US20140345844A1 - Heat sink - Google Patents

Heat sink Download PDF

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Publication number
US20140345844A1
US20140345844A1 US14/251,096 US201414251096A US2014345844A1 US 20140345844 A1 US20140345844 A1 US 20140345844A1 US 201414251096 A US201414251096 A US 201414251096A US 2014345844 A1 US2014345844 A1 US 2014345844A1
Authority
US
United States
Prior art keywords
upright
heat sink
base block
upright panel
panels
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US14/251,096
Other languages
English (en)
Inventor
Chun-Huang Chou
Jun Chen
Long-Sui LIU
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tai Sol Electronics Co Ltd
Original Assignee
Tai Sol Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tai Sol Electronics Co Ltd filed Critical Tai Sol Electronics Co Ltd
Assigned to TAI-SOL ELECTRONICS CO., LTD. reassignment TAI-SOL ELECTRONICS CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHEN, JUN, CHOU, CHUN-HUANG, LIU, LONG-SUI
Publication of US20140345844A1 publication Critical patent/US20140345844A1/en
Abandoned legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to cooling technology and more particularly, to a heat sink for use in an electronic device to dissipate heat.
  • cooling devices are used to help cooling of the electronic components, maintaining the normal functioning of the electronic components.
  • a conventional cooling device comprising a heat sink, and an electric fan affixed to a top side of the heat sink with a mounting frame or other fastening device. Further, a mounting plate may be provided at an opposing bottom side of the heat sink for fastening the heat sink to a circuit board.
  • Taiwan Patent M292733 discloses a cooling device comprising a heat sink, a fan mount affixed to a top side of the heat sink, and an electric fan mounted at the fan mount.
  • the fan mount comprises a mounting post downwardly extended from each of four corners thereof, a protruding portion protruded from each of four sides thereof, and a hook upwardly extended from each protruding portion.
  • the electric fan has a through hole at each of four corners thereof.
  • the hooks of the fan mount are respectively hooked in the through holes of the electric fan to secure the electric fan to the fan mount.
  • This design of cooling device needs the use of the fan mount for securing the electric fan to the heat sink, having the drawbacks of complicated structure and high cost.
  • Taiwan Utility M324808 discloses a CPU heat sink, which enables an electric fan to be affixed to radiation fins thereof with screws that are respectively mounted in gaps between radiation fins.
  • the radiation fins can easily be deformed due to elastic fatigue, causing the electric fan unable to be firmly secured to the heat sink.
  • the present invention has been accomplished under the circumstances in view. It is the main object of the present invention to provide a heat sink that simplifies the mounting structure of the cooling device and reduces its cost.
  • a heat sink includes a base block, a plurality of upright panels horizontally outwardly extended from the base block in a flush manner, each two adjacent upright panels defining with the base block a space, a plurality of radiation fins respectively extended from the periphery of the base block and two opposite lateral sides of each upright panel and respectively suspended in each space between each two adjacent upright panels, a mounting member located at a distal end of each upright panel remote from the base block, a sub-upright panel extended from one side of each upright panel adjacent to the mounting member of the respective upright panel, and a screw-connection member located at a distal end of each sub-upright panel remote from the respective upright panel.
  • FIG. 1 is an oblique top elevational view of a heat sink in accordance with the present invention.
  • FIG. 2 is a schematic applied view of the present invention, illustrating an electric fan mounted on the heat sink.
  • the heat sink 1 comprises a base block 10 , and a plurality of upright panels 20 horizontally outwardly extended from the base block 10 .
  • the base block 10 is a rectangular prism; the upright panels 20 are respectively outwardly extended from the four angles of the base block 10 .
  • the shape of the base block 10 is not limited. Further, the base block 10 can be solid or hollow member.
  • each upright panel 20 is equal to the height of the base block 10 so that the top surface of the base block 10 is kept in flush with the top surface of each upright panel 20 , forming a plane. Further, each two adjacent upright panels 20 define with the base block 10 a space 30 .
  • the heat sink 1 further comprises a plurality of radiation fins 40 equally arranged in parallel and respectively extended from the periphery of the base block 10 and two opposite lateral sides of each of the upright panels 20 and respectively suspended in each space 30 between each two adjacent upright panels 20 .
  • the heat sink 1 further comprises a plurality of mounting members 21 that are hollow posts respectively located at a distal end of each of the upright panels 20 remote from the base block 10 , having a C-shaped cross section and respectively defining therein an axially extended mounting hole 22 , a plurality of sub-upright panels 50 respectively extended from the upright panels 20 adjacent to the respective mounting members 21 and defining with the respective upright panels 20 a contained angle smaller than 180°, and a plurality of screw-connection members 51 that are hollow posts respectively located at a distal end of each of the sub-upright panels 50 , having a C-shaped cross section and respectively defining therein an axially extended screw hole 52 .
  • an electric fan 60 is illustrated mounted at the heat sink 10 .
  • the electric fan 60 is attached to the top side of the heat sink 10 to keep the screw holes 52 of the heat sink 10 in vertical alignment with respective mounting through holes (not shown) of the electric fan 60 and to have a washer 70 be set between each screw hole 52 and the electric fan 60 , and then insert screw bolts 80 through the mounting through holes of the electric fan 60 and the through hole of each of the washers 70 and thread the screw bolts 80 into the respective screw holes 52 to affix the electric fan 60 to the heat sink 1 , and then insert screw bolts 80 through the mounting holes 22 of the heat sink 10 and thread the screw bolts 80 into respective screw holes (not shown) in a circuit board (not shown) to affix the heat sink 10 to the circuit board.
  • the invention provides an integral heat sink having a plurality of mounting holes and screw holes so that an electric fan can be directly affixed to the heat sink with screw bolts and the heat sink can be directly affixed to a circuit board with screws without using any other retaining or mounting devices. Further, because the heat sink is a one-piece member, the overall cooling device structure is simplified, and its manufacturing cost is significantly reduced.
  • the present invention enables an electric fan to be steadily affixed to the top side of the heat sink, preventing the problem of being unable to affix the electric fan due to radiation fin deformation.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
US14/251,096 2013-05-22 2014-04-11 Heat sink Abandoned US20140345844A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW102209523U TWM465602U (zh) 2013-05-22 2013-05-22 散熱器
TW102209523 2013-05-22

Publications (1)

Publication Number Publication Date
US20140345844A1 true US20140345844A1 (en) 2014-11-27

Family

ID=49992462

Family Applications (1)

Application Number Title Priority Date Filing Date
US14/251,096 Abandoned US20140345844A1 (en) 2013-05-22 2014-04-11 Heat sink

Country Status (2)

Country Link
US (1) US20140345844A1 (zh)
TW (1) TWM465602U (zh)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160290365A1 (en) * 2015-03-31 2016-10-06 Hong Fu Jin Precision Industry (Wuhan) Co., Ltd. Fan and fan assembly
USD786202S1 (en) * 2016-02-08 2017-05-09 Liteideas, Llc Heat sink for a light-emitting diode
USD910583S1 (en) * 2020-01-29 2021-02-16 Veea Inc. Heat sink
USD910582S1 (en) * 2020-01-29 2021-02-16 Veea Inc. Heat sink
USD942959S1 (en) * 2020-01-29 2022-02-08 Veea Inc. Heat sink

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI708136B (zh) * 2019-09-10 2020-10-21 陳則弦 Cpu散熱模組

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080173426A1 (en) * 2007-01-19 2008-07-24 Ama Precision Inc. Clip module and heat-dissipation apparatus having the same
US20080295993A1 (en) * 2007-06-01 2008-12-04 Foxconn Technology Co., Ltd. Heat dissipation apparatus with heat pipes
US20090032220A1 (en) * 2007-07-30 2009-02-05 Ama Precision Inc. Clip module and heat dissipation device having the same
US20090120613A1 (en) * 2007-11-09 2009-05-14 Delta Electronics, Inc. Heat sink
US20090262505A1 (en) * 2008-04-16 2009-10-22 Asia Vital Components Co., Ltd. Heat radiator
US20090288806A1 (en) * 2008-05-21 2009-11-26 Asia Vital Components Co., Ltd. Heat Radiating Unit
US8144459B2 (en) * 2009-10-15 2012-03-27 Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. Heat dissipating system with fan module
US8191613B2 (en) * 2009-02-16 2012-06-05 Asia Vital Components Co., Ltd. Thermal module with quick assembling structure
US8199502B2 (en) * 2009-12-17 2012-06-12 Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. Heat dissipating device
US20130052937A1 (en) * 2011-08-29 2013-02-28 Hon Hai Precision Industry Co., Ltd. Heat dissipation apparatus
US8593814B2 (en) * 2011-01-26 2013-11-26 Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. Heat sink assembly

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080173426A1 (en) * 2007-01-19 2008-07-24 Ama Precision Inc. Clip module and heat-dissipation apparatus having the same
US20080295993A1 (en) * 2007-06-01 2008-12-04 Foxconn Technology Co., Ltd. Heat dissipation apparatus with heat pipes
US20090032220A1 (en) * 2007-07-30 2009-02-05 Ama Precision Inc. Clip module and heat dissipation device having the same
US20090120613A1 (en) * 2007-11-09 2009-05-14 Delta Electronics, Inc. Heat sink
US20090262505A1 (en) * 2008-04-16 2009-10-22 Asia Vital Components Co., Ltd. Heat radiator
US20090288806A1 (en) * 2008-05-21 2009-11-26 Asia Vital Components Co., Ltd. Heat Radiating Unit
US8191613B2 (en) * 2009-02-16 2012-06-05 Asia Vital Components Co., Ltd. Thermal module with quick assembling structure
US8144459B2 (en) * 2009-10-15 2012-03-27 Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. Heat dissipating system with fan module
US8199502B2 (en) * 2009-12-17 2012-06-12 Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. Heat dissipating device
US8593814B2 (en) * 2011-01-26 2013-11-26 Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. Heat sink assembly
US20130052937A1 (en) * 2011-08-29 2013-02-28 Hon Hai Precision Industry Co., Ltd. Heat dissipation apparatus

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160290365A1 (en) * 2015-03-31 2016-10-06 Hong Fu Jin Precision Industry (Wuhan) Co., Ltd. Fan and fan assembly
USD786202S1 (en) * 2016-02-08 2017-05-09 Liteideas, Llc Heat sink for a light-emitting diode
USD910583S1 (en) * 2020-01-29 2021-02-16 Veea Inc. Heat sink
USD910582S1 (en) * 2020-01-29 2021-02-16 Veea Inc. Heat sink
USD942959S1 (en) * 2020-01-29 2022-02-08 Veea Inc. Heat sink

Also Published As

Publication number Publication date
TWM465602U (zh) 2013-11-11

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Legal Events

Date Code Title Description
AS Assignment

Owner name: TAI-SOL ELECTRONICS CO., LTD., TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:CHOU, CHUN-HUANG;CHEN, JUN;LIU, LONG-SUI;REEL/FRAME:032683/0710

Effective date: 20140310

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION