TWM470090U - Pre-lay board transporting device - Google Patents

Abstract

A pre-lay board transporting device including a platform, a moving mechanism and a lifting mechanism is provided. A plurality of carrying plates are stacked on the platform and for carrying a pre-lay board respectively, wherein each of the carrying plates has at least an opening exposed a portion of the pre-lay board. The moving mechanism is disposed on the platform for moving the carrying plates in sequence. The lifting mechanism is disposed on the platform, wherein the moving mechanism moves the carrying plate in sequence to where the carrying plate is above the lifting mechanism, the lifting mechanism and the carrying plate move relatively, so that the lifting mechanism moves out the pre-lay board from the carrying plate through the opening. The pre-lay board being moved out from the carrying plate is moved to a board-stacking region, and the moving mechanism moves the carrying plate to a recycle region.

Description

Pre-board transport equipment

The present invention relates to a transport device, and more particularly to a transport device for a pre-lay board.

In recent years, in order to increase the application of printed circuit boards (PCBs), many techniques have been made to fabricate printed circuit boards into multilayer boards. In general, the multi-layer board structure is formed by stacking a plurality of pre-assembled boards and copper foils and pressing them together to increase the wiring space inside the printed circuit board, so that the multi-layer The board structure can select the number of layers to be pressed depending on the required wiring space.

Figure 1 is a schematic illustration of a conventional pre-assembly panel. Referring to FIG. 1, a general pre-assembly panel 10 includes an inner layer panel 12 and two films 14 (prepreg, pp) positioned on opposite sides of the inner layer panel 12. After the inner layer 12 completes the browning or bond film process, the film 14 is temporarily fixed to the inner layer 12 via a dispensing step, such as partial heating of the film 14, causing the film 14 to partially melt. The inner panel 12 and the film 14 are fixed to each other. Such an action may be referred to as a pre-lay up and the inner panel 12 and the two films 14 form a pre-set panel. In this way, the inner layer can be ensured 12 and film 14 will not produce relative movement to facilitate the subsequent pressing process.

However, such a dispensing operation is simply a simple fixing between the inner layer board 12 and the film 14 via heating dispensing. If the pre-setting board 10 is transported by an automated device, for example, it is carried by a vacuum chuck not shown. By pre-setting the panel 10, the pre-assembly panel 10 is easily separated from the dispensing. Alternatively, if the pre-plate 10 is carried by a gripper (not shown), the jaws may cause damage to the side edges of the pre-set panel 10 when the pre-set panel 10 is gripped. If the dispensing range is increased, problems such as uneven distribution of the colloid, change of the gelation mode, wrinkles of the film 14, cracking time parameters, or defects in the appearance of the pre-set panel 10 may occur, and subsequent pressures may occur. The quality of the pre-assembly panel 10 is affected during the manufacturing process. If the pre-grouping board 10 is manually carried, in addition to causing waste of manpower, it is also easy to cause the pre-grouping board 10 to cause the bending, scratching, and ordering errors of the pre-setting board 10 to affect the pre-setting board 10 when manually transporting the pre-setting board 10. Delivery rate.

The new creation provides a pre-assembly transport device that automates the transport of pre-set boards and increases the productivity and delivery yield of the pre-set boards.

The pre-assembly transporting device created by the present invention comprises a working platform, a transfer mechanism and a lifting mechanism. A plurality of carrier disks are stacked on the working platform and are respectively configured to carry a pre-setting plate, wherein each of the loading plates has at least one opening, and the opening exposes a part of the pre-setting plates. The transfer mechanism is disposed on the working platform and sequentially moves the carrier. The lifting mechanism is disposed on the working platform, wherein the transfer mechanism sequentially moves the loading tray to the upper side of the lifting mechanism, and the lifting mechanism and the loading tray located above thereof move relative to each other in an axial direction and are connected to each other Recently, the lifting mechanism is moved out of the carrier through the opening of the carrier. The pre-set plates removed from the carrier are transferred to a stack of plates, and the transfer mechanism moves the carriers to a recovery zone.

In an embodiment of the present invention, the pre-board transporting apparatus further includes a positioning mechanism disposed on the working platform and located above the lifting mechanism for fixedly moving the carrier to the upper side of the lifting mechanism. And the lifting mechanism moves toward the carrier relative to the positioning mechanism.

In an embodiment of the present invention, the positioning mechanism includes a positioning pedestal, a plurality of positioning pins, and a pair of positioning push rods. The positioning pedestal is disposed above the lifting mechanism, and the carrier is disposed on a top surface of the positioning pedestal. The locating pin is disposed at a periphery of the top surface of the positioning pedestal, and the carrier plate abuts the locating pin with its side edge. The positioning push rods are disposed on opposite sides of the positioning base and move toward the positioning base to fix the carrier from opposite sides of the carrier.

In an embodiment of the present invention, the positioning pedestal is an annular pedestal, and the lifting mechanism moves toward the carrier through the annular pedestal.

In an embodiment of the novel creation, the transfer mechanism includes a vacuum chuck.

In an embodiment of the present invention, the lifting mechanism includes a lifting pedestal and at least one lifting bump. The lifting pedestal is adapted to move towards the carrier plate that is moved above it. The lifting bump is disposed on a top surface of the lifting pedestal. The lift bump corresponds to the opening of the carrier and moves the pre-set plate away from the carrier as the lifting pedestal moves toward the carrier.

In an embodiment of the present invention, the ratio of the area of the orthographic projection of the lifting bump on the lifting pedestal to the area of the orthographic projection of the pre-grouping plate on the lifting pedestal is greater than one tenth.

In an embodiment of the present invention, each of the above trays is a "field" shaped frame and has four openings.

In an embodiment of the present invention, each of the above-mentioned carriers has a body portion and an abutting portion. The opening extends through the body portion. The abutting portion is located at a peripheral edge of the body portion and protrudes from a top surface of the body portion. The pre-plate is adapted to be carried on the top surface of the body portion and abuts against the abutting portion with its side edge.

In an embodiment of the present invention, each of the above-mentioned trays has a protruding portion located at a peripheral edge of the body portion and protruding from a top surface of the body portion. The carrier is adapted to be carried by its bottom portion on the projection of the other carrier, and the transfer mechanism moves the carriers by contacting the projections.

In an embodiment of the present invention, the pre-plate transporting apparatus further includes a clamping mechanism disposed on one side of the lifting mechanism for clamping the pre-setting plate removed from the carrier and pre- The group board moves to the stack area.

In an embodiment of the novel creation, the clamping mechanism described above includes a plurality of jaws. The jaws move toward the carrier and grip the pre-set plates that are removed from the carrier.

In an embodiment of the present invention, the pre-assembly board transporting device further includes a tray stacking module for sequentially arranging the pre-grouping boards in the respective trays, and the carriers carrying the pre-grouping boards are mutually Stacked and moved to the work platform.

In an embodiment of the present invention, the above-described carrier stacking module includes A roller mechanism is used to sequentially move each pre-set plate into each carrier.

Based on the above, the pre-assembled board transporting apparatus of the present invention carries the pre-assembled board by the carrier and is transported together with the carrier during the transport of the pre-set board. During the transport of the pre-assembly plate, the transfer mechanism sequentially moves the carrier, and the lifting mechanism removes the pre-set plate from the carrier so that the pre-set plate can be moved to the stacking zone, and the empty carrier moves to Recycling area. In this way, replacing the manpower with automated pre-board transport equipment can avoid the destruction of human factors and improve production efficiency. In addition, by carrying the pre-assembly board on the carrier, it is possible to prevent the automated pre-assembly transport equipment from damaging the pre-set board. Accordingly, the novel pre-assembly board transporting device can automatically transport the pre-set board and improve the production efficiency and the transport yield of the pre-group board.

The above described features and advantages of the present invention will become more apparent and understood from the following description.

10‧‧‧Pre-set board

12‧‧‧ Inner board

14‧‧‧ Film

20‧‧‧Package

22‧‧‧ openings

24‧‧‧ Body Department

26‧‧‧Abutment

28‧‧‧Protruding

30‧‧‧ Dispenser

40‧‧‧Clamp crane

50‧‧‧Working car

100‧‧‧Pre-board transport equipment

102‧‧‧Package stacking module

102a‧‧‧Roller mechanism

102b, 120‧‧‧Transportation mechanism

102c, 110‧‧‧Working Platform

130‧‧‧ Lifting mechanism

132‧‧‧lifting pedestal

134‧‧‧ Lifting bumps

140‧‧‧ Positioning mechanism

142‧‧‧ positioning pedestal

144‧‧‧Locating pin

146a, 146b‧‧‧ Positioning putters

150‧‧‧Clamping mechanism

150a to 150d‧‧‧ jaws

R1‧‧‧Stacking area

R2‧‧‧Stacked area

R3‧‧‧Recycling area

S1, S2, S3, S4‧‧‧ top

X, Y, Z‧‧‧ axial

Figure 1 is a schematic illustration of a conventional pre-assembly panel.

2 is a schematic view of a pre-assembly plate transporting apparatus according to an embodiment of the present invention.

3 is a schematic diagram of a carrier stacking module of the pre-assembly board transport apparatus of FIG. 2.

4 is a schematic view of a carrier and a pre-assembly plate to which the pre-assembly transport apparatus of FIG. 2 is applied.

Figure 5 is a schematic illustration of the carrier disks of Figure 4 stacked on each other.

Figure 6 is a schematic illustration of the lifting mechanism and positioning mechanism of the pre-assembly plate transporting apparatus of Figure 2 Figure.

Figure 7 is a schematic illustration of the lift mechanism of the pre-assembly plate transport apparatus of Figure 6 with the pre-set plate removed from the carrier.

8A to 8E are schematic diagrams showing the operation flow of the pre-assembly board transporting apparatus of FIG. 2.

2 is a schematic view of a pre-assembly plate transporting apparatus according to an embodiment of the present invention. 3 is a schematic diagram of a carrier stacking module of the pre-assembly board transport apparatus of FIG. 2. Referring to FIG. 1 to FIG. 3, in the present embodiment, the pre-assembly board 10 includes an inner layer board 12 and two films 14 positioned on opposite sides of the inner layer board 12, and the inner layer board 12 of the pre-group board 10 and the film. 14 are fixed to each other via a pre-grouping step as described above, as shown in FIG. The pre-grouped pre-assembly plate 10 is disposed on the carrier 20, and the pre-assembly plate transporting device 100 is adapted to transport the pre-assembly plate 10 from the dispenser 30 (shown in FIG. 3) to a clamper 40 ( Shown in Figure 2).

Specifically, referring to FIG. 3 , in the embodiment, the pre-assembly board transport apparatus 100 includes a tray stacking module 102 . The carrier stacking module 102 is disposed on one side of the dispenser 30 for sequentially moving the pre-setting plates 10 that have completed the dispensing step via the dispenser 30 to the respective carriers 20. In this embodiment, the carrier stacking module 102 includes a roller mechanism 102a and a transfer mechanism 102b. The empty tray 20 that has not carried the pre-assembly panel 10 is placed on a work platform 102c, and the transfer mechanism 102b (for example, a vacuum chuck) moves the empty tray 20 to one side of the roller mechanism 102a so that the roller mechanism is utilized. 102a moves out of the pre-assembly plate 10 of the dispenser 30 directly to the carrier 20 (as shown by the dotted line in FIG. 3) The pre-composition plate 10 and the carrier 20) are shown. Thereafter, the transfer mechanism 102b moves the pre-assembly plate 10 together with the carrier 20 to a stacking area R1. The carrier trays 20 carrying the pre-assembly plates 10 are stacked on each other in the stacking area R1. After being accumulated to a certain number, the pre-assembly boards 10 are transferred to the work platform 110 of the pre-assembly board transport apparatus 100 (shown in FIG. 2). The method for transferring the pre-assembly plate 10 to the work platform 110 may be transferred by the work vehicle 50, as shown in FIG. 2 and FIG. 3, or may be transferred by a conveyor belt or other suitable carrier not shown. Since the transfer mechanism 102b moves the pre-set panel 10 by clamping or adsorbing the carrier 20, the transfer mechanism 102b can be effectively prevented from damaging the pre-assembly panel 10.

4 is a schematic view of a carrier and a pre-assembly plate to which the pre-assembly transport apparatus of FIG. 2 is applied. Figure 5 is a schematic illustration of the carrier disks of Figure 4 stacked on each other. Referring to FIG. 2, FIG. 4 and FIG. 5, in the present embodiment, the pre-assembly transporting apparatus 100 includes a working platform 110, a transfer mechanism 120, and a lifting mechanism 130. The transfer mechanism 120 and the lifting mechanism 130 are disposed on the work platform 110, wherein the transfer mechanism 120 is adapted to move back and forth along an axial direction (for example, along the axial direction X in FIG. 2), and the lifting mechanism 130 is adapted to The other axial direction (for example, along the axial direction Y in Fig. 2) moves up and down. The pre-assembly board 10 is correspondingly disposed in the plurality of carriers 20 and is transferred from the carrier stacking module 102 to the work platform 110 of the pre-assembly transport apparatus 100. The carrier trays 20 are stacked on the work platform 110 and are respectively used to carry the pre-assembly plates 10 for transport to the clamp crane 40 via the transfer mechanism 120 and the lift mechanism 130. Since the pre-assembly panel 10 is disposed in the carrier 20 during transportation, the transfer mechanism 120 of the pre-assembly transport apparatus 100 and the lift mechanism 130 can be prevented from damaging the pre-set panel 10.

Specifically, each of the carriers 20 has at least one opening, such as the embodiment. The carrier 20 is a "field" shaped frame and has four openings 22, and the opening 22 exposes a portion of the pre-assembly panel 10. However, in other embodiments, the carrier may also have only one opening, and the novel creation does not limit the number of openings 22, which may be adjusted as needed. Further, in the present embodiment, each of the carriers 20 has a body portion 24, an abutting portion 26, and a protruding portion 28. The opening 22 of the carrier 20 is actually located on the body portion 24 and extends through the body portion 24. The abutment portion 26 is located at the periphery of the body portion 24 and protrudes from the top surface S1 of the body portion 24. The pre-assembly plate 10 is adapted to be carried on the top surface S1 of the body portion 24 and abuts against the side edges of the abutment portion 26 with its side edges. In this manner, the pre-assembly panel 10 is restrained in the annular region enclosed by the abutting portion 26, and the offset of the pre-plate 10 can be avoided. Further, the projection 28 is located on the periphery of the body portion 24 and protrudes from the top surface S1 of the body portion, and the projection portion 28 is on the abutment portion 26. The carrier 20 is adapted to be carried by its bottom on the projection 28 of the other carrier 20. Since the projections 28 between the body portion 24 and the carrier 20 where the pre-assembly plate 10 is located have a height difference, when the carriers 20 are stacked on each other, the carrier 20 contacts the projection of the other carrier 20 with its bottom. The outlet 28, but does not contact the pre-plate 10 located on the top surface S1 of the body portion 24 of the other carrier 20. In this way, it is possible to prevent the carrier 20 stacked on each other from damaging the pre-assembly panel 10.

On the other hand, referring to FIG. 2, in the present embodiment, the transfer mechanism 120 sequentially moves the carrier 20 to the upper side of the lifting mechanism 130, wherein the transfer mechanism 120 of the embodiment is, for example, a vacuum chuck, and The transfer mechanism 120 sequentially moves the carrier 20 by contacting the projections 28 of the carrier 20, but the present invention does not limit the type of the transfer mechanism 120. Further, when the transfer mechanism 120 moves the carrier 20 configured with the pre-assembly plate 10 in the axial direction X above the lifting mechanism 130, the lifting mechanism 130 is located thereon The side carriers 20 are relatively moved in an axial direction (for example, in the axial direction Y in FIG. 2), for example, the lifting mechanism 130 moves in the axial direction Y toward the carrier 20 located above it, and is close to each other so that The lift mechanism 130 removes the pre-assembly plate 10 from the carrier 20 through the opening 22 of the carrier 20. The pre-assembly plate 10 removed from the carrier 20 is moved in an axial direction (for example, in the axial direction Z in FIG. 2) to a stack of plate regions R2 adjacent to the gripper 40, and the transfer mechanism 120 is axially X moves the empty tray 20 to a recovery zone R3. However, in other unillustrated embodiments, when the transfer mechanism 120 moves the carrier 20 configured with the pre-assembly plate 10 in the axial direction X above the lifting mechanism 130, the carrier 20 can also be transferred by The mechanism 120 or other mechanism (not shown) moves along the axial direction Y toward the lifting mechanism 130 located below and approaches each other, and the lifting mechanism 130 can also be transmitted through the relative movement of the lifting mechanism 130 and the carrier 20. The opening 22 of the disk 20 removes the pre-assembly plate 10 from the carrier 20. The novel creation is not limited to the above embodiments.

Figure 6 is a schematic illustration of the lift mechanism and positioning mechanism of the pre-assembly plate transport apparatus of Figure 2; Figure 7 is a schematic illustration of the lift mechanism of the pre-assembly plate transport apparatus of Figure 6 with the pre-set plate removed from the carrier. Please refer to FIG. 2 , FIG. 6 to FIG. 7 . Specifically, in the present embodiment, the lifting mechanism 130 includes a lifting pedestal 132 and at least one lifting bump 134 . The lifting pedestal 132 is adapted to move in the axial direction Y toward the carrier 20 that is moved thereto. The lift bumps 134 are disposed on the top surface S2 of the lifting pedestal 132. The lift bump 134 corresponds to the opening 22 of the carrier 20 and moves the pre-assembly panel 10 from the carrier 20 through the opening 22 as the lift pedestal 132 moves toward the carrier 20. Furthermore, since the carrier 20 of the present embodiment is a "field" type frame and has four openings 22, and the opening 22 is rectangular, the lifting mechanism 130 of the present embodiment has four lifting bumps 134. , The lift bumps 134 are rectangular blocks that correspond to the openings 22 and can pass through the openings 22, respectively. However, in other embodiments, the lift mechanism 130 may also have only one lift tab 134 when the carrier has only one opening. The present creation does not limit the number, shape and position of the lift bumps 134.

In the present embodiment, the lift bump 134 contacts the bottom of the pre-plate 10 with its top surface S3, wherein the lift bump 134 is sized to pass through the opening 22 to remove the pre-set panel 10 from the carrier 20. In addition, the ratio of the area of the orthographic projection of the lifting bump 134 on the lifting pedestal 132 to the area of the orthographic projection of the pre-assembly panel 10 on the lifting pedestal 132 is greater than one tenth. In other words, the contact area of the lift bump 134 with the pre-plate 10 cannot be too small (for example, the area of the orthographic projection of the lift bump 134 on the lift pedestal 132 and the positive of the pre-plate 10 on the lift pedestal 132. The ratio of the projected area is less than one tenth) to prevent the pre-plate 10 from being attracted by gravity to cause a sagging bend. Since the lift mechanism 130 of the present embodiment has four lift bumps 134, the area of the orthographic projection of the lift bumps 134 on the lift pedestal 132 refers to the four lift bumps 134 on the lifting pedestal. The sum of the areas of the orthographic projections on 132. In addition, the above-mentioned ratio range is only an embodiment of the present invention. In fact, the contact area of the lifting bump 134 and the pre-plate 10 can be determined according to actual needs (for example, according to the shape and position of the lifting bump 134). Adjustment.

On the other hand, referring to FIG. 2 and FIG. 6 to FIG. 7 , in the embodiment, the pre-assembly board transport apparatus 100 further includes a positioning mechanism 140 . The positioning mechanism 140 is disposed on the working platform 110 and located above the lifting mechanism 130 for fixing the carrier 20 moving to the upper side of the lifting mechanism 130, and the lifting mechanism 130 is opposite to the positioning mechanism 140. Moving toward the carrier 20 In other words, in this embodiment, the carrier 20 is disposed on the positioning mechanism 140 to maintain its position, and the lifting pedestal 132 of the lifting mechanism 130 moves relative to the positioning mechanism 140 (also simultaneously moves toward the carrier 20). The lift bumps 134 move the pre-assembly plate 10 out of the carrier 20 through the opening 22.

Specifically, in the present embodiment, the positioning mechanism 140 includes a positioning pedestal 142, a plurality of positioning pins 144, and a pair of positioning push rods 146a and 146b. The positioning pedestal 142 is disposed above the lifting mechanism 130, and the lifting pedestal 132 is movable relative to the positioning pedestal 142 in the axial direction Y. The positioning pedestal 142 is an annular pedestal, and the carrier 20 is disposed on the top surface S4 of the positioning pedestal 142. Thus, the lift bumps 134 of the lift mechanism 130 can be moved toward the carrier 20 by the annular positioning pedestal 142 and the pre-assembly plate 10 can be removed from the carrier 20 through the opening 22. The positioning pin 144 is disposed at the periphery of the top surface S4 of the positioning pedestal 142, and the carrier 20 disposed on the top surface S4 abuts against the positioning pin 144 with its side edge. Therefore, the positioning pin 144 can prevent the carrier 20 from being displaced on the top surface S4. In addition, the positioning push rods 146a and 146b are disposed on opposite sides of the positioning base 142, and are driven by the motor or the cylinder to move in the axial direction X toward the positioning base 142 and approach each other to be opposite to the carrier 20 in the axial direction X. The carrier 20 is fixed on both sides. Since the positioning pushers 146a and 146b collectively clamp the carrier 20 in the axial direction X, it is also possible to prevent the carrier 20 from being displaced. Accordingly, when the transfer mechanism 120 moves the carrier 20 to the upper side of the lift mechanism 130 in the axial direction X as shown in FIG. 2, the transfer mechanism 120 moves in the axial direction Y toward the positioning mechanism 140 to load the carrier 20 It is placed on the positioning pedestal 142, and the carrier 20 is fixed by the positioning pin 144 and the positioning push rods 146a and 146b. Through the fixing of the positioning mechanism 140, the lifting mechanism 130 can be accurately aligned to the carrier 20 (for example) If the lifting lug 134 is aligned to the opening 22), the lifting mechanism 130 can also be prevented from moving the carrier 20 during the above-described removal of the pre-plate 10.

8A to 8E are schematic diagrams showing the operation flow of the pre-assembly board transporting apparatus of FIG. 2. In order to make the drawings clearer, FIG. 8A to FIG. 8E omits part of the components, such as the clamping gantry 40, the working platform 110 and the positioning pedestal 142 of the positioning mechanism 140, so that the other drawings can be matched with FIGS. 8A to 8E. Reference together. Referring to FIG. 2 and FIG. 8A to FIG. 8E, in the embodiment, when the pre-assembly board 10 is moved from the dispenser 30 to the carrier 20 via the carrier stacking module 102 as shown in FIG. The carriers 20 configured with the pre-setting plates 10 are stacked one on another behind the stacking area R1, and the carriers 20 can be transferred to the work platform 110 as shown in FIG. Thereafter, the transfer mechanism 120 and the lift mechanism 130 of the pre-assembly transporting apparatus 100 can remove the pre-assembly panel 10 from the carrier 20 and transfer the pre-assembly panel 10 to the stacking zone R2 of the gripper 40. The flow of transporting the pre-assembled panel 10 to the gripper 40 by the pre-assembly transporting apparatus 100 of the present embodiment will be described below in order with FIGS. 8A to 8E.

First, referring to FIG. 2 and FIG. 8A, in the present embodiment, after the carrier 20 can be transferred to the work platform 110 as shown in FIG. 2, the transfer mechanism 120 moves in the axial direction X to above the carrier 20. And adsorbing or gripping the uppermost carrier 20 located in the plurality of carriers 20 stacked on each other. At this time, since the transfer mechanism 120 sequentially moves the carrier 20 by contacting the carrier 20, the pre-assembly panel 10 is not damaged during the movement of the pre-assembly panel 10 by the transfer mechanism 120.

Next, referring to FIG. 2 and FIG. 8B, in the embodiment, after the transfer mechanism 120 adsorbs or grips the carrier 20, the transfer mechanism 120 moves in the axial direction X to the lift. The lifting mechanism 130 and the positioning mechanism 140 (shown in FIGS. 6 and 7) are moved upwards in the axial direction Y to dispose the carrier 20 in the positioning base 142 of the positioning mechanism 140 (shown in FIG. 6 and Figure 7). After the transfer mechanism 120 disposes the carrier 20 on the positioning pedestal 142, the carrier 20 is positioned by the positioning pin 144 (shown in FIGS. 6 and 7) of the top surface S4 of the positioning pedestal 142, and is configured. The positioning pushers 146a and 146b on opposite sides of the positioning pedestal 142 move relative to the carrier 20 in the axial direction X and approach each other to secure the carrier 20 from opposite sides of the carrier 20.

Next, referring to FIG. 2 and FIG. 8C, in the embodiment, after the positioning of the carrier 20 is completed, the transfer mechanism 120 can be moved back to the stack of the remaining carriers 20 in the axial direction X, or moved to not affect the subsequent Steps to avoid interactions between agencies. Next, the lifting pedestal 132 moves along the axial direction Y toward the carrier 20 above which is fixed to the positioning mechanism 140 (shown in FIGS. 6 and 7) to pass through the opening 22 by lifting the bump 134. The pre-assembly plate 10 is removed from the carrier 20. At this time, since the carrier 20 has been previously positioned by the positioning mechanism 140, the lifting protrusion 134 can accurately pass the opening 22 to remove the pre-plate 10 from the carrier 20, and the carrier 20 is subjected to the positioning pusher. The fixing of 146a and 146b can avoid offset.

Next, referring to FIG. 2 and FIG. 8D, in the embodiment, the pre-assembly transporting apparatus 100 further includes a clamping mechanism 150 disposed on one side of the lifting mechanism 130 for clamping and removing from the loading tray 20. The board 10 is pre-assembled and the pre-set board 10 is moved to the stacking area R2. Specifically, in the present embodiment, the clamping mechanism 150 includes the jaws 150a to 150d. The jaws 150a to 150d move in the axial direction Z toward the carrier 20 and sandwich the pre-plate 10 removed from the carrier 20. The position where the jaws 150a to 150d are clamped can be Depending on the design of the pre-assembly panel 10, for example, the jaws 150a to 150d are clamped as much as possible on the corners of the pre-assembly panel 10 that are not needed to avoid damaging the pre-assembly panel 10. Since the jaws 150a to 150d hold the pre-plate 10 when the pre-plate 10 is lifted from the carrier 20 by the lifting projections 134, it is possible to avoid the pre-groups in which the jaws 150a to 150d directly protrude into each other. The sides of the pre-assembly plate 10 are caused to be broken by the jaws 150a to 150d between the plates 10. However, in other embodiments, the clamping mechanism 150 can adjust the number and position of the jaws as needed, or use other types of clamps, the novel creation does not limit the type of clamping mechanism and the number and position of the jaws. Can be adjusted according to demand.

In the present embodiment, after the pre-set plates 10 are held by the jaws 150a to 150d, the jaws 150a to 150d are moved in the axial direction Z to move the pre-plate 10 to the stacking zone R2. The pre-assembly panel 10 moved to the stacking zone R2 can be moved to the clip crane 40 as shown in FIG. 2, wherein the method of moving the pre-set panel 10 from the stacking zone R2 to the gripper 40 can be by means of a conveyor belt Or other automatic devices can also be delivered by human power. This new creation is not limited by this. After the pre-assembly plate 10 is moved to the clamp crane 40, the pre-assembly plate 10 can be pressed with the copper skin, and more pre-assembly plates 10 can be successively moved to the clamp crane 40 according to this process for reverse pressure. Together, a multi-layer board structure is formed.

Finally, referring to FIG. 2 and FIG. 8E, in the present embodiment, after the pre-setting plate 10 is removed from the carrier 20 via the lifting mechanism 130, the positioning pushers 146a and 146b of the positioning mechanism 140 are mutually axial X. Moving away from the fixed empty tray 20, the transfer mechanism 120 is moved in the axial direction X above the empty tray 20 and moved down in the axial direction Y to adsorb or clamp the empty tray 20. Adsorbing or clamping no load at the transfer mechanism 120 After the disk 20, the transfer mechanism 120 moves the empty tray 20 to the recovery zone R3 in the axial direction X. Thereafter, the transfer mechanism 120 is moved back in the axial direction X above the stack of the remaining carriers 20 to re-adsorb or clamp the carrier 20 carrying the pre-assembly plate 10.

Thus, the above steps are repeated to successively move the pre-setting plate 10 disposed in the carrier 20 to the stacking zone R2, and the empty-carrying disk 20 is moved to the recovery zone R3 to be stacked on each other. After the empty trays 20 of the recovery area R3 are accumulated to a certain amount, the empty trays 20 can be transported back to the tray stacking module 102 as shown in FIG. 3 to complete the pre-grouping of the pre-groups at the dispenser 30. 10 is sequentially moved into the empty tray 20, and the carrier 20 configured with the pre-grouping board 10 is stacked in the stacking area R1. After the carrier 20 of the stacking area R1 is accumulated to a certain amount, the carrier 20 can be transported back to the working platform 110 as shown in FIG. 2 to sequentially remove the pre-grouped pre-setting board 10 out of the carrier 20 and be Transfer to the clip crane 40. Accordingly, the pre-assembly plate transporting apparatus 100 transports the pre-assembled panel 10 from the dispenser 30 to the gripper 40, which can greatly reduce manpower requirements and improve production efficiency. In addition, the above-described modules and mechanisms of the pre-assembly transport apparatus 100 actually transport the pre-set board 10 by the carrier 20 during the transport of the pre-set board 10. Therefore, these automated modules and mechanisms only contact the carrier 20 without contacting the pre-assembly panel 10. In this way, it is possible to prevent the pre-assembly board 10 from being damaged by the pre-assembly board transporting device 100 during transportation, thereby improving the transport yield.

The axial X, Y and Z mentioned in the above are only explained by the common space coordinate system, and the drawings are taken as an example to make the description of the specification and the moving manner of the components clearer. In other words, the directional term mentioned in the above content and the moving path of each module and mechanism are in the case of the matching schema. For example, it is only an embodiment of the present invention, and is not intended to limit the actual operation direction of each module and mechanism of the pre-assembly board transport apparatus 100 of the present invention. Therefore, in the case that the actuation paths of the modules and the mechanisms do not interfere with each other, as long as the pre-assembly transporting device 100 can achieve the operation of transporting the pre-composition 10, the tray stacking module 102 can be adjusted and transferred according to requirements. The mechanism 120, the lifting mechanism 130, the positioning mechanism 140 and the moving axis of the clamping mechanism 150.

In summary, the pre-assembly board transporting device of the present invention carries the pre-grouping board by the carrier and transports it along with the carrier during the process of transporting the pre-grouping board. After the pre-assembly process is completed by the pre-assembly plate via the dispenser, the pre-assembly plate can be transported to the gripper by the newly created pre-assembly transport device and the nip process has been performed. During the transport of the pre-assembly plate, the transfer mechanism sequentially moves the carrier, and the lifting mechanism removes the pre-set plate from the carrier so that the pre-set plate can be moved to the stacking zone, and the empty carrier moves to Recycling area. In this way, replacing the manpower with automated pre-board transport equipment can avoid the destruction of human factors and improve production efficiency. In addition, by carrying the pre-composition plate on the carrier, it is possible to avoid various modules and mechanisms in the automated pre-assembly transport device (for example, a carrier stacking module, a transfer mechanism, a lifting mechanism, a positioning mechanism, and a clamping mechanism) Damage the pre-set board. Accordingly, the novel pre-assembly board transporting device can automatically transport the pre-set board and improve the production efficiency and the transport yield of the pre-group board.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the novel creation, and any person skilled in the art can make some changes without departing from the spirit and scope of the novel creation. Retouching, the scope of protection of this new creation is subject to the definition of the scope of the patent application attached.

10‧‧‧Pre-set board

20‧‧‧Package

40‧‧‧Clamp crane

50‧‧‧Working car

100‧‧‧Pre-board transport equipment

110‧‧‧Working platform

120‧‧‧Transportation mechanism

130‧‧‧ Lifting mechanism

R2‧‧‧Stacked area

R3‧‧‧Recycling area

X, Y, Z‧‧‧ axial

Claims (14)

A pre-stacking device includes: a working platform, a plurality of carriers are stacked on the working platform, and are respectively configured to carry a pre-set board, wherein each of the trays has at least one opening, the opening exposing part of the a pre-assembly mechanism; a transfer mechanism disposed on the work platform and sequentially moving the trays; and a lifting mechanism disposed on the working platform, wherein the transfer mechanism sequentially moves the trays Up to the lifting mechanism, the lifting mechanism and the tray above it move relative to each other in an axial direction and approach each other, so that the lifting mechanism transmits the pre-setting plate from the opening of the loading tray The tray is removed and the pre-set plate removed from the carrier is transferred to a stack of plates, and the transfer mechanism moves the carrier to a recovery zone. The pre-board transporting device according to claim 1, further comprising: a positioning mechanism disposed on the working platform and located above the lifting mechanism for fixedly moving to the upper of the lifting mechanism The carrier is moved relative to the positioning mechanism toward the carrier. The pre-grouping device of claim 2, wherein the positioning mechanism comprises: a positioning pedestal disposed above the lifting mechanism, and the carrier is disposed on a top surface of the positioning pedestal; a positioning pin disposed at a periphery of the top surface of the positioning pedestal, and the carrier plate abuts the positioning pins with a side edge thereof; A pair of positioning push rods are disposed on opposite sides of the positioning base and move toward the positioning base to fix the carrier from opposite sides of the carrier. The pre-assembly plate transporting device of claim 3, wherein the positioning pedestal is an annular pedestal, and the lifting mechanism is moved toward the carrier by the annular pedestal. The pre-assembly plate transporting device of claim 1, wherein the transfer mechanism comprises a vacuum chuck. The pre-assembly plate transporting device of claim 1, wherein the lifting mechanism comprises: a lifting pedestal adapted to move toward the carrier plate moved thereto; and at least one lifting bump disposed at the Lifting a bump corresponding to the opening of the carrier, and moving the lifting pedestal toward the carrier to pass the pre-set plate from the carrier through the opening Move out. The pre-assembly plate transporting device of claim 6, wherein an area of the orthographic projection of the lifting bump on the lifting pedestal and an area of the orthographic projection of the pre-combined plate on the lifting pedestal The ratio is greater than one tenth. The pre-assembled board transporting device of claim 1, wherein each of the trays is a "field" shaped frame and has four openings. The pre-assembly plate transporting device of claim 1, wherein each of the loading trays has a body portion and an abutting portion, the opening penetrating the body portion, the abutting portion is located at a circumference of the body portion and Projecting from a top surface of the body portion, the pre-plate is adapted to be carried on the top surface of the body portion and abuts the abutting portion with a side edge thereof. The pre-assembled board transporting device of claim 9, wherein each of the loading trays has a protruding portion located at a peripheral edge of the body portion and protruding from a top surface of the body portion, the loading trays It is adapted to be carried by its bottom portion on the projection of the other carrier, and the transfer mechanism moves each of the carriers by contacting the projection. The pre-grouping device of claim 1, further comprising: a clamping mechanism disposed on one side of the lifting mechanism for clamping the pre-setting plate removed from the carrier. And moving the pre-assembly plate to the stacking area. The pre-assembly plate transporting device of claim 11, wherein the clamping mechanism comprises a plurality of jaws, the jaws move toward the carrier, and the pre-group removed from the carrier is clamped board. The pre-boarding device according to the first aspect of the invention, further comprising: a carrier-carrying module, configured to sequentially configure each of the pre-grouping boards in each of the loading trays, and carry the pre-composing boards The trays are stacked on each other and transferred to the work platform. The pre-package transporting device of claim 13, wherein the stacking module comprises a roller mechanism for sequentially moving each of the pre-sets into each of the carriers.