TWM465602U - 散熱器 - Google Patents

散熱器 Download PDF

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Publication number
TWM465602U
TWM465602U TW102209523U TW102209523U TWM465602U TW M465602 U TWM465602 U TW M465602U TW 102209523 U TW102209523 U TW 102209523U TW 102209523 U TW102209523 U TW 102209523U TW M465602 U TWM465602 U TW M465602U
Authority
TW
Taiwan
Prior art keywords
heat sink
vertical plates
base
fan
fixing
Prior art date
Application number
TW102209523U
Other languages
English (en)
Inventor
Jun-Huang Zhou
Jun Chen
Long-Hui Liu
Original Assignee
Tai Sol Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tai Sol Electronics Co Ltd filed Critical Tai Sol Electronics Co Ltd
Priority to TW102209523U priority Critical patent/TWM465602U/zh
Publication of TWM465602U publication Critical patent/TWM465602U/zh
Priority to US14/251,096 priority patent/US20140345844A1/en

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367Cooling facilitated by shape of device
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)

Description

散熱器
本創作係有關於一種散熱器,尤指一種用於電子元件散熱裝置的散熱器。
由於電子元件在使用時會產生大量的熱量影響到電子元件的正常運作,因此必須藉由散熱裝置幫助電子元件散熱,使電子元件可以正常運作。
習知的散熱裝置必須藉由固定架或其他扣件將風扇固定於散熱器上方,或是在散熱器下方設置一固定片,用以將散熱器鎖固於電路板上方。如台灣專利公告號M292733「散熱裝置」,包括一散熱器、一鎖固在該散熱器上的風扇固定架及一安裝在風扇固定架上的風扇,該風扇固定架的四角各向下延伸出一固定柱,該風扇固定架的四側邊各向外凸伸一突出部,各該突出部向上突伸一卡鈎,該風扇的四角各設有一穿孔,該風扇固定架的卡鈎對應與該風扇的穿孔相配合,將該風扇固定於該風扇固定架上。此種散熱裝置必須藉由一固定架將風扇固定於散熱器上,在結構上較為複雜,且成本亦較高。
又,如台灣專利公告號M324808「CPU散熱器結構」,是將風扇以螺絲鎖固於鰭片的間隔空隙,使風扇固定於散熱片上,但是經過長 時間之後,鰭片容易因為彈性疲乏而產生變形,使風扇無法穩固地鎖固在散熱片上。
本創作之主要目的在提供一種散熱器,可簡化散熱裝置的組裝結構並降低成本。
本創作之另一目的在提供一種散熱器,可使風扇穩固地鎖合在散熱器上方。
為達成上述之目的,本創作之散熱器包含有:一基座及多數個自該基座向外水平延伸的立板,該基座頂面與各該立板頂面形成一平面,各該相鄰的立板與該基座之間區隔出一空間,該基座與各該立板側邊延伸有多個鰭片,該等鰭片係位於各該空間內,各該立板向外延伸形成一固定部,且各該立板之一側邊於鄰近該固定部的位置向外延伸一子立板,且各該子立板分別向外延伸形成一螺接部。
1‧‧‧散熱器
10‧‧‧基座
20‧‧‧立板
21‧‧‧固定部
22‧‧‧固定孔
30‧‧‧空間
40‧‧‧鰭片
50‧‧‧子立板
51‧‧‧螺接部
52‧‧‧螺接孔
60‧‧‧散熱風扇
70‧‧‧墊片
80‧‧‧螺栓
第1圖為本創作一較佳實施例之立體圖。
第2圖為本創作一較佳實施例之立體組合圖,顯示配合一散熱風扇的組合狀態。
請參閱第1圖,本創作係提供一種散熱器1,包含有:一基座10及多數個自該基座10向外水平延伸的立板20,在本實施例中,該基 座10為一矩形柱體,該等立板20係自該基座10的四個角向外延伸而出,但該基座10的形狀並不限定,且亦可為實心體或空心體。
各該立板20的高度與該基座10的高度相等,使該基座10的頂面與各該立板20的頂面形成一平面,各該相鄰的立板20與該基座10之間區隔出一空間30,該基座10與各該立板20側邊向外延伸有多個鰭片40,而位於各該空間30內。
各該立板20向外延伸形成一固定部21,各該固定部21為一C形柱體,且各該固定部21形成有一固定孔22,各該立板20的一側邊於鄰近其固定部21的位置向外延伸一子立板50,各該立板20與其子立板50之間形成一小於180度的夾角。且各該子立板50向外延伸形成一螺接部51,各該螺接部為一C形柱體,且各該螺接部51形成有一螺接孔52。
請參閱第2圖,顯示一散熱風扇與該散熱器的組合狀態,將一散扇風扇60置於該散熱器10上方,並使該散熱風扇60的穿孔(圖中未示)對應於該散熱器10的螺接孔52,該散熱風扇60與各該螺接孔52之間設有一墊片70,各該墊片70具有一貫孔(圖中未示),利用複數個螺栓80穿過該散熱風扇60的穿孔及各該墊片70的貫孔,進而鎖固於該散熱器10的螺接孔52,使該散熱風扇60固定於該散熱器10上方,並藉由複數個螺栓80穿過該散熱器10的固定孔22,可將該散熱器10連接於一電路板(圖中未示)上。
綜上所述,本創作係於散熱器上一體成型設有多個固定孔及螺接孔,可將散熱風扇直接鎖固於散熱器上方,或是將散熱器固定於電路板上,不需借助其他扣件或固定件,使得散熱裝置的整體結構簡化,並可 因為元件的減少而降低成本。
此外,本創作更可使散熱風扇穩固地鎖固於散熱器上方,不會因為散熱鰭片變形而導致散熱風扇無法鎖固的問題。
1‧‧‧散熱器
10‧‧‧基座
20‧‧‧立板
21‧‧‧固定部
22‧‧‧固定孔
30‧‧‧空間
40‧‧‧鰭片
50‧‧‧子立板
51‧‧‧螺接部
52‧‧‧螺接孔

Claims (6)

  1. 一種散熱器,包含有:一基座及多數個自該基座向外水平延伸的立板,該基座頂面與各該立板頂面形成一平面,各該相鄰的立板與該基座之間區隔出一空間,該基座與各該立板側邊延伸有多個鰭片,該等鰭片係位於各該空間內,各該立板向外延伸形成一固定部,且各該立板之一側邊於鄰近該固定部的位置向外延伸一子立板,且各該子立板分別向外延伸形成一螺接部。
  2. 如請求項1所述之散熱器,其中各該固定部為一C形柱體,且各該固定部形成有一第一固定孔。
  3. 如請求項1所述之散熱器,其中各該螺接部為一C形柱體,且各該螺接部形成有一螺接孔。
  4. 如請求項1所述之散熱器,其中該等鰭片係於各該空間內呈平行且間隔排列。
  5. 如請求項1所述之散熱器,其中各該立板及各該子立板的高度與該基座的高度相同。
  6. 如請求項1所述之散熱器,其中各該立板與各該子立板之間形成一小於180度的夾角。
TW102209523U 2013-05-22 2013-05-22 散熱器 TWM465602U (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW102209523U TWM465602U (zh) 2013-05-22 2013-05-22 散熱器
US14/251,096 US20140345844A1 (en) 2013-05-22 2014-04-11 Heat sink

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW102209523U TWM465602U (zh) 2013-05-22 2013-05-22 散熱器

Publications (1)

Publication Number Publication Date
TWM465602U true TWM465602U (zh) 2013-11-11

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ID=49992462

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Application Number Title Priority Date Filing Date
TW102209523U TWM465602U (zh) 2013-05-22 2013-05-22 散熱器

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US (1) US20140345844A1 (zh)
TW (1) TWM465602U (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI708136B (zh) * 2019-09-10 2020-10-21 陳則弦 Cpu散熱模組

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CN106151072A (zh) * 2015-03-31 2016-11-23 鸿富锦精密工业(武汉)有限公司 风扇及风扇组件
USD786202S1 (en) * 2016-02-08 2017-05-09 Liteideas, Llc Heat sink for a light-emitting diode
USD942959S1 (en) * 2020-01-29 2022-02-08 Veea Inc. Heat sink
USD910583S1 (en) * 2020-01-29 2021-02-16 Veea Inc. Heat sink
USD910582S1 (en) * 2020-01-29 2021-02-16 Veea Inc. Heat sink

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TW200832116A (en) * 2007-01-19 2008-08-01 Ama Precision Inc Clip-module and heat-dissipation apparatus having the same
US7802616B2 (en) * 2007-06-01 2010-09-28 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation apparatus with heat pipes
TW200905456A (en) * 2007-07-30 2009-02-01 Ama Precision Inc Clip module and heat-dissipation apparatus having the same
TWM335921U (en) * 2007-11-09 2008-07-01 Delta Electronics Inc Heat sink
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CN201590029U (zh) * 2009-10-15 2010-09-22 鸿富锦精密工业(深圳)有限公司 散热系统
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI708136B (zh) * 2019-09-10 2020-10-21 陳則弦 Cpu散熱模組

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