Toshiba Light emitting device

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100741516B1 (en) * 2006-01-27 2007-07-13 익스팬테크주식회사 Led package with radiating pin and manufacturing method thereof

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030038295A1 (en) 2001-08-22 2003-02-27 Nichia Corporation Light emitting device with fluorescent member excited by semiconductor light emitting element
KR100826411B1 (en) 2006-10-31 2008-04-29 삼성전기주식회사 Wavelength-converted light emitting device package
US20080149962A1 (en) 2006-12-21 2008-06-26 Lg Electronics Inc. Light emitting device package and method for manufacturing the same
US20080169752A1 (en) 2007-01-16 2008-07-17 Kabushiki Kaisha Toshiba Light emitting device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2532946A1 (en) * 2010-02-05 2012-12-12 Society With Limited Liability "Dis Plus" Method for producing a light-radiating surface and a lighting device for implementing the method
EP2532946A4 (en) * 2010-02-05 2013-10-02 With Ltd Liability Dis Plus Soc Method for producing a light-radiating surface and a lighting device for implementing the method

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Publication number Publication date
WO2010050644A1 (en) 2010-05-06

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