TWI755906B - Dually symmetric structure interactive image automatic stacking boards machine - Google Patents
Dually symmetric structure interactive image automatic stacking boards machine Download PDFInfo
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一種交互式疊板機,尤指一種雙對稱結構交互式影像自動疊板機。An interactive board stacker, especially a double-symmetrical structure interactive image automatic board stacker.
按,印刷電路板係朝向高密度以及高層數的型態進行發展,因此印刷電路板在製造過程中,需利用疊板機將複數層電路板經過對位層疊以及熱熔定位之加工程序。According to press, the printed circuit board is developing towards the type of high density and high number of layers. Therefore, during the manufacturing process of the printed circuit board, it is necessary to use a stacking machine to process the multiple layers of circuit boards through alignment and hot-melt positioning.
然而,現有的作法為利用送板人員將電路板放置於進料座上,再由取料裝置將電路板送進工作站以進行對位層疊以及熱熔定位之加工,但是此種作法在電路板進行層疊或熱熔時,送板人員的大部分時間則為閒置狀態,只能等待該電路板完成出料才能進行下一步,也因此導致整個送板人員利用率偏低,無法有效提升產能。是以,要如何能使現有的疊板機與送板人員之利用率增加,並且提升產能,即為相關業者所亟欲改善之課題所在。However, the existing method is to use the board feeder to place the circuit board on the feed seat, and then send the circuit board to the work station by the reclaimer for positional lamination and hot-melt positioning processing. When stacking or hot-melting, the board feeders spend most of their time in an idle state, and they can only wait for the circuit board to complete the discharge before proceeding to the next step, which leads to a low utilization rate of the entire board feeder, which cannot effectively increase the production capacity. Therefore, how to increase the utilization rate of the existing stacking machine and the board feeding personnel, and improve the production capacity, is the problem that the related industry is eager to improve.
本發明提出一種雙對稱結構交互式影像自動疊板機,以進而提升多個工作站組之疊板產能,使多個工作站組更能有效利用。The present invention provides a double-symmetrical structure interactive image automatic stacking machine, so as to further improve the stacking capacity of multiple workstation groups, so that the multiple workstation groups can be used more effectively.
本發明提供一種雙對稱結構交互式影像自動疊板機,雙對稱結構交互式影像自動疊板機包括第一交互式影像自動疊板機、第二交互式影像自動疊板機、進出料組與進料裝置。第一交互式影像自動疊板機包括工作站組、第一移載裝置與第二移載裝置。工作站組具有第一工作站與第二工作站,第一工作站為電路板的層疊對位站。第一移載裝置係設置於工作站組下方側,第一移載裝置具有第一軌道與第一載台,第一載台係設置於第一軌道,第一載台上設置第一壓板器,第一載台依第一軌道來回位移,以分別正對於工作站組之第一工作站與第二工作站。第二移載裝置係設置於第一移載裝置下方側,第二移載裝置具有第二軌道、第二載台與升降器,升降器係連接於第二載台,第二載台係設置於第二軌道,第二載台上設置有第二壓板器,第二載台依第二軌道來回位移,以及升降器驅動升降,而分別正對於工作站組之第一工作站與第二工作站,其中當第一載台於第一工作站時,則第二載台於第二工作站, 並且當第二載台於第一工作站時,則第一載台於第二工作站。第二交互式影像自動疊板機的結構相同於第一交互式影像自動疊板機。進出料組係於第一移載裝置靠近工作站組之第一工作站側方之間,設置有用以供電路板置放之進料座,其中第一交互式影像自動疊板機與第二交互式影像自動疊板機對稱於進出料組。進料裝置設置有取料軌道與取料裝置,取料軌道係位於進料座上方側,兩端係分別朝向第一移載裝置延伸,而取料裝置設於取料軌道,其中取料裝置用以夾取進料座上所置放之電路板,再分別置放於不同側方之第一載台或第二載台。The invention provides a double-symmetrical structure interactive image automatic board stacker. The double-symmetrical structure interactive image automatic board stacker includes a first interactive image automatic board stacker, a second interactive image automatic board stacker, an input and output group and a feeding device. The first interactive image automatic stacker includes a workstation group, a first transfer device and a second transfer device. The workstation group has a first workstation and a second workstation, and the first workstation is a stacking alignment station for circuit boards. The first transfer device is arranged on the lower side of the workstation group, the first transfer device has a first track and a first stage, the first stage is arranged on the first track, and a first platen is arranged on the first stage, The first stage is displaced back and forth along the first track so as to face the first work station and the second work station of the work station group respectively. The second transfer device is arranged on the lower side of the first transfer device. The second transfer device has a second rail, a second stage and a lifter. The lifter is connected to the second stage, and the second stage is installed On the second track, a second platen presser is arranged on the second stage, the second stage is displaced back and forth according to the second track, and the lifter drives up and down, respectively facing the first workstation and the second workstation of the workstation group, wherein When the first stage is at the first work station, the second stage is at the second work station, and when the second stage is at the first work station, the first stage is at the second work station. The structure of the second interactive image automatic stacker is the same as that of the first interactive image automatic stacker. The feeding and discharging group is located between the first transfer device and the side of the first work station of the work station group, and is provided with a feeding seat for placing circuit boards, wherein the first interactive image automatic stacker and the second interactive The image automatic stacking machine is symmetrical to the feeding and discharging group. The feeding device is provided with a reclaiming track and a reclaiming device. The reclaiming track is located on the upper side of the feeding seat, and the two ends are respectively extended toward the first transfer device, and the reclaiming device is arranged on the reclaiming track, wherein the reclaiming device It is used to clamp the circuit board placed on the feed base, and then place it on the first or second stage on different sides respectively.
在本發明之一實施例中,取料裝置包括第一取料件、第二取料件以及第三取料件。第一取料件、第二取料件以及第三取料件係併排連接於取料軌道,第二取料件係位於第一取料件以及第三取料件之間,其中第二取料件與第三取料件以及第二取料件與第一取料件,係用以夾取進料座上所置放之電路板,再分別置放於不同側方之第一載台或第二載台。In an embodiment of the present invention, the reclaiming device includes a first reclaiming part, a second reclaiming part, and a third reclaiming part. The first reclaiming part, the second reclaiming part and the third reclaiming part are connected to the reclaiming track side by side, the second reclaiming part is located between the first reclaiming part and the third reclaiming part, wherein the second reclaiming part is located between the first reclaiming part and the third reclaiming part. The material and the third reclaimer, as well as the second reclaimer and the first reclaimer, are used to clamp the circuit board placed on the feed seat, and then place them on the first carrier on different sides respectively. or second stage.
在本發明之一實施例中,第二取料件與第一取料件,係用以夾取進料座上所置放之電路板,置放於第一交互式影像自動疊板機之第一載台或第二載台。In an embodiment of the present invention, the second reclaiming part and the first reclaiming part are used to clamp the circuit board placed on the feeding seat and place it on the first interactive image automatic stacker. The first stage or the second stage.
在本發明之一實施例中,第二取料件與第三取料件係用以夾取進料座上所置放之電路板,置放於第二交互式影像自動疊板機之第一載台或第二載台。In an embodiment of the present invention, the second reclaiming part and the third reclaiming part are used for clamping the circuit board placed on the feeding seat and placing it on the first part of the second interactive image automatic stacker. A stage or a second stage.
在本發明之一實施例中,取料裝置用以夾取不同側方之第一載台或第二載台上的不合格之電路板,再分別放置於進料座上。In an embodiment of the present invention, the reclaiming device is used to clamp the unqualified circuit boards on the first carrier or the second carrier on different sides, and then place them on the feeder respectively.
在本發明之一實施例中,第二取料件與第三取料件以及第二取料件與第一取料件,係用以夾取不同側方第一載台或第二載台上的不合格之電路板,再分別放置於進料座上。In an embodiment of the present invention, the second reclaiming member and the third reclaiming member, as well as the second reclaiming member and the first reclaiming member, are used to clamp the first carrier or the second carrier on different sides The unqualified circuit boards are placed on the feeder seat respectively.
在本發明之一實施例中,第二取料件與第一取料件係用以夾取第一交互式影像自動疊板機之第一載台或第二載台上的不合格之電路板,再放置於進料座上。In an embodiment of the present invention, the second pick-up part and the first pick-up part are used to clamp the defective circuit on the first stage or the second stage of the first interactive image automatic stacker plate, and then placed on the feed seat.
在本發明之一實施例中,第二取料件與第三取料件係用以夾取第二交互式影像自動疊板機之第一載台或第二載台上的不合格之電路板,再放置於進料座上。In an embodiment of the present invention, the second pick-up part and the third pick-up part are used to clamp the defective circuit on the first stage or the second stage of the second interactive image automatic stacker plate, and then placed on the feed seat.
在本發明之一實施例中,進出料組係於第一移載裝置靠近工作站組之第二工作站側方之間,設置有用以供電路板置放之出料座,且出料座上方設置有出料裝置,出料裝置係設置有出料軌道以及連接於出料軌道之出料夾取件。In one embodiment of the present invention, the feeding and discharging group is located between the first transfer device and the side of the second work station of the work station group, and a discharging seat for placing the circuit board is arranged above the discharging seat There is a discharge device, and the discharge device is provided with a discharge track and a discharge clip connected to the discharge track.
在本發明之一實施例中,出料軌道係位於出料座上方側,兩端係分別朝向第一移載裝置延伸,出料夾取件係用以夾取兩側之第一載台或第二載台上所置放之電路板,再將電路板置放於出料座上。In one embodiment of the present invention, the discharge rail is located on the upper side of the discharge seat, both ends are respectively extended toward the first transfer device, and the discharge gripper is used for gripping the first carrier or the first carrier on both sides. The circuit board placed on the second carrier, and then the circuit board is placed on the discharge seat.
底下藉由具體實施例詳加說明,當更容易瞭解本發明之目的、技術內容、特點及其所達成之功效。The following describes in detail with specific embodiments, when it is easier to understand the purpose, technical content, characteristics and effects of the present invention.
為有關本發明為達成上述目的,所採用之技術手段及其功效,茲舉出可行實施例,並且配合圖式說明如下:In order to achieve the above-mentioned purpose, the technical means used and the effect thereof of the present invention, a feasible embodiment is given hereby, and the description is as follows in conjunction with the drawings:
請參閱第一圖,第一圖係本發明第一交互式影像自動疊板機之示意圖。由圖中可清楚看出,第一交互式影像自動疊板機係設置有工作站組1、第一移載裝置2以及第二移載裝置3。工作站組1係具有第一工作站11與第二工作站12,在本發明之第一工作站11係為電路板層疊對位站,第二工作站12為電路板熱熔疊合定位後之出料站。第一移載裝置2係設置於工作站組1下方側,係具有第一軌道21與第一載台22,第一載台22係設置於第一軌道21,第一載台22上設置有第一壓板器23,且第一載台22上進一步設置有第一熔接器24,第一載台22係依第一軌道21來回位移(第一載台22的移動路徑),而可分別正對於工作站組1之第一工作站11與第二工作站12。第二移載裝置3係設置於第一移載裝置2下方側,係具有第二軌道31、第二載台32與升降器33,升降器33係連接於第二載台32,第二載台32係設置於第二軌道31,第二載台32上設置有第二壓板器34,且第二載台32上進一步設置有第二熔接器35,第二載台32係依第二軌道31來回位移,以及透過升降器33來驅動第二載台32升降(第二載台32的移動路徑),而可分別正對於工作站組1之第一工作站11與第二工作站12。Please refer to the first figure, which is a schematic diagram of the first interactive image automatic stacking machine of the present invention. It can be clearly seen from the figure that the first interactive image automatic stacker is provided with a
先使第一載台22依第一軌道21位移至正對於第一工作站11,使第一工作站11對第一載台22表面所承載之電路板A或相關板片進行層疊對位。在第一載台22之電路板A進行層疊對位完畢後,利用第一壓板器23壓住電路板A,使電路板A形成定位狀態,然後利用第一熔接器24對於第一載台22上之電路板A進行熱熔疊合定位。第一載台22係依第一軌道21移動至正對於第二工作站12,而在位移過程中,第一熔接器24可對第一載台22上之電路板A持續進行熱熔定位。同時間,第二載台32會依第二軌道31位移至第一工作站11下方,讓升降器33驅動第二載台32上升至正對於工作站11,進而讓第一工作站11對第二載台32表面所承載之電路板A進行層疊對位,以及利用第二壓板器34壓住電路板A形成定位狀態,然後利用第二熔接器35對於第二載台32上之電路板A進行熱熔疊合定位。當第一工作站11下方之第二載台32表面所承載之電路板A進行層疊對位完畢,以及第二工作站12下方之第一載台22上之電路板A進行出料完畢後。升降器33會驅動第二載台32下降,並依第二軌道31位移至第二工作站12下方,讓升降器33驅動第二載台32上升至正對於第二工作站12。而在位移過程中,第二熔接器35可對第二載台32上之電路板A持續進行熱熔定位,以及第二工作站12下方之第一載台22上之電路板A移出第一載台22後,即依第一軌道21移動至正對於第一工作站11,以再次進行電路板A之層疊對位。First, the
請參閱第一圖至第八圖所示,第二圖係本發明之雙對稱結構交互式影像自動疊板機進料側之示意圖。第三圖係本發明之雙對稱結構交互式影像自動疊板機出料側之示意圖。第四圖係本發明之雙對稱結構交互式影像自動疊板機於疊板時之第一動作示意圖。第五圖係本發明之雙對稱結構交互式影像自動疊板機於疊板時之第二動作示意圖。第六圖係本發明之雙對稱結構交互式影像自動疊板機於疊板時之第三動作示意圖。 第七圖係本發明之雙對稱結構交互式影像自動疊板機於疊板時之第四動作示意圖。第八圖係本發明之雙對稱結構交互式影像自動疊板機將電路板移出之動作示意圖。 Please refer to the first figure to the eighth figure, the second figure is a schematic diagram of the feeding side of the double-symmetrical structure interactive image automatic stacking machine of the present invention. The third figure is a schematic diagram of the discharge side of the double-symmetrical structure interactive image automatic stacking machine of the present invention. The fourth figure is a schematic diagram of the first action of the dual-symmetric structure interactive image automatic stacking machine of the present invention when stacking. The fifth figure is a schematic diagram of the second action of the dual-symmetric structure interactive image automatic stacking machine of the present invention when stacking. The sixth figure is a schematic diagram of the third action of the dual-symmetric structure interactive image automatic stacking machine of the present invention when stacking. Figure 7 is a schematic diagram of the fourth action of the dual-symmetric structure interactive image automatic stacking machine of the present invention when stacking. The eighth figure is a schematic diagram of the action of the dual-symmetric structure interactive image automatic stacking machine of the present invention to remove the circuit board.
如圖二所示,本發明所提出之雙對稱結構交互式影像自動疊板機包括第一交互式影像自動疊板機(圖一之架構)、第二交互式影像自動疊板機(圖一之架構)、進出料組4與進料裝置5,其中第二交互式影像自動疊板機之結構相同於第一交互式影像自動疊板機(如圖1所示)並且第一交互式影像自動疊板機與第二交互式影像自動疊板機對稱於進出料組4。進出料組4係於兩個第一移載裝置2靠近工作站組1之第一工作站11側方之間,且設置有用以供電路板A置放之進料座41,以及於兩第一移載裝置2靠近工作站組1之第二工作站12側方之間,且設置有用以供電路板A置放之出料座42。前述之進料裝置5係設置有取料軌道51與取料裝置50,取料軌道51係位於進料座41上方側,兩端係分別朝向第一移載裝置2延伸,而取料裝置50設於取料軌道51,其中取料裝置50用以夾取進料座41上所置放之電路板A,再分別置放於不同側方之第一載台22或第二載台32。取料裝置50包括第一取料件52、第二取料件53以及第三取料件54。第一取料件52、第二取料件53以及第三取料件54係併排連接於取料軌道51,第二取料件53係位於第一取料件52以及第三取料件54之間。第二取料件53與第三取料件54以及第二取料件53與第一取料件52,係用以夾取進料座41上所置放之電路板A,再分別置放於不同側方之第一載台22或第二載台32。As shown in Fig. 2, the dual-symmetrical structure of the interactive image automatic stacking machine proposed by the present invention includes a first interactive image automatic stacking machine (the structure of Fig. 1), and a second interactive image automatic stacking machine (Fig. 1). structure), the feeding and
進一步來說,第二取料件53與第一取料件52,係用以夾取進料座41上所置放之電路板A,置放於第一交互式影像自動疊板機之第一載台22或第二載台32。第二取料件53與第三取料件54係用以夾取進料座41上所置放之電路板A,置放於第二交互式影像自動疊板機之第一載台22或第二載台32。也就是說,工作人員可以將電路板持續地放置於進料座41,而本發明之雙對稱結構交互式影像自動疊板機會透過進料裝置5中的第一取料件52、第二取料件53以及第三取料件54之上述機制的相互搭配而將電路板適當地往第一交互式影像自動疊板機或第二交互式影像自動疊板機送料,大大地提升了疊板效率。Further, the
此外,本發明內容更能夠處理當偵測到電路板A為不合格之情況,而進一步排除掉不合格之電路板A,如以下所述。在一實施例中,取料裝置50可用以夾取不同側方之第一載台22或第二載台32上的不合格之電路板A,再分別放置於進料座41上。也就是說,透過第二取料件53與第三取料件54以及第二取料件53與第一取料件52,係用以夾取不同側方第一載台22或第二載台上32的不合格之電路板A,再分別放置於進料座41上。當偵測到第一交互式影像自動疊板機之第一載台22或第二載台32上的電路板A為不合格時,則第二取料件53與第一取料件52會夾取第一交互式影像自動疊板機之第一載台22或第二載台32上的不合格之電路板A,再將此不合格之電路板A放置於進料座41上。另外,當偵測到第二交互式影像自動疊板機之第一載台22或第二載台32上的電路板A為不合格時,第二取料件53與第三取料件54會夾取第二交互式影像自動疊板機之第一載台22或第二載台32上的不合格之電路板A,再將此不合格之電路板A放置於進料座41上。藉此,本揭露內容透過取料裝置50之第一取料件52、第二取料件53與第三取料件54可將不合格之電路板A予以排除掉。In addition, the content of the present invention can further handle the situation when the circuit board A is detected to be unqualified, and further eliminate the unqualified circuit board A, as described below. In one embodiment, the reclaiming
進出料組4係於兩個第一移載裝置2靠近工作站組1之第二工作站12側方之間,設置有用以供電路板A置放之出料座42,且出料座42上方設置有出料裝置6,出料裝置6係設置有出料軌道61以及連接於出料軌道61之出料夾取件62。出料夾取件62係用以夾取兩側之第一載台22或第二載台32上所置放之電路板A,再將電路板A置放於出料座42上。The feeding and discharging
出料裝置6係設置有出料軌道61以及連接於出料軌道61之出料夾取件62,出料軌道61係位於出料座42上方側,兩端係分別朝向兩個第一移載裝置2延伸。當進料裝置5將進料座41上的電路板A依序置放於兩側之第一載台22或第二載台32上時,請參閱第三圖至第五圖所示,係先利用第二取料件53與第三取料件54夾取進料座41上所置放之電路板A,再將電路板A放置於靠近第三取料件54側方之第一載台22或第二載台32表面後,供第一工作站11(參閱第一圖)進行層疊定位。The discharging
請參閱第七圖所示,在移動第二取料件53與第一取料件52,夾取進料座41上所置放之電路板A,再將電路板A放置於靠近第一取料件52側方之第一載台22或第二載台32表面後,供第一工作站11進行層疊定位,重複上述步驟直到第一載台22或第二載台32表面之電路板A層疊定位完畢。請參閱第一圖與第八圖所示,在第一載台22或第二載台32在電路板A進行熱熔定位過程中,第一載台22或第二載台32位移至第二工作站12下方,而出料裝置6之出料夾取件62係依出料軌道61於兩側之第一載台22或第二載台32來回位移,以夾取兩側第一載台22或第二載台32表面經熱熔定位之電路板A,再將電路板A夾取放置於出料座42上。Please refer to Fig. 7. When the second reclaiming
綜上所述,本發明提出一種雙對稱結構交互式影像自動疊板機,以進而提升多個工作站組之產能,使多個工作站組更能有效利用。To sum up, the present invention proposes a double-symmetrical structure interactive image automatic stacking machine, so as to further improve the productivity of multiple workstation groups and make the multiple workstation groups more effectively utilized.
唯以上所述者,僅為本發明之較佳實施例而已,並非用來限定本發明實施之範圍。故即凡依本發明申請範圍所述之特徵及精神所為之均等變化或修飾,均應包括於本發明之申請專利範圍內。Only the above descriptions are only preferred embodiments of the present invention, and are not intended to limit the scope of the present invention. Therefore, all equivalent changes or modifications made according to the features and spirits described in the scope of the application of the present invention shall be included in the scope of the application for patent of the present invention.
1:工作站組1: Workstation group
11:第一工作站11: The first workstation
12:第二工作站12: Second workstation
2:第一移載裝置2: The first transfer device
21:第一軌道21: The first track
22:第一載台22: The first stage
23:第一壓板器23: The first platen press
24:第一熔接器24: First fusion splicer
3:第二移載裝置3: Second transfer device
31:第二軌道31: Second track
32:第二載台32: Second stage
33:升降器33: Lifter
34:第二壓板器34: Second platen press
35:第二熔接器35: Second fusion splicer
4:進出料組4: In and out group
41:進料座41: Feed seat
42:出料座42: Discharge seat
5:進料裝置5: Feeding device
50:取料裝置50: Reclaiming device
51:取料軌道51: Reclaiming track
52:第一取料件52: The first pick-up piece
53:第二取料件53: The second reclaimer
54:第三取料件54: The third reclaimer
6:出料裝置6: discharge device
61:出料軌道61: discharge track
62:出料夾取件62: Outlet gripper
A:電路板A: circuit board
第一圖係本發明第一交互式影像自動疊板機之示意圖。 第二圖係本發明之雙對稱結構交互式影像自動疊板機進料側之示意圖。 第三圖係本發明之雙對稱結構交互式影像自動疊板機出料側之示意圖。 第四圖係本發明之雙對稱結構交互式影像自動疊板機於疊板時之第一動作示意圖。 第五圖係本發明之雙對稱結構交互式影像自動疊板機於疊板時之第二動作示意圖。 第六圖係本發明之雙對稱結構交互式影像自動疊板機於疊板時之第三動作示意圖。 第七圖係本發明之雙對稱結構交互式影像自動疊板機於疊板時之第四動作示意圖。 第八圖係本發明之雙對稱結構交互式影像自動疊板機將電路板移出之動作示意圖。 The first figure is a schematic diagram of the first interactive image automatic stacking machine of the present invention. The second figure is a schematic diagram of the feeding side of the double-symmetrical structure interactive image automatic stacking machine of the present invention. The third figure is a schematic diagram of the discharge side of the double-symmetrical structure interactive image automatic stacking machine of the present invention. The fourth figure is a schematic diagram of the first action of the dual-symmetric structure interactive image automatic stacking machine of the present invention when stacking. The fifth figure is a schematic diagram of the second action of the dual-symmetric structure interactive image automatic stacking machine of the present invention when stacking. The sixth figure is a schematic diagram of the third action of the dual-symmetric structure interactive image automatic stacking machine of the present invention when stacking. Figure 7 is a schematic diagram of the fourth action of the dual-symmetric structure interactive image automatic stacking machine of the present invention when stacking. The eighth figure is a schematic diagram of the action of the dual-symmetric structure interactive image automatic stacking machine of the present invention to remove the circuit board.
2:第一移載裝置 2: The first transfer device
21:第一軌道 21: The first track
22:第一載台 22: The first stage
23:第一壓板器 23: The first platen press
24:第一熔接器 24: First fusion splicer
3:第二移載裝置 3: Second transfer device
31:第二軌道 31: Second track
32:第二載台 32: Second stage
33:升降器 33: Lifter
34:第二壓板器 34: Second platen press
35:第二熔接器 35: Second fusion splicer
4:進出料組 4: In and out group
41:進料座 41: Feed seat
42:出料座 42: Discharge seat
5:進料裝置 5: Feeding device
50:取料裝置 50: Reclaiming device
51:取料軌道 51: Reclaiming track
52:第一取料件 52: The first pick-up piece
53:第二取料件 53: The second reclaimer
54:第三取料件 54: The third reclaimer
A:電路板 A: circuit board
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Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6183190B1 (en) * | 1997-10-02 | 2001-02-06 | Borgotec Technologie Per L'automazione S.P.A. | Method of stacking packs of printed circuit boards and relative pack loading and unloading device for a machine tool |
CN103381408A (en) * | 2012-05-03 | 2013-11-06 | 富葵精密组件(深圳)有限公司 | Material sorting device and material sorting method |
US20160052830A1 (en) * | 2013-03-29 | 2016-02-25 | Mitsubishi Materials Corporation | Apparatus and method for producing (metal plate)-(ceramic board) laminated assembly, and apparatus and method for producing power-module substrate |
TWM564883U (en) * | 2018-03-28 | 2018-08-01 | 時豪 葉 | Stacking and moving apparatus for manufacturing printed circuit boards |
CN110366332A (en) * | 2019-07-09 | 2019-10-22 | 李舒武 | The parallel-moving type fuse machine aligned using camera |
CN110683353A (en) * | 2019-09-25 | 2020-01-14 | 珠海市柏泉精密制造有限公司 | Alternate plate stacking machine |
TWM591096U (en) * | 2019-05-15 | 2020-02-21 | 鴻鉑科技有限公司 | Thin plate stacking device |
CN111346880A (en) * | 2020-04-10 | 2020-06-30 | 广州市泰立机电设备有限公司 | One-driving-multiple circuit board feeding and discharging system and method |
CN111615271A (en) * | 2020-05-09 | 2020-09-01 | 江苏拓斯达机器人有限公司 | Automatic laminating equipment for multilayer circuit board |
TWM610238U (en) * | 2020-10-23 | 2021-04-11 | 尚城科技股份有限公司 | Mutual image automatic palletizing machine with double symmetrical structure |
-
2020
- 2020-10-23 TW TW109136900A patent/TWI755906B/en active
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6183190B1 (en) * | 1997-10-02 | 2001-02-06 | Borgotec Technologie Per L'automazione S.P.A. | Method of stacking packs of printed circuit boards and relative pack loading and unloading device for a machine tool |
CN103381408A (en) * | 2012-05-03 | 2013-11-06 | 富葵精密组件(深圳)有限公司 | Material sorting device and material sorting method |
US20160052830A1 (en) * | 2013-03-29 | 2016-02-25 | Mitsubishi Materials Corporation | Apparatus and method for producing (metal plate)-(ceramic board) laminated assembly, and apparatus and method for producing power-module substrate |
TWM564883U (en) * | 2018-03-28 | 2018-08-01 | 時豪 葉 | Stacking and moving apparatus for manufacturing printed circuit boards |
TWM591096U (en) * | 2019-05-15 | 2020-02-21 | 鴻鉑科技有限公司 | Thin plate stacking device |
CN110366332A (en) * | 2019-07-09 | 2019-10-22 | 李舒武 | The parallel-moving type fuse machine aligned using camera |
CN110683353A (en) * | 2019-09-25 | 2020-01-14 | 珠海市柏泉精密制造有限公司 | Alternate plate stacking machine |
CN111346880A (en) * | 2020-04-10 | 2020-06-30 | 广州市泰立机电设备有限公司 | One-driving-multiple circuit board feeding and discharging system and method |
CN111615271A (en) * | 2020-05-09 | 2020-09-01 | 江苏拓斯达机器人有限公司 | Automatic laminating equipment for multilayer circuit board |
TWM610238U (en) * | 2020-10-23 | 2021-04-11 | 尚城科技股份有限公司 | Mutual image automatic palletizing machine with double symmetrical structure |
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