TWM486652U - Oil mill for low-temperature milling - Google Patents

Description

Low temperature press oil press

This creation relates to an oil press, and in particular to a low temperature press oil press.

The existing oil press includes the body, the pressing rod and the pressing squeezing, the body is connected and squeezed, and the pressing rod is arranged in the squeezing squeezing. The existing oil press has only the heating scheme for the squeezing, and there is no cooling scheme for the squeezing. Because the friction between the squeeze rod and the squeezing work will continue to generate heat, the temperature of the squeezing is so high that it can not meet the demand of some oils requiring low temperature pressing, which destroys the nutrient content of the oil.

In view of this, the purpose of this creation is to propose a low-temperature press oil press with simple structure and reasonable structure, in order to effectively reduce the temperature of the pressing, meet the needs of oil materials requiring low-temperature pressing, and effectively reduce the damage of nutrients in the oil to overcome The deficiencies of the prior art.

In order to achieve the above object, the present invention proposes a low-temperature press oil press, which comprises a body, a squeezing and a cooling module, and the squeezing is connected with the body, and the cooling module is in contact with the surface of the squeegee.

In an embodiment of the present invention, the cooling module includes a cooling chip, and the surface of the cooling wafer facing the pressing surface is provided with a heat sink.

In an embodiment of the present invention, the heat sink is provided with a heat dissipation fan.

The cooling module may only include a cooling chip, the cooling film is directly fixed on the body, the cooling surface is directly in contact with the pressing surface, and the heat is transferred, and the heat sink is disposed on the heating surface of the cooling chip. When the cooled wafer is cooled to the crucible, the heat sink increases the efficiency of heat dissipation of the cooled wafer, allowing the quench surface to reach a lower temperature.

The refrigeration module is fixedly connected to the body and is in contact with the outer end of the top surface of the pressing bowl.

In an embodiment of the present invention, the body corresponding to the heat sink is provided with a heat dissipation channel, and the heat sink extends into the heat dissipation channel. The airflow in the heat dissipation channel is flowing, and the heat of the heat sink can be carried away by the flowing airflow, so that a large temperature difference is formed between the upper and lower surfaces of the cooled wafer (ie, the upper and lower surfaces of the cooled wafer are hot or cold or cold and hot). ).

In an embodiment of the present invention, the cooling module further includes a fixing frame, the fixing frame is connected to the body, and the cooling chip is disposed in the fixing frame.

In an embodiment of the present invention, the low temperature press oil press further includes a DC power supply terminal for supplying power to the cold chip, the DC power supply terminal includes a positive electrode and a negative electrode, and the positive and negative transfer switches are electrically connected between the positive and negative electrodes through the positive and negative transfer switches. Sexual connection. The positive and negative electrodes of the access cooling chip are exchanged by the positive and negative transfer switches, so that the cooling surface of the initial state of the cooled wafer becomes a heating surface, and the heating surface of the initial state becomes a cooling surface, thereby achieving a cooling function and The mutual conversion of the heating functions.

In an embodiment of the present invention, the cooling module further includes a heat conducting plate, and the cooling chip is disposed on a top surface of the heat conducting plate, and the bottom surface of the heat conducting plate is in contact with the pressing surface. By providing a heat conducting plate, the cooling amount or heat of the cooling wafer can be covered to a larger area, so that the pressing temperature is more uniform or the heating is more uniform.

In an embodiment of the present invention, the heat conducting plate and the cooling chip are flat or arched.

In an embodiment of the present invention, the surface of the heat conducting plate is provided with a temperature sensor and/or a temperature protector.

In an embodiment of the present invention, in addition to the cooling chip, the top surface of the heat conducting plate is further provided with a heater.

The beneficial effects of this creation are as follows:

(1) This low-temperature press oil press has the function of cooling the press, specifically by setting a cooling module on the surface of the press to effectively reduce the temperature of the press to meet the demand for oil required for low-temperature press, effectively reducing Destroying the nutrients in the oil;

(2) The component for cooling in the low-temperature press oil press is a refrigerating wafer having a cooling working surface and a heating working surface, and the cooling chip is connected to the DC power terminal through a positive and negative transfer switch. The positive and negative transfer switches exchange the positive and negative electrodes to convert the cooling working surface into a heating working surface, thereby realizing the dual function of both cooling and heating, so that the low temperature pressing oil press can process more kinds of oil materials;

(3) The cooling module can also be equipped with a heater. By starting the heater, the pressing can be made to have a higher temperature, so as to press the oil which is out of the grease at other high temperature conditions.

To make the objects, features, and advantages of the present invention more comprehensible to those of ordinary skill in the art, the following description of the preferred embodiments and the accompanying drawings are set forth below.

1‧‧‧ Refrigeration module

11‧‧‧Cold wafer

111‧‧‧ first input

112‧‧‧second input

12‧‧‧ Fixing frame

121‧‧‧Connected ears

122‧‧‧Connecting column
123‧‧‧ vents

13‧‧‧heat conducting plate

14‧‧‧ screws

15‧‧‧Temperature Sensor

16‧‧‧heater

2‧‧‧Squeeze

3‧‧‧sucker

4‧‧‧ radiator

5‧‧‧ cooling fan

SA‧‧‧ positive and negative transfer switch

FIG. 1 is a schematic structural view of a first embodiment of the present invention.

Fig. 2 is a circuit diagram showing the connection of a DC chip to a DC power supply terminal in the first embodiment.

FIG. 3 is a schematic exploded view of the second embodiment of the present invention.

Figure 4 is a schematic view of the structure of Figure 3 after assembly.

Fig. 5 is a structural schematic view of the holder in a second embodiment in another view.

Fig. 6 is a schematic exploded view showing the third embodiment of the creation.

The present invention will be further described below in conjunction with the accompanying drawings and embodiments.

Please refer to FIG. 1. FIG. 1 is a schematic structural view of a first embodiment. The low-temperature press oil press includes a body (not shown), a cooling module 1 and a squeezer 2, and the press 2 is connected to the body. The cooling module 1 is in contact with the surface of the press 2 .

The cooling module 1 comprises a cooling chip 11 which is directly fixed on the body, and the cooling surface (the surface in contact with the pressing blade 2) is directly in contact with the surface of the pressing blade 2, causing the cooling of the wafer 11. A heat sink 4 is disposed on the hot surface (the surface facing the press squeezing 2), and a heat radiating fan 5 is disposed on the heat sink 4. A press bar 3 is provided in the press 2 .

Referring to FIG. 1 and FIG. 2 at the same time, FIG. 2 is a schematic circuit diagram of a DC power supply (DC) terminal connected to the cooling chip 11, and the low temperature press oil press further includes a DC power supply terminal for supplying power to the cooling chip 11. The DC power supply terminal includes a positive electrode + a negative electrode - and a positive electrode and a negative electrode are electrically connected to the first input end 111 and the second input end 112 of the refrigerating wafer 11 through a positive and negative transfer switch SA, wherein the positive and negative transfer switches SA It can be a relay or a switch. When the positive and negative transfer switch SA is switched to the a position, the first input end 111 of the refrigerating wafer 11 is connected to the positive pole of the power source, the second input end 112 is connected to the negative pole of the power source, and the bottom surface of the refrigerating wafer 11 is a cooling surface, and the top surface is When the positive and negative transfer switch SA is switched to the b position, the first input end 111 of the refrigerating wafer 11 is connected to the negative pole of the power supply, the second input end 112 is connected to the positive pole of the power supply, and the bottom surface of the cooled wafer 11 is the heating surface. The top surface is the cooling surface.

The above-mentioned refrigerating wafer 11 can also be electrically connected to a DC power source through a common control switch, and the refrigerating wafer 11 is used alone for cooling work.

Referring to the second embodiment shown in FIG. 3 to FIG. 5 , the second embodiment is different from the first embodiment in that the cooling module 1 further includes a fixing frame 12 and a heat conducting plate 13 , and the fixing frame 12 . The connecting ear 121 is connected to the body. The fixing frame 12 is provided with a connecting post 122. The heat conducting plate 13 is fixedly connected to the connecting post 122 by screws 14 (but not limited to being fixed by screws 14), and the cooling chip 11 is disposed in the fixing frame 12. And connected to the top surface of the heat conducting plate 13, the bottom surface of the heat conducting plate 13 is in contact with the outer end of the top surface of the press 2 . The top surface of the fixing frame 12 is further provided with a heat dissipation hole 123.

The heat conducting plate 13 and the cooling fin 11 are in the form of a flat plate (but not limited to a flat plate shape, and may be in the shape of an arch or the like, and the main purpose thereof is to fit the surface of the press having different shapes).

A temperature sensor 15 is disposed on the top surface of the heat conducting plate 13 , and the temperature sensor 15 can timely feed the temperature of the pressing tube 2 to the microcontroller of the control board (not shown), and the microcontroller controls according to the relevant temperature information. The wafer 11 is cooled.

The heat sink 4 described above is generally made of aluminum or copper, and has a plurality of fins on its surface.

The heat conducting plate 13 may be a metal plate, a microcrystalline plate, a ceramic plate or the like.

Referring to the third embodiment shown in FIG. 6, the third embodiment is different from the second embodiment in that a heater 16 is further disposed on the top surface of the heat conducting plate 13. The heater 16 may be a PTC (Positive Temperature Coefficient) heating body or a heating wire. A temperature protector may be added to the top surface of the heat conducting plate 13 or the temperature sensor 15 may be replaced with a temperature protector. The temperature protector mainly refers to a fuse or a thermostat. When the temperature of the press 2 is higher than the predetermined warning temperature, the fuse is blown or the thermostat takes off to protect other parts.

The temperature sensor 15 senses and transmits a signal to the microcontroller to control the operation of the cryo wafer 11 and the heater 16, and the temperature of the cooled wafer 11 and the heater 16 is transmitted to the press 2 through the heat conducting plate 13 to reach the press 2 The temperature of demand.

The present invention also proposes a fourth embodiment. The fourth embodiment is different from the first embodiment in that the body corresponding to the heat sink is provided with a heat dissipation channel, and the heat sink extends into the heat dissipation channel (not shown). .

Although the present invention has been disclosed in the above preferred embodiments, it is not intended to limit the present invention, and anyone skilled in the art can make some changes and refinements without departing from the spirit and scope of the present invention. The scope of protection is subject to the definition of the scope of the patent application.

Although the present invention has been disclosed in the above preferred embodiments, it is not intended to limit the present invention, and anyone skilled in the art can make some changes and refinements without departing from the spirit and scope of the present invention. The scope of protection is subject to the definition of the scope of the patent application.

1‧‧‧ Refrigeration module

11‧‧‧Cold wafer

2‧‧‧Squeeze

3‧‧‧sucker

4‧‧‧ radiator

5‧‧‧ cooling fan

Claims (10)

A low temperature press oil press comprising:
a body
a squeeze, connected to the body; and a uniform cold module in contact with the surface of the press. The low temperature press oil press according to claim 1, wherein the refrigeration module comprises a uniform cold wafer, and the surface of the refrigerant wafer facing the press is provided with a heat sink. The low temperature press oil press according to claim 2, wherein the heat sink is provided with a heat dissipating fan. The low temperature press oil press according to claim 2, wherein the body is provided with a heat dissipation channel corresponding to the heat sink, and the heat sink extends into the heat dissipation channel. The low temperature press oil press according to claim 2, wherein the refrigeration module further comprises a fixing frame, the fixing frame is connected to the body, and the cooling chip is disposed in the fixing frame. The low temperature press oil press according to claim 2 or 5, further comprising a DC power supply terminal for supplying power to the refrigerant chip, the DC power supply terminal comprising a positive electrode and a negative electrode, and a positive and negative electrode passing between the positive electrode and the negative electrode A transfer switch is electrically connected to the refrigerant chip. The low-temperature press oil press according to claim 2, wherein the cooling module further comprises a heat conducting plate, the cooling chip is disposed on a top surface of the heat conducting plate, and the bottom surface of the heat conducting plate is The surface of the press is in contact. The low temperature press oil press according to claim 7, wherein the heat conducting plate and the cooling chip are flat or arched. The low temperature press oil press according to claim 7, wherein the surface of the heat conducting plate is provided with a temperature sensor and/or a temperature protector. The low temperature press oil press according to claim 7, wherein a top surface of the heat conducting plate is provided with a heater.