TWI571597B - Light - emitting diode explosion - proof lamp cooling structure - Google Patents
Light - emitting diode explosion - proof lamp cooling structure Download PDFInfo
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- TWI571597B TWI571597B TW103126829A TW103126829A TWI571597B TW I571597 B TWI571597 B TW I571597B TW 103126829 A TW103126829 A TW 103126829A TW 103126829 A TW103126829 A TW 103126829A TW I571597 B TWI571597 B TW I571597B
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V25/00—Safety devices structurally associated with lighting devices
- F21V25/12—Flameproof or explosion-proof arrangements
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
- F21V29/507—Cooling arrangements characterised by the adaptation for cooling of specific components of means for protecting lighting devices from damage, e.g. housings
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
- F21V29/773—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
本發明有關於一種發光二極體防爆燈散熱結構，尤指一種散熱效果較佳並能兼顧防爆特性之發光二極體防爆燈散熱結構。
The invention relates to a heat-dissipating structure of a light-emitting diode explosion-proof lamp, in particular to a heat-dissipating structure of a light-emitting diode explosion-proof lamp which has better heat dissipation effect and can simultaneously take into consideration explosion-proof characteristics.
發光二極體(Light-Emitting Diode, LED)具有體積小、反應速度快、使用壽命長等優點，以往發光二極體的用途主要為螢幕的背光板光源使用，經不斷研究改良之後，現今已發展出利用發光二極體作為光源的照明燈具。然而，當發光二極體在高溫下，其使用壽命會顯著地縮短，而發光二極體運作時產生的廢熱無法經由紅外線輻射排出，僅能以傳導方式散出，因此，一般的發光二極體燈具常連接有導熱材料以降低熱阻，使廢熱能傳導至燈具外部，當發光二極體應用於防爆燈具時，需要將燈具內置放光源的空間與外界環境密閉，致使廢熱更難以逸散。
台灣專利公告號第M461751號便提供一種發光二極體燈具及其導熱裝置，其設有至少一導熱裝置，包括至少一基座，包括一電路基板層設於一導熱基板上，電路基板上設有至少一發光二極體，導熱基板下表面連接熱導管一端之連接部，熱導管另一端並設有固定部，以利用固定部將導熱裝置設置於環形散熱鰭片，其內緣環設有至少一容置座以分別裝設導熱裝置，環形散熱鰭片上設有蓋體遮罩環形散熱鰭片，以及燈座固定於環形散熱鰭片下以組裝為發光二極體燈具。故而藉由熱導管搭配散熱鰭片可有效提高燈具的散熱效益，並適用於各種燈具。
然而，先前技術採用熱導管將發光二極體產生之廢熱傳導至環形散熱鰭片之方式，由於散熱鰭片之散熱效果與其表面積有關，若燈具採用大功率的發光二極體時，散熱鰭片之體積與重量將相應地增大，不但在製造成本上是一大負擔，使用時亦會造成空間上的限制。是以，先前技術實有改良之必要。Light-Emitting Diode (LED) has the advantages of small size, fast response speed and long service life. The use of the light-emitting diode in the past is mainly used for the backlight source of the screen. After continuous research and improvement, it is now A lighting fixture using a light-emitting diode as a light source has been developed. However, when the light-emitting diode is at a high temperature, its service life is significantly shortened, and the waste heat generated by the operation of the light-emitting diode cannot be discharged through the infrared radiation, and can only be transmitted in a conductive manner, and therefore, the general light-emitting diode The body lamp is often connected with a heat conductive material to reduce the thermal resistance, so that the waste heat energy is transmitted to the outside of the lamp. When the light emitting diode is applied to the explosion-proof lamp, the space in which the light source is built and sealed is sealed with the external environment, so that the waste heat is more difficult to escape.
Taiwan Patent Publication No. M461751 provides a light-emitting diode lamp and a heat-dissipating device thereof, which is provided with at least one heat-conducting device, including at least one base, comprising a circuit substrate layer disposed on a heat-conducting substrate, and a circuit substrate There is at least one light emitting diode, the lower surface of the heat conductive substrate is connected with the connecting portion of one end of the heat pipe, and the other end of the heat pipe is provided with a fixing portion for fixing the heat conducting device to the annular heat radiating fin by the fixing portion, and the inner edge ring is provided At least one receiving seat is respectively provided with a heat conducting device, the annular heat radiating fin is provided with a cover body covering the annular heat radiating fin, and the lamp socket is fixed under the annular heat radiating fin to be assembled into the light emitting diode lamp. Therefore, the heat pipe with the heat sink fins can effectively improve the heat dissipation efficiency of the lamp and is suitable for various lamps.
However, the prior art uses a heat pipe to conduct the waste heat generated by the light-emitting diode to the annular heat-dissipating fin. Since the heat-dissipating effect of the heat-dissipating fin is related to its surface area, if the lamp adopts a high-power light-emitting diode, the heat-dissipating fin The volume and weight will increase accordingly, which is not only a burden on the manufacturing cost, but also causes space constraints when used. Therefore, the prior art has been improved.
本發明之目的，在於解決上述先前技術中防爆燈具採用熱導管與散熱鰭片組合之散熱方式造成防爆燈具整體體積過大及重量過重之問題。
為解決上述問題，本發明提供一種發光二極體防爆燈散熱結構，包含有一照明模組、一窗框罩體、一燈具罩體、一導熱盤、以及複數個緊迫件。該照明模組包含有一基座，以及至少一設置於該基座上之發光二極體。該窗框罩體包含有一透光部，一環設於該透光部之窗框部，以及複數個開設於該窗框部之窗框連接孔。該燈具罩體包含有一蓋狀部，以及複數個設置於該蓋狀部之燈具連接孔，該導熱盤連接於該基座，並包含有複數個對應該些窗框連接孔以及該些燈具連接孔之設置孔。該些緊迫件分別穿設於該些窗框連接孔、該些設置孔、以及該些燈具連接孔以壓合固定該窗框罩體以及該燈具罩體於該導熱盤之相對兩側，該窗框罩體罩覆該導熱盤連接該基座之一側且該透光部對應於該發光二極體，該燈具罩體罩覆該導熱盤相對該窗框罩體之另一側，且該導熱盤連接該窗框罩體及該燈具罩體之面積大於該窗框罩體以及該燈具罩體罩覆於該導熱盤之面積。
進一步地，該導熱盤連接該基座之一側設置有一容置部，該容置部包含有複數個以該導熱盤連接該基座位置為中心呈輻射狀設置之凹槽，且該發光二極體防爆燈散熱結構更包含有複數個分別設置於該些凹槽中的導熱材。
進一步地，該容置部包含有至少一彎折凹槽，且該彎折凹槽具有一對應設置於該導熱盤連接該基座位置之凹槽彎折段。
進一步地，該窗框罩體罩以及該燈具罩體覆於該導熱盤界定一密閉區，該容置部設置於該密閉區內。
進一步地，該導熱盤開設有複數個環繞該密閉區設置之散熱孔，且該些散熱孔係具有複數個鋸齒狀之缺口。
進一步地，該導熱盤包含有二板件，該些板件相互連接之一側分別對應凹陷形成一夾置部，該夾置部包含有複數個以該導熱盤連接該基座位置為中心呈輻射狀設置之嵌槽，且該發光二極體防爆燈散熱結構更包含有複數個分別設置於該些嵌槽中的導熱材。
進一步地，該夾置部包含有至少一彎折嵌槽，且該彎折嵌槽具有一對應設置於該導熱盤連接該基座位置之嵌槽彎折段。
進一步地，該窗框罩體以及該燈具罩體罩覆於該導熱盤界定一密閉區，該導熱盤開設有複數個環繞該密閉區及該些導熱材之散熱孔，且該些散熱孔係具有複數個鋸齒狀之缺口。
進一步地，該窗框罩體以及該燈具罩體罩覆於該導熱盤界定一密閉區，該些板件分別對應凹陷形成複數個環繞該密閉區及該些導熱材之散熱腔，該導熱盤開設有複數個貫通該散熱腔之散熱孔，且該些散熱孔係具有複數個鋸齒狀之缺口。
進一步地，該導熱盤包含有二夾板，以及一設置於該些夾板中間之隔板，該隔板設有複數個以該導熱盤連接該基座位置為中心呈輻射狀設置並受該些夾板封閉之容置腔，且該發光二極體防爆燈散熱結構更包含有複數個分別設置於該些容置腔中的導熱材。
進一步地，該窗框罩體以及該燈具罩體罩覆於該導熱盤界定一密閉區，該導熱盤開設有複數個環繞該密閉區及該些導熱材設置之散熱孔，且該些散熱孔係具有複數個鋸齒狀之缺口。
進一步地，該窗框罩體以及該燈具罩體罩覆於該導熱盤界定一密閉區，該隔板設有複數個環繞該密閉區及該些導熱材之散熱腔，該些夾板開設有複數個對應於該些散熱腔上之散熱孔，且該些散熱孔係具有複數個鋸齒狀之缺口。
進一步地，所述之發光二極體防爆燈散熱結構更進一步包含有複數個設置於該導熱盤連接該燈具罩體之一側的擴充鰭片。
是以，本發明相較於先前技術具有以下有益功效：
1.本發明透過將發光二極體產生之廢熱自基座上傳導至相對大面積的導熱盤，並且導熱盤可突伸至燈具外部與空氣接觸，增加散熱效率，藉以取代傳統採用體積較大的導熱材與散熱鰭片之組合方式。此外，本發明導熱盤突伸至燈具外部的面積增加時，由於同時增加了導熱盤傳熱時接觸空氣的面積，而可進一步提高其散熱效率。
2.本發明之燈具罩體、導熱盤以及窗框罩體相互壓合固定，能隔絕燈具內部與外部空間，以達到防爆之目的。
3.本發明之導熱盤加裝導熱材以進一步提高傳導廢熱之效率，並延長火焰路徑以防止火花產生，增加防爆之效果。
4.本發明之散熱孔包含有呈鋸齒狀之缺口、以及於該些板件上凹陷所形成之散熱腔，可進一步提高散熱之效率，此外，本發明藉由二板件將該導熱材封閉於其中可防止火花產生以增加防爆之效果。The object of the present invention is to solve the problem that the explosion-proof lamp adopts the heat dissipation mode of the combination of the heat pipe and the heat dissipation fin in the prior art, and the overall volume of the explosion-proof lamp is too large and the weight is too heavy.
In order to solve the above problems, the present invention provides a heat dissipation structure for a light-emitting diode explosion-proof lamp, comprising a lighting module, a window frame cover, a lamp cover body, a heat conducting plate, and a plurality of pressing members. The lighting module includes a base and at least one light emitting diode disposed on the base. The sash cover includes a light transmitting portion, a ring is disposed on the window frame portion of the light transmitting portion, and a plurality of window frame connecting holes are formed in the window frame portion. The luminaire cover includes a cover portion and a plurality of luminaire connection holes disposed on the cover portion, the heat conducting plate is coupled to the pedestal, and includes a plurality of corresponding sash connection holes and the luminaire connections Hole setting hole. The stiles are respectively disposed on the stile connection holes, the installation holes, and the luminaire connection holes to press and fix the sash cover and the illuminant cover on opposite sides of the thermal pad. a sash cover covering the one side of the pedestal and the light transmitting portion corresponding to the light emitting diode, the illuminating cover covering the other side of the sash cover The area of the heat shield disk connecting the window frame cover and the lamp cover body is larger than the area of the window frame cover and the lamp cover cover.
Further, a receiving portion is disposed on a side of the heat conducting plate connected to the base, and the receiving portion includes a plurality of grooves radially disposed with the heat conducting plate connected to the base, and the light emitting device The pole body explosion-proof lamp heat dissipation structure further comprises a plurality of heat-conducting materials respectively disposed in the grooves.
Further, the accommodating portion includes at least one bending groove, and the bending groove has a groove bending portion corresponding to the position where the heat conducting plate is connected to the base.
Further, the sash cover cover and the illuminating cover cover the heat conducting plate to define a sealed area, and the accommodating portion is disposed in the sealed area.
Further, the heat conducting plate is provided with a plurality of heat dissipation holes disposed around the sealing region, and the heat dissipation holes have a plurality of zigzag notches.
Further, the heat conducting plate comprises two plate members, and the one side of each of the plate members is respectively connected to the recess to form a sandwiching portion, and the sandwiching portion comprises a plurality of positions with the heat conducting disk connected to the base as a center. The radiatingly disposed recessed groove further comprises a plurality of heat conducting materials respectively disposed in the plurality of recessed grooves.
Further, the clamping portion comprises at least one bending groove, and the bending groove has a corresponding groove bending section corresponding to the position where the heat conducting plate is connected to the base.
Further, the sash cover and the illuminator cover cover the heat-conducting disk to define a sealed area, and the heat-dissipating disk is provided with a plurality of heat-dissipating holes surrounding the sealing area and the heat-conducting materials, and the heat-dissipating holes are There are a plurality of zigzag gaps.
Further, the sash cover and the illuminator cover cover the heat-conducting disk to define a sealed area, and the plate-shaped recesses respectively form a plurality of heat-dissipating cavities surrounding the sealing area and the heat-conducting materials, and the heat-dissipating disk A plurality of heat dissipation holes penetrating through the heat dissipation cavity are formed, and the plurality of heat dissipation holes have a plurality of zigzag notches.
Further, the heat conducting plate comprises two clamping plates, and a partition plate disposed in the middle of the clamping plates, wherein the partition plate is provided with a plurality of splints arranged radially around the position of the heat conducting plate connected to the base plate. The heat-dissipating structure of the light-emitting diode explosion-proof lamp further comprises a plurality of heat-conducting materials respectively disposed in the accommodating cavities.
Further, the sash cover and the illuminator cover cover the heat-conducting disk to define a sealed area, and the heat-dissipating plate is provided with a plurality of heat-dissipating holes surrounding the sealing area and the heat-dissipating materials, and the heat-dissipating holes There are a plurality of zigzag gaps.
Further, the sash cover and the illuminator cover cover the heat-conducting disk to define a sealed area, the partition is provided with a plurality of heat-dissipating cavities surrounding the sealing area and the heat-conducting materials, and the plywoods are provided with a plurality of Corresponding to the heat dissipation holes on the heat dissipation cavities, and the heat dissipation holes have a plurality of zigzag gaps.
Further, the light-emitting diode explosion-proof lamp heat dissipation structure further includes a plurality of expansion fins disposed on a side of the heat-conducting disk connected to the lamp cover.
Therefore, the present invention has the following beneficial effects as compared with the prior art:
1. The invention transmits the waste heat generated by the light-emitting diode from the base to the relatively large-area heat-conducting disk, and the heat-conducting disk can protrude to the outside of the lamp to contact with the air, thereby increasing the heat dissipation efficiency, thereby replacing the traditional large volume. The combination of heat conductive material and heat sink fins. In addition, when the area of the heat conducting disk protruding to the outside of the lamp increases, the heat dissipation efficiency can be further improved by simultaneously increasing the area of the heat conducting disk to contact the air during heat transfer.
2. The lamp cover body, the heat conducting plate and the window frame cover of the invention are pressed and fixed to each other, and can isolate the inner and outer space of the lamp to achieve the purpose of explosion protection.
3. The heat conducting plate of the present invention is provided with a heat conducting material to further improve the efficiency of conducting waste heat, and prolong the flame path to prevent spark generation and increase the effect of explosion prevention.
4. The heat dissipation hole of the present invention comprises a jagged notch and a heat dissipation cavity formed by recessing the plate member, which can further improve the efficiency of heat dissipation. In addition, the present invention encloses the heat conduction material by two plates. In this, spark generation can be prevented to increase the effect of explosion protection.
1‧‧‧發光二極體防爆燈散熱結構 1‧‧‧Lighting diode explosion-proof lamp heat dissipation structure
10‧‧‧照明模組 10‧‧‧Lighting module
11‧‧‧基座 11‧‧‧Base
12a、12b‧‧‧發光二極體 12a, 12b‧‧‧Lighting diodes
20‧‧‧窗框罩體 20‧‧‧Window frame cover
21‧‧‧透光部 21‧‧‧Transmission Department
22‧‧‧窗框部 22‧‧‧Window frame
23‧‧‧窗框連接孔 23‧‧‧Window frame connection hole
30a、30b‧‧‧燈具罩體 30a, 30b‧‧‧Lighting cover
31‧‧‧配裝部 31‧‧‧Fitting Department
32‧‧‧配裝孔 32‧‧‧ fitting holes
33a、33b‧‧‧蓋狀部 33a, 33b‧‧‧ cover
331‧‧‧散熱鰭片 331‧‧‧heat fins
34a、34b‧‧‧燈具連接孔 34a, 34b‧‧‧Lighting connection holes
35‧‧‧密封元件
40a、40b、40c‧‧‧導熱盤
41‧‧‧設置孔
42‧‧‧容置部
421‧‧‧凹槽
422‧‧‧彎折凹槽
423‧‧‧凹槽彎折段
44‧‧‧散熱孔
441‧‧‧缺口
45‧‧‧板件
46‧‧‧夾置部
461‧‧‧嵌槽
462‧‧‧彎折嵌槽
463‧‧‧嵌槽彎折段
47‧‧‧散熱腔
48‧‧‧固定孔
481‧‧‧鰭片散熱孔
49‧‧‧夾板
491‧‧‧隔板
492‧‧‧容置腔
50‧‧‧電控單元
61‧‧‧緊迫件
62‧‧‧鎖固螺帽
70‧‧‧導熱材
80‧‧‧擴充鰭片
81‧‧‧鰭片連接孔
90‧‧‧鉚釘
F‧‧‧密閉區35‧‧‧Sealing components
40a, 40b, 40c‧‧‧ Thermal pads
41‧‧‧Setting holes
42‧‧‧ 容部
421‧‧‧ Groove
422‧‧‧Bending groove
423‧‧‧ Groove bending section
44‧‧‧ vents
441‧‧‧ gap
45‧‧‧ plates
46‧‧‧Clamping Department
461‧‧‧ slotted
462‧‧‧Bending inlay
463‧‧‧Clot section
47‧‧‧Heat cavity
48‧‧‧Fixed holes
481‧‧‧Fin vents
49‧‧‧ splint
491‧‧‧Baffle
492‧‧‧ 容室
50‧‧‧Electronic control unit
61‧‧‧ 紧
62‧‧‧Lock nut
70‧‧‧heat-conducting materials
80‧‧‧Expanding fins
81‧‧‧Fin joint hole
90‧‧‧ Rivets
F‧‧‧Confined area
第1圖：為本發明第一實施態樣之立體分解圖
第2-1圖：為本發明第一實施態樣之立體組合圖
第2-2圖：為第2-1圖在A-A位置之平面剖視圖
第3圖：為本發明第一實施態樣導熱盤之平面圖
第4-1圖：為本發明防爆燈散熱結構與擴充鰭片之局部分解圖
第4-2圖：為第4-1圖在B-B位置之平面剖視圖
第5圖：為本發明第二實施態樣之立體分解圖
第6-1圖：為本發明第二實施態樣之立體組合圖
第6-2圖：為第6-1圖在C-C位置之平面剖視圖
第7圖：為本發明板件之平面圖
第8圖：為本發明第三實施態樣之立體分解圖
1 is a perspective exploded view of a first embodiment of the present invention. FIG. 2-1 is a perspective view of a first embodiment of the present invention. FIG. 2-2 is a view of FIG. 2-1 at the AA position. FIG. 3 is a plan view of a heat conducting disk according to a first embodiment of the present invention. FIG. 4-1 is a partial exploded view of the heat dissipation structure and the expanded fin of the explosion-proof lamp of the present invention. FIG. FIG. 5 is a perspective exploded view of a second embodiment of the present invention. FIG. 6-1 is a perspective view of a second embodiment of the present invention. FIG. -1 is a plan sectional view of the CC position. FIG. 7 is a plan view of the plate of the present invention. FIG. 8 is an exploded perspective view showing a third embodiment of the present invention.
茲就本申請案的技術特徵暨操作方式舉數個較佳實施態樣，並配合圖示說明，謹述於后，俾提供審查參閱。惟該等實施態樣僅供說明本創作之技術內容，再者，本創作中之圖式，為便於說明其比例未必按實際比例繪製，圖式中之比例並不用以限制本創作所欲請求保護之範圍。
關於本發明之技術，請參照第1圖、第2-1圖以及第2-2圖所示，為本發明第一實施態樣之立體分解示意圖、立體組合示意圖、以及第2-1圖之平面剖視示意圖，如圖所示：本發明提供一種發光二極體防爆燈散熱結構1，包含有：一照明模組10、一窗框罩體20、一燈具罩體30、一導熱盤40a、以及複數個緊迫件61。本發明之發光二極體防爆燈散熱結構1係用於石油化學廠、燃煤廠等具有易燃性或爆炸性氣體之環境中做為照明設備，然而，本發明亦可應用於一般的發光二極體燈具，在此不予限制。
更詳言之，於本創作第一實施態樣中，該照明模組10包含有一基座11，以及至少一設置於該基座11上之發光二極體12a(Light-Emitting Diode, LED)。該基座11上佈設有電路(圖中未示)與該些發光二極體12a電性連接，該些發光二極體12a可為多個二極體所組成的陣列，或是僅設置單一個二極體，端視照明需求而定。
該窗框罩體20包含有一透光部21，一環設於該透光部21之窗框部22，以及複數個開設於該窗框部22之窗框連接孔23。該透光部21可為玻璃、透明塑膠、或塗佈有螢光漆之透光材質等，以令該些發光二極體12a所發出之光線透出，該窗框部22較佳由具有高熱傳導係數的金屬材質製成，其開設有該些窗框連接孔23以使該窗框罩體20可與其他部件相互連接。
該燈具罩體30包含有一配裝部31，一貫穿該配裝部31之配裝孔32，一連接於該配裝部31之蓋狀部33a，以及複數個設置於該蓋狀部33a之燈具連接孔34a，以使該燈具罩體30可與其他部件相互連接。該配裝部31可為卡榫、螺栓、螺孔或其他可用於將該發光二極體防爆燈散熱結構1連接於支架等構件，以令該發光二極體防爆燈散熱結構1可設置於牆壁、天花板等處做為照明之用。該配裝孔32供外部電源線穿入並連接於該基座11上的電路以提供該發光二極體12a所需之電源，於本創作中，該配裝孔32較佳須以一密封元件35如密封環(sealing ring)或O型環(O-ring)加以封閉，以隔絕該發光二極體防爆燈散熱結構1與外在環境的易燃性或爆炸性氣體，該蓋狀部33a較佳係由金屬材質製成，且其表面設置有複數個呈凹凸起伏狀之散熱鰭片331，該發光二極體防爆燈散熱結構1更包含有一電控單元50，該電控單元50係設置於該導熱盤40a以及該燈具罩體30之間，且該電控單元50電性連接於該些發光二極體12a。其中該蓋狀部33a預留有一定空間，而可供該電控單元50設置於其中，該電控單元50為具有穩壓、整流功用之電路，係用於連接電源，並經由電控單元50調整輸出電壓後再電性連接至該些發光二極體12a以提供運作之電力。
請一併參照第3圖所示，為本發明第一實施態樣導熱盤之平面示意圖，如圖所示：該導熱盤40a連接於該照明模組10之該基座11，該導熱盤40a係為具有較佳熱傳效率、抗腐蝕性之金屬材質所製成，如鋁合金-6061或鋁合金-6063等。該導熱盤40a包含有複數個對應該窗框連接孔23以及該燈具連接孔34a之設置孔41，該窗框罩體20罩覆於該導熱盤40a連接該照明模組10之一側，且該透光部21的位置對應於該發光二極體12a以利光線穿透而出，該燈具罩體30罩覆於該導熱盤40a連接該窗框罩體20之另一側，且該導熱盤40a連接該窗框罩體20及該燈具罩體30之面積大於該窗框罩體20以及該燈具罩體30罩覆於該導熱盤40a之面積，而使該導熱盤40a朝向外部突伸。是以，該導熱盤40a可延伸至該燈具罩體30、該窗框罩體20之外部與空氣接觸，而有助於將該些發光二極體12a產生的廢熱傳導逸散至外部空氣中。
該些緊迫件61分別穿設於該些窗框連接孔23、該些設置孔41、以及該些燈具連接孔34a，藉以將該窗框罩體20以及該燈具罩體3壓合固定於該導熱盤40a之相對兩側。於本實施態樣中，該些緊迫件61為迫緊螺絲，而該燈具連接孔34a為一端封閉的螺孔，每一該窗框連接孔23、設置孔41、燈具連接孔34a係分別由一個該緊迫件61穿過並鎖緊於該燈具連接孔34a，以令該燈具罩體30、該導熱盤40a、以及該窗框罩體20連接固定。須注意的是，該燈具罩體30、該導熱盤40a、以及該窗框罩體20亦可由夾扣等方式壓合固定，本實施態樣僅為舉例說明，其壓合固定之方式在此不予限制。是以，該發光二極體12a運作時產生的廢熱，可經由該基座11傳導至該導熱盤40a，而將原本集中於該基座11週圍之熱源，遍佈分散至面積相對較大的該導熱盤40a上，並逸散至空氣中增加其散熱之效率。
於一實施態樣中，該導熱盤40a連接該基座11之一側設置有一容置部42，該容置部42包含有複數個以該導熱盤40a連接該基座11位置為中心呈輻射狀設置之凹槽421，且該發光二極體防爆燈散熱結構1更包含有複數個分別設置於該些凹槽421中的導熱材70。又，該容置部42包含有至少一彎折凹槽422，且該彎折凹槽422具有一對應設置於該導熱盤40a連接該基座11位置之凹槽彎折段423。該些導熱材70係由高純度之銅材製成，該發光二極體12a產生的廢熱可經由該些導熱材70更快速地延伸傳導至該導熱盤40a上其他部位，而將熱源遍佈分散於該導熱盤40a上，該凹槽彎折段423經過該基座11中央位置，而可將廢熱有效率地自該些導熱材70傳導而分散。
此外，為避免燈具使用時因電源不穩定或電路故障所產生的火花接觸到外部具有易燃性的氣體而引發危險，該窗框罩體20以及該燈具罩體30罩覆於該導熱盤40a界定一密閉區F，該容置部42以及該些導熱材70設置於該密閉區F內。該些導熱材70可將火焰路徑向該導熱盤40a各處延伸，一方面可抑制火花產生，另一方面由於該些導熱材70受限在該密閉區F之內，可確保火花不會接觸到外部的易燃性或爆炸性氣體，以達防爆之功效。
此外，為達到更佳的散熱效果，該導熱盤40a開設有複數個環繞該密閉區F設置之散熱孔44，且該些散熱孔44係具有複數個鋸齒狀之缺口441。該些缺口441之鋸齒狀部位於使該導熱盤40a之表面積增加，並可藉由該些缺口441於該導熱盤40a上所形成之尖點進行散熱。
又，參照第4-1圖及第4-2圖所示，若須在不增加導熱盤40a面積的前提下提高散熱效率，該發光二極體防爆燈散熱結構1可更進一步包含有複數個設置於該導熱盤40a連接該燈具罩體30之一側的擴充鰭片80，於本實施態樣中，該些擴充鰭片80分別開設有一鰭片連接孔81，且該導熱盤40a開設有複數個對應於該鰭片連接孔81以固定該擴充鰭片80於該導熱盤40a上的固定孔48，於本實施態樣中，該些鰭片連接孔81以及該些固定孔48是透過鉚釘90等元件穿設固定，而該固定孔48周圍可開設有複數個鰭片散熱孔481，並藉由該些擴充鰭片80提高散熱效率。
本發明各實施態樣中，對於相同的元件賦予相同的符號，於各元件於圖式中具有相同對應及連接關係時，為避免重複說明，請參考首次陳述之對應及連接關係。本發明之第二實施態樣與第一實施態樣各部件大致相同，以下僅就該些實施態樣之差異處進行說明。
請參照第5圖、第6-1圖、以及第6-2圖，為本發明第二實施態樣之立體分解示意圖、立體組合示意圖、以及第6-1圖之平面剖視示意圖，如圖所示：於本發明第二實施態樣中，該發光二極體防爆燈散熱結構1包含有：一照明模組10、一窗框罩體20、一燈具罩體30、一導熱盤40b、以及複數個緊迫件61，其中該照明模組10、該窗框罩體20、緊迫件61之具體結構請參照前述第一實施態樣之敘述。本實施態樣中，如第6-2圖所示，係採用單一個發光二極體12b，該導熱盤40b係連接於該照明模組10，且該燈具罩體30、該導熱盤40b、以及該窗框罩體20依序壓合固定，該窗框罩體20罩覆於該導熱盤40b連接該照明模組10之一側，該燈具罩體30罩覆於該導熱盤40b連接該窗框罩體20之另一側，且該導熱盤40b連接該窗框罩體20及該燈具罩體30之面積大於該窗框罩體20以及該燈具罩體30罩覆於該導熱盤40b之面積，而使該導熱盤40b朝外部突伸。本實施態樣中，該些窗框連接孔23、該些設置孔41、以及該些燈具連接孔34b係由每一該緊迫件61依序穿過，並由一鎖固螺帽62自該燈具罩體30相對於該導熱盤40a之一側鎖固結合至該緊迫件61，進而將該燈具罩體30、該導熱盤40b、以及該窗框罩體20壓合固定。
更詳言之，於本發明第二實施態樣中，該燈具罩體30包含有一配裝部31，一連接於該配裝部31之蓋狀部33b，以及複數個設置於該蓋狀部33b之燈具連接孔34b。於本實施態樣中，該發光二極體12b為交流驅動發光二極體，可直接連接市電110V、220V或其他電壓規格，故不需裝設如前述實施態樣第1圖所示之電控單元50，該蓋狀部33b呈平板狀之結構，而可直接與該導熱盤40b組合，縮小該發光二極體防爆燈散熱結構1之體積。
請一併參照第7圖所示，為本發明第二實施態樣板件之平面示意圖，由於該些板件具有相同之構造，在第7圖中僅顯示其中一個作為示意，本發明第二實施態樣中，該導熱盤40b包含有二板件45，該些板件45相互連接之一側對應分別凹陷形成一夾置部46，該夾置部46包含有複數個以該導熱盤40b連接該基座11位置為中心呈輻射狀設置之嵌槽461，且該發光二極體防爆燈散熱結構1更包含有複數個分別設置於該些嵌槽461中的導熱材70。是以，於本實施態樣中，該些導熱材70設置於受該些板件45夾持於該夾置部46之中，該發光二極體12b運作時產生的廢熱，可經由基座11傳導至導熱盤40b，進一步再由該些導熱材70延伸傳導致該導熱盤40b的其他部位，而將原本集中於鄰近該基座11之小區域熱源快速地分散至相對大面積的該導熱盤40b上，使廢熱可以有效地排出，且因電源不穩等原因所產生之火花將會被封閉於該些板件45之間，故於本實施態樣中，該些導熱材70可突伸至該導熱盤40b之末端，以增加熱傳導之面積，同時亦能保有防爆之功效。又，該夾置部46包含有至少一彎折嵌槽462，且該彎折嵌槽462具有一對應設置於該導熱盤40b連接該基座11位置之嵌槽彎折段463。該嵌槽彎折段463經過該基座11中央位置，而可將廢熱有效率地藉由該些導熱材70傳導而出。
此外，為達到更佳的散熱效果，於本實施態樣中，該窗框罩體20以及該燈具罩體30罩覆於該導熱盤40b界定一密閉區F，該導熱盤40b開設有複數個環繞該密閉區F及該些導熱材70之散熱孔44，且該些散熱孔44係具有複數個鋸齒狀之缺口441。該些缺口441之鋸齒狀部位亦能使該導熱盤40b之表面積增加，並可藉由該些缺口441於該導熱盤40b上所形成之尖點進行散熱。於另一實施態樣中，該些板件45分別對應凹陷形成複數個環繞該密閉區F及該些導熱材70之散熱腔47，該導熱盤40b開設有複數個貫通該散熱腔47之散熱孔44，且該些散熱孔44係具有複數個鋸齒狀之缺口441。由於該些散熱腔47於兩兩該導熱材70之間鑿空凹陷，進而提高該些板件45之表面積，可更進一步提高其散熱效果。
請參照第8圖所示，為本發明第三實施態樣之導熱盤分解示意圖，本實施態樣該發光二極體防爆燈散熱結構1與第二實施態樣之差異僅在於該導熱盤40c，其他部件如20b、30b或10(參照第1圖)之細部構造請參照前開敘述之內容。
於本實施態樣中，該導熱盤40c包含有二夾板49，以及一設置於該些夾板中間之隔板491，該隔板491設有複數個以該導熱盤40c連接該基座11(參照第1圖)位置為中心呈輻射狀設置並受該些夾板封閉之容置腔492，且該發光二極體防爆燈散熱結構1更包含有複數個分別設置於該些容置腔中的導熱材70。本實施態樣是在該隔板491上開孔後，再由該些夾板49由該隔板491的兩側夾合，使該隔板491上的開孔構成空腔型態的該些容置腔492，因此，本實施態樣之在製作該些容置腔492時，僅須將該隔板491貫穿並由該些夾板49夾合即可，而具有易於加工之優點。
又，為達到更佳的散熱效果，該窗框罩體20(參照第1圖)以及該燈具罩體30(參照第1圖)罩覆於該導熱盤40c界定一密閉區F，該隔板49設有複數個環繞該密閉區F及該些導熱材70之散熱腔47，該些散熱腔47可為圓孔狀、或如本發明第二實施態樣第7圖所示為邊角呈圓弧狀的梯形，在此不予以限制。該些夾板491開設有複數個對應於該些散熱腔47上之散熱孔44，且該些散熱孔44係具有複數個鋸齒狀之缺口441。由於該些散熱腔47於兩兩該導熱材70之間鑿空凹陷，進而提高該隔板491之表面積，可更進一步提高其散熱效果。
For a more detailed description of the technical features and operation modes of the present application, and with reference to the illustrations, please refer to the following. However, these implementations are for illustrative purposes only. In addition, the schema in this creation is not necessarily drawn to the actual scale for ease of illustration. The ratio in the schema is not intended to limit the scope of the creation. The scope of protection.
Regarding the technology of the present invention, please refer to FIG. 1 , FIG. 2-1 and FIG. 2-2 , which are schematic exploded perspective view, perspective assembled view, and FIG. 2-1 of the first embodiment of the present invention. A schematic cross-sectional view, as shown in the figure, provides a light-emitting diode explosion-proof lamp heat dissipation structure 1, comprising: a lighting module 10, a window frame cover 20, a lamp cover 30, and a heat conducting plate 40a. And a plurality of pressing pieces 61. The light-emitting diode explosion-proof lamp heat dissipation structure 1 of the invention is used as a lighting device in an environment with flammable or explosive gas such as a petrochemical plant or a coal-fired plant, however, the invention can also be applied to a general light-emitting device. Polar body lamps are not limited here.
More specifically, in the first embodiment of the present invention, the lighting module 10 includes a base 11 and at least one light-emitting diode (LED) disposed on the base 11. . The pedestal 11 is electrically connected to the LEDs 12a (not shown), and the LEDs 12a can be an array of a plurality of diodes, or can be arranged only A diode, depending on the lighting needs.
The sash cover 20 includes a light transmitting portion 21, a ring frame portion 22 disposed on the light transmitting portion 21, and a plurality of window frame connecting holes 23 formed in the window frame portion 22. The light transmitting portion 21 may be glass, a transparent plastic, or a light-transmitting material coated with a fluorescent paint to allow light emitted from the light-emitting diodes 12a to pass through, and the sash portion 22 preferably has The high heat transfer coefficient is made of a metal material, and the sash connecting holes 23 are opened to allow the sash cover 20 to be connected to other components.
The lamp cover 30 includes a fitting portion 31, a fitting hole 32 extending through the fitting portion 31, a cap portion 33a connected to the fitting portion 31, and a plurality of the cap portions 33a disposed on the cap portion 33a. The luminaire is connected to the aperture 34a such that the luminaire housing 30 can be interconnected with other components. The fitting portion 31 can be a latch, a bolt, a screw hole or other member that can be used to connect the light-emitting diode explosion-proof lamp heat dissipation structure 1 to a bracket, etc., so that the light-emitting diode explosion-proof lamp heat dissipation structure 1 can be disposed on Walls, ceilings, etc. are used for lighting purposes. The fitting hole 32 is provided for the external power source to penetrate and connect to the circuit on the base 11 to provide the power required for the LED 12a. In the present invention, the fitting hole 32 preferably needs to be sealed. The element 35 is sealed, such as a sealing ring or an O-ring, to isolate the illuminating or explosive gas of the light-emitting diode explosion-proof lamp heat-dissipating structure 1 from the external environment. The cover portion 33a Preferably, it is made of a metal material, and a plurality of heat-dissipating fins 331 having a undulating shape are disposed on the surface thereof. The light-emitting diode explosion-proof lamp heat dissipation structure 1 further includes an electronic control unit 50. The electrical control unit 50 is electrically connected to the light-emitting diodes 12a. The electrical control unit 50 is electrically connected to the light-emitting diodes 12a. The cover portion 33a is reserved for a certain space, and the electronic control unit 50 is disposed therein. The electronic control unit 50 is a circuit having a voltage stabilization and rectification function, and is used for connecting a power source and passing through the electronic control unit. After adjusting the output voltage, the battery is electrically connected to the light-emitting diodes 12a to provide operating power.
Referring to FIG. 3, it is a schematic plan view of a heat conducting disk according to a first embodiment of the present invention. As shown in the figure, the heat conducting plate 40a is connected to the base 11 of the lighting module 10, and the heat conducting plate 40a is shown. It is made of metal material with better heat transfer efficiency and corrosion resistance, such as aluminum alloy-6061 or aluminum alloy-6063. The heat conducting plate 40a includes a plurality of mounting holes 41 corresponding to the window frame connecting holes 23 and the lamp connecting holes 34a. The window frame cover 20 is covered on the side of the heat conducting plate 40a connected to the lighting module 10, and The position of the light transmitting portion 21 corresponds to the light emitting diode 12a for light penetration, and the lamp cover 30 covers the other side of the heat shield 40a connecting the window frame cover 20, and the heat conduction The area of the sash cover 20 and the illuminant cover 30 is larger than the sash cover 20 and the area of the illuminant cover 30 covering the thermal pad 40a, so that the thermal pad 40a protrudes outward. . Therefore, the heat conducting plate 40a can extend to the outside of the hood body 30 and the sash cover 20 to contact the air, and the waste heat generated by the light emitting diodes 12a can be dissipated into the outside air. .
The sills 61 are respectively disposed in the sash connecting holes 23, the mounting holes 41, and the illuminating connecting holes 34a, thereby pressing and fixing the sash cover 20 and the luminaire cover 3 to the sash cover The opposite sides of the thermal pad 40a. In this embodiment, the pressing members 61 are tightening screws, and the lamp connecting holes 34a are screw holes closed at one end, and each of the window frame connecting holes 23, the setting holes 41, and the lamp connecting holes 34a are respectively One of the pressing members 61 passes through and is locked to the lamp connecting hole 34a to connect and fix the lamp cover 30, the heat conducting plate 40a, and the window frame cover 20. It should be noted that the lamp cover 30, the heat conducting plate 40a, and the sash cover 20 can also be pressed and fixed by means of a clip or the like. This embodiment is merely an example, and the manner of pressing and fixing is here. No restrictions. Therefore, the waste heat generated during operation of the light-emitting diode 12a can be conducted to the heat conducting plate 40a via the susceptor 11, and the heat source originally concentrated around the susceptor 11 is dispersed over a relatively large area. The heat conducting plate 40a is dissipated into the air to increase the efficiency of heat dissipation.
In one embodiment, the heat conducting plate 40a is connected to one side of the base 11 and has a receiving portion 42. The receiving portion 42 includes a plurality of radiations centered on the position of the heat conducting plate 40a. The light-emitting diode 1 is further provided with a plurality of heat-dissipating materials 70 respectively disposed in the grooves 421. Moreover, the receiving portion 42 includes at least one bending groove 422, and the bending groove 422 has a groove bending portion 423 corresponding to the position of the heat conducting plate 40a connecting the base 11. The heat conductive materials 70 are made of a high-purity copper material, and the waste heat generated by the light-emitting diodes 12a can be further extended to the other parts of the heat-conducting disk 40a via the heat-dissipating materials 70, and the heat source is dispersed. On the heat conducting plate 40a, the groove bending section 423 passes through the central position of the base 11, and the waste heat can be efficiently conducted and dispersed from the heat conducting materials 70.
In addition, in order to avoid the danger that the spark generated by the power supply instability or the circuit failure is in contact with the external flammable gas when the lamp is used, the sash cover 20 and the lamp cover 30 cover the thermal pad 40a. A sealing area F is defined, and the receiving portion 42 and the heat conducting materials 70 are disposed in the sealing area F. The heat conducting materials 70 can extend the flame path to the heat conducting plate 40a, on the one hand, suppress spark generation, and on the other hand, the heat conducting materials 70 are confined within the sealing region F to ensure that the spark does not contact. Flammable or explosive gas to the outside to achieve the effect of explosion protection.
In addition, in order to achieve a better heat dissipation effect, the heat conducting plate 40a is provided with a plurality of heat dissipation holes 44 disposed around the sealing region F, and the heat dissipation holes 44 have a plurality of zigzag notches 441. The serrations of the notches 441 are located to increase the surface area of the thermal pad 40a, and can be dissipated by the sharp points formed by the notches 441 on the thermal pad 40a.
Moreover, referring to FIG. 4-1 and FIG. 4-2, if the heat dissipation efficiency is to be improved without increasing the area of the thermal pad 40a, the light-emitting diode explosion-proof lamp heat dissipation structure 1 may further include a plurality of The expansion fins 40 are disposed on one side of the illuminating panel 40. The expansion fins 80 are respectively provided with a fin connecting hole 81, and the thermal pad 40a is opened. A plurality of fixing holes 48 corresponding to the fin connecting holes 81 for fixing the expansion fins 80 on the heat conducting plate 40a. In the embodiment, the fin connecting holes 81 and the fixing holes 48 are transparent. The rivet 90 and the like are fixedly disposed, and a plurality of fin heat dissipation holes 481 are formed around the fixing hole 48, and the heat dissipation efficiency is improved by the expansion fins 80.
In the embodiments of the present invention, the same reference numerals are given to the same elements, and when the elements have the same correspondence and connection relationship in the drawings, in order to avoid redundant description, please refer to the correspondence and connection relationship of the first statement. The second embodiment of the present invention is substantially the same as the components of the first embodiment, and only the differences between the embodiments will be described below.
Referring to FIG. 5, FIG. 6-1, and FIG. 6-2, FIG. 5 is a perspective exploded view, a three-dimensional combination diagram, and a plane cross-sectional view of FIG. 6-1 according to a second embodiment of the present invention. As shown in the second embodiment of the present invention, the light-emitting diode explosion-proof lamp heat dissipation structure 1 comprises: a lighting module 10, a window frame cover 20, a lamp cover 30, a thermal pad 40b, And a plurality of pressing members 61. For the specific structure of the lighting module 10, the sash cover 20, and the pressing member 61, refer to the foregoing first embodiment. In this embodiment, as shown in FIG. 6-2, a single LED 12b is used, and the thermal pad 40b is connected to the illumination module 10, and the lamp cover 30, the thermal pad 40b, The sash cover 20 is sequentially pressed and fixed, and the sash cover 20 is covered on the side of the thermal pad 40b to be connected to the illumination module 10, and the illuminant cover 30 is covered by the thermal pad 40b. The other side of the sash cover 20, and the heat shield 40b is connected to the sash cover 20 and the illuminant cover 30 has a larger area than the sash cover 20 and the luminaire cover 30 covers the thermal pad 40b. The area is such that the heat conducting plate 40b protrudes toward the outside. In this embodiment, the window frame connecting holes 23, the setting holes 41, and the lamp connecting holes 34b are sequentially passed by each of the pressing members 61, and are locked by a locking nut 62. The lamp cover 30 is fixedly coupled to the pressing member 61 with respect to one side of the heat conducting plate 40a, and the lamp cover 30, the heat conducting plate 40b, and the sash cover 20 are press-fitted.
More specifically, in the second embodiment of the present invention, the lamp cover 30 includes a fitting portion 31, a cover portion 33b connected to the fitting portion 31, and a plurality of the cover portions. The lamp connection hole 34b of 33b. In the embodiment, the LED 12b is an AC driven LED, and can be directly connected to the mains 110V, 220V or other voltage specifications, so it is not necessary to install the electric power as shown in FIG. 1 of the foregoing embodiment. The control unit 50 has a flat plate-like structure and can be directly combined with the heat conducting plate 40b to reduce the volume of the light-emitting diode explosion-proof lamp heat dissipation structure 1.
Referring to FIG. 7 together, it is a schematic plan view of a second embodiment of the present invention. Since the plates have the same configuration, only one of them is shown in FIG. In an aspect, the heat conducting plate 40b includes two plate members 45, and the plate members 45 are respectively recessed to form a sandwiching portion 46 corresponding to one side of the interconnecting portion 45. The sandwiching portion 46 includes a plurality of the heat conducting plates 40b connected thereto. The base 11 is located at a center of the radiation groove 461. The light-emitting diode explosion-proof lamp heat dissipation structure 1 further includes a plurality of heat-conducting materials 70 respectively disposed in the plurality of slots 461. Therefore, in the embodiment, the heat conductive materials 70 are disposed in the sandwiching portion 46, and the waste heat generated when the LEDs 12b operate can pass through the base. 11 is conducted to the heat conducting plate 40b, and further extended by the heat conducting materials 70 to cause other portions of the heat conducting plate 40b, and the heat source originally concentrated in a small area adjacent to the base 11 is rapidly dispersed to a relatively large area of the heat conduction. On the disk 40b, the waste heat can be effectively discharged, and the spark generated by the power source instability or the like is enclosed between the plates 45. Therefore, in the embodiment, the heat conductive materials 70 can be protruded. Extending to the end of the thermal pad 40b to increase the area of heat conduction, while also maintaining the effect of explosion protection. Moreover, the clamping portion 46 includes at least one bending recess 462, and the bending recess 462 has a corresponding groove bending portion 463 disposed at a position where the heat conducting plate 40b is connected to the base 11. The groove bending section 463 passes through the central position of the base 11, and the waste heat can be efficiently conducted by the heat conducting materials 70.
In addition, in the embodiment, the sash cover 20 and the illuminant cover 30 cover the thermal pad 40b to define a sealing area F, and the thermal pad 40b is provided with a plurality of The heat dissipation holes 44 are formed around the sealing area F and the heat dissipation holes 70, and the plurality of heat dissipation holes 44 have a plurality of zigzag notches 441. The indented portions of the notches 441 can also increase the surface area of the thermal pad 40b, and can dissipate heat by the notches formed by the notches 441 on the thermal pad 40b. In another embodiment, the plate members 45 respectively form a plurality of heat dissipation cavities 47 surrounding the sealing region F and the heat dissipating materials 70, and the heat conducting plates 40b are provided with a plurality of heat dissipation holes extending through the heat dissipation cavity 47. The holes 44, and the plurality of heat dissipation holes 44 have a plurality of zigzag notches 441. Since the heat dissipation cavities 47 are hollowed out between the two heat-conducting materials 70, thereby increasing the surface area of the plates 45, the heat dissipation effect can be further improved.
Please refer to FIG. 8 , which is a schematic exploded view of a thermal conductive disk according to a third embodiment of the present invention. In this embodiment, the heat dissipation structure 1 of the LED explosion-proof lamp is different from the second embodiment only in the thermal pad 40 c. For details of the details of other components such as 20b, 30b or 10 (see Fig. 1), please refer to the previous section.
In this embodiment, the heat conducting plate 40c includes two clamping plates 49, and a partition 491 disposed in the middle of the clamping plates. The partitioning plate 491 is provided with a plurality of the conductive plates 40c connected to the base 11 (refer to FIG. 1 is a accommodating cavity 492 which is radially disposed at the center and is closed by the splints, and the illuminating structure 1 of the illuminating diode of the illuminating diode further comprises a plurality of heat conducting portions respectively disposed in the accommodating cavities. Material 70. In this embodiment, after the opening of the partition 491, the clamping plates 49 are sandwiched by the two sides of the partition 491, so that the openings in the partition 491 form the cavity type. The chamber 492 is disposed. Therefore, in the embodiment, when the accommodating chambers 492 are formed, the partition 491 only needs to be penetrated and sandwiched by the splints 49, and has the advantage of being easy to process.
Moreover, in order to achieve a better heat dissipation effect, the sash cover 20 (see FIG. 1) and the lamp cover 30 (see FIG. 1) are covered on the heat conducting plate 40c to define a sealed area F. 49 is provided with a plurality of heat dissipation cavities 47 surrounding the sealing area F and the heat conducting materials 70. The heat dissipation cavities 47 may be in the shape of a circular hole or as shown in FIG. 7 of the second embodiment of the present invention. The arcuate trapezoid is not limited here. The plurality of splints 491 are provided with a plurality of heat dissipation holes 44 corresponding to the heat dissipation holes 47, and the plurality of heat dissipation holes 44 have a plurality of zigzag notches 441. Since the heat dissipation cavities 47 are hollowed out between the two heat-conducting materials 70, thereby increasing the surface area of the partition 491, the heat dissipation effect can be further improved.
綜上所述，本發明可藉由導熱盤將該發光二極體產生之廢熱自小面積的基座上，分散導引至相對大面積的導熱盤上，並且由導熱盤延伸至外部與空氣接觸，增加熱量逸散之速度，同時可藉由該燈具罩體、該導熱盤、以及該窗框罩體之組合密閉該發光二極體防爆燈散熱結構達到防爆之效果，此外，本發明可透過該些導熱材快速地分散至該導熱盤各處提高其散熱效率，並進一步透過散熱孔上鋸齒狀之缺口增加其散熱效率，而可取代固有以導熱材與散熱鰭片組合進行散熱之方式，達到減少發光二極體防爆燈散熱結構體積與重量之功效。 In summary, the present invention can disperse the waste heat generated by the light-emitting diode from a small-area base to a relatively large-area heat-conducting disk by a heat-conducting disk, and extend from the heat-conducting disk to the outside and the air. Contacting, increasing the speed of heat dissipation, and at the same time, the heat-dissipating structure of the light-emitting diode explosion-proof lamp can be sealed by the combination of the lamp cover, the heat-conducting disk and the window frame cover, and the invention can be used for the explosion-proof effect. The heat dissipating material is rapidly dispersed to the heat conducting plate to improve the heat dissipating efficiency, and further increases the heat dissipating efficiency through the jagged notch on the heat dissipating hole, thereby replacing the inherent heat dissipation material and the heat dissipating fin combination for heat dissipation. The utility model can reduce the volume and weight of the heat dissipation structure of the LED explosion-proof lamp.
1‧‧‧防爆燈散熱結構 1‧‧‧Explosion-proof lamp heat dissipation structure
10‧‧‧照明模組 10‧‧‧Lighting module
11‧‧‧基座 11‧‧‧Base
12a‧‧‧發光二極體 12a‧‧‧Lighting diode
20‧‧‧窗框罩體 20‧‧‧Window frame cover
21‧‧‧透光部 21‧‧‧Transmission Department
22‧‧‧窗框部 22‧‧‧Window frame
23‧‧‧窗框連接孔 23‧‧‧Window frame connection hole
30a‧‧‧燈具罩體 30a‧‧‧Lighting cover
31‧‧‧配裝部 31‧‧‧Fitting Department
32‧‧‧配裝孔 32‧‧‧ fitting holes
33a‧‧‧蓋狀部 33a‧‧‧Cover
331‧‧‧散熱鰭片 331‧‧‧heat fins
34a‧‧‧燈具連接孔 34a‧‧‧Lighting connection hole
35‧‧‧密封元件 35‧‧‧Sealing components
40a‧‧‧導熱盤 40a‧‧‧thermal plate
41‧‧‧設置孔 41‧‧‧Setting holes
42‧‧‧容置部 42‧‧‧ 容部
421‧‧‧凹槽 421‧‧‧ Groove
422‧‧‧彎折凹槽 422‧‧‧Bending groove
423‧‧‧凹槽彎折段 423‧‧‧ Groove bending section
44‧‧‧散熱孔 44‧‧‧ vents
441‧‧‧缺口 441‧‧‧ gap
50‧‧‧電控單元 50‧‧‧Electronic control unit
61‧‧‧緊迫件 61‧‧‧ 紧
70‧‧‧導熱材 70‧‧‧heat-conducting materials
Claims (12)
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| TW103126829A TWI571597B (en) | 2014-07-15 | 2014-08-06 | Light - emitting diode explosion - proof lamp cooling structure |
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| TW103124325 | 2014-07-15 | ||
| TW103126829A TWI571597B (en) | 2014-07-15 | 2014-08-06 | Light - emitting diode explosion - proof lamp cooling structure |
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| TW201602498A TW201602498A (en) | 2016-01-16 |
| TWI571597B true TWI571597B (en) | 2017-02-21 |
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| JP (1) | JP5774759B1 (en) |
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| JP2016066694A (en) * | 2014-09-24 | 2016-04-28 | 株式会社東芝 | Heat sink and illumination apparatus |
| US10209005B2 (en) * | 2015-10-05 | 2019-02-19 | Sunlite Science & Technology, Inc. | UV LED systems and methods |
| TWI586918B (en) * | 2015-11-20 | 2017-06-11 | LED explosion-proof lamp cover | |
| US11022287B2 (en) * | 2018-09-12 | 2021-06-01 | Appleton Grp Llc | Explosion proof luminaire |
| CN113819415A (en) | 2020-06-15 | 2021-12-21 | 伊顿智能动力有限公司 | Explosion-proof lighting equipment |
| CN114928990B (en) * | 2022-05-27 | 2024-01-23 | 滨海治润电子有限公司 | Heat radiation assembly for light-emitting diode |
| CN116357942B (en) * | 2023-06-01 | 2023-08-01 | 山东智信光电有限公司 | Colliery explosion-proof LED lamp area |
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| TWM343109U (en) * | 2008-06-04 | 2008-10-21 | Li Hong Science & Technology Co Ltd | Light Emitting Diode (LED) explosion proof lamp |
| EP2397753B1 (en) * | 2010-06-15 | 2013-05-29 | Kitagawa Holdings, LLC | Led lamp and a heat sink thereof having a wound heat pipe |
| TWM471549U (en) * | 2013-10-04 | 2014-02-01 | Lian-Gui Lin | Structure of LED lamp |
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| CN101408300B (en) * | 2007-10-10 | 2011-06-08 | 富准精密工业(深圳)有限公司 | LED light fitting with heat radiation structure |
| CN201212662Y (en) * | 2008-06-26 | 2009-03-25 | 丽鸿科技股份有限公司 | LED flameproof lamp structure |
| US7611264B1 (en) * | 2008-08-28 | 2009-11-03 | Li-Hong Technological Co., Ltd. | LED lamp |
| CN101929625A (en) * | 2009-06-25 | 2010-12-29 | 富准精密工业(深圳)有限公司 | Light emitting diode (LED) lamp |
| WO2011028805A2 (en) * | 2009-09-01 | 2011-03-10 | Savenergy Inc. | Cooled led lighting assemblies |
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2014
- 2014-08-06 TW TW103126829A patent/TWI571597B/en active
- 2014-10-13 CN CN201410538254.9A patent/CN105258088A/en active Pending
- 2014-10-24 US US14/523,384 patent/US20160018096A1/en not_active Abandoned
- 2014-11-05 JP JP2014224888A patent/JP5774759B1/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM343109U (en) * | 2008-06-04 | 2008-10-21 | Li Hong Science & Technology Co Ltd | Light Emitting Diode (LED) explosion proof lamp |
| EP2397753B1 (en) * | 2010-06-15 | 2013-05-29 | Kitagawa Holdings, LLC | Led lamp and a heat sink thereof having a wound heat pipe |
| TWM471549U (en) * | 2013-10-04 | 2014-02-01 | Lian-Gui Lin | Structure of LED lamp |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201602498A (en) | 2016-01-16 |
| JP2016021361A (en) | 2016-02-04 |
| JP5774759B1 (en) | 2015-09-09 |
| CN105258088A (en) | 2016-01-20 |
| US20160018096A1 (en) | 2016-01-21 |
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