TWM493002U - External heat dissipation fin of LED lighting device - Google Patents

Description

External heat sink fins for LED lighting

The external heat-dissipating fins of the LED lighting device of the present invention are especially the external heat-dissipating fins of the high-power medium- and large-sized LED light-emitting device. The heat-dissipating fin has an L-shaped cross section and is disposed on the heat-dissipating fin. The lower plate body is provided with a plurality of through holes for assembling the heat dissipation fins to the outside of the illumination device casing, and a plurality of through air holes are arranged on the heat dissipation fins on the side plates of the heat dissipation fins. It can be set as an airflow hole fin protruding outward.

General LED lighting devices include small LED bulbs, tubes and high-power medium- and large-sized LEDs for lighting. In terms of heat dissipation of related small LED bulbs and tubes, most of them use bulb holders or lamps. The tube holder directly molds the heat dissipation fins and the associated heat dissipation surface area design, and the heat dissipation technology of the known LED lighting devices is as follows: known announcement No. M352879 "Connecting device for LED lamps and heat sink fins", Announcement No. M352635 "LED Lighting Fixture and Its Heat Dissipating Device", Announcement No. M357566 "High Power LED Lighting Fixture and Its Heat Dissipation Structure", Announcement No. M358257 "LED Lamps with Streamline Curved Heat Dissipation Structure", Announcement No. M362944" LED Lamp Cooling Module", Announcement No. I315180 "Combination of Light Emitting Diode and Heat Dissipating Device", Announcement No. M352879 "LED Illuminator with Heat Dissipating Device", Announcement No. I321630 "LED Light Emitting Dipole with Heat Dissipating Structure" "Lamps", Announcement No. M384972 "LED Lamps and Their Heat Dissipation Structures", Announcement No. I331200 "Heat Dissipating Devices and Their Applications "," M403608 "Disarming Module for LED Lamps", Announcement No. M395119 "LED Lighting with High Efficiency Radiator", Announcement No. M395117 "LED Lighting Device and Its Heat Dissipation Structure", Announcement I335402 "Light-emitting diode lamps with heat-dissipating structure", Announcement No. M403608 "Heat-dissipation module for LED lamps", Announcement No. I349084 "Light-emitting diode lamps with heat-dissipating structure", Announcement No. I349083 "Light-emitting diode lamp with heat-dissipating structure", Announcement No. M413089 "LED lamp for heat-dissipating structure of guide vane", Announcement No. M415258 "Radiator and LED lighting device with the same", Announcement No. M420646 LED heat-dissipating device", Announcement No. M423204 "High-efficiency heat-dissipating LED lamp", Announcement No. I359243 "LED lamp with heat-dissipating effect", Announcement No. M424451 "LED lamp heat-dissipation structure (1)", Announcement No. M424450 "LED Lamp Heat Dissipation Structure (2)", Announcement No. I394919 "LED Lamp and Its Heat Dissipation Structure", Announcement No. M467819 "LED Lighting Device and Its Radiator (1)", Announcement D16 A number of prior art technical documents such as "The Part of the Heatsink of the LED Bulb" and the No. I449226 "The Heat Dissipation Structure for the Light Emitting Diode Device".

However, most of the heat-dissipation designs of various LED LED lighting devices are aimed at research and development of small and medium-sized lighting devices (light bulbs, lamps), and the reason for this is because of small and medium-sized The lighting device (light bulb, lamp tube) has a large market and a large amount of use, and the industrial economic benefit is high (because the bulb heat sink of the bulb and the lamp tube can be modularized, the mold is small, and the development investment cost is low) However, for large and medium-sized lighting devices, because of the large size and high investment cost of mold development, there are few related technical creations. However, the heat dissipation performance requirements of such high-power medium and large-sized lighting devices are required to be rapid. Thermal conductivity, rapid cooling and cooling, as well as low-cost, high-efficiency performance, therefore, the need for heat dissipation devices for medium and large-scale lighting devices is also urgently necessary for innovation and efficiency.

The main purpose of the "external heat sink fins of LED lighting devices" created in this case is to provide a practical heat sink fin for rapid thermal conduction and rapid heat dissipation.

The utility model is characterized in that: the cross section of the heat dissipation fin is L-shaped, and the lower plate body of the heat dissipation fin is provided with a plurality of through holes for screwing the heat dissipation fins to the outside of the illumination device housing, and the heat dissipation fins are arranged on the heat dissipation fins. The rafter is provided with a plurality of through-hole airflow holes, and the peripheral edge of one side of the airflow hole may be provided as an outwardly protruding airflow hole heat sink.

The heat-dissipating fins are distributed outside the illuminating device casing, and the plurality of penetrating airflow holes provided on the heat-dissipating fins and the stern plate, and the one-side hole periphery of the airflow hole can be disposed to protrude outwardly from the airflow hole. The film makes the overall heat dissipation fins achieve the practical benefits of rapid thermal conduction and rapid cooling and cooling.

1‧‧‧Heat fins

11‧‧‧ lower plate

12‧‧‧through holes

13‧‧‧伫板

130‧‧‧ board edge

14‧‧‧ airflow hole

141‧‧‧Airflow fins

Fig. 1 is a perspective view of the present embodiment.

Figure 2: Front view of the embodiment of Figure 1.

Figure 3: Left view of Figure 2.

Figure 4: A-A cross-sectional view of Figure 2.

Fig. 5 is a perspective view showing another embodiment of the present creation.

Figure 6: Front view of the embodiment of Figure 5.

Figure 7: Left view of Figure 6.

Figure 8: Section B-B of Figure 6.

Please refer to the first and fifth figures in the drawing for different examples of the application of the case, but the technical idea of the creation is the same different application, and the embodiments of the different heat dissipation fins have the same L-shaped cross. In the cross section, a plurality of through holes for the heat dissipating fins to be assembled outside the illuminating device housing are disposed on the lower plate of the heat dissipating fins, and a plurality of through air holes are formed in the slab of the heat dissipating fins.

Referring to the embodiment shown in FIG. 1 to FIG. 4 , the lower body 11 of the heat dissipation fin 1 is provided with a plurality of through holes 12 for assembling the heat dissipation fins 1 to the outside of the illumination device housing by screws or rivets; The plurality of through air holes 14 are formed in the raft 13 of the heat dissipating fins 1, and the upper rim of the slab 13 can be an irregular or regular curved rim 130 according to the design.

Referring to the embodiment shown in FIG. 5 to FIG. 8 , the lower body 11 of the heat dissipation fin 1 is provided with a plurality of through holes 12 for assembling the heat dissipation fins 1 to the outside of the illumination device housing by screws or rivets; A plurality of through air holes 14 are formed in the raft 13 of the heat dissipating fins 1, and the upper rim of the slab 13 can be an irregular or regular curved rim 130 according to the design to increase the raft 13 The heat dissipation area and the cooling efficiency of the edge 130 can be set. The outer peripheral edge of the airflow hole 14 can be disposed as an outwardly protruding airflow hole fin 141 to increase the heat dissipation area of the airflow hole 14 and the cooling effect of the airflow.

The heat-dissipating fins are evenly or unevenly distributed on the outside of the illuminating device casing, and are provided by a plurality of penetrating airflow holes provided on the heat-dissipating fins and the sill plates, and a peripheral hole of one side of the airflow holes. The outwardly protruding airflow fins can surely achieve the rapid thermal conductivity of the fins, the practical benefits of rapid cooling and cooling, and the novel and progressive industrial utilization and economic efficiency.

1‧‧‧Heat fins

11‧‧‧ lower plate

12‧‧‧through holes

13‧‧‧伫板

130‧‧‧ board edge

14‧‧‧ airflow hole

Claims (3)

An external heat dissipating fin of an LED lighting device, the heat dissipating fin has an L-shaped cross section, a plurality of through holes are arranged in the lower plate of the heat dissipating fin, and a plurality of through air flows are arranged on the fin of the heat dissipating fin hole. The external heat-dissipating fin of the LED lighting device according to the first aspect of the invention, wherein the heat-dissipating fin is provided with a gas-convenient fin on the side of the air-flow hole. The external heat dissipating fin of the LED lighting device according to claim 1, wherein the fin edge of the heat dissipating fin is an irregular or regular curved edge.