CN205447293U - LED lamp of embedded heat dissipation basic unit - Google Patents
LED lamp of embedded heat dissipation basic unit Download PDFInfo
- Publication number
- CN205447293U CN205447293U CN201521092880.6U CN201521092880U CN205447293U CN 205447293 U CN205447293 U CN 205447293U CN 201521092880 U CN201521092880 U CN 201521092880U CN 205447293 U CN205447293 U CN 205447293U
- Authority
- CN
- China
- Prior art keywords
- radiator
- led lamp
- led
- lamp plate
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000017525 heat dissipation Effects 0.000 title abstract description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 11
- 229910052710 silicon Inorganic materials 0.000 claims description 11
- 239000010703 silicon Substances 0.000 claims description 11
- 239000011324 bead Substances 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 7
- 239000004411 aluminium Substances 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminum Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 4
- 239000000377 silicon dioxide Substances 0.000 abstract 2
- 239000004065 semiconductor Substances 0.000 description 5
- 239000004593 Epoxy Substances 0.000 description 3
- 125000003700 epoxy group Chemical group 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000001808 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000009795 derivation Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Abstract
The utility model relates to a LED lamp of embedded heat dissipation basic unit, including the LED lamp holder, LED lamp holder and power strip support fixed connection, threaded connection between power strip support downside and the radiator, the radiator includes a plurality of fin, fin evenly distributed is on the radiator circumferencial direction, the radiator inboard is provided with the lamp plate, be provided with a plurality of LED lamp pearl on the lamp plate, be provided with the reflector on each LED lamp pearl outside, the radiator outside is provided with lens, be provided with the power cord between LED lamp holder and the lamp plate, set up a plurality of louvre on the radiator lateral wall, be provided with the series thermal silica layer on the inboard horizontal plane of radiator, series thermal silica layer upper end is provided with the heat dissipation layer. The utility model discloses can in time give off the heat that the lamp plate produced the effectual life who prolongs the LED lamp.
Description
Technical field
This utility model relates to LED technology field, particularly relates to the LED of a kind of embedded radiating base layer.
Background technology
LED, also known as light emitting diode.Its basic structure is one block of electroluminescent semi-conducting material, is the semiconductor device of a kind of solid-state, and it directly can be converted into light electricity.It is placed on a leaded shelf, then surrounding epoxy sealing, plays the effect of protection internal core, so the anti-seismic performance of LED is good.The heart of LED is the wafer of a quasiconductor, and one end of wafer is attached on a support, and one end is negative pole, and the other end connects the positive pole of power supply, makes whole wafer by epoxy encapsulation.
The heart of LED is the wafer of a quasiconductor, and one end of wafer is attached on a support, and one end is negative pole, and the other end connects the positive pole of power supply, makes whole wafer by epoxy encapsulation.Semiconductor wafer is made up of two parts, and a part is P-type semiconductor, and inside it, occupy an leading position in hole, and the other end is N-type semiconductor, at the most mainly electronics.But the when that both quasiconductors coupling together, between them, it is formed for a P-N junction.When electric current acts on this wafer by wire when, electronics will be pushed to P district, and in P district, electronics is with hole-recombination, then will send energy with the form of photon, here it is the principle that LED is luminous.And the wavelength of light i.e. the color of light, it is to be determined by the material forming P-N junction.
The LED light source product that have employed pollution-free environmental protection this year is progressively popularized, and derive all kinds of replacement conventional light source such as incandescent lamp bulb, halogen spot light, the LED light source class illumination of fluorescent lamp, utilize that LED's is energy-efficient, but LED can produce heat when long-time use, if the heat dissipation problem of LED can not be properly settled, its working life will be severely impacted.
Utility model content
The purpose of this utility model is to overcome the deficiencies in the prior art, it is provided that the LED of a kind of embedded radiating base layer.
This utility model is to be achieved through the following technical solutions:
A kind of LED of embedded radiating base layer, including LED lamp holder, described LED lamp holder is fixing with power panel support to be connected, threaded with between radiator on the downside of described power panel support, if described radiator includes dry tablet fin, described fin is evenly distributed on radiator circumferencial direction, it is provided with lamp plate inside described radiator, several LED lamp bead it are provided with on described lamp plate, it is provided with reflection shield on outside each LED lamp bead described, it is provided with lens outside described radiator, it is provided with power line between described LED lamp holder and lamp plate, on described radiator sidewall, several louvres are set, thermal conductive silicon glue-line it is provided with on horizontal plane inside described radiator, described thermal conductive silicon glue-line upper end is provided with heat dissipating layer.
As optimal technical scheme of the present utility model, described louvre is that low inside and high outside shape is in tilted layout.
As optimal technical scheme of the present utility model, described thermal conductive silicon glue-line is pasted onto inside radiator on horizontal plane.
As optimal technical scheme of the present utility model, described heat dissipating layer is copper material or aluminium material.
Compared with prior art, the beneficial effects of the utility model are: this utility model LED is in use, LED lamp bead work process on lamp plate produces more heat, now heat is derived by thermal conductive silicon glue-line in time, distributing of heat is carried out through heat dissipating layer, heat is discharged through louvre simultaneously, is distributed in time by the heat that lamp plate produces, the effective service life extending LED.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model.
Detailed description of the invention
In order to make the purpose of this utility model, technical scheme and advantage clearer, below in conjunction with drawings and Examples, this utility model is further elaborated.Should be appreciated that specific embodiment described herein, only in order to explain this utility model, is not used to limit this utility model.
Referring to Fig. 1, Fig. 1 is structural representation of the present utility model.
nullA kind of LED of embedded radiating base layer，Including LED lamp holder 1，Described LED lamp holder 1 is fixing with power panel support 2 to be connected，Threaded between radiator 3 on the downside of described power panel support 2，If described radiator 3 includes dry tablet fin 301，Described fin 301 is evenly distributed on radiator 3 circumferencial direction，It is provided with lamp plate 4 inside described radiator 3，Several LED lamp bead 401 it are provided with on described lamp plate 4，It is provided with reflection shield 5 on outside each LED lamp bead 401 described，It is provided with lens 6 outside described radiator 3，It is provided with power line 7 between described LED lamp holder 1 and lamp plate 4，On described radiator 3 sidewall, several louvres 302 are set，Wherein said louvre 302 is in tilted layout in low inside and high outside shape，So louvre 302 is not only convenient for distributing of heat，Effectively avoid dust simultaneously and enter power panel support 2 inside.
It is provided with thermal conductive silicon glue-line 8 on horizontal plane inside described radiator 3, wherein said thermal conductive silicon glue-line 8 is pasted onto inside radiator 3 on horizontal plane, so can realize the derivation of heat, described thermal conductive silicon glue-line 8 upper end is provided with heat dissipating layer 9, wherein said heat dissipating layer 9 is copper material or aluminium material, and such heat dissipating layer 9 can realize distributing of heat.
In use, LED lamp bead 401 work process on lamp plate 4 produces more heat, now heat is derived by thermal conductive silicon glue-line 8 in time, distributing of heat is carried out through heat dissipating layer 9, heat is discharged through louvre 302 simultaneously, the heat that lamp plate 4 produces is distributed in time, the effective service life extending LED.
In description of the present utility model, it will be appreciated that, term " orientation or the position relationship of the instruction such as " center ", " top ", " end ", " interior ", " outward " they be based on orientation shown in the drawings or position relationship; be for only for ease of description this utility model and simplifying and describe; rather than instruction or imply the device of indication or element must have specific orientation, with specific azimuth configuration and operation, therefore it is not intended that to restriction of the present utility model.
The foregoing is only preferred embodiment of the present utility model, not in order to limit this utility model, all any amendment, equivalent and improvement etc. made within spirit of the present utility model and principle, within should be included in protection domain of the present utility model.
Claims (4)
- null1. the LED of an embedded radiating base layer，Including LED lamp holder (1)，Described LED lamp holder (1) is fixing with power panel support (2) to be connected，Threaded between radiator (3) in described power panel support (2) downside，Described radiator (3) is if including dry tablet fin (301)，Described fin (301) is evenly distributed on radiator (3) circumferencial direction，Described radiator (3) inner side is provided with lamp plate (4)，Several LED lamp bead (401) it are provided with on described lamp plate (4)，Described each LED lamp bead (401) is provided with reflection shield (5) on outside，Described radiator (3) outside is provided with lens (6)，Power line (7) it is provided with between described LED lamp holder (1) and lamp plate (4)，It is characterized in that: several louvres (302) are set on described radiator (3) sidewall，It is provided with thermal conductive silicon glue-line (8) on the horizontal plane of described radiator (3) inner side，Described thermal conductive silicon glue-line (8) upper end is provided with heat dissipating layer (9).
- The LED of embedded radiating base layer the most according to claim 1, it is characterised in that: described louvre (302) is in tilted layout in low inside and high outside shape.
- The LED of embedded radiating base layer the most according to claim 1, it is characterised in that: described thermal conductive silicon glue-line (8) is pasted onto on the horizontal plane of radiator (3) inner side.
- The LED of embedded radiating base layer the most according to claim 1, it is characterised in that: described heat dissipating layer (9) is copper material or aluminium material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521092880.6U CN205447293U (en) | 2015-12-25 | 2015-12-25 | LED lamp of embedded heat dissipation basic unit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521092880.6U CN205447293U (en) | 2015-12-25 | 2015-12-25 | LED lamp of embedded heat dissipation basic unit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205447293U true CN205447293U (en) | 2016-08-10 |
Family
ID=56586359
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201521092880.6U Expired - Fee Related CN205447293U (en) | 2015-12-25 | 2015-12-25 | LED lamp of embedded heat dissipation basic unit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205447293U (en) |
-
2015
- 2015-12-25 CN CN201521092880.6U patent/CN205447293U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160810 Termination date: 20161225 |