200832116 0950358 22814twf.doc/t 九、發明說明： 【發明所屬之技術領域】 月是有關於一種扣具模組(ciip-M°duie)，且特別 疋有關於-種扣具模組及具有此扣具模組執壯寸= (Heat-Dissipation Apparatus)。 、 月尤、衣置 【先前技術】 曰片电技的犬飛猛進’各種電子元件(例如: j組）所包含的電晶體數量也越來越多，使得這些電子 二'工:;溫度2來越高。以電腦裝置之中央處理器 例’中央處理器的散熱問題，—直是個值得研 =士 =題j為1^勝中央處理器過熱而導致電腦裝置發生 暫時性或永久性的失效，所以電職置需要奴夠的^敎 能^以使中央處理器能正常運作。為能移除中央處理器 於南速運作時所產生的熱能’進*使得中央處理器在高速 運作時仍可維持在正常狀態，f知技術將—散熱裝置直接 配置於中央處理II .(或發熱晶片）上，以使中央處理器所 產生之熱此可藉由散熱裝置迅速地散逸至外界環境。 圖1A繪示習知技術之一種散熱裝置配設於一發熱源 上的立體圖，而圖1B繪示圖1A之散熱裝置與發熱源的分 解圖。请同時參考圖1A與圖1B，習知的散熱裝置1〇〇是 配设於電腦主機中，以對例如是中央處理器之發熱源】〇 進行散熱。上述散熱裝置100包括一配設於發熱源1〇周圍 的固定模組(retention module，RM)ll〇、散熱器12〇、及扣 具模組130。散熱器120適於配設於發熱源1〇上，以對發 200832116 0950358 22814twf.doc/t 熱源10進行散熱，而扣具模組130則適於跨設於散熱器 120上並施予散熱器12〇 一下壓力量，以使散熱器12〇與 务熱源10緊搶貼合。如此一來，發熱源1〇内部之熱量即 可有效地傳導至散熱器120，進而藉由散熱器12〇將發熱 源10内部之熱量散逸至外界環境中。 … 在4知技術中，扣具模組130包括跨設於散熱器；[20 之本體132、卡扣件134、，及凸輪按壓結構136。本體132 • 適於抵壓散熱器120，以使散熱器120與發熱源10緊密貼 合。本體132之一端扣合於固定模組之一卡榫112， • 而卡扣件組設於本體132之另一端，且卡扣件134亦 適於扣合於固定模组110之另一卡榫114。此外，凸輪按 壓結構136經由插銷138來與卡扣件134枢接。凸輪按壓 結構136可沿著插銷138之柩設軸向L(X轴）轉動，以對 本體132施予一下壓力量。 值得一提的是，上述凸輪按壓結構136之材質為成本 馨較為昂貴之塑膠材質，因此習知的扣具模組13〇有較高之 產品成本。此外，由於凸輪按壓結構136.是沿著插銷138 之柩設軸向L(X軸）轉動，以對本體丨32施予一下壓力量， • 因此在將散熱器120組裝至發熱源1〇上時，散熱器12〇 - 周圍需要有足夠之空間來供凸輪按壓結構136轉動，以順 利地將散熱器120組裝至發熱源1〇上。然而，在電腦主機 内部中，散熱器120周圍之空間有限（散熱器〗2〇之周圍 可此配设有s己憶體模組、多種板卡等各種電子元件），因 此在散熱器120組裝至發熱源1〇的過程中，樞接於卡扣件 200832116 0950358 22814twf.doc/t 13:之:輪按壓結構136在轉動時即容易因空間之限制而 1熱器120周圍之電子元件發生干涉，導致散熱器. 不易組設於發熱源10上。 【發明内容】 本發明之目的是提供—種扣具模組及具有此扣具模 組之散熱裝置，以提供較低廉之扣具模組。 “本發日狀另—目的是提供—種扣具触及具有此扣 具=組之散減置，這姊具模組可·地將散熱器組裝 於杳熱源上、’而不易與散熱H周圍之電子元件發生干涉。 為達上述或是其他目的，本發明提出一種扣具模组， 其適於與蚊模轉_將散脑 固定模組具有第一扣合部與第二扣合部。本發曰L扣^ ，包括本體、卡扣件、及按壓結構。本體具有第一抵壓部： 扣口彳及第連接部，第—抵壓部適於將散熱器抵 壓於發熱源上，第三扣合部位於第—減部之—端， 於扣合於第-扣合#，而第—連接部位於第—抵壓部之另 一端。此外’卡扣件具有第二連接部、支點、固定部.、及 第四扣合部，第—連接部組設於第二連接部，支點與固定 部分別配設於第二連接部之兩側，且第四扣合部適於扣合 於第一扣合部。按壓結構則沿—旋轉軸線樞設於支點，且 適於沿旋轉軸線轉動以卡合於固定部，進而施予本體 壓力量。 在本發明之-實施例中，按壓結構包括一第三連 以及-按壓部’第三連接雜旋轉減樞設於支點，而按 200832116 0950358 22814twf.doc/t 壓部適於沿旋轉軸線轉動以卡合於周 ^ f本發明之一實施例，，按壓結構更包括一第二抵壓 部，第二抵壓部配設於第三連接部與按 ，且適於 對本體施力。 、在本發明之-實施例中，本體、卡扣件以及按壓結構 為板金件（sheet metal part)。 在本發日狀-實_巾，第二連接較有一限位結 • 構，以限制第一連接部之作動範圍。 . 纟本發日狀—實施例巾’旋轉軸線與本體之配設方向 平行。 本發明再提出一種散熱裝置，其適於對一電路板上之 -發熱源進行散熱。本發明之散歸置包括一固定模組、 政’::…以及上述之扣具模組，其巾目定模組配設於電路 ^反上並圍繞發熱源，且固賴組具有—第—扣合部以及一 弟二扣合部。此外，散熱器則是配設於發熱源上，而扣具 組是跨設於散熱器，且扣合於固定模組。 在本發明之散熱裳置中，本發明之扣具模組之組成構 •= 本體、卡扣件以及按屢結構)例如是結構較為簡易之板 :’因此本發明之扣具触有較低廉之產品成本 。此外， 壯Γ具拉組之組成構件（本體、卡扣件以及按壓結構）為 =較^簡易之板金件，因此本發明之扣具餘具有容易 埶衣之叙點。另一方面，為能使散熱器能順利地配設於發 二、’、上本务明之按壓結構之樞設方向與本體之配設方向 Q此，樞接於卡扣件上之按壓結構在轉動時即不易 9 200832116 0950358 228l4twf.doc/t 因空間之限制而與散熱器周圍之電子元件發生干涉。換言 之’本發明之扣具模組可順利地將散熱器固定於發熱源上。 一為讓本發明之上述和其他目的、特徵和優點能更明顯 易懂，下文特舉較佳實施例，並配合所附圖式，作詳細說 明如下。 W…" 【實施方式】 义圖2A繪示本發明較佳實施例之一種散熱裝置配設於 發熱源上的立體圖，而圖2B緣示圖Μ之散熱裳置與發熱 源之分解圖。請同時參考圖2A與圖2B，本實施例之散熱 結構200適於對電路板2()上之發熱源22進行散熱，散= 結構200包括固定模組210、配設於發熱源22上之散埶哭 挪、及扣具模組23〇。在本實施例中，扣具模組 用禎桿原，來將散熱器220穩固地扣合於發熱源2 2上。下 ϋ發描述扣具模組23G將散熱器220扣 鬥縫^實施例中，固定模、组210配設於電路板2〇上且 22 ’且固賴組21G具有第—扣合部以及 扣合部214。此外，散熱器22G例如是—擠 或疋其他適當型式之散熱器，而扣具模組2 散二 器220，且扣合於固定模組21〇之第— /文第、 圖3績示圖沈.之扣具模組之分解圖 沈與圖3,本實施例所提供之扣具·咖^^2圖 200832116 0950358 22814twf.doc/t 卡扣件234、及按麼結構236。在本實施例中，本體232、 卡扣件234、及按壓結構236可以是結構較為簡易之板金 件。上述本體232具有第一抵壓部232a、位於第一抵壓部 232a —端的第三扣合部232b、及位於第一抵壓部232a另 一端之第一連接部232c。在本實施例中，散熱器220上例 如設有一溝槽220a，而本體232之第一抵壓部232a適於 穿設於散熱器220之溝槽220a，並適於抵壓住散熱器220, φ 而第三扣合部232b則適於扣合於固定模組210之第一扣合 “ 部 212 〇 - 承上所述，本實施例之卡扣件234具有第二連接部 234a、支點234b、固定部234c、及第四扣合部234d，而 卡扣件234是經由第二連接部234a與第一連接部232c之 相互連接，來活動地組設於本體232。本實施例可以在第 二連接部234a上設置一限位結構234a，，限位結構234a， 可限制第一連接部232c之作動範圍，進而使得第一連接部 _ 232c與第二連接部234a間有較穩固的連接關係。此外， 支點234b與固定部234c分別配設於第二連接部234a之兩 ，，且第四扣合部234d適於扣合於第二扣合部214。在本 - 貝知例中，第一扣合部212與第二扣合部214分別設有一 _ 扣鈎，而第三扣合部232b與第四扣合部234d分別設有一 ^孔’因此第三扣合部232b可扣合於第一扣合部212，而 ，四扣合部234d可扣合於第二扣合部214。當然，在其他 貫施例中’第一扣合部212與第二扣合部214可設置扣孔， 而第二扣合部232b與第四扣合部234d可設置扣鈎，本發 200832116 0950358 22814twf.doc/t 明在此並不做任何限制。 此外，在本實施例中，按壓結構236例如是沿著一與 核之配設方向平行之旋雜線設於支點纖，且按 壓結構236適於沿著旋轉軸線R轉動以卡合於卡扣件故 之固定部2.34c，進而施予本體232 一下壓力量。200832116 0950358 22814twf.doc/t IX. Description of the invention: [Technical field of invention] The month is related to a clip module (ciip-M°duie), and particularly related to the type of clip module and having this The buckle module is strong (=Heat-Dissipation Apparatus). , Yue You, clothing [previous technology] 曰 电 电 犬 ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' The higher it is. In the case of the central processing unit of the computer device, the heat dissipation problem of the central processor is straightforward. It is worthwhile to study. If the CPU is overheated, the computer device will be temporarily or permanently disabled. It is necessary to have enough slaves to enable the central processing unit to operate normally. In order to remove the thermal energy generated by the central processing unit during the south speed operation, the central processing unit can maintain the normal state during high-speed operation, and the heat-dissipating device is directly disposed in the central processing II (or The heat generating wafer is disposed so that the heat generated by the central processing unit can be quickly dissipated to the external environment by the heat dissipating device. 1A is a perspective view of a heat dissipating device of the prior art disposed on a heat source, and FIG. 1B is a cross-sectional view of the heat sink and the heat source of FIG. 1A. Referring to FIG. 1A and FIG. 1B simultaneously, the conventional heat dissipating device 1 is disposed in a computer main body to dissipate heat from, for example, a heat source of the central processing unit. The heat dissipating device 100 includes a fixing module (RM) 11 , a heat sink 12 , and a buckle module 130 disposed around the heat source 1 . The heat sink 120 is adapted to be disposed on the heat source 1 , to dissipate heat from the heat source 10 of the 200832116 0950358 22814 twf.doc/t, and the buckle module 130 is adapted to straddle the heat sink 120 and apply the heat sink. 12 〇 a pressure amount, so that the heat sink 12 〇 and the heat source 10 tightly fit. In this way, the heat inside the heat source 1 is effectively conducted to the heat sink 120, and the heat inside the heat source 10 is dissipated into the external environment by the heat sink 12〇. In the four-knowledge technology, the buckle module 130 includes a body spanned over the heat sink, [20], a snap member 134, and a cam pressing structure 136. The body 132 is adapted to press against the heat sink 120 such that the heat sink 120 is in close contact with the heat source 10. One end of the body 132 is fastened to one of the latches 112 of the fixed module, and the latching member is disposed at the other end of the main body 132, and the latching member 134 is also adapted to be fastened to another latch of the fixed module 110. 114. In addition, the cam pressing structure 136 is pivotally coupled to the catch member 134 via the latch 138. The cam pressing structure 136 is rotatable along the axial axis L (X-axis) of the latch 138 to apply a downward pressure to the body 132. It is worth mentioning that the material of the cam pressing structure 136 is a plastic material which is expensive and expensive, so that the conventional clip module 13 has a high product cost. In addition, since the cam pressing structure 136. is rotated along the axial direction L (X-axis) of the latch 138 to apply a pressure amount to the body bore 32, the heat sink 120 is assembled to the heat source 1 At the time of the heat sink 12 〇 - there is a need for sufficient space for the cam pressing structure 136 to rotate to smoothly assemble the heat sink 120 to the heat source 1 . However, in the interior of the computer mainframe, the space around the heat sink 120 is limited (the heat sink can be equipped with various electronic components such as a memory module and a plurality of boards), and thus is assembled in the heat sink 120. During the process of the heat source 1 ,, the pivoting member is attached to the latching member 200832116 0950358 22814twf.doc/t 13: the wheel pressing structure 136 is easily interfered by the space and the electronic components around the heater 120 are interfered by the space. , resulting in a radiator. It is not easy to set up on the heat source 10. SUMMARY OF THE INVENTION It is an object of the present invention to provide a buckle module and a heat sink having the same, to provide a lower fastener module. "This is a daily appearance. The purpose is to provide a kind of buckle that has the deduction of the buckle = group. This module can assemble the radiator on the heat source, and it is not easy to be surrounded by heat dissipation H. The electronic component interferes. For the above or other purposes, the present invention provides a buckle module that is adapted to be rotated with a mosquito mold to have a first fastening portion and a second fastening portion. The hairpin L buckle ^ comprises a body, a snap member, and a pressing structure. The body has a first pressing portion: a buckle port and a connecting portion, and the first pressing portion is adapted to press the heat sink against the heat source The third fastening portion is located at the end of the first-subtracting portion, and is fastened to the first fastening portion, and the first connecting portion is located at the other end of the first pressing portion. Further, the [fastening member has a second connecting portion a fulcrum, a fixing portion, and a fourth fastening portion, wherein the first connecting portion is disposed on the second connecting portion, the fulcrum and the fixing portion are respectively disposed on two sides of the second connecting portion, and the fourth fastening portion is adapted to Fastened to the first fastening portion. The pressing structure is pivoted along the rotation axis at the fulcrum and is adapted to rotate along the rotation axis for the card In the fixing portion, the body pressure is further applied. In the embodiment of the invention, the pressing structure comprises a third connection and a pressing portion, and the third connection is provided at the pivot point, and according to 200832116 0950358 22814twf.doc The pressing portion is further configured to include a second pressing portion, and the second pressing portion is disposed on the third connecting portion and the pressing portion is adapted to be rotated along the rotation axis to engage with the circumference. And in the embodiment of the present invention, the body, the snap member and the pressing structure are sheet metal parts. In the present invention, the second connection is There is a limit structure to limit the range of actuation of the first connecting portion. The present embodiment is in parallel with the arrangement direction of the body. The present invention further provides a heat dissipating device which is suitable for A heat source on a circuit board performs heat dissipation. The bulk placement of the present invention includes a fixed module, a government package: and the above-mentioned fastener module, and the towel module is disposed on the circuit and Surrounding the heat source, and the Gulai group has a - first fastening portion and In addition, the heat sink is disposed on the heat source, and the buckle set is spanned on the heat sink and fastened to the fixed module. In the heat sink of the present invention, the present invention The structure of the buckle module•= body, snap fastener and repeated structure) is, for example, a relatively simple structure: 'Therefore, the buckle of the invention has a lower cost of the product. In addition, the strong group has a pull group. The constituent members (the body, the snap member and the pressing structure) are = simple and simple sheet metal parts, so the buckle of the present invention has a simple point of easy clothing. On the other hand, in order to enable the radiator to be smoothly matched The setting direction of the pressing structure of the pressing body and the body is set to the same. The pressing structure pivoted on the locking member is not easy to rotate when it is rotated. 200832116 0950358 228l4twf.doc/t The space is limited to interfere with the electronic components around the heat sink. In other words, the clip module of the present invention can smoothly fix the heat sink to the heat source. The above and other objects, features, and advantages of the present invention will become more fully understood from [Embodiment] FIG. 2A is a perspective view showing a heat dissipating device of the preferred embodiment of the present invention disposed on a heat source, and FIG. 2B is an exploded view of the heat sink and the heat source of FIG. Referring to FIG. 2A and FIG. 2B , the heat dissipation structure 200 of the embodiment is adapted to dissipate heat from the heat source 22 on the circuit board 2 . The structure 200 includes a fixed module 210 and is disposed on the heat source 22 . Dangling and crying, and the buckle module 23〇. In the present embodiment, the clip module is fastened to the heat source 2 2 by the mast. In the embodiment, the fixing die and the group 210 are disposed on the circuit board 2〇 and 22' and the fastening group 21G has the first fastening portion and the buckle. Joint 214. In addition, the heat sink 22G is, for example, a squeezing or squeezing other suitable type of heat sink, and the buckle module 2 is detached from the second unit 220, and is fastened to the fixed module 21 — - / / /, Figure 3 The exploded view of the buckle module of Shen. Fig. 3 and the buckle provided by the embodiment of the present invention are shown in the following figure: 200832116 0950358 22814twf.doc/t fastener 234, and structure 236. In this embodiment, the body 232, the snap member 234, and the pressing structure 236 may be sheet metal members having a relatively simple structure. The main body 232 has a first pressing portion 232a, a third engaging portion 232b at the end of the first pressing portion 232a, and a first connecting portion 232c at the other end of the first pressing portion 232a. In this embodiment, the heat sink 220 is provided with a groove 220a, and the first pressing portion 232a of the body 232 is adapted to pass through the groove 220a of the heat sink 220 and is adapted to press the heat sink 220. The third fastening portion 232b is adapted to be fastened to the first fastening portion 212 of the fixing module 210. The fastening member 234 of the embodiment has a second connecting portion 234a and a fulcrum 234b. The fixing portion 234c and the fourth engaging portion 234d are connected to each other via the second connecting portion 234a and the first connecting portion 232c, and are movably assembled to the body 232. This embodiment can be A limiting structure 234a is disposed on the two connecting portions 234a, and the limiting structure 234a limits the operating range of the first connecting portion 232c, so that the first connecting portion _232c and the second connecting portion 234a have a relatively stable connection relationship. In addition, the fulcrum 234b and the fixing portion 234c are respectively disposed on the second connecting portion 234a, and the fourth engaging portion 234d is adapted to be engaged with the second engaging portion 214. In the present example, A fastening portion 212 and a second fastening portion 214 are respectively provided with a _ hook, and the third fastening portion 232b and the The fastening portions 234d are respectively provided with a hole. Therefore, the third fastening portion 232b can be fastened to the first fastening portion 212. The four fastening portions 234d can be fastened to the second fastening portion 214. Of course, in other In the embodiment, the first fastening portion 212 and the second fastening portion 214 can be provided with a fastening hole, and the second fastening portion 232b and the fourth fastening portion 234d can be provided with a fastening hook. The present invention 200832116 0950358 22814twf.doc/ In the present embodiment, the pressing structure 236 is disposed on the fulcrum fiber along a spur line parallel to the direction in which the core is disposed, and the pressing structure 236 is adapted to be along The rotation axis R is rotated to be engaged with the fixing portion 2.34c of the snap member, thereby applying the body 232 with a downward pressure.
詳細地說，本實施例之按壓結構236例如是包括第三 連接部236a以及按壓部236b，第三連接部2如例如是^ 著旋轉轴線R鉚接於支點234b。當使用者 σ 組裝於發熱源22日夺，使用者可以以位於第二連接部 -侧之支點234b為旋轉中心來旋轉按壓部2遍 =施卡合於位在第二連接部屬另—側之固定ς 34c，進而使得第三連接部236a與按壓部说 抵壓部236c能對組設於第二連接部施之本體说施^ —下壓力量。連帶地，散熱器22G會受到本體232所施予 之下壓力量，進而穩固地組裝於發熱源22上。 上文主要疋針對扣具模組23〇之各部位元件與固定模 、、且210以及散熱器220之連接關係作說明。接下來文 說明扣具模組23G是如何扣合於固定模組21〇，以 將散熱器220固定於發熱源22上。 圖4A繪示圖2A中配設於發熱源上之散執 現圖’而圖4BI會示圖4A之散熱裝置的侧視圖:圖5A絡 扣合於固定模組的前視圖，而 政”、'衣置的側視圖。請先參考圖4Α與圖4Β， μ吏用者欲將絲器2期定於電路板2Q上之發熱源22 12 200832116 0950358 22814twf.doc/t 日守’使用者可將本體232之第三扣合部232b卡扣於固定模 組210之第-扣合部212，接著再將卡扣件之第四扣 合部234d卡扣於固定模組21G之第二扣合部2H。如此， 本體232之第一抵壓部232a即可初步抵壓於散熱器22〇。 接著，請參考圖5A與圖5B，使用者可以以支點23仆 為旋轉中心來轉動按壓部236b，並使第三連接部23如與 知:壓部236J?間之第二抵壓部236c來對本體232之第一連 接部232e進行-向下之壓縮行程。詳細地說，由於本體 232之第一抵壓部232a是抵靠於散熱器220,且卡扣件234 之第四扣合部234d是扣合於固定模組21〇之第二扣合部 214,因此當第二抵壓部236c對本體232之第一連二部 232c施力時，本體232之第一連接部232c會進行一向下 之壓縮行程，進而使得第一抵壓部232&對散熱器22〇施加 一向下壓力，而散熱器220即可穩固地組裝於發熱源 上。 值得一提的是，在使用者施力於按壓結構236以對本 體232進行壓縮行程之後，本實施例可以將按壓結構236 之按壓部236b卡合於卡扣件234之固定件234c，其中固 定件234c能有效地克服散熱器220施予本體232之一反作 用力，以使按壓部236b能固定於一預定位置。如此一來， 按壓結構236之第二抵壓部236c即可持續對本體232施 力’進而使得散熱器220能穩固地組裝於發熱源22上。 承上所述，在本實施例中.·，由於扣具模組之第三扣合 部232b與第四扣合部234d分別扣合於固定模組21〇之第 13 200832116 0950358 22814twf.doc/t 一扣合部212與第二扣合部214，且扣具模組23〇之本體 232又可對散熱器220施加一下壓力量，因此散熱器2加 即可穩固地配設於發熱源22上。 综上所述，在本發明實施例所提供之散熱裝置中，扣 /、模、、且疋％5又於散熱為，且扣合於固定模組，進而使得散 熱裔能穩固地配設於發熱源上，以對其進行散熱。值得一 提的是，扣具模組之組成構件（本體、卡扣件以及按壓結構） • 例如是結構較為簡易之板金件，因此本發明之扣具模組有 • 較低廉之產品成本。另一方面，由於扣具模組之組成構件 (本體、卡扣件以及按壓結構）為結構較為簡易之板金件， 因此本發明之扣具模組具有容易組裝之優點，即扣具模組 有較佳之組裝效率，且適合大量生產。 此外’為能使散熱器能順利地配設於發熱源上，本發 明之按壓結構之枢設方向與本體之配設方向平行。如此一 來，樞接於卡扣件上之按壓結構在轉動時即不易因空間之 限制而與散熱器周圍之電子元件發生干涉。換言之，本發 明之扣具模組可順利地將散熱器固定於發熱源上。" 雖然本發明已以較佳實施例揭露如上，然其並非用以 限定本發明，任何熟習此技藝者，在不脫離本發明之精神 、 ^範圍内，當可作些許之更動與潤飾，因此本發明之保護 範圍當視後附之申請專利範圍所界定者為準。 【圖式簡單說明】 圖1Α %示習知技術之一種散熱裝置配設於一發熱源 14 200832116 0950358 22814twf.doc/t 圖IB繪示圖1A之散熱裝置與發熱源的分解圖。 圖2Α繪示本發明較佳實施例之一種散熱裝置配設於 一發熱源上的立體圖。 圖2Β繪示圖2Α之散熱裝置與發熱源之分解圖。 圖3繪示圖2Β之扣具模組之分解圖。 圖4Α繪示圖2Α中配設於發熱源上之散熱裝置的前 視圖。 圖4Β繪示圖4Α之散熱裝置的側視圖。 圖5Α繪示圖4Α之扣具模組扣合於固定模組的前視 圖。 圖5Β繪示圖5Α之散熱裝置的侧視圖。 【主要元件符號說明】 10 ··發熱源 20 :電路板 22 :發熱源 - 100 :散熱裝置 110 :固定模組 112 :卡榫 114 :卡榫 120:散熱器 130 :扣具模組 132 :本體 134 ··卡扣件 136:凸輪按壓結構 15 200832116 0950358 22814twf.doc/t 138 :插銷 200 :散熱結構 、 210 :固定模組 212 :第一扣合部 214 :第二扣合部 220 :散熱器 220a :溝槽 φ 230 :扣具模組 * 232 :本體 - 232a :第一抵壓部 232b :第三扣合部 232c :第一連接部 234 :卡扣件 234a :第二連接部 234a’ ：限位結構 234b :支點 _ 234c :固定部 234d :第四扣合部 - 236 :按壓結構 . 236a :第三連接部 236b :按壓部 236c ··第二抵壓部 L ·枢設轴向 R :旋轉轴線In detail, the pressing structure 236 of the present embodiment includes, for example, a third connecting portion 236a and a pressing portion 236b, and the third connecting portion 2 is riveted to the fulcrum 234b, for example, by the rotation axis R. When the user σ is assembled to the heat source 22, the user can rotate the pressing portion 2 by using the fulcrum 234b located at the second connecting portion-side as the center of rotation = the clamping position is on the other side of the second connecting portion. The fixing jaw 34c further causes the third connecting portion 236a and the pressing portion pressing portion 236c to apply a lowering amount to the body of the second connecting portion. Incidentally, the radiator 22G is subjected to a pressure amount applied from the body 232, and is thus stably assembled to the heat source 22. The above is mainly explained for the connection relationship between the components of the clip module 23 and the fixed molds, and 210 and the heat sink 220. Next, how the clip module 23G is fastened to the fixed module 21A to fix the heat sink 220 to the heat source 22. 4A is a side view of the heat sink disposed on the heat source of FIG. 2A and FIG. 4B is a side view of the heat sink of FIG. 4A: FIG. 5A is a front view of the fixed module, and the government is 'Side view of the clothing. Please refer to Figure 4Α and Figure 4Β first, the user wants to set the wire 2 to the heat source of the circuit board 2Q 22 12 200832116 0950358 22814twf.doc/t The third fastening portion 232b of the main body 232 is fastened to the first fastening portion 212 of the fixing module 210, and then the fourth fastening portion 234d of the fastening component is buckled to the second fastening of the fixing module 21G. In this way, the first pressing portion 232a of the main body 232 can be initially pressed against the heat sink 22A. Next, referring to FIG. 5A and FIG. 5B, the user can rotate the pressing portion 236b with the fulcrum 23 as a center of rotation. And the third connecting portion 23 performs a downward compression stroke on the first connecting portion 232e of the body 232, such as the second pressing portion 236c between the pressing portion 236J. In detail, due to the body 232 The first pressing portion 232 a is abutted against the heat sink 220 , and the fourth fastening portion 234 d of the fastening member 234 is a second fastening portion 214 fastened to the fixing module 21 , Therefore, when the second pressing portion 236c applies a force to the first connecting portion 232c of the body 232, the first connecting portion 232c of the body 232 performs a downward compression stroke, thereby causing the first pressing portion 232& 22〇 applies a downward pressure, and the heat sink 220 can be firmly assembled on the heat source. It is worth mentioning that after the user applies the pressing structure 236 to compress the body 232, the embodiment can The pressing portion 236b of the pressing structure 236 is engaged with the fixing member 234c of the latching member 234, wherein the fixing member 234c can effectively overcome the reaction force of the heat radiating body 220 to the body 232, so that the pressing portion 236b can be fixed at a predetermined position. In this way, the second pressing portion 236c of the pressing structure 236 can continuously force the body 232 to further enable the heat sink 220 to be stably assembled on the heat source 22. As described above, in the present embodiment. The third fastening portion 232b and the fourth fastening portion 234d of the buckle module are respectively fastened to the fixing module 21, and the third fastening portion 212 is coupled to the second fastening portion. 214, and the body of the buckle module 23 The 232 can apply a pressure to the heat sink 220. Therefore, the heat sink 2 can be stably disposed on the heat source 22. In summary, in the heat sink provided by the embodiment of the present invention, the buckle/module And 疋%5 is also heat-dissipating, and is fastened to the fixed module, so that the heat-dissipating person can be stably disposed on the heat source to dissipate heat. It is worth mentioning that the buckle module The constituent members (body, snap member, and pressing structure) are, for example, sheet metal members having a relatively simple structure, so that the clip module of the present invention has a lower product cost. On the other hand, since the components of the clip module (the main body, the snap member and the pressing structure) are simple metal sheets, the clip module of the present invention has the advantage of being easy to assemble, that is, the clip module has Better assembly efficiency and suitable for mass production. Further, in order to enable the heat sink to be smoothly disposed on the heat source, the pivoting direction of the pressing structure of the present invention is parallel to the direction in which the body is disposed. In this way, the pressing structure pivotally connected to the latch member is not easily interfered with the electronic components around the heat sink due to space constraints when rotated. In other words, the clip module of the present invention can smoothly fix the heat sink to the heat source. Although the present invention has been disclosed in the above preferred embodiments, it is not intended to limit the invention, and those skilled in the art can make some modifications and refinements without departing from the spirit and scope of the invention. Therefore, the scope of the invention is defined by the scope of the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1A shows a heat dissipating device of the prior art in a heat source. 14 200832116 0950358 22814twf.doc/t FIG. 1B is an exploded view of the heat sink and the heat source of FIG. 1A. 2 is a perspective view of a heat dissipating device disposed on a heat source according to a preferred embodiment of the present invention. 2A is an exploded view of the heat sink and the heat source of FIG. 3 is an exploded view of the buckle module of FIG. 2 . Figure 4 is a front elevational view of the heat sink disposed in the heat source of Figure 2A. 4A is a side view of the heat sink of FIG. FIG. 5 is a front elevational view of the buckle module of FIG. 4 snapped to the fixed module. FIG. 5 is a side view of the heat sink of FIG. [Main component symbol description] 10 · · Heat source 20 : Circuit board 22 : Heat source - 100 : Heat sink 110 : Fixed module 112 : Card 114 : Card 120 : Heat sink 130 : Buckle module 132 : Body 134 ··Snap 136: Cam pressing structure 15 200832116 0950358 22814twf.doc/t 138: Plug 200: heat dissipation structure, 210: fixing module 212: first fastening portion 214: second fastening portion 220: heat sink 220a: groove φ 230 : buckle module * 232 : body - 232a : first pressing portion 232b : third fastening portion 232c : first connecting portion 234 : snap member 234a : second connecting portion 234a ' : The stopper structure 234b: the fulcrum _ 234c: the fixing portion 234d: the fourth fastening portion - 236: the pressing structure. 236a: the third connecting portion 236b: the pressing portion 236c · the second pressing portion L · the pivoting direction R: Rotation axis