TWM488591U - LED heat dissipation module - Google Patents

LED heat dissipation module Download PDF

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Publication number
TWM488591U
TWM488591U TW103207743U TW103207743U TWM488591U TW M488591 U TWM488591 U TW M488591U TW 103207743 U TW103207743 U TW 103207743U TW 103207743 U TW103207743 U TW 103207743U TW M488591 U TWM488591 U TW M488591U
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Taiwan
Prior art keywords
heat dissipation
graphite
conductive sheet
heat
led
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TW103207743U
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Chinese (zh)
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Wei-Jia Huang
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Wei-Jia Huang
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Priority to TW103207743U priority Critical patent/TWM488591U/en
Publication of TWM488591U publication Critical patent/TWM488591U/en

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Description

LED散熱模組(一)LED cooling module (1)

本創作係有關於一種LED燈管,尤係關於一種運用石墨導熱片(石墨烯)進行散熱之LED散熱模組(一)。This creation is about an LED tube, especially for an LED cooling module that uses graphite thermal film (graphene) for heat dissipation (1).

一般傳統市售的照明燈,基本上存在著電耗量嚴重、發光元件壽命短、需經常耗費人力去更換等技術問題;為克服上述問題,已有技術揭露導入低耗電、高照明亮度及使用壽命長、不易損壞之LED燈,做為照明燈之照明發光元件。Generally, the conventional commercially available lighting lamps basically have technical problems such as serious power consumption, short life of the light-emitting elements, and frequent manual replacement, etc. In order to overcome the above problems, the prior art discloses introducing low power consumption and high illumination brightness. The LED lamp with long service life and not easy to be damaged is used as the illumination light-emitting component of the illumination lamp.

發光二極體(Light Emitting Diode,LED)由於具有低耗能、省電、使用壽命長、體積小、反應快等特點,故已逐漸取代傳統燈泡而應用在各種發光裝置上,如LED燈具即為其中之一。將LED應用在一般燈具(球炮燈或嵌燈)時,雖然LED燈只需小電量即可發光,然,其同時產生的高熱會導致電路基板上產生高溫現象,倘若無法及時有效地對電路基板散熱,將使電路板上的電子元件因高熱而有毀損或不正常工作的現象,造成燈具部份無法正常使用,且維修及使用成本也會增加。Light Emitting Diode (LED) has been replaced by traditional light bulbs and used in various light-emitting devices due to its low energy consumption, power saving, long service life, small size and fast response, such as LED lamps. For one of them. When the LED is applied to a general lamp (ball gun lamp or recessed lamp), although the LED lamp only needs a small amount of power to emit light, the high heat generated at the same time may cause high temperature on the circuit substrate, if the circuit cannot be effectively and timely The heat dissipation of the substrate will cause the electronic components on the circuit board to be damaged or not working properly due to high heat, so that the lamp parts cannot be used normally, and the maintenance and use costs will also increase.

有鑑於此,本創作人係為改善並解決上述之缺失,乃特潛心研究並配合學理之運用,終於提出一種設計合理且有效改善上述缺失之本創作。In view of this, the creator is trying to improve and solve the above-mentioned shortcomings, and he has devoted himself to researching and cooperating with the application of theory, and finally proposed a creation that is reasonable in design and effective in improving the above-mentioned defects.

本創作主要目的在於:運用石墨導電片能將由散熱基座傳導出的熱能以石墨導電片平面(X、Y軸)進行導熱及散熱,藉此提升整體導熱及散熱的效果。The main purpose of this creation is to use the graphite conductive sheet to heat and dissipate the heat energy radiated from the heat dissipation base by the graphite conductive sheet plane (X, Y axis), thereby improving the overall heat conduction and heat dissipation effect.

為達上述之目的,本創作係一種LED散熱模組(一),係包括:一電路板,該電路板供配置複數LED晶粒;一散熱基座,該散熱基座係界定一供配置該電路板之安裝表面及一背離該安裝表面方向之安裝部;至少一石墨導熱片(石墨烯),該石墨導熱片(石墨烯)係固定於該安裝部以供進行平面導熱;一透光罩,該透光罩係界定一供設置該散熱基座且遮罩各該LED晶粒之容置空間及一連接座,該連接座係裝設於該散熱基座並遮罩該石墨導熱片(石墨烯)。For the purpose of the above, the present invention is an LED heat dissipation module (1), comprising: a circuit board for configuring a plurality of LED dies; a heat dissipation pedestal, the heat dissipation pedestal defining a configuration a mounting surface of the circuit board and a mounting portion facing away from the mounting surface; at least one graphite thermal conductive sheet (graphene) fixed to the mounting portion for planar heat conduction; a transparent cover The light-transmissive cover defines a receiving space for providing the heat-dissipating base and covering each of the LED dies, and a connecting seat mounted on the heat-dissipating base and covering the graphite heat-conducting sheet ( Graphene).

根據本創作之一實施例,其中該安裝部係形成複數供固定該石墨導熱片(石墨烯)之卡合槽。According to an embodiment of the present invention, the mounting portion forms a plurality of engaging grooves for fixing the graphite thermal conductive sheet (graphene).

根據本創作之一實施例,其中該石墨導熱片(石墨烯)組裝方式為同心螺旋、同心圓或放射其中一者。According to an embodiment of the present invention, the graphite thermal conductive sheet (graphene) is assembled in a concentric spiral, a concentric circle or a radiation.

根據本創作之一實施例,其中該連接座係為一供電性連接一外接電源之電性接頭或嵌燈後蓋。According to an embodiment of the present invention, the connecting base is an electrical connector or a recessed rear cover electrically connected to an external power source.

1‧‧‧散熱模組1‧‧‧ Thermal Module

10、10c‧‧‧電路板10, 10c‧‧‧ circuit board

11、11c‧‧‧LED晶粒11, 11c‧‧‧LED dies

12、12a、12c‧‧‧散熱基座12, 12a, 12c‧‧‧ heat sink

120、120c‧‧‧安裝表面120, 120c‧‧‧ mounting surface

122、122a、122b、122c‧‧‧安裝部122, 122a, 122b, 122c‧‧‧ Installation Department

124a‧‧‧卡合槽124a‧‧‧ snap groove

13、13a、13b、13c‧‧‧石墨導熱片(石墨烯)13, 13a, 13b, 13c‧‧‧ graphite thermal conductive sheet (graphene)

14‧‧‧透光罩14‧‧‧Transparent cover

15、15a、15c‧‧‧連接座15, 15a, 15c‧‧‧ connectors

圖1 係為本創作較佳實施例之立體示意圖。1 is a perspective view of a preferred embodiment of the present invention.

圖2 係為本創作較佳實施例之立體分解示意圖。2 is a perspective exploded view of the preferred embodiment of the present invention.

圖3 係為本創作石墨導熱片(石墨烯)之熱傳導狀態示意圖。Fig. 3 is a schematic view showing the heat conduction state of the graphite heat conductive sheet (graphene).

圖4 係為本創作另一石墨導熱片(石墨烯)擺設之立體示意圖。Fig. 4 is a schematic perspective view showing another graphite heat conductive sheet (graphene).

圖5 係為本創作又一石墨導熱片(石墨烯)擺設之立體示意圖。Figure 5 is a three-dimensional schematic view of another graphite thermal conductive sheet (graphene).

圖6 係為本創作再一石墨導熱片(石墨烯)擺設之立體示意圖。Figure 6 is a three-dimensional schematic diagram of another graphite heat conductive sheet (graphene).

以下藉由具體實施例說明本創作之實施方式,熟悉此技藝之人士可由本說明書所揭示之內容輕易地瞭解本創作之其他優點及功效。The embodiments of the present invention are described below by way of specific examples, and those skilled in the art can readily understand other advantages and effects of the present invention from the disclosure of the present disclosure.

本說明書所附圖式所繪示之結構、比例、大小等,均僅用以配合說明書所揭示之內容,以供熟悉此技藝之人士之瞭解與閱讀,並非用以限定本創作可實施之限定條件,故不具技術上之實質意義,任何結構之修飾、比例關係之改變或大小之調整,在不影響本創作所能產生之功效及所能達成之目的下,均應仍落在本創作所揭示之技術內容得能涵蓋之範圍內。同時,本說明書中所引用之如“一”、“兩”、“上”等之用語,亦僅為便於敘述之明瞭,而非用以限定本創作可實施之範圍,其相對關係之改變或調整,在無實質變更技術內容下,當亦視為本創作可實施之範疇。The structure, the proportions, the sizes and the like of the drawings are only used to cope with the contents disclosed in the specification for the understanding and reading of those skilled in the art, and are not intended to limit the implementation of the present invention. Conditions, so it is not technically meaningful. Any modification of the structure, change of the proportional relationship or adjustment of the size should remain in the firm without affecting the effectiveness of the creation and the purpose that can be achieved. The technical content revealed can be covered. In the meantime, the terms “a”, “two”, “upper”, and the like, are used for convenience of description, and are not intended to limit the scope of the invention, the relative relationship may be changed or Adjustments, if there is no material change in the content of the technology, are also considered to be the scope of implementation of this creation.

請參閱圖1、圖2及圖3所示,係為本創作較佳實施例之立體示意圖、立體分解示意圖及石墨導熱片(石墨烯)之熱傳導狀態示意圖。本實施例中以同心螺旋方式將石墨導熱片(石墨烯)13設置於散熱基座12上,本創作的散熱模組1主要由電路板10、LED晶粒11、散熱基座12、石墨導熱片(石墨烯)13、透光罩14及連接座15組成,其中LED晶粒11係配置於電路板10, 並將此電路板10裝設在散熱基座12的安裝表面120,而背離安裝表面120方向的安裝部122則供設置一石墨導熱片(石墨烯)13,此石墨導熱片(石墨烯)13以螺旋方式設置,因此僅需單片石墨導熱片(石墨烯)13即可完成組裝,最後再將連接座15(以供電性連接一外接電源之電性接頭為例)裝設於散熱基座12並遮罩石墨導熱片(石墨烯)13。由於石墨導熱片(石墨烯)13主要以平面(X,Y軸)的傳導性最佳(箭頭為散熱方向),因此可提供較佳的平面導熱,本創作中的石墨導熱片(石墨烯)13係固定於安裝部122,所以其兩面均可進行前述的平面導熱,進而大幅提升整體導熱及散熱的效果。Please refer to FIG. 1 , FIG. 2 and FIG. 3 , which are schematic perspective views, a perspective exploded view of the preferred embodiment, and a schematic diagram of the heat conduction state of the graphite thermal conductive sheet (graphene). In this embodiment, a graphite thermal conductive sheet (graphene) 13 is disposed on the heat dissipation base 12 in a concentric spiral manner. The heat dissipation module 1 of the present invention is mainly composed of a circuit board 10, an LED die 11, a heat dissipation base 12, and graphite heat conduction. The sheet (graphene) 13 , the transparent cover 14 and the connecting base 15 are configured, wherein the LED die 11 is disposed on the circuit board 10 , The circuit board 10 is mounted on the mounting surface 120 of the heat dissipation base 12, and the mounting portion 122 facing away from the mounting surface 120 is provided with a graphite thermal conductive sheet (graphene) 13, which is a graphite thermal conductive sheet (graphene) 13 It is arranged in a spiral manner, so that only a single piece of graphite thermal conductive sheet (graphene) 13 is required for assembly, and finally the connecting base 15 (for example, an electrical connection for supplying an external power supply with power supply) is mounted on the heat dissipation base. 12 and cover the graphite thermal conductive sheet (graphene) 13. Since the graphite thermal conductive sheet (graphene) 13 has the best conductivity in the plane (X, Y axis) (the arrow is the heat dissipation direction), it can provide better planar heat conduction, and the graphite thermal conductive sheet (graphene) in the present creation. Since the 13 series is fixed to the mounting portion 122, the above-described planar heat conduction can be performed on both sides, thereby greatly improving the overall heat conduction and heat dissipation effect.

一併請參閱圖4所示,係為本創作另一石墨導熱片(石墨烯)擺設之立體示意圖。此實施例中係以嵌燈樣式為例,石墨導熱片(石墨烯)13a以放射狀方式設置於散熱基座12a的安裝部122a上,再將連接座15a(以嵌燈後蓋為例)裝設在散熱基座12a以遮罩石墨導熱片(石墨烯)13a,值得一提的是在安裝部122a上係形成複數卡合槽124a,透過卡合槽124a將多個石墨導熱片(石墨烯)13a固定於其內,由於卡合槽124a以放射狀的結構成形,因此讓每片的石墨導熱片(石墨烯)13a於固定後亦呈現放射狀。Please refer to FIG. 4 together for a schematic view of another graphite heat conductive sheet (graphene). In this embodiment, a recessed light pattern is taken as an example, and a graphite heat conductive sheet (graphene) 13a is radially disposed on the mounting portion 122a of the heat dissipation base 12a, and then the connecting seat 15a (for example, a recessed rear cover) Mounted on the heat dissipation base 12a to cover the graphite thermal conductive sheet (graphene) 13a, it is worth mentioning that a plurality of engagement grooves 124a are formed on the mounting portion 122a, and a plurality of graphite thermal conductive sheets (graphite) are passed through the engagement grooves 124a. The olefin 13a is fixed therein, and since the engaging groove 124a is formed in a radial structure, the graphite heat conductive sheet (graphene) 13a of each sheet is also radially formed after being fixed.

除前述石墨導熱片(石墨烯)的組裝方式外,另一種方式則以同心圓做為組裝樣式,請參閱圖5所示,為本創作又一石墨導熱片(石墨烯)擺設之立體示意圖。其中將多片石墨導熱片(石墨烯)13b以中心圍繞而成,運用同心方式將石墨導熱片(石墨烯)13b組裝在安裝部122b,且呈現多層次結構的態樣使得石墨導熱片(石墨烯)13b數量增加,進而提升整體散熱效率,石墨導熱片(石墨烯)13b的固定方式可以黏膠方式黏著固定,或運用圖4的方式進行嵌合固定。In addition to the above-mentioned graphite thermal conductive sheet (graphene) assembly method, the other way is to use concentric circles as the assembly style, please refer to FIG. 5, which is a three-dimensional schematic diagram of another graphite thermal conductive sheet (graphene). Wherein a plurality of graphite heat conductive sheets (graphene) 13b are centered, and the graphite heat conductive sheet (graphene) 13b is assembled in the mounting portion 122b in a concentric manner, and the multi-layer structure is formed to make the graphite heat conductive sheet (graphite) The number of ene) 13b is increased, thereby improving the overall heat dissipation efficiency, and the fixing method of the graphite thermal conductive sheet (graphene) 13b can be fixed by adhesive bonding or by using the method of FIG.

一併參考圖6所示,係為本創作再一石墨導熱片(石墨烯)擺設之立體示意圖。電路板10c以錐形為主要結構,並在多面的電路板10c上均設有LED晶粒11c,藉此可增加照明範圍,而散熱基座12a亦做成與電路板10c可相對應組裝的錐形結構,藉此可讓散熱基座12a的安裝表面120c貼合於電路板10c,另外,石墨導熱片(石墨烯)13c以圓筒狀方式設置於散熱基座12c的安裝部122c上,且石墨導熱片(石墨烯)13c則貼合在連接座15c內面,進而大幅提升整體導熱及散熱的效果。Referring to FIG. 6 together, it is a three-dimensional schematic diagram of another graphite heat conductive sheet (graphene). The circuit board 10c has a tapered structure as a main structure, and LED crystal chips 11c are provided on the multi-sided circuit board 10c, thereby increasing the illumination range, and the heat dissipation base 12a is also made to be assembled corresponding to the circuit board 10c. a tapered structure, whereby the mounting surface 120c of the heat dissipation base 12a is attached to the circuit board 10c, and the graphite heat conductive sheet (graphene) 13c is disposed on the mounting portion 122c of the heat dissipation base 12c in a cylindrical manner. Moreover, the graphite heat conductive sheet (graphene) 13c is attached to the inner surface of the connecting seat 15c, thereby greatly improving the overall heat conduction and heat dissipation effect.

本創作中石墨導熱片(石墨烯)13可運用在任何LED燈泡及LED嵌燈,且石墨導熱片(石墨烯)13可以各種樣式不同數量進行組裝,最重要的是,各石墨導熱片(石墨烯)13必須以的方式裝設在散熱基座12,由於石墨導熱片(石墨烯)13主要以平面(X,Y軸)的傳導性最佳(箭頭為散熱方向),因此可提供較佳的平面導熱,本創作中的石墨導熱片(石墨烯)13係固定於安裝部122,所以其兩面均可進行前述的平面導熱,進而大幅提升整體導熱及散熱的效果。In this creation, the graphite thermal conductive sheet (graphene) 13 can be applied to any LED bulb and LED recessed lamp, and the graphite thermal conductive sheet (graphene) 13 can be assembled in various styles and, most importantly, each graphite thermal conductive sheet (graphite) The olefin 13 must be installed in the heat dissipation pedestal 12, and since the graphite heat conductive sheet (graphene) 13 is mainly in the plane (X, Y axis), the conductivity is optimal (the arrow is the heat dissipation direction), so that it is preferable. The plane heat conduction, the graphite heat conductive sheet (graphene) 13 in the present invention is fixed to the mounting portion 122, so that the above-mentioned planar heat conduction can be performed on both sides, thereby greatly improving the overall heat conduction and heat dissipation effect.

10‧‧‧電路板10‧‧‧ boards

11‧‧‧LED晶粒11‧‧‧LED dies

12‧‧‧散熱基座12‧‧‧ Thermal base

13‧‧‧石墨導熱片(石墨烯)13‧‧‧ graphite thermal conductive sheet (graphene)

14‧‧‧透光罩14‧‧‧Transparent cover

Claims (4)

一種LED散熱模組(一),係包括:一電路板,該電路板供配置複數LED晶粒;一散熱基座,該散熱基座係界定一供配置該電路板之安裝表面及一背離該安裝表面方向之安裝部;至少一石墨導熱片,該石墨導熱片係固定於該安裝部以供進行平面導熱;一透光罩,該透光罩係界定一供設置該散熱基座且遮罩各該LED晶粒之容置空間;及一連接座,該連接座係裝設於該散熱基座並遮罩該石墨導熱片。An LED heat dissipation module (1) includes: a circuit board for configuring a plurality of LED dies; a heat dissipation pedestal defining a mounting surface for arranging the circuit board and a deviation from the a surface mounting portion; at least one graphite heat conductive sheet fixed to the mounting portion for planar heat conduction; and a light transmissive cover defining a heat dissipating base and a mask An accommodating space of each of the LED dies; and a connecting base mounted on the heat dissipating pedestal and covering the graphite thermal conductive sheet. 如申請專利範圍第1項所述之LED散熱模組(一),其中該安裝部係形成複數供固定該石墨導熱片之卡合槽。The LED heat dissipation module (1) according to claim 1, wherein the mounting portion forms a plurality of engaging grooves for fixing the graphite heat conductive sheet. 如申請專利範圍第1項所述之LED散熱模組(一),其中該石墨導熱片組裝方式為同心螺旋、同心圓或放射其中一者。The LED heat dissipation module (1) according to claim 1, wherein the graphite heat conduction sheet is assembled in a concentric spiral, a concentric circle or a radiation. 如申請專利範圍第1項所述之LED散熱模組(一),其中該連接座係為一供電性連接一外接電源之電性接頭或嵌燈後蓋。The LED heat dissipation module (1) of claim 1, wherein the connection seat is an electrical connector or a recessed rear cover electrically connected to an external power supply.
TW103207743U 2014-05-02 2014-05-02 LED heat dissipation module TWM488591U (en)

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