WO2010050644A1 - Module for light emitting diode - Google Patents
Module for light emitting diode Download PDFInfo
- Publication number
- WO2010050644A1 WO2010050644A1 PCT/KR2008/007288 KR2008007288W WO2010050644A1 WO 2010050644 A1 WO2010050644 A1 WO 2010050644A1 KR 2008007288 W KR2008007288 W KR 2008007288W WO 2010050644 A1 WO2010050644 A1 WO 2010050644A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- emitting diode
- light
- led
- disposed
- module according
- Prior art date
Links
- 239000010410 layer Substances 0.000 claims abstract description 41
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims abstract description 28
- 239000011241 protective layer Substances 0.000 claims abstract description 15
- 239000002184 metal Substances 0.000 claims abstract description 12
- 229910052751 metal Inorganic materials 0.000 claims abstract description 12
- 150000001450 anions Chemical class 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 239000005995 Aluminium silicate Substances 0.000 claims description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 2
- 235000012211 aluminium silicate Nutrition 0.000 claims description 2
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 claims description 2
- 229910052710 silicon Inorganic materials 0.000 claims description 2
- 239000010703 silicon Substances 0.000 claims description 2
- 239000004575 stone Substances 0.000 claims description 2
- 229940070527 tourmaline Drugs 0.000 claims description 2
- 229910052613 tourmaline Inorganic materials 0.000 claims description 2
- 239000011032 tourmaline Substances 0.000 claims description 2
- 238000002834 transmittance Methods 0.000 description 4
- 241000237858 Gastropoda Species 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V7/00—Reflectors for light sources
- F21V7/22—Reflectors for light sources characterised by materials, surface treatments or coatings, e.g. dichroic reflectors
- F21V7/28—Reflectors for light sources characterised by materials, surface treatments or coatings, e.g. dichroic reflectors characterised by coatings
- F21V7/30—Reflectors for light sources characterised by materials, surface treatments or coatings, e.g. dichroic reflectors characterised by coatings the coatings comprising photoluminescent substances
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V13/00—Producing particular characteristics or distribution of the light emitted by means of a combination of elements specified in two or more of main groups F21V1/00 - F21V11/00
- F21V13/02—Combinations of only two kinds of elements
- F21V13/04—Combinations of only two kinds of elements the elements being reflectors and refractors
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/51—Cooling arrangements using condensation or evaporation of a fluid, e.g. heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/89—Metals
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
- F21K9/64—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction using wavelength conversion means distinct or spaced from the light-generating element, e.g. a remote phosphor layer
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V15/00—Protecting lighting devices from damage
- F21V15/01—Housings, e.g. material or assembling of housing parts
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V3/00—Globes; Bowls; Cover glasses
- F21V3/04—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Definitions
- the present invention relates to a light-emitting diode (LED) module, and more particularly, to a light-emitting diode (LED) module which can effectively emit heat generated from light-emitting diode (LED) devices, and can emit anions or far-infrared rays while effectively increasing light transmittance and waterproof capability.
- LED light-emitting diode
- LEDs light-emitting diodes
- the LEDs are relatively small-sized, have a relatively extended lifespan, and is higher in efficiency of converting electric energy into light energy as compared to a conventional light source.
- LEDs high-brightness white light-emitting diodes
- LED light-emitting diode
- Such an LED module entails a problem in that as its integration density increases, heat generated from the same area also increases, thereby causing a damage to a light- emitting diode device. Disclosure of Invention Technical Problem
- LED light-emitting diode
- a light-emitting diode (LED) module includes: a first lens; a first phosphor layer coated on the first lens; a second lens disposed on the first phosphor layer; a plurality of protective layers disposed on the second lens in a trapezoidal shape; a second phosphor layer coated on a lateral surface of each of the protective layers; a reflection plate disposed on the second phosphor layer; a light-emitting diode (LED) device disposed on the top surface of each of the protective layers; and a metal slug disposed on the light-emitting diode (LED) device.
- the light-emitting diode (LED) module according to the present invention has an advantageous effect in that it can effectively emit heat generated from light-emitting diode (LED) devices, and can emit anions or far-infrared rays while effectively increasing light transmittance and waterproof capability.
- FIG. 1 is a cross-sectional view illustrating a light-emitting diode (LED) module according to a preferred embodiment of the present invention. Best Mode for Carrying out the Invention
- FIG. 1 is a cross-sectional view illustrating a light-emitting diode (LED) module according to a preferred embodiment of the present invention.
- LED light-emitting diode
- the light-emitting diode (LED) module includes a first lens 110, a first phosphor layer 120, a second lens 130, a plurality of protective layers 150, a second phosphor layer 140, a reflection plate 160, a plurality of light-emitting diode (LED) devices 210, a plurality of metal slugs 170, a plurality of insulating layers 180, a plurality of heat pipes 190 and an environmentally-friendly layer 220.
- the first phosphor layer 120 is coated on the first lens 110, and the second lens 130 is disposed on the first phosphor layer 120.
- the plurality of protective layers 150 is disposed on the second lens 130 in a trapezoidal shape.
- each of the protective layers 150 may be formed of transparent silicon gel and can serve to improve light transmittance while protecting the second lens 130 or the first phosphor layer 120.
- the second phosphor layer 140 is coated on a lateral surface of each of the protective layers 150, the reflection plate 160 is disposed on the second phosphor layer 140.
- the plurality of light-emitting diode (LED) devices 210 is disposed on the top surface of the protective layers 150 and the plurality of metal slugs 170 is disposed on the light- emitting diode (LED) devices 210.
- the first phosphor layer 120 and the second phosphor layer 140 comprise phosphor
- the light-emitting diode (LED) device 210 is a blue light-emitting diode (LED).
- the first phosphor layer 120, the second phosphor layer 140 and the light- emitting diode (LED) device 210 can be used to produce a white light source.
- first phosphor layer 120 and the second phosphor layer 140 are surrounded by the reflection plate 160 so that waterproof capability can be improved.
- the metal slug 170 comprises copper and is plated with silver to facilitate its bonding to the light-emitting diode (LED) device 210.
- the light-emitting diode (LED) device 210 is bonded to the metal slug 170 using a solder. By doing so, heat generated from the light-emitting diode (LED) device 210 can be effectively emitted through the metal slug 170.
- each of the metal slugs 170 has a groove formed on the top surface thereof and an insulating layer 180 is formed along the surface of the groove.
- a heat pipe 190 is mounted on the insulating layer 180.
- the insulating layer 180 comprises AIN, BN or Al O and the heat pipe 190 comprises copper. The heat of the metal slug can be transferred to the heat pipe 190.
- the environmentally-friendly layer 220 is disposed above the plurality of heat pipes 190 so as to emit anions or far-infrared rays.
- the environmentally-friendly layer 220 comprises magic stone, tourmaline, kaolin or elvan.
- LED light-emitting diode
- the environmentally-friendly layer 220 can generate anions or far-infrared rays so as to create a pleasant environment.
Abstract
The present invention provides a light-emitting diode (LED) module including: a first lens; a first phosphor layer coated on the first lens; a second lens disposed on the first phosphor layer; a plurality of protective layers disposed on the second lens in a trapezoidal shape; a second phosphor layer coated on a lateral surface of each of the protective layers; a reflection plate 160 disposed on the second phosphor layer; a light-emitting diode (LED) device disposed on the top surface of each of the protective layers; and a metal slug disposed on the light-emitting diode (LED) device.
Description
Description MODULE FOR LIGHT EMITTING DIODE
Technical Field
[1] The present invention relates to a light-emitting diode (LED) module, and more particularly, to a light-emitting diode (LED) module which can effectively emit heat generated from light-emitting diode (LED) devices, and can emit anions or far-infrared rays while effectively increasing light transmittance and waterproof capability. Background Art
[2] In general, light-emitting diodes (LEDs) have been developed using the characteristics in which a light emission phenomenon occurs when voltage is applied to a compound semiconductor. The LEDs are relatively small-sized, have a relatively extended lifespan, and is higher in efficiency of converting electric energy into light energy as compared to a conventional light source. Currently, the development of the semiconductors achieves commercialization of high-brightness white light-emitting diodes (LEDs), leading to the advent of a variety of illumination apparatuses.
[3] Particularly, much research and development for a light-emitting diode (LED) module for illumination is in active progress, in which a plurality of light-emitting diodes is arranged in a high-density integration fashion to increase the light intensity per unit area so as to illuminate a sufficiently distant place.
[4] Such an LED module entails a problem in that as its integration density increases, heat generated from the same area also increases, thereby causing a damage to a light- emitting diode device. Disclosure of Invention Technical Problem
[5] Accordingly, it is an object of the present invention to provide a light-emitting diode
(LED) module which can effectively emit heat generated from light-emitting diode (LED) devices, and can emit anions or far-infrared rays while effectively increasing light transmittance and waterproof capability.
[6] The object of the present invention is not limited to the above-mentioned object, but other objects of the present invention will be clearly understood from the following description by a person having an ordinary skill in the art. Technical Solution
[7] To accomplish the above object, according to the present invention, there is provided a light-emitting diode (LED) module includes: a first lens; a first phosphor layer coated on the first lens; a second lens disposed on the first phosphor layer; a plurality of protective layers disposed on the second lens in a trapezoidal shape; a second phosphor
layer coated on a lateral surface of each of the protective layers; a reflection plate disposed on the second phosphor layer; a light-emitting diode (LED) device disposed on the top surface of each of the protective layers; and a metal slug disposed on the light-emitting diode (LED) device.
Advantageous Effects
[8] The light-emitting diode (LED) module according to the present invention has an advantageous effect in that it can effectively emit heat generated from light-emitting diode (LED) devices, and can emit anions or far-infrared rays while effectively increasing light transmittance and waterproof capability. Brief Description of Drawings
[9] FIG. 1 is a cross-sectional view illustrating a light-emitting diode (LED) module according to a preferred embodiment of the present invention. Best Mode for Carrying out the Invention
[10] The preferred embodiment of the present invention will be described in detail hereinafter with reference to the attached drawings. The specific contents of other embodiments are incorporated in the following description and the attached drawings. The advantages and features of the present invention, and a method of achieving them will be apparent from the embodiments while will be in detail described later along with the attached drawings. Throughout the drawings, like reference numerals are used to designate the same or similar elements although these elements are illustrated in different figures.
[11] FIG. 1 is a cross-sectional view illustrating a light-emitting diode (LED) module according to a preferred embodiment of the present invention.
[12] As shown in FIG. 1, the light-emitting diode (LED) module according to a preferred embodiment of the present invention includes a first lens 110, a first phosphor layer 120, a second lens 130, a plurality of protective layers 150, a second phosphor layer 140, a reflection plate 160, a plurality of light-emitting diode (LED) devices 210, a plurality of metal slugs 170, a plurality of insulating layers 180, a plurality of heat pipes 190 and an environmentally-friendly layer 220.
[13] The first phosphor layer 120 is coated on the first lens 110, and the second lens 130 is disposed on the first phosphor layer 120. The plurality of protective layers 150 is disposed on the second lens 130 in a trapezoidal shape. In this case, each of the protective layers 150 may be formed of transparent silicon gel and can serve to improve light transmittance while protecting the second lens 130 or the first phosphor layer 120.
[14] The second phosphor layer 140 is coated on a lateral surface of each of the protective layers 150, the reflection plate 160 is disposed on the second phosphor layer 140. The
plurality of light-emitting diode (LED) devices 210 is disposed on the top surface of the protective layers 150 and the plurality of metal slugs 170 is disposed on the light- emitting diode (LED) devices 210.
[15] In this case, the first phosphor layer 120 and the second phosphor layer 140 comprise phosphor, and the light-emitting diode (LED) device 210 is a blue light-emitting diode (LED). The first phosphor layer 120, the second phosphor layer 140 and the light- emitting diode (LED) device 210 can be used to produce a white light source.
[16] In addition, the first phosphor layer 120 and the second phosphor layer 140 are surrounded by the reflection plate 160 so that waterproof capability can be improved.
[17] In the meantime, the metal slug 170 comprises copper and is plated with silver to facilitate its bonding to the light-emitting diode (LED) device 210. The light-emitting diode (LED) device 210 is bonded to the metal slug 170 using a solder. By doing so, heat generated from the light-emitting diode (LED) device 210 can be effectively emitted through the metal slug 170.
[18] Further, each of the metal slugs 170 has a groove formed on the top surface thereof and an insulating layer 180 is formed along the surface of the groove. A heat pipe 190 is mounted on the insulating layer 180. The insulating layer 180 comprises AIN, BN or Al O and the heat pipe 190 comprises copper. The heat of the metal slug can be transferred to the heat pipe 190.
[19] Meanwhile, the environmentally-friendly layer 220 is disposed above the plurality of heat pipes 190 so as to emit anions or far-infrared rays. The environmentally-friendly layer 220 comprises magic stone, tourmaline, kaolin or elvan. When the heat generated from the light-emitting diode (LED) devices 210 is transferred to the environmentally- friendly layer 220 through the heat pipes 190, it can be emitted to the outside through the environmentally-friendly layer 220. At this time, the environmentally-friendly layer 220 can generate anions or far-infrared rays so as to create a pleasant environment.
[20] Although the present invention has been described in connection with the preferred exemplary embodiments illustrated in the drawings, it is only illustrative of the principle of the present invention, but not limited to the construction and operation as described above.
[21] It will be rather understood by those skilled in the art that various modifications and variations can be made to the present invention without departing from the spirit and scope of the appended claims.
[22] Therefore, all of such modifications and variations and equivalents should be construed as falling within the scope of the present invention.
Claims
[1] L A light-emitting diode (LED) module comprising: a first lens; a first phosphor layer coated on the first lens; a second lens disposed on the first phosphor layer; a plurality of protective layers disposed on the second lens in a trapezoidal shape; a second phosphor layer coated on a lateral surface of each of the protective layers; a reflection plate disposed on the second phosphor layer; a light-emitting diode (LED) device disposed on the top surface of each of the protective layers; and a metal slug disposed on the light-emitting diode (LED) device.
[2] The light-emitting diode (LED) module according to claim 1, wherein the protective layer is formed of silicon gel.
[3] The light-emitting diode (LED) module according to claim 1, wherein the light- emitting diode (LED) device is a blue light-emitting diode (LED) device, and the first and second phosphor layers comprise phosphor.
[4] The light-emitting diode (LED) module according to claim 1, wherein the metal slug comprises copper.
[5] The light-emitting diode (LED) module according to claim 1, wherein the metal slug has a groove formed on the top surface thereof, an insulating layer is formed along the surface of the groove, and a heat pipe is mounted on the insulating layer.
[6] The light-emitting diode (LED) module according to claim 5, wherein the insulating layer comprises AIN, BN or Al O
[7] The light-emitting diode (LED) module according to claim 5, wherein the heat pipe comprises copper.
[8] The light-emitting diode (LED) module according to claim 1, wherein an environmentally-friendly layer is disposed above the heat pipe so as to emit anions or far-infrared rays.
[9] The light-emitting diode (LED) module according to claim 1, wherein the environmentally-friendly layer comprises magic stone, tourmaline, kaolin or elvan.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020080107864A KR100887401B1 (en) | 2008-10-31 | 2008-10-31 | Module for light emitting diode |
| KR10-2008-0107864 | 2008-10-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2010050644A1 true WO2010050644A1 (en) | 2010-05-06 |
Family
ID=40697820
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/KR2008/007288 WO2010050644A1 (en) | 2008-10-31 | 2008-12-10 | Module for light emitting diode |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR100887401B1 (en) |
| WO (1) | WO2010050644A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013139309A1 (en) * | 2012-03-23 | 2013-09-26 | 深圳市瑞丰光电子股份有限公司 | Led module structure with remote phosphor |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2532946A4 (en) * | 2010-02-05 | 2013-10-02 | With Ltd Liability Dis Plus Soc | Method for producing a light-radiating surface and a lighting device for implementing the method |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030038295A1 (en) * | 2001-08-22 | 2003-02-27 | Nichia Corporation | Light emitting device with fluorescent member excited by semiconductor light emitting element |
| KR100741516B1 (en) * | 2006-01-27 | 2007-07-20 | 익스팬테크주식회사 | Led package with radiating pin and manufacturing method thereof |
| KR100826411B1 (en) * | 2006-10-31 | 2008-04-29 | 삼성전기주식회사 | Wavelength-converted light emitting device package |
| US20080169752A1 (en) * | 2007-01-16 | 2008-07-17 | Kabushiki Kaisha Toshiba | Light emitting device |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100845856B1 (en) * | 2006-12-21 | 2008-07-14 | 엘지전자 주식회사 | LED package and method of manufacturing the same |
-
2008
- 2008-10-31 KR KR1020080107864A patent/KR100887401B1/en not_active IP Right Cessation
- 2008-12-10 WO PCT/KR2008/007288 patent/WO2010050644A1/en active Application Filing
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030038295A1 (en) * | 2001-08-22 | 2003-02-27 | Nichia Corporation | Light emitting device with fluorescent member excited by semiconductor light emitting element |
| KR100741516B1 (en) * | 2006-01-27 | 2007-07-20 | 익스팬테크주식회사 | Led package with radiating pin and manufacturing method thereof |
| KR100826411B1 (en) * | 2006-10-31 | 2008-04-29 | 삼성전기주식회사 | Wavelength-converted light emitting device package |
| US20080169752A1 (en) * | 2007-01-16 | 2008-07-17 | Kabushiki Kaisha Toshiba | Light emitting device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013139309A1 (en) * | 2012-03-23 | 2013-09-26 | 深圳市瑞丰光电子股份有限公司 | Led module structure with remote phosphor |
Also Published As
| Publication number | Publication date |
|---|---|
| KR100887401B1 (en) | 2009-03-11 |
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