CN104896320A - LED (light-emitting diode) lamp - Google Patents
LED (light-emitting diode) lamp Download PDFInfo
- Publication number
- CN104896320A CN104896320A CN201410079930.0A CN201410079930A CN104896320A CN 104896320 A CN104896320 A CN 104896320A CN 201410079930 A CN201410079930 A CN 201410079930A CN 104896320 A CN104896320 A CN 104896320A
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- Prior art keywords
- led
- circuit
- lamp bead
- led lamp
- radiator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
Abstract
The invention relates to the field of lamp illumination and discloses an LED (light-emitting diode) lamp. The LED lamp comprises a circuit substrate, a radiator, a stereo circuit, an LED lamp bead or bare crystal and a drive circuit, wherein the circuit substrate and the radiator are integrally molded through the same thermally conductive and insulating material to form a structural part; the stereo circuit is manufactured on the circuit substrate of the structural part; the LED lamp bead or the LED bare crystal is mounted on the stereo circuit; and the drive power supply is connected with the stereo circuit for providing power to the LED lamp bead or the LED bare crystal. According to the LED lamp, the circuit substrate and the radiator are substituted by a thermally conductive and insulating body, the stereo circuit is directly manufactured on the insulating body, and a LED is directly packaged or welded on the stereo circuit, so that the insulating safety is ensured, the heat on the LED is ensured to be efficiently transmitted to the radiator, and the service life of the LED lamp is prolonged. During assembly, the LED lamp bead or LED bare crystal is only required to mount on the stereo circuit of the structural part directly, so that the components are reduced and the assembly is simple.
Description
Technical field
The present invention relates to field of lamp illumination, particularly a kind of LED.
Background technology
Along with the raising of the luminous efficiency of the luminescence chips such as diode LED chips, LED constantly expands to applications such as large scale liquid crystal backlight and indoor and outdoor lighting.
Meanwhile, had higher requirement in the structure of LED, the aspect such as manufacture and cost.In addition, in general, the heat radiation correlation degree of the stability of LED work and the service life of LED chip and lamp body itself is high, and therefore radiating effect also needs further raising.
The structure of existing LED is more complicated, shown in LEDbulb lamp exemplary block diagram as existing in Fig. 1, generally LED lamp bead be welded on aluminium base or ceramic substrate, then substrate is fixed to heat sink body to solve heat radiation preferably, heat sink body generally uses aluminium alloy compression casting shaping.Be connected with heat-conducting silicone grease or heat-conducting silica gel sheet between substrate with heat sink body, in order to save space power system module be generally built in aluminium alloy heat sink body inside be connected with welding manner by wire with substrate.
As shown in Figure 2, LED lamp bead 201 is arranged on aluminium base or ceramic substrate 202 the existing technique of corresponding making LED, and substrate 202 is connected by heat-conducting silicone grease 203 with between radiator 204 simultaneously.Make the profile of the LED obtained as shown in Figure 3 according to existing technique as shown in Figure 2, be followed successively by from top to bottom: LED chip 301, substrate 302, connecting material 303, and radiator 304.
There is following defect in this structure:
1. aluminium alloy heat sink body is the good conductor of electricity, therefore insulation processing must be carried out between itself and power module, general use insulating materials, by coated for power supply, increases the heat radiation being unfavorable for power supply while cost, easily causes power supply to shorten the life-span because of poor heat radiation;
2. use heat-conducting silicone grease as the connecting material of substrate and heat sink body:
Traditional LED thermally-conductive interface adopts heat conductive silicon grease material to carry out heat conduction, and the heat conductivility due to heat conductive silicon grease material is far from the height of Heat Conduction Material, and so the thermal resistance adding membership increase radiator of heat-conducting silicone grease, causes radiating effect to be deteriorated;
In use there is dissociant and separate out in heat-conducting silicone grease, pollutes lamp lens, affect light transmittance;
Can be there is aging problem in heat-conducting silicone grease, heat transfer efficiency declines in long-time use procedure, finally causes LED to save temperature rise, cause LED to occur light decay, affect the life-span;
In an assembling process, need manually to be coated on radiator by heat-conducting silicone grease, the requirement of process to personnel of application is higher, in case heat-conducting silicone grease effect of flood;
3. aluminium base is as the circuit substrate of LED lamp bead, although the heat conduction of aluminium, heat-sinking capability are very strong, but an insulating barrier must be added between line layer and aluminum base layer to insulate, this just causes the capacity of heat transmission of aluminium base sharply to decline, and Long-Time Service exists the risk that insulating barrier is separated with line layer or aluminum substrate, cause the further decline of the capacity of heat transmission.
In sum, whole LED lamp has many places to need to carry out insulation processing, reduces the radiating effect of each parts; In addition, need during installation first LED lamp bead to be arranged on substrate, then substrate and heat sink are assembled together, when the assembling of substrate and radiator is both taken a lot of work, connect because of needs heat-conducting silicone grease again or have mechanical connecting sewing gap and reduce heat-conductive characteristic.
Summary of the invention
The object of the present invention is to provide a kind of LED, instead of circuit substrate and radiator two objects by a thermal conductive insulator, directly make stereo circuit on the body, LED directly encapsulates or is welded on stereo circuit, so both ensure that insulation safety, in turn ensure that the heat on LED can pass to radiator efficiently, improve the service life of LED; Only need during assembling directly to install LED lamp bead or the naked crystalline substance of LED at the stereo circuit of structural member circuit substrate, number of parts is few, and assembling is simple.
For solving the problems of the technologies described above, embodiments of the present invention disclose a kind of LED, comprise circuit substrate and radiator, stereo circuit, LED lamp bead or the naked crystalline substance of LED, driving power;
Circuit substrate and the radiator one-body molded formation structural member of same heat-conducting insulation material;
The circuit substrate of structural member is manufactured with stereo circuit;
LED lamp bead or the naked crystalline substance of LED are arranged on stereo circuit;
Driving power is connected with stereo circuit, is LED lamp bead or the naked crystalline substance power supply of LED.
Compared with prior art, the main distinction and effect thereof are embodiment of the present invention:
Because instead of circuit substrate and radiator two objects by a thermal conductive insulator, directly make stereo circuit on the body, LED directly encapsulates or is welded on stereo circuit, so both ensure that insulation safety, in turn ensure that the heat on LED can pass to radiator efficiently, improve the service life of LED; Only need during assembling directly to install LED lamp bead or the naked crystalline substance of LED at the stereo circuit of thermal conductive insulator, number of parts is few, and assembling is simple.
Further, stereo circuit is irradiated by laser and the mode of changing plating is made, and can form stereo circuit at any visible surface of structural member, has expanded driving power and has been connected to mode on stereo circuit.
Further, driving power is connected directly between on described stereo circuit, or be connected on described stereo circuit in the mode of non-solder, simplify production technology, driving power can use open power supply simultaneously, improve the heat-sinking capability of power supply while reducing costs, improve the service life of power module.
Further, driving power and described LED lamp bead or the naked crystalline substance of LED are positioned at the not homonymy of described circuit substrate, and are placed in the accommodating storehouse that described radiator formed, and save the overall space of LED etc. further.
Further, select heat-conducting plastic to make circuit substrate and radiator, there is shaping advantage easy, with low cost.
Accompanying drawing explanation
Fig. 1 is a kind of LEDbulb lamp exemplary block diagram in prior art;
Fig. 2 is the existing process schematic representation making LED in prior art;
Fig. 3 is the structural representation sectional view that existing technique makes the LED obtained;
Fig. 4 is the structural representation sectional view of a kind of LED in first embodiment of the invention;
Fig. 5 is the new technology schematic diagram making LED in first embodiment of the invention;
Fig. 6 is the structural representation sectional view of a kind of LED in second embodiment of the invention.
Detailed description of the invention
In the following description, many ins and outs are proposed in order to make reader understand the application better.But, persons of ordinary skill in the art may appreciate that even without these ins and outs with based on the many variations of following embodiment and amendment, also can realize each claim of the application technical scheme required for protection.
For making the object, technical solutions and advantages of the present invention clearly, below in conjunction with accompanying drawing, embodiments of the present invention are described in further detail.
First embodiment of the invention relates to a kind of LED, and Fig. 4 is the structural representation of this LED, wherein schemes (a) and figure (b) is two kinds of different embodiments.As shown in Figure 4, this LED comprises circuit substrate 401 and radiator 402, stereo circuit 403, LED lamp bead or LED naked brilliant 404, driving power 405.
Circuit substrate 401 and the radiator 402 one-body molded formation structural member of same heat-conducting insulation material, this structural member can embed an alumiaum article to improve heat-conducting effect by the technique of in-mould injection if desired, and wherein alumiaum article is coated in heat-conducting insulation material;
The circuit substrate 401 of structural member is manufactured with stereo circuit 403;
LED lamp bead or LED naked brilliant 404 are arranged on stereo circuit 403;
Driving power 405 is connected with stereo circuit 403, is LED lamp bead or naked brilliant 404 power supplies of LED.
In addition, in the present embodiment, driving power 405 is positioned at the same side of circuit substrate with LED lamp bead or LED naked brilliant 404, driving power 405 is connected directly between on stereo circuit 403, or is connected on stereo circuit 403 in the mode of non-solder (comprising contact or the mode such as draw-in groove or contact pin).As shown in the structural representation sectional view of LED in Fig. 4, driving power 405 is positioned at the same side of circuit substrate with LED lamp bead or LED naked brilliant 404, wherein scheming driving power 405 in (a) is connected on stereo circuit 403 by thimble 406, and in figure (b), driving power 405 is directly welded on stereo circuit 403.
Be appreciated that, due to circuit substrate 401 and the radiator 402 one-body molded formation structural member of same heat-conducting insulation material, on the one hand, the circuit substrate 401 be made up of heat-conducting insulation material both can as LED lamp bead or the thermal conductor between LED naked brilliant 404 and radiator 402, as insulator, the operation adding insulating barrier between circuit substrate 401 and stereo circuit 403 can be eliminated again; On the other hand, the radiator 402 be made up of heat-conducting insulation material also possesses heat conduction and insulating capacity simultaneously, and therefore driving power 405 does not need to carry out insulation processing, can use open power supply, improve the heat-sinking capability of power supply while reducing costs, improve the service life of power supply.Moreover, because radiator 402 and circuit substrate 401 are integrated, both eliminate and used heat-conducting silicone grease connecting circuit substrate 401 and the operation of radiator 402, overcome again the problem of the radiating efficiency decline caused by heat-conducting silicone grease to a certain extent; One-body moldedly also space can be saved, for LED outward appearance personalized designs realizes providing possibility.
Due to above-mentioned many-sided factor, as Fig. 5 makes shown in the new technology schematic diagram of LED, as long as the stereo circuit of the structural member directly formed at circuit substrate 202 and radiator 204 integrated molding when assembling sets up LED lamp bead or LED naked brilliant 201, number of parts is few, assembles simply.Then need in prior art first LED lamp bead to be arranged on substrate, again substrate and heat sink are assembled together, as shown in Figures 2 and 3, when the assembling of substrate and radiator is both taken a lot of work, connect because of needs heat-conducting silicone grease again or have mechanical connecting sewing gap and reduce heat-conductive characteristic.
Preferably, the insulating heat-conduction material making circuit substrate and radiator is heat-conducting plastic.
Use heat-conducting plastic to make circuit substrate and radiator, there is shaping advantage easy, with low cost.
In addition, be appreciated that in other embodiments of the present invention, also can select thermal conductive ceramic or other insulating heat-conduction materials, such as aluminium nitride ceramics, aluminium oxide ceramics or carborundum.
Preferably, stereo circuit is by first obtaining line pattern by laser scanning, the rear metal line made the technology mode carrying out selectiveization plating through the region of laser scanning.
In the present embodiment, adopt laser link straight forming technique (LDS technique) stereo circuit can be formed at any visible surface of structural member, driving power both can be connected directly between on stereo circuit, also can be connected on stereo circuit in the mode of non-solder (comprising contact or the mode such as draw-in groove or contact pin), expand driving power and be connected to mode on stereo circuit, also simplify production technology further.
LDS technique utilizes laser to carry out radium carving to the special plastic material containing metallochemistry thing, then through electroless copper/nickel, form high accuracy interconnect architecture and stereo circuit on plastic surface, technological process is: modified plastics injection mo(u)lding → laser radium carving → metal-plated.
Laser scanning laser equipment used is multi-mode laser device, and laser equipment power is 5 ~ 50W, and wavelength is 200 ~ 1064nm.
In addition, be appreciated that in other embodiments of the present invention, also can adopt the laser instrument of other types, and be not limited to this.Such as gas laser, solid state laser or semiconductor laser.The power of laser equipment and wavelength also can select other scopes be applicable to.
Be appreciated that, in other embodiments of the present invention, laser link straight forming technique (LDS technique) can be adopted to make stereo circuit, other three dimensional mold interconnecting device technique (3D-MID) also can be adopted on structural member, to form stereo circuit, such as LAP, LRP technique etc.
LAP(Laser Activating Plating) technique, namely after laser activation, metal plating process is the radium-shine precise machining process of three-dimensional based on common plastic substrates, base material carries out chemical liquid activation process after laser radium carving, then through electroless copper/nickel, high accuracy interconnect architecture and stereo circuit is formed on plastic surface.
Technological process is: common plastics injection mo(u)lding → laser radium carving → chemical surface activation → metal-plated.
LRP(Laser Restructuring Printing) technique, namely laser reconstruct typography is by three-dimensional printing art, and conductive silver paste is coated to surface of the work at a high speed accurately, forms circuit shape, then by Three dimensions control laser reconditioning, to form high-precision circuit interconnects structure.
Technological process is: common plastics injection mo(u)lding → silver slurry 3D printing → laser radium carving.
Wherein, 3D-MID technology refers on the surface of the plastic casing of injection mo(u)lding, is manufactured with 3 D stereo circuit and the interconnection element of electric function.
Selectiveization plating generate metal layer thickness be 1 ~ 50um, change plating temperature be 20 ~ 70 degrees Celsius, change the plating time be 1 ~ 7 hour.In addition, be appreciated that in other embodiments of the present invention, other also can be selected to change plating parameter, and be not limited to this.
In addition, be appreciated that in other embodiments of the present invention, except selectiveization plating, also electrodepositable copper thickeies, and follow-uply also can select other coat of metal such as nickel plating, gold.Preferably, before the processing step of selectiveization plating, the processing step of activation can also be had.
Preferably, LED lamp bead is arranged on stereo circuit in the mode of paster or welding.
Preferably, the naked crystalline substance of LED is that the mode directly encapsulated is arranged on stereo circuit.
In addition, be appreciated that in other embodiments of the present invention, be not limited to above-mentioned mentioned mode mounted LED lamp bulb or the naked crystalline substance of LED.
Because instead of circuit substrate and radiator two objects by a thermal conductive insulator, directly make stereo circuit on the body, LED directly encapsulates or is welded on stereo circuit, so both ensure that insulation safety, in turn ensure that the heat on LED can pass to radiator efficiently, improve the service life of LED.Only need during assembling directly to install LED lamp bead or the naked crystalline substance of LED at the stereo circuit of thermal conductive insulator, number of parts is few, and assembling is simple.
Second embodiment of the invention relates to a kind of LED, and Fig. 6 is the structural representation sectional view of this LED.
Second embodiment improves on the basis of the first embodiment, and main improvements are, as shown in Figure 6:
In figure (c) figure (d), driving power 405 and LED lamp bead or LED naked brilliant 404 are positioned at the not homonymy of circuit substrate 401, and are placed in the accommodating storehouse of radiator 402 formation;
Preferably, as shown in figure (d), circuit substrate 401 part has metallization via hole 407, and driving power 405 passes through metallization via hole 407 and utilizes thimble 406 to be connected with stereo circuit 403, is naked brilliant 404 power supplies of LED lamp bead or LED.
In addition, be appreciated that a kind of preferred generating mode of metallization via hole is punching on insulating heat-conduction material with laser, be plated in hole plate metal by selectiveization.Also can generate metallization via hole by traditional mode, such as, implant a bit of plain conductor etc.
Driving power and LED lamp bead or the naked crystalline substance of LED are positioned at the not homonymy of circuit substrate, and are placed in the accommodating storehouse that radiator formed, and save the overall space of LED etc. further.
As preference of the present invention, concrete scheme is as follows:
1. with the mode production drawing 6(d of injection moulding) shown in structural member, material is heat-conducting plastic (thermal conductivity factor 2 ~ 20W/(mK)); This structural member is the one-body molded of substrate and radiator; Porose with the use doing circuit via hole in circuit substrate part in structure as shown in the figure;
2. circuit is shaping: line pattern radium is carved on structural member by the three-dimensional marking machine (model is: QM3D1H) using Shenzhen Fanyou Technologies Co., Ltd. to produce, the all right gas laser of laser equipment that above-mentioned technique is used, or solid state laser, or semiconductor laser; Plant capacity is 5 ~ 50W, preferably 10 ~ 25W; Optical maser wavelength can be 200 ~ 1064nm, preferably 1064nm; Product after being carved by radium carries out selectiveization copper facing, and electroless copper thickness is 1 ~ 50um, and electroless copper temperature is 20 ~ 70 DEG C, and the time is 1 ~ 7h; Electrodepositable copper thickeies 10 ~ 35um; Follow-uply also can select other coats of metal such as nickel plating, gold;
3. after above-mentioned carrier completes metal line, after carrier builds circuit, LED (is comprised surface mounting technology (" Surface Mount Technology " in the mode of paster, be called for short SMT) and welding) be fixed on circuit, or the mode that naked for LED crystalline substance directly encapsulates is fixed on circuit; This structural implementations is not limited to above-mentioned mentioned mode;
4. after building circuit on carrier, driving power is fixed on structural member, and is connected on circuit in the mode of thimble, form functional unit.
In sum, the design feature of LED of the present invention be by LED-baseplate/circuit substrate and radiator one-body molded with same heat-conducting insulation material, heat-conducting insulation material can be heat-conducting plastic or pottery; By 3D MID(three dimensional mold interconnecting) technology formation metallic circuit, this circuit can be three-dimensional; Then components and parts and LED lamp bead are fixed on circuit with paster (SMT, welding), also can naked for LED crystalline substance are fixed on circuit in the mode directly encapsulated; Driving power directly can be welded on circuit substrate circuit or will independently be connected on circuit with welding, non-solder (comprising contact or the mode such as draw-in groove or contact pin) by power supply module simultaneously.
Its advantage is mainly reflected in:
1., by LED circuit substrate (corresponding aluminium base) and heat sink body integrated molding, material is the Heat Conduction Material of insulation, and the program well solves the problem using heat-conducting silicone grease to bring; Material simultaneously owing to using possesses heat conduction and insulating capacity driving power module can use open power supply, and the heat-sinking capability improving power supply while reducing costs improves the service life of power module;
2. integration also can save space, for LED outward appearance personalized designs realizes providing possibility;
3. on structural member, form stereo circuit by the technique of 3D-MID, LED can be fixed on circuit in two ways (by LED lamp bead in the mode of SMT or welding or naked for LED crystalline substance is directly encapsulated on the line) significantly simplify production technology, reduce and produce cost; 3D-MID technique can preferred LDS or LAP, the preferred heat-conducting plastic of material or pottery; When using heat-conducting plastic relatively and aluminium alloy heat radiator have shaping advantage easy, with low cost;
4., owing to utilizing laser link straight forming technique (i.e. LDS) can form stereo circuit at any visible surface of structural member, power supply directly can design on structural member or be connected on circuit by non-solder mode, simplifies production technology further and improves power source life.
Yes it may be noted that, in the embodiments of the present invention, the appearance that stereo circuit refers to insulating body (insulating heat-conduction material) is three-dimensional (not being dull and stereotyped), metallic circuit on insulating body can be three-dimensional, also can be plane (such as metallic circuit may cover only insulating body side).
It should be noted that, in the claim and description of this patent, the such as relational terms of first and second grades and so on is only used for an entity or operation to separate with another entity or operating space, and not necessarily requires or imply the relation that there is any this reality between these entities or operation or sequentially.And, term " comprises ", " comprising " or its any other variant are intended to contain comprising of nonexcludability, thus make to comprise the process of a series of key element, method, article or equipment and not only comprise those key elements, but also comprise other key elements clearly do not listed, or also comprise by the intrinsic key element of this process, method, article or equipment.When not more restrictions, the key element " being comprised " limited by statement, and be not precluded within process, method, article or the equipment comprising described key element and also there is other identical element.
Although by referring to some of the preferred embodiment of the invention, to invention has been diagram and describing, but those of ordinary skill in the art should be understood that and can do various change to it in the form and details, and without departing from the spirit and scope of the present invention.
Claims (9)
1. a LED, is characterized in that, comprises circuit substrate and radiator, stereo circuit, LED lamp bead or the naked crystalline substance of LED, driving power;
Described circuit substrate and the radiator one-body molded formation structural member of same heat-conducting insulation material;
The circuit substrate of described structural member is manufactured with stereo circuit;
Described LED lamp bead or the naked crystalline substance of LED are directly installed on described stereo circuit;
Described driving power is connected with described stereo circuit, is described LED lamp bead or the naked crystalline substance power supply of LED.
2. LED according to claim 1, is characterized in that, described stereo circuit is by first obtaining line pattern by laser scanning, the rear metal line made the technology mode carrying out selectiveization plating through the region of laser scanning.
3. LED according to claim 1, is characterized in that, described LED lamp bead is arranged on described stereo circuit in the mode of paster or welding.
4. LED according to claim 1, is characterized in that, the naked crystalline substance of described LED is that the mode of directly encapsulation is arranged on described stereo circuit.
5. LED according to claim 1, it is characterized in that, described driving power and described LED lamp bead or the naked crystalline substance of LED are positioned at the same side of described circuit substrate, and described driving power is connected directly between on described stereo circuit, or is connected on described stereo circuit in the mode of non-solder.
6. LED according to claim 1, is characterized in that, described driving power and described LED lamp bead or the naked crystalline substance of LED are positioned at the not homonymy of described circuit substrate, and is placed in the accommodating storehouse that described radiator formed;
Described circuit substrate part has metallization via hole, and described driving power is connected with described stereo circuit by described metallization via hole, is described LED lamp bead or the naked crystalline substance power supply of LED.
7. LED according to claim 2, is characterized in that, described laser scanning laser equipment used is multi-mode laser device, and laser equipment power is 5 ~ 50W, and wavelength is 200 ~ 1064nm.
8. LED according to claim 2, is characterized in that, the plating of described selectiveization generate metal layer thickness be 1 ~ 50um, changing plating temperature is 25 ~ 90 degrees Celsius, and changing the plating time is 1 ~ 7 hour.
9. according to the LED described in claim 1 to 8, it is characterized in that, the insulating heat-conduction material making described circuit substrate and radiator is heat-conducting plastic.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410079930.0A CN104896320A (en) | 2014-03-06 | 2014-03-06 | LED (light-emitting diode) lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410079930.0A CN104896320A (en) | 2014-03-06 | 2014-03-06 | LED (light-emitting diode) lamp |
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| CN104896320A true CN104896320A (en) | 2015-09-09 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410079930.0A Pending CN104896320A (en) | 2014-03-06 | 2014-03-06 | LED (light-emitting diode) lamp |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106122804A (en) * | 2015-10-22 | 2016-11-16 | 亚浦耳照明股份有限公司 | A kind of LEDbulb lamp and preparation method thereof |
| WO2018176738A1 (en) * | 2017-04-01 | 2018-10-04 | 杭州安得电子有限公司 | Led lamp |
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| CN202493961U (en) * | 2012-04-01 | 2012-10-17 | 德清新明辉电光源有限公司 | Light emitting diode (LED) lamp with good insulativity |
| CN103037635A (en) * | 2011-10-05 | 2013-04-10 | 台湾立体电路股份有限公司 | Three-dimensional curved surface laser penetration hole filling line method |
| CN103220884A (en) * | 2012-01-18 | 2013-07-24 | 光宏精密股份有限公司 | Line substrate structure and manufacturing method thereof |
| CN103225748A (en) * | 2012-01-30 | 2013-07-31 | 上海鼎晖科技有限公司 | Optical module set provided with driving power supply and control module |
| CN203261570U (en) * | 2013-04-30 | 2013-10-30 | 台湾立体电路股份有限公司 | Ceramic laser metallization and metal layer structure |
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| CN103037635A (en) * | 2011-10-05 | 2013-04-10 | 台湾立体电路股份有限公司 | Three-dimensional curved surface laser penetration hole filling line method |
| CN103220884A (en) * | 2012-01-18 | 2013-07-24 | 光宏精密股份有限公司 | Line substrate structure and manufacturing method thereof |
| CN103225748A (en) * | 2012-01-30 | 2013-07-31 | 上海鼎晖科技有限公司 | Optical module set provided with driving power supply and control module |
| CN202493961U (en) * | 2012-04-01 | 2012-10-17 | 德清新明辉电光源有限公司 | Light emitting diode (LED) lamp with good insulativity |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106122804A (en) * | 2015-10-22 | 2016-11-16 | 亚浦耳照明股份有限公司 | A kind of LEDbulb lamp and preparation method thereof |
| WO2018176738A1 (en) * | 2017-04-01 | 2018-10-04 | 杭州安得电子有限公司 | Led lamp |
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Application publication date: 20150909 |