CN106299823B - Connection method of three-dimensional circuit and metal piece and LDS antenna - Google Patents
Connection method of three-dimensional circuit and metal piece and LDS antenna Download PDFInfo
- Publication number
- CN106299823B CN106299823B CN201610701271.9A CN201610701271A CN106299823B CN 106299823 B CN106299823 B CN 106299823B CN 201610701271 A CN201610701271 A CN 201610701271A CN 106299823 B CN106299823 B CN 106299823B
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- China
- Prior art keywords
- metalwork
- lds
- matrix
- copper
- connection method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000000034 method Methods 0.000 title claims abstract description 44
- 229910052751 metal Inorganic materials 0.000 title abstract description 11
- 239000002184 metal Substances 0.000 title abstract description 11
- 239000011159 matrix material Substances 0.000 claims abstract description 43
- 239000000463 material Substances 0.000 claims abstract description 26
- 238000007747 plating Methods 0.000 claims abstract description 24
- 239000000126 substance Substances 0.000 claims abstract description 18
- 239000010410 layer Substances 0.000 claims description 54
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 29
- 229910052802 copper Inorganic materials 0.000 claims description 28
- 239000010949 copper Substances 0.000 claims description 28
- 230000008569 process Effects 0.000 claims description 20
- 238000007689 inspection Methods 0.000 claims description 18
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 11
- 229910052737 gold Inorganic materials 0.000 claims description 11
- 239000010931 gold Substances 0.000 claims description 10
- 239000011247 coating layer Substances 0.000 claims description 6
- 150000002902 organometallic compounds Chemical class 0.000 claims description 6
- 238000005554 pickling Methods 0.000 claims description 6
- 239000004033 plastic Substances 0.000 claims description 4
- 229920003023 plastic Polymers 0.000 claims description 4
- 238000005452 bending Methods 0.000 claims description 3
- 230000015572 biosynthetic process Effects 0.000 claims description 3
- 238000004140 cleaning Methods 0.000 claims description 3
- 125000004122 cyclic group Chemical group 0.000 claims description 3
- 230000008642 heat stress Effects 0.000 claims description 3
- 238000002347 injection Methods 0.000 claims description 3
- 239000007924 injection Substances 0.000 claims description 3
- 230000035939 shock Effects 0.000 claims description 3
- 230000008646 thermal stress Effects 0.000 claims description 3
- 238000005406 washing Methods 0.000 claims description 3
- 238000010586 diagram Methods 0.000 claims 1
- 230000003760 hair shine Effects 0.000 claims 1
- 238000003032 molecular docking Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 abstract description 7
- 230000008901 benefit Effects 0.000 abstract description 3
- 238000002360 preparation method Methods 0.000 abstract description 3
- 238000010329 laser etching Methods 0.000 abstract 2
- 238000000465 moulding Methods 0.000 abstract 1
- 238000005516 engineering process Methods 0.000 description 6
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 4
- 239000002253 acid Substances 0.000 description 4
- 239000003814 drug Substances 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 238000006073 displacement reaction Methods 0.000 description 3
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical group OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000002075 main ingredient Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N sulfuric acid group Chemical group S(O)(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 229910000570 Cupronickel Inorganic materials 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- 239000005864 Sulphur Substances 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229910052705 radium Inorganic materials 0.000 description 1
- HCWPIIXVSYCSAN-UHFFFAOYSA-N radium atom Chemical compound [Ra] HCWPIIXVSYCSAN-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/40—Securing contact members in or to a base or case; Insulating of contact members
- H01R13/405—Securing in non-demountable manner, e.g. moulding, riveting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/50—Structural association of antennas with earthing switches, lead-in devices or lightning protectors
Landscapes
- Laser Beam Processing (AREA)
- Chemically Coating (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention is suitable for the technical field of three-dimensional circuit preparation and LDS antennas, and discloses a method for connecting a three-dimensional circuit and a metal piece and an LDS antenna. A method of connection comprising the steps of: preparing a metal piece and an LDS material, molding the LDS material to obtain an LDS matrix, embedding at least one part of the metal piece in the LDS matrix, forming a circuit pattern on the LDS matrix in a laser etching mode, and forming a conductive connecting layer on the surfaces of the circuit pattern and the metal piece in a chemical plating mode. The LDS antenna comprises a metal piece and an LDS substrate, wherein the metal piece is partially embedded in the LDS substrate, a circuit pattern is formed on the LDS substrate in a laser etching mode, at least part of the circuit pattern is connected with the metal piece, and a conductive connecting layer is formed on the circuit pattern and the surface of the metal piece in a chemical plating mode. The connection method of the three-dimensional circuit and the metal piece and the LDS antenna have the advantages of good product reliability and low cost.
Description
Technical field
The invention belongs to stereo circuit preparations and LDS antenna technical field more particularly to a kind of stereo circuit and metalwork
Connection method and LDS antenna.
Background technique
It is to lead for LDS (Laser-Direct-structuring, laser direct structuring technique) antenna or with LDS substrate
The stereo circuit of logical route, connecting between LDS substrate and metalwork mostly is realized by silver paste or welding, silver paste and gold
Atom level connection can not be formed by belonging between part or the coating of LDS substrate, so long-time or the meeting under various climatic enwronmental tests
Cracking layering influences conduction；Moreover, being connect LDS substrate with metalwork by welding manner, then requiring plastic material is energy
The LDS material of proper alignment high temperature, material selection is limited, limits the intention of appearance and structure to a certain extent, while also increasing
Technology difficulty and cost.
Summary of the invention
It is an object of the invention to overcome above-mentioned the deficiencies in the prior art, the company of a kind of stereo circuit and metalwork is provided
Method and LDS antenna are connect, product reliability is good and at low cost.
The technical scheme is that the connection method of a kind of stereo circuit and metalwork, comprising the following steps: preparation gold
Belong to part and LDS material, obtains LDS matrix for LDS material is molded, and at least part of the metalwork is embedded in institute
LDS matrix is stated, forms circuitous pattern in the LDS matrix by the way of laser laser carving, then in institute by the way of chemical plating
The surface for stating circuitous pattern and metalwork forms conductive tie layers.
Optionally, the metalwork is copper fitting.
Optionally, the metalwork is non-copper metalwork, before the metalwork is embedded in the LDS matrix, at least
Surface plating in the metalwork Yu LDS matrix joint sets layers of copper.
Optionally, before using chemical plating, oil removing cleaning, microetch, pickling are increased to the circuitous pattern and metalwork
With four processes of washing.
Optionally, the stereo circuit is LDS antenna.
Optionally, it is formed after the formation conductive tie layers, the inspection of hardware coating layer is carried out on Yu Suoshu conductive tie layers
Test process.
Optionally, the hardware coating layer inspection process scrapes inspection process, frustrates knife inspection man including bending inspection process, knife
Sequence and thermal stress inspection process.
Optionally, to the conductive tie layers of the metalwork and LDS matrix junction, proceed through double 85 tests,
Temperature shock test, thermocycling and high low humidity cyclic test and heat stress test.
The present invention also provides a kind of LDS antennas, including metalwork and LDS matrix, and the metalwork part inlay is in institute
State LDS matrix, the LDS matrix is formed with circuitous pattern by the way of laser laser carving, at least partly described circuitous pattern with
The metalwork connects, and is formed with conductive connection in the circuitous pattern and metalwork surface by using the mode of chemical plating
Layer.
Optionally, the metalwork is copper fitting, alternatively, the metalwork be non-copper fitting and the non-copper fitting at least
Copper is covered with LDS matrix junction.
The connection method of stereo circuit and metalwork provided by the present invention and LDS antenna, by the way of chemical plating
Conductive tie layers are formed on the surface of the circuitous pattern and metalwork, conductive tie layers are formed by chemistry displacement reaction, led
Electric connection layer can be covered in the surface of circuitous pattern and metalwork for layers of copper or layer gold etc., conductive tie layers, be formed reliable
Conductive path, conductive tie layers can form the connection of atom level, are not easy out for a long time or in various climatic environments using lower
Layering is split, circuit conduction property is reliable, can continuously work normally under various climatic enwronmental tests for a long time, product not only may be used
To be applied to general civilian mobile terminal, the professional equipment field under particular surroundings can also be applied to.Moreover, in chemical plating
Be not required for LDS material high temperature resistant, therefore the choice of LDS material is big, appearance is small by being limited with structure, technology difficulty and
Product cost is relatively low.
Detailed description of the invention
It to describe the technical solutions in the embodiments of the present invention more clearly, below will be to needed in the embodiment
Attached drawing is briefly described, it should be apparent that, drawings in the following description are only some embodiments of the invention, for ability
For the those of ordinary skill of domain, without creative efforts, it can also be obtained according to these attached drawings other attached
Figure.
Fig. 1 is the reference flow sheet of the connection method of stereo circuit and metalwork provided in an embodiment of the present invention.
Specific embodiment
In order to make the objectives, technical solutions, and advantages of the present invention clearer, with reference to the accompanying drawings and embodiments, right
The present invention is further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, and
It is not used in the restriction present invention.
The connection method of a kind of stereo circuit and metalwork provided in an embodiment of the present invention, prepares metalwork and LDS material,
LDS material is a kind of modified plastics for including organometallic compounds, after laser irradiation, organometallic compounds is made to release gold
Belong to particle.The connection method of stereo circuit and metalwork the following steps are included: obtain LDS matrix for LDS material is molded, and
At least part of the metalwork is embedded in the LDS matrix, in concrete application, can be made by way of in-mould injection
The end of metalwork is embedded in LDS matrix, is connected as one metalwork with LDS matrix, and structural reliability is high, concrete application
In, it can inlay in metalwork to the part of LDS matrix and through-hole is set, so that LDS material can be in through-hole, structure is reliable
Property is higher.Circuitous pattern is formed in the LDS matrix by the way of laser laser carving again, i.e., using computer according to conductive pattern
TRAJECTORY CONTROL laser movement, laser throwing is shone circuitous pattern is activated on molded LDS matrix.On LDS matrix
At least partly circuitous pattern and metalwork be aligned on one side, circuitous pattern is docked with metalwork.Again by the way of chemical plating
Conductive tie layers are formed on the surface of the circuitous pattern and metalwork, conductive tie layers are formed by chemistry displacement reaction, led
Electric connection layer can be covered in the surface of circuitous pattern and metalwork for layers of copper or layer gold etc., conductive tie layers, be formed reliable
Conductive path, conductive tie layers can form the connection of atom level, are not easy out for a long time or in various climatic environments using lower
Layering is split, circuit conduction property is reliable, can continuously work normally under various climatic enwronmental tests for a long time, product not only may be used
To be applied to general civilian mobile terminal, the professional equipment field under particular surroundings can also be applied to.Moreover, in chemical plating
Be not required for LDS material high temperature resistant, therefore the choice of LDS material is big, appearance is small by being limited with structure, technology difficulty and
Advantage of lower cost.
Specifically, the metalwork is the non-copper metalwork that copper fitting or surface are coated with layers of copper, so that connection is reliable.
Alternatively, the metalwork may be non-copper metalwork, before the metalwork is embedded in the LDS matrix,
Layers of copper is set to the surface plating less than the metalwork and LDS matrix joint.
In concrete application, using before chemical plating, to the circuitous pattern and metalwork increase oil removing cleaning, microetch,
Four processes of pickling and washing, to further increase the reliability of connection.
Microetch liquid medicine is used in microetch process, the main ingredient of microetch liquid medicine is hydrogen peroxide+acid or SPS+ acid, and acid is sulphur
Acid or hydrochloric acid.
Pickling liquid medicine is used in pickling in sequence, the main ingredient of pickling liquid medicine is sulfuric acid or hydrochloric acid.
Specifically, the stereo circuit is LDS antenna, can be applied to the mobile terminals such as mobile phone, can use laser radium
Penetrate technology change directly on LDS matrix plating form metal antenna pattern, can be directly radium-shine on phone housing by antenna, day
Line is more stable, can also be to avoid the interference of internal component, while can also save more design spaces, and mobile phone is allowed to do
It obtains more slim.
Specifically, it is formed after the formation conductive tie layers, the inspection of hardware coating layer is carried out on Yu Suoshu conductive tie layers
Process is tested, to guarantee reliability.
Specifically, the hardware coating layer inspection process includes at least bending inspection process, knife scrapes inspection process, frustrates knife inspection
Test process and thermal stress inspection process.
Specifically, to the conductive tie layers of the metalwork and LDS matrix junction, proceed through double 85 tests,
Temperature shock test, thermocycling and high low humidity cyclic test and heat stress test.It is 85 that double 85 tests, which are in temperature,
Degree Celsius, humidity be 85% degradation.It is as shown in Figure 1 the company of stereo circuit provided in an embodiment of the present invention and metalwork
Connect the reference flow sheet of method.
The embodiment of the invention also provides a kind of LDS antenna, including metalwork and LDS matrix, the metalwork part edge
Embedded in the LDS matrix, the LDS matrix is formed with circuitous pattern by the way of laser laser carving, at least partly described circuit
Figure connects with the metalwork, is formed with conduction in the circuitous pattern and metalwork surface by using the mode of chemical plating
Articulamentum.Conductive tie layers, conductive tie layers are formed on the surface of the circuitous pattern and metalwork by the way of chemical plating
Reaction is replaced by chemistry to be formed, conductive tie layers can for layers of copper or layer gold etc., conductive tie layers be covered in circuitous pattern and
The surface of metalwork forms reliable conductive path, and conductive tie layers can form the connection of atom level, for a long time or various
Climatic environment uses lower layering not easy to crack, and circuit conduction property is reliable, can continuously try for a long time in various climatic environments
Lower normal work is tested, product can be applied not only to general civilian mobile terminal, can also be applied to special under particular surroundings
Industry apparatus field.Moreover, LDS material high temperature resistant is not required in chemical plating, therefore the choice of LDS material is big, appearance and knot
Structure is small by being limited, and technology difficulty and product cost are relatively low.
In concrete application, the metalwork is copper fitting, alternatively, the metalwork is non-copper fitting and the non-copper fitting
At least copper is covered with LDS matrix junction.
The connection method of stereo circuit and metalwork provided by the embodiment of the present invention, can by after LDS matrix laser carving, with
Metalwork changes plating simultaneously, and LDS matrix is reliably connect with metalwork, does not need LDS plastic material resistant to high temperature, does not also need to weld
It connects, thus cost is relatively low, and changing plating is to form cupro-nickel layer or layer gold etc. by replacing reaction, belongs to the connection of atom level, institute
With the layering that will not crack under long-time use or climatic enwronmental test, high reliablity.
LDS antenna provided by the embodiment of the present invention, in the circuitous pattern and metalwork by the way of chemical plating
Surface forms conductive tie layers, and conductive tie layers are formed by chemistry displacement reaction, and conductive tie layers can be layers of copper or layer gold
Deng conductive tie layers are covered in the surface of circuitous pattern and metalwork, form reliable conductive path, and conductive tie layers can be with shape
At the connection of atom level, long-time or the layering not easy to crack under various climatic environment uses, circuit conduction property is reliable, can
It is worked normally under various climatic enwronmental tests for a long time with continuous, product can be applied not only to general civilian mobile whole
End can also be applied to the professional equipment field under particular surroundings.Moreover, LDS material high temperature resistant is not required in chemical plating, therefore
The choice of LDS material is big, and appearance is small by being limited with structure, and technology difficulty and product cost are relatively low.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all in essence of the invention
Made any modification, equivalent replacement or improvement etc., should all be included in the protection scope of the present invention within mind and principle.
Claims (10)
1. the connection method of a kind of stereo circuit and metalwork prepares metalwork and LDS material, which is characterized in that including following
Step: LDS matrix is obtained by LDS material is molded, the LDS material is a kind of modified modeling for including organometallic compounds
Material, and the end of the metalwork is embedded in the LDS matrix by way of in-mould injection, by the way of laser laser carving
Circuitous pattern is formed in the LDS matrix to throw laser using computer according to the movement of the TRAJECTORY CONTROL laser of conductive pattern
It shines on the molded LDS matrix, so that the organometallic compounds is released metallic, circuit diagram is activated
Shape, at least partly circuitous pattern on the LDS matrix are aligned on one side with the metalwork, the circuitous pattern and the gold
Belong to part docking, then forms conductive tie layers on the surface of the circuitous pattern and metalwork by the way of chemical plating, it is described to lead
The surface that electric connection layer is covered in circuitous pattern and metalwork forms conductive path, the conductive tie layers be layers of copper or layer gold and
Form the connection of atom level.
2. the connection method of stereo circuit as described in claim 1 and metalwork, which is characterized in that the metalwork is copper
Part.
3. the connection method of stereo circuit as described in claim 1 and metalwork, which is characterized in that the metalwork is non-copper
Metalwork, before the metalwork is embedded in the LDS matrix, until less than the metalwork and LDS matrix joint
Surface plating set layers of copper.
4. the connection method of stereo circuit as described in claim 1 and metalwork, which is characterized in that using chemical plating it
Before, oil removing cleaning, four microetch, pickling and washing processes are increased to the circuitous pattern and metalwork.
5. the connection method of stereo circuit as described in claim 1 and metalwork, which is characterized in that the stereo circuit is
LDS antenna.
6. the connection method of stereo circuit as described in claim 1 and metalwork, which is characterized in that it is conductive to form the formation
After articulamentum, hardware coating layer inspection process is carried out on Yu Suoshu conductive tie layers.
7. the connection method of stereo circuit as claimed in claim 6 and metalwork, which is characterized in that the hardware coating layer inspection
Process is tested to scrape inspection process including bending inspection process, knife, frustrate knife inspection process and thermal stress inspection process.
8. the connection method of stereo circuit and metalwork as described in any one of claims 1 to 7, which is characterized in that institute
The conductive tie layers for stating metalwork Yu LDS matrix junction proceed through double 85 tests, temperature shock test, high/low temperature
Test and high low humidity cyclic test and heat stress test.
9. a kind of LDS antenna, including metalwork and by the molded obtained LDS matrix of LDS material, which is characterized in that described
Metalwork part is embedded in the LDS matrix by way of in-mould injection, and LDS material is that one kind includes organometallic compounds
Modified plastics, the LDS matrix makes organometallic compounds release metallic to be formed with by the way of laser laser carving
Circuitous pattern, at least partly described circuitous pattern connect with the metalwork, by using the mode of chemical plating in the circuit
Figure and metalwork surface are formed with conductive tie layers, and the conductive tie layers are covered in the surface shape of circuitous pattern and metalwork
At conductive path, the conductive tie layers are layers of copper or layer gold and the connection for forming atom level.
10. LDS antenna as claimed in claim 9, which is characterized in that the metalwork is copper fitting, alternatively, the metalwork
For non-copper fitting and the non-copper fitting at least covers copper with LDS matrix junction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610701271.9A CN106299823B (en) | 2016-08-22 | 2016-08-22 | Connection method of three-dimensional circuit and metal piece and LDS antenna |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610701271.9A CN106299823B (en) | 2016-08-22 | 2016-08-22 | Connection method of three-dimensional circuit and metal piece and LDS antenna |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106299823A CN106299823A (en) | 2017-01-04 |
| CN106299823B true CN106299823B (en) | 2019-11-29 |
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|---|---|---|---|
| CN201610701271.9A Active CN106299823B (en) | 2016-08-22 | 2016-08-22 | Connection method of three-dimensional circuit and metal piece and LDS antenna |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106684598A (en) * | 2017-01-23 | 2017-05-17 | 广东小天才科技有限公司 | Electronic product and circuit connecting device thereof |
| CN107567202A (en) * | 2017-08-28 | 2018-01-09 | 广东小天才科技有限公司 | Circuit board assembly and manufacturing method thereof |
| CN110767984B (en) * | 2018-07-27 | 2022-03-15 | 比亚迪股份有限公司 | Housing and method for making same |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203261570U (en) * | 2013-04-30 | 2013-10-30 | 台湾立体电路股份有限公司 | Ceramic laser metallization and metal layer structure |
| CN104419916A (en) * | 2013-08-26 | 2015-03-18 | 深圳崇达多层线路板有限公司 | Manufacturing method of chemical nickel palladium gold plating plated with thick palladium |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101859613B (en) * | 2009-04-09 | 2013-03-27 | 深圳市微航磁电技术有限公司 | Three-dimensional circuit manufacturing process and composite components of laser plastic material and manufacturing method |
| CN101577361A (en) * | 2009-06-01 | 2009-11-11 | 中兴通讯股份有限公司 | Method for manufacturing near field communication (NFC) terminal and antenna thereof |
| CN104577301A (en) * | 2013-10-15 | 2015-04-29 | 位速科技股份有限公司 | Production method of three-dimensional antenna |
| CN104526093B (en) * | 2014-08-22 | 2017-01-11 | 华侨大学 | Method of manufacturing cathode for surface texture micro-electrochemical machining |
| CN104320922A (en) * | 2014-10-20 | 2015-01-28 | 广东佳禾声学科技有限公司 | Method for arranging multiple layers of electronic elements on single-surface stereo circuit and device prepared by the same |
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2016
- 2016-08-22 CN CN201610701271.9A patent/CN106299823B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203261570U (en) * | 2013-04-30 | 2013-10-30 | 台湾立体电路股份有限公司 | Ceramic laser metallization and metal layer structure |
| CN104419916A (en) * | 2013-08-26 | 2015-03-18 | 深圳崇达多层线路板有限公司 | Manufacturing method of chemical nickel palladium gold plating plated with thick palladium |
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| CN106299823A (en) | 2017-01-04 |
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