TWM462745U - Ceramic laser metallization and metal layer structure - Google Patents

Description

Ceramic laser metallization and metal layer structure

This creation is about a ceramic laser metallization and metal layer structure, especially the application of laser direct molding technology, processing for flat plate and three-dimensional structure, and through the plating or electroplating method to achieve the wiring precision and line conduction structure.

High-tech products are changing with each passing day, and micro-precision electronic components are constantly being introduced and are constantly being applied to 3C products, automobile and motorcycle industries, and medical industries. The technology of the three-dimensional circuit occupies a very important proportion. Laser direct structuring (LDS) is the most widely used.

However, most of the substrates used in LDS are plastic materials, and the plastic materials used are usually expensive and specified materials. In addition, in the process of products with high heat dissipation requirements, the heat dissipation problem is also urgently needed. One of the problems overcome.

Therefore, in view of the shortcomings of the prior art, the ceramic laser metallization and metal layer structure of the present invention replaces the traditional LDS special designated material, and the ceramic substrate is used as the base, and combined with the technology of LDS, to achieve easy processing and accurate wiring. Line conduction and good heat dissipation and low cost.

The present invention provides a ceramic laser metallization and metal layer structure comprising a substrate, a three-dimensional circuit layer and a plurality of metal layers. The substrate is a body of the structure; the three-dimensional circuit layer is engraved on the substrate by two-dimensional or three-dimensional laser, and engraves a plurality of grooves according to the designed circuit track; the metal layers are electroplated or The recess is plated with a metal to form a conductive conductive loop. Among them, the substrate is a material using a precision ceramic.

Compared with the prior art, a ceramic laser metallization and metal layer structure of the present invention replaces the traditional LDS special design material with a ceramic substrate as a structural body, and the ceramic material has the following advantages:

(1) Mechanical properties: good mechanical properties, high dimensional accuracy, and low warpage.

(2) Characteristics of heat: good heat resistance, high thermal conductivity, and good heat dissipation.

(3) Electrical characteristics: high insulation resistance, easy metallization, and low dielectric constant.

(4) Chemical characteristics: lead-free, non-toxic, and chemically stable.

(5) Market characteristics: rich material resources, low price and mature technology.

100‧‧‧Substrate

200‧‧‧Three-dimensional circuit layer

202‧‧‧ Groove

300‧‧‧metal layer

302‧‧‧ conduction layer

304‧‧‧First protective layer

305‧‧‧Intermediate protective layer

306‧‧‧Second protective layer

The first figure is a schematic diagram of laser engraving of ceramic laser metallization and metal layer structure.

The second figure is a schematic diagram of metallization of ceramic laser metallization and metal layer structure.

The third figure is a schematic diagram of another metallization of ceramic laser metallization and metal layer structure.

The fourth figure is a schematic diagram of another metallization of ceramic laser metallization and metal layer structure.

The fifth figure is a schematic sectional view of a ceramic laser metallization and a metal layer structure.

In order to fully understand the purpose, features and effects of this creation, the following specific examples are used, and the accompanying drawings are used to explain the creation in detail. For the following: Please refer to the first figure and the second figure. One embodiment of the present invention discloses a ceramic laser metallization and a metal layer structure, which mainly includes a substrate 100, a three-dimensional circuit layer 200, and a plurality of metal layers 300.

First, as shown in the first figure, the substrate 100 is a structure of a body, which may be a three-dimensional structure or a flat structure. The substrate 100 is made of aluminum oxide (Al ₂ O ₃ ), aluminum nitride (AlN), beryllium oxide (BeO), chromium oxide (Cr ₂ O ₃ ), zirconium oxide (ZrO ₂ ), and tantalum nitride (Si). ₃ N ₄ ) ceramic material.

The three-dimensional circuit layer 200 is applied to the substrate 100 by laser engraving, processed by a pre-designed circuit trace, and engraved to form a plurality of grooves 202. Among them, the laser engraving system can be two-dimensional laser engraving or three-dimensional laser engraving. Further, the laser engraving system utilizes one of a green laser beam having a wavelength of 532 nm, a UV laser having a wavelength of 355 nm, and an IR laser having a wavelength of 1064 nm.

Referring to the second figure, the metal layer 300 is plated with metal by electroplating or chemical deposition to form a conductive conductive loop. The metal layer 300 includes copper, nickel, gold, silver, platinum, palladium, tin, zinc, chromium or a combination thereof. In this embodiment, the order of the metal layers is as shown in FIG. A: a. the conductive layer 302, the metal layer material used is copper, and the thickness thereof is preferably within 30 μm; b. the first protective layer 304 The metal layer material used is nickel, and its function is to protect the conductive layer 302 from oxidation, and the wear resistance is better, and the thickness thereof is preferably 10 μm or less.

Please refer to the third figure for the purpose of creating a ceramic laser metallization and another metallization of the metal layer structure. The metal layer 300 may include a second protective layer 306. The order of the metal layers is as shown in the figure. B)): a. the conductive layer 302, the metal layer material used is copper, preferably 30 μm or less; b. the first protective layer 304, the metal layer material used is nickel, and its function is to protect the The conductive layer 302 avoids oxidation, and has good wear resistance, and the thickness thereof is preferably 10 μm or less; c. The second protective layer 306 is made of gold, and the effect is an anti-oxidation layer having a thickness of 0.2. It is preferably within μm.

Please refer to the fourth figure, which is a schematic diagram of another metallization of the ceramic laser metallization and metal layer structure. The metal layer 300 further includes an intermediate protective layer 305, and the order of the metal layer 300 is as follows. C shows): a. conductive layer 302, the metal layer material used It is copper, and its thickness is preferably less than 30 μm; b. The first protective layer 304 is made of nickel, and its function is to protect the conductive layer 302 from oxidation, and has good wear resistance, and the thickness thereof is 10 μm. Preferably, c. The intermediate protective layer 305, the metal layer material used is palladium, and its function is to increase corrosion resistance (for example, Wire Bounding), and the thickness thereof is preferably between 1 μm and 2 μm; d. The second protective layer 306, the metal layer material used is gold, and its function is an anti-oxidation layer, and the thickness thereof is preferably 0.2 μm or less.

As shown in the fifth figure, a schematic cross-sectional view of a ceramic laser metallization and a metal layer structure is created. The laser engraving forms the groove 202 of the cross-sectional shape of the substrate 100. The cross-sectional shape may be one of a rectangle, a trapezoid, and a triangle.

Above, this creation uses a ceramic substrate combined with Laser Direct Structuring (LDS) process to increase the smoothness of the operation process, the heat dissipation of the substrate, and improve the continuity of the circuit.

The present invention has been described in detail above, but the above is only the preferred embodiment of the present invention, and those skilled in the art will be apparent to those skilled in the art. These embodiments are only used to depict the present and should not be interpreted. To limit the scope of this creation. That is, the equivalent changes and modifications made in accordance with the scope of this creation application shall remain within the scope of the patent of this creation.

100‧‧‧Substrate

200‧‧‧Three-dimensional circuit layer

202‧‧‧ Groove

300‧‧‧metal layer

302‧‧‧ conduction layer

304‧‧‧First protective layer

Claims (6)

A ceramic laser metallization and metal layer structure comprises: a substrate; a three-dimensional circuit layer, which is laser-engraved on the substrate, and engraves a plurality of grooves according to the designed circuit trace; and a plurality of metal layers The recess is plated with a metal to form a conductive conductive loop by electroplating or chemical deposition. A ceramic laser metallization and metal layer structure as described in claim 1, wherein the substrate is one of a three-dimensional structure and a flat structure. A ceramic laser metallization and metal layer structure according to claim 1, wherein the material of the substrate comprises aluminum oxide (Al ₂ O ₃ ), aluminum nitride (AlN), and cerium oxide (BeO). ), a ceramic material of chromium oxide (Cr ₂ O ₃ ), zirconium oxide (ZrO ₂ ), and tantalum nitride (Si ₃ N ₄ ). A ceramic laser metallization and metal layer structure as described in claim 1, wherein the laser engraving system is one of two-dimensional laser engraving and three-dimensional laser engraving. A ceramic laser metallization and metal layer structure according to claim 1, wherein the laser engraving utilizes a green laser with a wavelength of 532 nm, a UV laser with a wavelength of 355 nm, and an IR laser with a wavelength of 1064 nm. One of them. A ceramic laser metallization and metal layer structure as described in claim 1, wherein the metal layer comprises copper, nickel, gold, silver, platinum, palladium, tin, zinc, chromium or a combination thereof.