CN105698014A - LED lamp bank - Google Patents
LED lamp bank Download PDFInfo
- Publication number
- CN105698014A CN105698014A CN201610062028.7A CN201610062028A CN105698014A CN 105698014 A CN105698014 A CN 105698014A CN 201610062028 A CN201610062028 A CN 201610062028A CN 105698014 A CN105698014 A CN 105698014A
- Authority
- CN
- China
- Prior art keywords
- substrate
- led
- layer
- circuit board
- solar panel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V31/00—Gas-tight or water-tight arrangements
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Led Device Packages (AREA)
Abstract
The invention relates to an LED lamp bank. The LED lamp bank is characterized by comprising a substrate, an LED lamp bank body, light gathering boards and a circuit board embedment groove; the substrate is embedded in the circuit board embedment groove; the LED lamp bank body is mounted on the substrate; the light gathering boards are mounted on the periphery of the LED lamp bank body; and the light gathering boards are made of high-thermal-conductivity insulating materials and can conduct heat generated by the LED lamp bank body to a thermal conduction insulating layer of the substrate, the heat generated by the thermal conduction insulating layer is rapidly dissipated into air, and accordingly the rapid heat dissipation effect of the LED lamp bank is guaranteed.
Description
Technical field
The present invention relates to lighting field, particularly relate to a kind of LED group。
Background technology
LED and semi-conductor electricity light source, light emitting diode, also referred to as semiconductor lamp, it is a kind of electric light source without filament, directly electric energy is converted into luminous energy。
LED has feature energy-conservation, life-span length, it is to avoid often needing the trouble more changed the bulb, be subject to the favor of increasing user, LED group uses in increasing field。Wherein it is installed in advertisement show window in the increasing LED projector lamp in advertisement Projecting Lamp field, owing to advertisement show window is exposed to open air, and LED group can give out substantial amounts of heat in working long hours, time in severe natural environment, the service life being made LED by the mode of natural cooling is substantially reduced, therefore the heat dissipation problem of LED group, badly influences light efficiency and the service life of LED group。
Summary of the invention
The technical problem to be solved in the present invention is to provide the LED group of a kind of quick heat radiating, it is possible to extend the service life of LED group。
For solving above-mentioned technical problem, the technical scheme is that
A kind of LED group, its innovative point is in that: this LED group includes substrate, LED, solar panel and circuit board caulking groove；Substrate is embedded in circuit board caulking groove, and LED is arranged on substrate, and solar panel is arranged on the surrounding of LED；
Described substrate includes thermally conductive insulating layer, circuit layer and metal-based layer, and thermally conductive insulating layer, circuit layer and metal-based layer are from top to bottom laid successively on substrate；
Described LED has several and is evenly distributed on substrate, and LED includes LED chip and lens, and LED chip is connected on the circuit layer of substrate by wire, and lens, by the injection molded surface being attached to LED chip of colloid, form convex；
LED is nested in its horn mouth by described solar panel flare shape, and the small-bore horn mouth of solar panel is embedded in the thermally conductive insulating layer of substrate；
Described circuit board caulking groove is cuboid groove-like structure, and it is arranged on the underface of substrate, and the circuit layer of substrate is embedded in this circuit board caulking groove。
Further, described substrate is provided with one layer of protective cover。
Further, the circuit layer of described substrate and circuit board caulking groove junction water proof and dust proof cover。
Further, described solar panel adopts High-heat-conductiviinsulation insulation material。
It is an advantage of the current invention that: the High-heat-conductiviinsulation insulation material that spotlight adopts; the heat that LED produces quickly is transmitted to the thermally conductive insulating layer on substrate; by thermally conductive insulating layer, the heat of generation is quickly scattered in air; to ensure the quick heat radiating effect of LED, protective cover prevents from the impurity entrance substrate in air, LED being damaged；Substrate circuit layer is smooth and easy with the connection of the dust-proof, water-proof cover of circuit board caulking groove junction protection circuit, it is prevented that the circuit problems such as short circuit。
Accompanying drawing explanation
Below in conjunction with the drawings and specific embodiments, the present invention is further detailed explanation。
Fig. 1 is the assembling front view of a kind of LED group。
Fig. 2 is the structure chart of a kind of LED。
As shown in Fig. 1 Fig. 2: 1, substrate；11, thermally conductive insulating layer；12 circuit layers；13, metal-based layer；2, LED；21, LED chip；22, lens；3 solar panels；4, circuit board caulking groove；5, protective cover；6, water proof and dust proof cover。
Detailed description of the invention
The following examples can make professional and technical personnel more fully understand the present invention, but does not therefore limit the present invention among described scope of embodiments。
A kind of LED group as shown in Figure 1, its innovative point is in that: this LED group includes substrate 1, LED 2, solar panel 3 and circuit board caulking groove 4；Substrate 1 is embedded in circuit board caulking groove 4, and LED 2 is installed on substrate 1, and solar panel 3 is arranged on the surrounding of LED 2。
Substrate 1 includes thermally conductive insulating layer 11, circuit layer 12 and metal-based layer 13, and thermally conductive insulating layer 11, circuit layer 12 and metal-based layer 13 are from top to bottom laid on substrate 1 successively。
LED 2 has several and is evenly distributed on substrate, and LED includes LED chip 21 and lens 22, and LED chip 21 is connected on the circuit layer 12 of substrate 1 by wire, and lens 22, by the injection molded surface being attached to LED chip 21 of colloid, form convex。
LED is nested in its horn mouth by solar panel 3 flare shape, and the small-bore horn mouth of solar panel 3 is embedded in the thermally conductive insulating layer 11 of substrate 1。
Circuit board caulking groove 4 is in cuboid groove-like structure, and it is arranged on the underface of substrate 1, and the circuit layer 12 of substrate 1 is embedded in this circuit board caulking groove 4。
Substrate 1 is provided with one layer of protective cover 5, it is prevented that the impurity in air enters and on substrate, LED group damaged。
Circuit layer 12 and the circuit board caulking groove 4 junction water proof and dust proof cover 6 of substrate 1, the connection of protection circuit is smooth and easy, it is prevented that the circuit problems such as short circuit。
Solar panel 3 adopts High-heat-conductiviinsulation insulation material, the heat that LED produces quickly is transmitted to the thermally conductive insulating layer on substrate, is quickly scattered in air by the heat of generation by thermally conductive insulating layer, to ensure the quick heat radiating effect of LED。
The operation principle of this LED group is: be embedded in circuit board caulking groove 4 by the circuit layer 12 of LED group substrate 1, it is electrified rear LED 2 luminous, light LED 2 sent by solar panel 3 is assembled increases brightness, absorbs the substantial amounts of heat of LED 2 generation by solar panel and heat quickly passes to the thermally conductive insulating layer 11 of substrate 1。
Skilled person will appreciate that of the industry; the present invention is not restricted to the described embodiments; described in above-described embodiment and description is that principles of the invention is described; without departing from the spirit and scope of the present invention; the present invention also has various changes and modifications, and these changes and improvements both fall within the claimed scope of the invention。Claimed scope is defined by appending claims and equivalent thereof。
Claims (4)
1. a LED group, it is characterised in that: this LED group includes substrate, LED, solar panel and circuit board caulking groove；Substrate is embedded in circuit board caulking groove, and LED is arranged on substrate, and solar panel is arranged on the surrounding of LED；
Described substrate includes thermally conductive insulating layer, circuit layer and metal-based layer, and thermally conductive insulating layer, circuit layer and metal-based layer are from top to bottom laid successively on substrate；
Described LED has several and is evenly distributed on substrate, and LED includes LED chip and lens, and LED chip is connected on the circuit layer of substrate by wire, and lens, by the injection molded surface being attached to LED chip of colloid, form convex；
LED is nested in its horn mouth by described solar panel flare shape, and the small-bore horn mouth of solar panel is embedded in the thermally conductive insulating layer of substrate；
Described circuit board caulking groove is cuboid groove-like structure, and it is arranged on the underface of substrate, and the circuit layer of substrate is embedded in this circuit board caulking groove。
2. a kind of LED group according to claim 1, it is characterised in that: described substrate is provided with one layer of protective cover。
3. a kind of LED group according to claim 1, it is characterised in that: the circuit layer of described substrate and circuit board caulking groove junction water proof and dust proof cover。
4. a kind of LED group according to claim 1, it is characterised in that: described solar panel adopts High-heat-conductiviinsulation insulation material。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610062028.7A CN105698014A (en) | 2016-01-29 | 2016-01-29 | LED lamp bank |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610062028.7A CN105698014A (en) | 2016-01-29 | 2016-01-29 | LED lamp bank |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105698014A true CN105698014A (en) | 2016-06-22 |
Family
ID=56229765
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610062028.7A Pending CN105698014A (en) | 2016-01-29 | 2016-01-29 | LED lamp bank |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105698014A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106051625A (en) * | 2016-06-22 | 2016-10-26 | 南通泰和食品有限公司 | LED lamp set |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201032117Y (en) * | 2007-05-21 | 2008-03-05 | 诸建平 | High-power LED lighting lamp |
| CN101586749A (en) * | 2009-06-11 | 2009-11-25 | 浙江西子光电科技有限公司 | LED lighting device and radiator structure thereof |
| CN201396599Y (en) * | 2009-03-13 | 2010-02-03 | 深圳市勤仕达照明有限公司 | Semiconductor LED spotlight light source |
| CN102840488A (en) * | 2012-09-11 | 2012-12-26 | 广东宏泰照明科技有限公司 | LED lamp provided with heat dissipation function |
| CN203868853U (en) * | 2014-04-03 | 2014-10-08 | 江西阿拉丁光电有限公司 | Led ceiling lamp |
-
2016
- 2016-01-29 CN CN201610062028.7A patent/CN105698014A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201032117Y (en) * | 2007-05-21 | 2008-03-05 | 诸建平 | High-power LED lighting lamp |
| CN201396599Y (en) * | 2009-03-13 | 2010-02-03 | 深圳市勤仕达照明有限公司 | Semiconductor LED spotlight light source |
| CN101586749A (en) * | 2009-06-11 | 2009-11-25 | 浙江西子光电科技有限公司 | LED lighting device and radiator structure thereof |
| CN102840488A (en) * | 2012-09-11 | 2012-12-26 | 广东宏泰照明科技有限公司 | LED lamp provided with heat dissipation function |
| CN203868853U (en) * | 2014-04-03 | 2014-10-08 | 江西阿拉丁光电有限公司 | Led ceiling lamp |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106051625A (en) * | 2016-06-22 | 2016-10-26 | 南通泰和食品有限公司 | LED lamp set |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20160622 |
|
| WD01 | Invention patent application deemed withdrawn after publication |