TWM471549U - Structure of LED lamp - Google Patents
Structure of LED lamp Download PDFInfo
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- TWM471549U TWM471549U TW102218558U TW102218558U TWM471549U TW M471549 U TWM471549 U TW M471549U TW 102218558 U TW102218558 U TW 102218558U TW 102218558 U TW102218558 U TW 102218558U TW M471549 U TWM471549 U TW M471549U
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- heat
- heat dissipation
- led light
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- lamp cover
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Description
本創作係有關一種LED燈之結構,尤指一種於散熱基板底部中央,設有一LED光源模組,其頂部之LED發光元件則貼合於散熱基板底面,於散熱基板周緣,設有複數個通氣孔或通氣槽孔,於散熱基板上方,設有一電源供應元件及一上燈罩,該上燈罩周邊設有複數散熱槽孔,於上燈罩頂部,另組設一端部具導電的螺旋頭之螺接座,以可螺接於燈座上,於使用時,LED發光元件所產生熱源溫度則傳導至其上方之散熱基板將熱源溫度擴散至整個散熱基板,而與空氣接觸產生熱交換作用,並藉散熱基板之溫度升高時產生熱氣流向上升之氣流牽引,使散熱基板下方之冷空氣被帶動並通過散熱基板周緣所設複數通氣孔或通氣槽孔後而進入上燈罩內,部份熱源再被上燈罩吸收,並藉此流動之空氣氣流將熱源由上燈罩周邊設有複數散熱槽孔帶出,進而有效降低LED光源模組之熱源,使其發揮最大光效益及延長其使用壽命之LED燈設計。The present invention relates to a structure of an LED lamp, in particular, an LED light source module is disposed at the center of the bottom of the heat dissipation substrate, and the LED light-emitting component at the top is attached to the bottom surface of the heat dissipation substrate, and a plurality of passes are disposed on the periphery of the heat dissipation substrate. The air hole or the vent hole is disposed above the heat dissipating substrate, and is provided with a power supply component and an upper lamp cover. The upper lamp cover is provided with a plurality of heat dissipation slots at the top of the upper lamp cover, and a screw head with a conductive screw head at one end is further disposed. The socket can be screwed to the lamp holder. When in use, the heat source temperature generated by the LED light-emitting element is transmitted to the heat-dissipating substrate above the heat-dissipating substrate to diffuse the heat source temperature to the entire heat-dissipating substrate, and the heat exchange effect is generated by contact with the air, and When the temperature of the heat dissipation substrate rises, the hot air flow is pulled toward the rising airflow, so that the cold air under the heat dissipation substrate is driven and passes through the plurality of vent holes or the ventilation holes at the periphery of the heat dissipation substrate to enter the upper lamp cover, and some of the heat sources are again The upper lampshade absorbs, and the air flow flowing through the air source is provided with a plurality of heat dissipation slots around the upper lamp cover, thereby effectively reducing the LED light source module. Source, so as to maximize the optical efficiency and extend the life of the LED lamp design.
按,因科技進步而帶動工商業發達,使各種科技產品在大量使用後產生了大量污染源及碳,使得我們居住之地球生態環境受到嚴重破壞,已嚴重威脅我們的生存環境,且在大量耗費地球能源下地球的能源亦有短缺之危機,因此,目前各國除致力於開發新能源外,亦提倡各種節約 能源之政策,如過去使用耗電量大之燈泡,目前也漸漸以省電之LED燈來取代,但為達一定之亮度,使用較大功率之LED燈時,其會產生高溫,而此高溫除影響LED燈之發光效率外,亦將使LED燈損壞,而減少其使用壽命。According to the advancement of science and technology, it has promoted the development of industry and commerce, which has caused a large number of pollution sources and carbon after the use of various scientific and technological products. This has caused the earth's ecological environment in which we live to be seriously damaged, which has seriously threatened our living environment and consumes a lot of energy. There is also a shortage of energy for the Earth’s energy. Therefore, in addition to developing new energy sources, countries are also promoting various savings. Energy policies, such as the use of large-capacity light bulbs in the past, are gradually being replaced by power-saving LED lights, but for a certain brightness, when using a higher-power LED lamp, it will generate high temperature, and this high temperature In addition to affecting the luminous efficiency of the LED lamp, it will also damage the LED lamp and reduce its service life.
目前因提倡節能減碳,故LED燈泡已成為主流,而一般之LED燈泡(7),如第四圖所示,其主要包括透光罩(71)、燈殼(72)、螺旋頭(73)及設於燈殼(72)內之LED及控制電路,其利用該燈殼(72)與外部空氣接觸,而使內部LED之熱源傳導予該燈殼(72),再藉燈殼(72)與外部之空氣產生熱交換,以達散熱之目的。At present, due to the promotion of energy saving and carbon reduction, LED bulbs have become the mainstream, and the general LED bulbs (7), as shown in the fourth figure, mainly include a translucent cover (71), a lamp housing (72), and a spiral head (73). And an LED and a control circuit disposed in the lamp housing (72), wherein the lamp housing (72) is in contact with the outside air, and the heat source of the internal LED is transmitted to the lamp housing (72), and then the lamp housing (72) ) It exchanges heat with the outside air for heat dissipation purposes.
但習知之LED燈泡(7),其LED係被包覆於燈殼(72)及透光罩(71)內,雖熱源可由燈殼(72)產生散熱作用,但因為密閉,其無法產生有效之熱對流作用,故其散熱效果相當有限,進而影響LED燈泡之亮度及使用壽命。However, the conventional LED bulb (7) is covered in the lamp housing (72) and the translucent cover (71). Although the heat source can be dissipated by the lamp housing (72), it cannot be effectively used because it is sealed. The heat convection action, so the heat dissipation effect is quite limited, which in turn affects the brightness and service life of the LED bulb.
本創作人有鑑於上述習知LED燈泡散熱設計不佳及有待改善之缺失,盼能提供一突破性之設計,以增進實用效果,乃潛心研思、設計組製,綜集其多年從事相關產品設計產銷之專業技術知識與實務經驗及研思設計所得之成果,終研究出本創作一種LED燈之結構,以提供使用者。In view of the poor design of the above-mentioned LED bulbs and the lack of improvement, the creator hopes to provide a breakthrough design to enhance the practical effect, which is devoted to research and design, and has been engaged in related products for many years. Designing the professional technical knowledge and practical experience of production and sales and the results of the research and design, and finally researched the structure of an LED lamp to provide users.
本創作主要係於散熱基板底部中央,設有一LED光源模組,其頂部之LED發光元件則貼合於散熱基板底面,於散熱基板周緣,設有複數個通氣孔或通氣槽孔,於散熱基板上方,設有一電源供應元件及一上燈罩,該上 燈罩周邊設有複數散熱槽孔,於上燈罩頂部,另組設一端部具導電的螺旋頭之螺接座,以可螺接於燈座上,於使用時,LED發光元件所產生熱源溫度則傳導至其上方之散熱基板將熱源溫度擴散至整個散熱基板,而與空氣接觸產生熱交換作用,並藉散熱基板之溫度升高時產生熱氣流向上升之氣流牽引,使散熱基板下方之冷空氣被帶動並通過散熱基板周緣所設複數通氣孔或通氣槽孔後而進入上燈罩內,部份熱源再被上燈罩吸收,並藉此流動之空氣氣流將熱源由上燈罩周邊設有複數散熱槽孔帶出,進而有效降低LED光源模組之熱源,使其發揮最大光效益及延長其使用壽命者。The present invention is mainly disposed at the center of the bottom of the heat dissipation substrate, and is provided with an LED light source module. The LED light emitting element at the top is attached to the bottom surface of the heat dissipation substrate, and a plurality of vent holes or vent holes are provided on the periphery of the heat dissipation substrate for the heat dissipation substrate. Above, there is a power supply component and an upper lamp cover, the upper A plurality of heat dissipating slots are formed in the periphery of the lampshade. On the top of the lampshade, a screw socket with a conductive screw head at one end is arranged to be screwed onto the lamp socket. When used, the temperature of the heat source generated by the LED light emitting component is The heat-dissipating substrate transmitted to the heat-dissipating substrate spreads the heat source temperature to the entire heat-dissipating substrate, and generates heat exchange by contact with the air, and generates a hot air flow to the rising airflow when the temperature of the heat-dissipating substrate rises, so that the cold air under the heat-dissipating substrate is After being driven by the plurality of vent holes or vent holes provided on the periphery of the heat dissipation substrate, the heat source is again absorbed by the upper lamp cover, and the air flow flowing through the air source is provided with a plurality of heat dissipation slots from the periphery of the upper lamp cover. Bring out, which effectively reduces the heat source of the LED light source module, so that it can maximize the light efficiency and extend its service life.
本創作之主要目的係藉於該散熱基板上設有複數個通氣孔,並於上燈罩周邊設有複數供空氣對流之散熱槽孔,散熱基板之溫度升高時產生熱氣流向上升之氣流牽引狀態,使散熱基板下方之冷空氣被帶動並通過散熱基板周緣所設複數通氣孔或通氣槽孔後而進入上燈罩內,部份熱源再被上燈罩吸收,並藉此流動之空氣氣流將熱源由上燈罩周邊設有複數散熱槽孔帶出,進而有效降低LED光源模組之熱源。The main purpose of the present invention is to provide a plurality of vent holes on the heat dissipating substrate, and a plurality of heat dissipating holes for air convection are arranged around the upper lamp cover. When the temperature of the heat dissipating substrate increases, the hot air flow is pulled toward the rising air stream. The cold air under the heat-dissipating substrate is driven and passed through the plurality of vent holes or vent holes in the periphery of the heat-dissipating substrate to enter the upper lamp cover, and some of the heat source is absorbed by the upper lamp cover, and the flow of the air is used to heat the heat source. A plurality of heat dissipation slots are provided around the upper cover to effectively reduce the heat source of the LED light source module.
為使 貴審查委員能更了解本創作之結構特徵及其功效,茲配合圖式並詳細說明於后。In order to make your review board more aware of the structural features and efficacy of this creation, we will cooperate with the schema and elaborate on it later.
(1)‧‧‧散熱基板(1) ‧‧‧thermal substrate
(11)‧‧‧通氣孔(11) ‧ ‧ vents
(12)‧‧‧鎖接孔(12)‧‧‧Lock holes
(2)‧‧‧電源供應元件(2) ‧‧‧Power supply components
(3)‧‧‧上燈罩(3) ‧‧‧Uplight cover
(31)‧‧‧散熱槽孔(31)‧‧‧Solution slots
(4)‧‧‧螺接座(4)‧‧‧ screw socket
(41)(73)‧‧‧螺旋頭(41) (73) ‧ ‧ spiral head
(5)‧‧‧LED光源模組(5)‧‧‧LED light source module
(51)‧‧‧光學透鏡(51)‧‧‧ Optical Lenses
(52)‧‧‧電路基板(52)‧‧‧ Circuit board
(53)‧‧‧LED發光元件(53)‧‧‧LED light-emitting elements
(6)‧‧‧燈座(6)‧‧‧ lamp holder
(7)‧‧‧LED燈泡(7)‧‧‧LED bulbs
(71)‧‧‧透光罩(71)‧‧‧Transparent cover
(72)‧‧‧燈殼(72)‧‧‧Light shell
第一圖係本創作試舉其中一較佳實施例之立體分解圖。The first figure is an exploded perspective view of one of the preferred embodiments of the present invention.
第二圖係本創作之立體外觀圖。The second picture is a three-dimensional appearance of the creation.
第三圖係本創作可鎖組於燈座之實施例立體分解圖。The third figure is an exploded perspective view of an embodiment in which the present invention can be locked in a lamp holder.
第四圖係習知LED燈泡之立體圖。The fourth figure is a perspective view of a conventional LED bulb.
請參閱第一圖及第二圖所示,本創作係有關一種LED燈之結構,其包括一LED光源模組(5)、一散熱基板(1)、一電源供應元件(2)、一上燈罩(3)及一螺接座(4)所構成,其中該LED光源模組(5)係包括光學透鏡(51)、電路基板(52)及LED發光元件(53)組合而成,LED光源模組(5)係設於散熱基板(1)底部中央,其頂部之LED發光元件(53)則貼合於散熱基板(1)底面,於散熱基板(1)周緣,設有複數個通氣孔(11)或通氣槽孔,於散熱基板(1)上方,設有一電源供應元件(2),於散熱基板(1)上設有可鎖組上燈罩(3)之鎖接孔(12),該上燈罩(3)周邊設有複數散熱槽孔(31),於上燈罩(3)頂部,另組設一端部具導電的螺旋頭(41)之螺接座(4),以可螺接於燈座(6)上(如第三圖所示),於使用時,LED發光元件(53)所產生熱源溫度則傳導至其上方之散熱基板(1)將熱源溫度擴散至整個散熱基板(1),而與空氣接觸產生熱交換作用,並藉散熱基板(1)之溫度升高時產生熱氣流向上升之氣流牽引,使散熱基板(1)下方之冷空氣被帶動並通過散熱基板(1)周緣所設複數通氣孔(11)或通氣槽孔後而進入上燈罩(3)內,部份熱源再被上燈罩(3)吸收,並藉此流動之空氣氣流將熱源由上燈罩(3)周邊所設複數散熱槽孔(31)帶出,進而有效降低LED光源模組(5)之熱源,進而達到散熱佳及壽命長之目的。Referring to the first figure and the second figure, the present invention relates to a structure of an LED lamp, which comprises an LED light source module (5), a heat dissipation substrate (1), a power supply component (2), and an upper The lamp cover (3) and a screw socket (4) are formed by combining the optical lens (51), the circuit substrate (52) and the LED light-emitting component (53), and the LED light source The module (5) is disposed at the center of the bottom of the heat dissipation substrate (1), and the LED light-emitting element (53) at the top of the heat-dissipating substrate (1) is attached to the bottom surface of the heat-dissipating substrate (1), and a plurality of vent holes are disposed on the periphery of the heat-dissipating substrate (1). (11) or a venting slot, above the heat dissipating substrate (1), a power supply component (2) is disposed, and a locking hole (12) for locking the lampshade (3) on the heat dissipating substrate (1) is disposed on the heat dissipating substrate (1). The upper lamp cover (3) is provided with a plurality of heat dissipation slots (31) at the top of the upper lamp cover (3), and a screw socket (4) having a conductive spiral head (41) at one end is provided for screwing On the lamp holder (6) (as shown in the third figure), in use, the temperature of the heat source generated by the LED light-emitting element (53) is transmitted to the heat-dissipating substrate (1) above which spreads the heat source temperature to the entire heat-dissipating substrate ( 1), and contact with air to generate heat Acting, and when the temperature of the heat-dissipating substrate (1) rises, the hot air flow is pulled toward the rising airflow, so that the cold air under the heat-dissipating substrate (1) is driven and the plurality of vent holes (11) are provided through the periphery of the heat-dissipating substrate (1). Or after venting the slot, entering the upper lamp cover (3), some of the heat source is absorbed by the upper lamp cover (3), and the air flow flowing through the heat source is provided with a plurality of heat dissipation slots (31) around the upper lamp cover (3). ) Bring out, and effectively reduce the heat source of the LED light source module (5), thereby achieving the purpose of good heat dissipation and long life.
其中於螺接座(4)端部可依所需組配所需規格具導電的螺旋頭(41),以可螺接於不同規格之燈座(6)上。At the end of the screw socket (4), a conductive spiral head (41) can be assembled according to the required specifications to be screwed to the lamp holders (6) of different specifications.
綜上所述,本創作具提供有效降低LED光源模組之熱源,進而達到散熱佳及壽命長,為一甚具新穎性、進步性及可供產業上應用之創作,實已符合新型專利之給予要件,爰依法提出專利申請,尚祈 貴審查委員能詳予審查,並早日賜准本案專利,實為德便。In summary, the creation tool provides a heat source for effectively reducing the LED light source module, thereby achieving good heat dissipation and long life. It is a novelty, progressive and industrial application, and has been in line with the new patent. Give the requirements, and file a patent application in accordance with the law. The members of the review committee can review the case in detail, and grant the patent in this case as soon as possible.
唯以上所述者,僅為本創作所舉之其中較佳實施例,當不能以之限定本創作之範圍,舉凡依本創作申請專利範圍所作之均等變化與修飾,皆應仍屬本創作專利涵蓋之範圍內。The above is only the preferred embodiment of the present invention. When it is not possible to limit the scope of this creation, the equivalent changes and modifications made by the patent application scope of this creation should still belong to this creation patent. Within the scope of coverage.
(1)‧‧‧散熱基板(1) ‧‧‧thermal substrate
(11)‧‧‧通氣孔(11) ‧ ‧ vents
(3)‧‧‧上燈罩(3) ‧‧‧Uplight cover
(31)‧‧‧散熱槽孔(31)‧‧‧Solution slots
(4)‧‧‧螺接座(4)‧‧‧ screw socket
(41)‧‧‧螺旋頭(41)‧‧‧Spiral head
(5)‧‧‧LED光源模組(5)‧‧‧LED light source module
(51)‧‧‧光學透鏡(51)‧‧‧ Optical Lenses
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TW102218558U TWM471549U (en) | 2013-10-04 | 2013-10-04 | Structure of LED lamp |
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TW102218558U TWM471549U (en) | 2013-10-04 | 2013-10-04 | Structure of LED lamp |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105258088A (en) * | 2014-07-15 | 2016-01-20 | 丽鸿科技股份有限公司 | Heat radiation structure of LED explosion-proof lamp |
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2013
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105258088A (en) * | 2014-07-15 | 2016-01-20 | 丽鸿科技股份有限公司 | Heat radiation structure of LED explosion-proof lamp |
TWI571597B (en) * | 2014-07-15 | 2017-02-21 | Light - emitting diode explosion - proof lamp cooling structure |
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