TWM494474U - Heat dissipation apparatus - Google Patents

Description

Heat sink

The present invention relates to a heat sink that can greatly increase the locking force of the heat sink when it is combined with the heat sink.

According to the advancement of the technological era, the operational efficiency of electronic components is getting higher and higher, so that the functional requirements for the heat dissipation unit are also increasing. The conventional heat dissipation unit has adopted the stacked heat dissipation fins in order to increase the heat dissipation efficiency. The chip set is continuously developed on the heat sink fins, so the high-efficiency heat sink is one of the most important research and development priorities in the industry today, or a heat sink is disposed above the electronic component and the heat sink is The heat dissipating component is usually disposed with a heat dissipating fan for heat dissipation work, and the heat dissipating member is further attached to the heat dissipating member to guide the heat source to one side for heat dissipation.

It is known that a heat-conducting member that uses a temperature-average plate to pass through a cyclic change of a vapor-liquid phase to provide heat transfer is often used in the field of heat dissipation; however, due to the demand for current technological advancement and the demand for lightness, the heat-conducting member corresponds to The thickness of the cover plate is relatively thin, so when the heat dissipating member is locked on the heat conducting member, since the locking force of the heat conducting member is required to be larger, the current heat conducting member cannot withstand such a large The locking force causes the problem of bending deformation of the heat-conducting member, which causes the heat-conducting effect to be greatly reduced, and in severe cases, it is even disabled.

As mentioned above, the conventional disadvantages have the following disadvantages:

1. Can not bear a large locking force;

2. causing deformation problems;

3. The thermal conductivity is poor.

Therefore, how to solve the above problems and problems in the past, that is, the creators of the case and the relevant manufacturers engaged in this industry are eager to study the direction of improvement.

Therefore, in order to effectively solve the above problems, the main purpose of the present invention is to provide a heat sink capable of increasing the locking force of the heat conducting member and the heat sink when combined.

A secondary object of the present invention is to provide a heat sink that improves the deformation of the heat conductive member.

In order to achieve the above object, the present invention provides a heat dissipating device, which comprises a heat dissipating member, a heat conducting member and a supporting member, wherein one side of the heat conducting member is correspondingly disposed with the heat dissipating member, and opposite sides of the heat conducting member are respectively Forming at least one set of joints, the support members are correspondingly combined on the other side of the heat-conducting member, and the opposite side edges of the support member respectively form at least a pair of joint portions corresponding to the joint portion, and the support member is at a central position Forming a hollowed out area, through the design of the structure, the heat conducting member and the supporting member are combined with each other, so that the heat dissipating member can bear a larger locking force when being locked, in addition, Improve the heat-conducting parts and easily cause deformation problems.

2‧‧‧heating device

21‧‧‧ Heat sink

211‧‧‧ Heat sink fins

212‧‧‧ dent

22‧‧‧ Thermal Conductive Parts

221‧‧‧ first side

222‧‧‧ second side

223‧‧‧Boss

224‧‧‧Team

225‧‧‧Perforation

23‧‧‧Support

231‧‧‧ upper side

2311‧‧‧Protruding

232‧‧‧ underside

2312‧‧‧ Groove

233‧‧‧Extension

234‧‧‧ hole

235‧‧‧Docking Department

236‧‧‧ Short-cut area

1A is a perspective view 1 of a first embodiment of a support member for creating a heat sink;

1B is a perspective view 2 of the first embodiment of the support member for creating the heat sink;

2A is an exploded perspective view of the first embodiment of the heat sink device;

2B is a perspective assembled view of the first embodiment of the heat sink device;

Figure 3 is a perspective view of a second embodiment of the heat sink of the present invention;

4A is a perspective exploded view of the second embodiment of the heat sink device;

Figure 4B is a perspective assembled view of the second embodiment of the creation heat sink.

The above object of the present invention, as well as its structural and functional features, will be described in accordance with the preferred embodiments of the drawings.

Please refer to FIGS. 1A and 1B and 2A and 2B for the perspective view of the support member of the first embodiment of the present invention and the perspective exploded view and the three-dimensional assembly diagram of the heat dissipating device. As shown in the figure, a heat dissipating device 2 is shown. The heat dissipating member 21 has a plurality of heat dissipating fins 211 and forms at least one recess 212;

One side of the heat conducting member 22 is attached to the heat dissipating member 21, and the opposite sides of the heat conducting member 22 respectively form at least one set of joints 224 and at least one through hole 225;

The supporting member 23 is correspondingly combined with the other side of the heat conducting member 22, and opposite sides of the supporting member 23 are respectively formed with at least a pair of connecting portions 235 corresponding to the connecting portion 224, and the central position of the supporting member 23 a hollow area 236 is formed, and the four of the support members 23 further have at least one hole 234;

The heat conducting member 22 is a temperature equalizing plate, and a boss 223 is formed at a central position of the temperature equalizing plate. The boss 223 is received in the hollow region 236 to be flush or slightly convex to the support member 23 . The upper side 231, and the heat conducting member 22 has a first side 221 and a second side 222 opposite the first side 221, the first side 221 is correspondingly coupled with the support member 23, the second side 222 and the The heat dissipating member 21 is correspondingly disposed, and the four ends of the heat conducting member 22 are formed to correspond to the through hole 225 and communicate with the hole 234, and the heat dissipating member 21 is formed with the recess 212 corresponding to the hole 234 and the through hole 225;

The support member 23 has an upper side 231 and a lower side 232. The upper side 231 is convexly provided with at least one protruding portion 2311. The lower side 232 forms at least one recess 2312 corresponding to the position of the protruding portion 2311. The protruding portion is formed. 2311 is distributed on the upper side 231 of the support member 23 for reinforcing the structural strength of the support member 23, wherein the material of the support member 23 can be selected from any metal or non-metal;

Through the design of the structure of the present invention, when the support member 23 is combined with the heat conductive member 22, since the heat conductive member 22 is made of copper or aluminum or a metal material having heat conduction, it is selected in the present invention. The copper plate is used as an illustration, and the material used for the support member 23 is relatively harder than the heat conductive member 22, and the arrangement of the protruding portion 2311 on the support member 23 is matched to lock the heat dissipating member 21. At the same time, a larger locking force can be withstood by the arrangement of the support member 23, and in addition, the problem that the conventional heat-conducting member is easily deformed can be prevented, thereby greatly increasing the effect of heat conduction.

Please refer to the figures 3 and 4A and 4B, which are perspective views of the support member of the second embodiment of the present invention, and an exploded perspective view and a three-dimensional assembly diagram of the heat dissipating device, the components and components of the heat dissipating device The corresponding relationship is the same as that of the heat dissipating device described above, and therefore is not described here again. However, the main difference between the heat dissipating device and the foregoing is that the peripheral edge of the supporting member 23 extends toward the lower side 232 to extend an extension portion 233. The extending portion 233 covers or positions the heat conducting member 22, that is, in the embodiment, the overall structure of the supporting member 23 covers the heat conducting member 22, and the supporting member 23 and the heat conducting member are When the 22 pieces are combined, the material of the support member 23 is harder than the heat conducting member 22, so that the heat dissipating member 21 can be locked, and can withstand a larger locking force, and the heat conducting member can be prevented from being easily generated. The problem of deformation, which in turn greatly increases the effect of heat conduction.

As mentioned above, this creation has the following advantages over the prior art:

1. Can withstand greater locking force;

2. Improve the deformation problem;

3. Significantly improve the thermal conductivity.

The present invention has been described in detail above, but the above description is only a preferred embodiment of the present invention, and the scope of the present invention cannot be limited. That is, all changes and modifications made in accordance with the scope of this creation application shall remain covered by the patents of this creation.

2‧‧‧heating device

21‧‧‧ Heat sink

211‧‧‧ Heat sink fins

212‧‧‧ dent

22‧‧‧ Thermal Conductive Parts

221‧‧‧ first side

222‧‧‧ second side

223‧‧‧Boss

224‧‧‧Team

225‧‧‧Perforation

23‧‧‧Support

231‧‧‧ upper side

2311‧‧‧Protruding

232‧‧‧ underside

234‧‧‧ hole

235‧‧‧Docking Department

236‧‧‧ Short-cut area

Claims (9)

[Item 1] A heat dissipating device includes: a heat dissipating member having a plurality of heat dissipating fins; a heat conducting member having a side opposite to the heat dissipating member; the opposite side edges of the heat conducting member respectively forming at least one set of joint portions; And a supporting member is correspondingly combined on the other side of the heat conducting member, wherein opposite sides of the supporting member respectively form at least a pair of joint portions corresponding to the joint portion, and a hollow portion is formed at a central position of the support member. . [Item 2] The heat dissipating device of claim 1, wherein the heat conducting member is a temperature equalizing plate, and a boss is formed at a central position of the temperature equalizing plate to be accommodated in the hollow region. [Item 3] The heat dissipating device of claim 2, wherein the heat conducting member has a first side and a second side, the first side is correspondingly coupled to the supporting member, and the second side corresponds to the heat dissipating member Laying. [Item 4] The heat dissipating device of claim 3, wherein the supporting member has an upper side and a lower side, the upper side is convexly provided with at least one protruding portion, and the lower side forms at least one groove corresponding to the position of the protruding portion The protrusion is distributed on the upper side of the support. [Item 5] The heat dissipating device of claim 3, wherein a periphery of the support member further extends toward the lower side direction, and the extension portion covers the heat conducting member. [Item 6] The heat dissipating device of claim 1, wherein the support member has at least one hole. [Item 7] The heat dissipating device of claim 6, wherein the four ends of the heat conducting member further have at least one perforation corresponding to and communicate with the hole. [Item 8] The heat dissipating device of claim 7, wherein the heat dissipating member further forms at least one recess, and the holes and the perforations are correspondingly recessed. [Item 9] The heat dissipating device of claim 1, wherein the material of the support member is selected from a metal or a non-metal.