TWM459589U - Connector - Google Patents

Abstract

A connector including a substrate and at least one patterned metal foil is provided. The substrate has a first surface, a second surface opposite to the first surface and at least one first through hole penetrating through the first surface and the second surface. The patterned metal foil is disposed on the first surface. The patterned metal foil includes a first elastic cantilever, a second elastic cantilever and a trace pattern. The trace pattern connects the first elastic cantilever and the second elastic cantilever and is disposed at periphery of the first through hole. The first elastic cantilever is extended toward the direction away from the first surface. The second elastic cantilever penetrating through the first through hole is extended toward the direction away from the second surface.

Description

Connector

This creation is related to a connector, and in particular to a connector having a relatively thin thickness.

Generally, an electronic device is usually provided with a connector and has a connection hole exposing the connector, so that an external route such as a mesh route or a sound source line can be inserted into the connection hole. Electrically connected to the connector.

1 is a schematic cross-sectional view of a conventional connector. Referring to FIG. 1 , the conventional connector structure 10 has a substrate 100 , a first conductive layer 110 , a second conductive layer 120 , a conductive elastic cantilever 130 , an adhesive layer 140 , a copper layer 150 , a nickel layer 160 , and a gold layer 170 . The substrate 100 has a first surface 100a and a second surface 100b opposed to each other, and has a via hole 100c in the substrate 100. The first conductive layer 110 is disposed on the first surface 100a, and the second conductive layer 120 is disposed on the second surface 100b, and the first conductive layer 110 and the second conductive layer 120 are electrically connected by the via hole 100c. The conductive elastic cantilever 130 is pressed onto the first conductive layer 110 by the adhesive layer 140. The copper layer 150 is disposed on the surface of the conductive elastic cantilever 130 and the via hole 100c, and the nickel layer 160 is disposed on the copper layer 150 to electrically connect the conductive elastic cantilever 130 and the via hole 100c. Pick up. In addition, the gold layer 170 is disposed on the portion of the conductive elastic cantilever 130 for connection to the external component.

The connector structure 10 is generally formed by first pressing a metal foil having a conductive elastic cantilever 130 onto the first conductive layer 110 by an adhesive layer 140, and then plating the copper layer on the conductive elastic cantilever 130 and the via hole 100c. Surfacely, the nickel layer 160 is plated on the surface of the copper layer 150 and the gold layer 170 is plated on the partially conductive elastic cantilever 130, after which the unnecessary portion of the metal foil is removed and the conductive elastic cantilever 130 is retained, and the second The conductive layer 120 is patterned. Therefore, the fabrication process of the conventional connector structure is very complicated and takes a lot of time, thus making the connector structure have a high production cost.

This creation provides a connector that is simpler in process and lower in production cost.

A connector of the present invention includes a substrate and at least one patterned metal foil. The substrate has a first surface, a second surface opposite the first surface, and at least one first through hole. The first consistent hole penetrates the first surface and the second surface. The patterned metal foil is disposed on the first surface. The patterned metal foil includes a first elastic cantilever, a second elastic cantilever, and a line pattern. The circuit pattern connects the first elastic cantilever and the second elastic cantilever and is disposed around the first through hole. The first resilient cantilever extends in a direction away from the first surface. The second elastic cantilever extends through the first through hole in a direction away from the second surface.

In an embodiment of the present creation, the first elastic cantilever and the second elastic The cantilever and the line pattern are integrally formed.

In an embodiment of the present invention, the connector further includes a gold layer covering the surface of the patterned metal foil.

In an embodiment of the present invention, the material of the substrate comprises polyimide (PI).

In an embodiment of the present invention, the connector further includes a first insulating adhesive and a second insulating adhesive disposed on the first surface and the second surface, wherein the first insulating adhesive and the second insulating adhesive are respectively Having at least one second through hole corresponding to at least one first through hole. The first elastic cantilever extends through the second through hole of the first insulating rubber in a direction away from the first surface. The second elastic cantilever extends through the second through hole of the second insulating rubber and the first through hole of the substrate toward the direction away from the second surface.

In an embodiment of the present invention, the material of the first insulating paste and the second insulating paste comprises polyimide (PI).

In an embodiment of the present invention, the first elastic cantilever includes a first free end. The first free end protrudes from the surface of the first insulating paste. The second resilient cantilever includes a second free end. The second free end protrudes from the surface of the second insulating paste.

In an embodiment of the present invention, the material of the patterned metal foil includes copper and a copper alloy.

In an embodiment of the present invention, the connector further includes an adhesive layer disposed on the substrate and connected between the substrate and the patterned metal foil.

Based on the above, the present invention places a patterned metal foil on a substrate having a through hole. The patterned metal foil includes a first elastic cantilever, a second elastic cantilever, and a line And the circuit pattern connects the first elastic cantilever and the second elastic cantilever and is disposed around the through hole, and the first elastic cantilever and the second elastic cantilever respectively extend away from the upper and lower surfaces of the substrate. In this way, the present invention does not need to use the conventional circuit board substrate, but directly adheres the patterned metal foil to the substrate with the through hole, so that the patterned metal foil can pass through the first elastic cantilever and the second elastic cantilever respectively. Electrically connected to external components located on the upper and lower surfaces of the substrate. Therefore, the creation can eliminate the complicated connector process such as chemical plating, plating through hole, plating forming circuit layer, surface treatment, etc., thereby improving production efficiency and saving production cost. In addition, since the connector of the present invention has a small number of layers, the overall thickness of the connector can be reduced, thereby shortening the conduction path of the current. Therefore, this creation can improve the current carrying capacity of the connector.

In order to make the above features and advantages of the present invention more comprehensible, the following embodiments are described in detail with reference to the accompanying drawings.

10, 20‧‧‧ connectors

30‧‧‧metal foil

35‧‧‧Metal pattern

100, 200‧‧‧ substrate

100a, 210‧‧‧ first surface

100b, 220‧‧‧ second surface

100c‧‧‧via

110‧‧‧First conductive layer

120‧‧‧Second conductive layer

130‧‧‧Electrically conductive cantilever

140, 700‧‧‧ adhesive layer

150‧‧‧ copper layer

160‧‧‧ Nickel layer

170, 400‧‧ ‧ gold layer

230‧‧‧ first through hole

300‧‧‧ patterned metal foil

310‧‧‧First elastic cantilever

312‧‧‧The first free end

320‧‧‧Second elastic cantilever

322‧‧‧Second free end

330‧‧‧ line pattern

500‧‧‧First insulating glue

510, 610‧‧‧ second through hole

600‧‧‧Second insulation adhesive

1 is a schematic cross-sectional view of a conventional connector.

2 is a schematic diagram of a connector in accordance with an embodiment of the present invention.

3 is a partial cross-sectional view of the connector of FIG. 2.

4A-4D are schematic diagrams showing a manufacturing process of a connector according to an embodiment of the present invention.

2 is a schematic diagram of a connector in accordance with an embodiment of the present invention. 3 is a partial cross-sectional view of the connector of FIG. 2. Referring to FIG. 2 and FIG. 3 simultaneously, in the embodiment, the connector 20 includes a substrate 200 and at least one patterned metal foil 300. The substrate 200 has a first surface 210 , a second surface 220 opposite to the first surface 210 , and at least one first through hole 230 . The first constant hole 230 penetrates the first surface 210 and the second surface 220. In this embodiment, the material of the substrate 200 includes polyimide (PI). The patterned metal foil 300 is disposed on the first surface 210. The patterned metal foil 300 includes a first elastic cantilever 310, a second elastic cantilever 320, and a line pattern 330. In this embodiment, the first elastic cantilever 310, the second elastic cantilever 320, and the circuit pattern 330 are integrally formed, and the material of the patterned metal foil 300 includes copper, that is, the patterned metal foil 300 is an integrally formed pattern. Copper foil layer. In addition, the connector 20 of the present embodiment may further include a gold layer 400 covering the surface of the patterned metal foil 300. The circuit pattern 330 connects the first elastic cantilever 310 and the second elastic cantilever 320 and is disposed around the first through hole 230 as shown in FIG. 2 . The first elastic cantilever 310 extends and is bent away from the first surface 210. The second elastic cantilever 320 extends through the first through hole 230 and is bent away from the second surface 220. In this embodiment, the connector 20 further includes an adhesive layer 700 disposed on the substrate 200 and connected between the substrate 200 and the patterned metal foil 300.

In addition, the connector 20 further includes a first insulating paste 500 and a second insulating paste 600 disposed on the first surface 210 and the second surface 220 respectively as a stand-off layer. Use. The first insulating rubber 500 and the second The material of the edge glue 600 is, for example, polyimide (PI). The first insulating paste 500 and the second insulating paste 600 each have at least one second through hole 510, 610 (shown as two) corresponding to the first through hole 230. The first elastic cantilever 310 extends through the second through holes 510, 610 of the first insulating rubber 500 in a direction away from the first surface 210 and is bent, and the first elastic cantilever 310 includes a first freedom. The end 312 protrudes from the surface of the first insulating paste 500. In other words, the height of the free end of the first elastic cantilever 310 is higher than the surface of the first insulating paste 500. Symmetrically, the second elastic cantilever 320 extends through the second through holes 510, 610 of the second insulating paste 600 and the first through holes 230 of the substrate 200 as shown in FIG. 2, and is bent away from the second surface 220. And the second elastic cantilever 320 includes a second free end 322 that protrudes from the surface of the second insulating paste 600. In this manner, the patterned metal foil 300 on the substrate 200 can be electrically connected to the external components of the first surface 210 and the second surface 220 of the substrate 200 through the first elastic cantilever 310 and the second elastic cantilever 320, respectively.

4A-4D are schematic diagrams showing a manufacturing process of a connector according to an embodiment of the present invention. The above-described method of fabricating the connector 20 can include, for example, the following steps. First, as shown in FIG. 4A, a metal foil 30 having a plurality of metal patterns 35 arranged in an array is provided. The metal patterns 35 are connected to each other and each include a first elastic cantilever 310, a second elastic cantilever 320, and a line pattern 330. In this embodiment, the first elastic cantilever 310, the second elastic cantilever 320, and the line pattern 330 are integrally formed, and the material of the metal foil 30 is, for example, copper, that is, the metal foil 30 can be a copper foil layer. The circuit pattern 330 of each metal pattern 35 is connected to the corresponding first elastic cantilever 310 and the corresponding second elastic cantilever 320, and the first elastic cantilever 310 and the second elastic The arms extend and are bent away from the upper and lower surfaces of the line pattern 330 as shown in FIG. 4A, respectively. In this embodiment, the manufacturing method of the connector 20 further includes an optional step of forming a gold layer (the gold layer 400 as shown in FIG. 3) on the surface of the metal foil 30 to cover or partially cover the surface. The surface of each of the metal patterns 35, wherein the method of forming the gold layer 400 is, for example, electroplating.

Next, as shown in FIG. 4B, the metal foil 30 is pressed onto a substrate 200 having a first surface 210 and a second surface opposite to the first surface 210 (the second surface 220 as shown in FIG. 3). And a plurality of first through holes 230. The first constant hole 230 penetrates the first surface 210 and the second surface (the second surface 220 shown in FIG. 3), and corresponds to the metal pattern 35, respectively. The line patterns 330 are respectively located around the first through holes 230. The first elastic cantilevers 310 extend away from the first surface 210, respectively. The second elastic cantilever 320 extends through the first through hole 230 and away from the second surface (the second surface 220 as shown in FIG. 3). In this embodiment, the step of pressing the metal foil 30 onto the substrate 200 includes, for example, providing an adhesive layer (the adhesive layer 700 as shown in FIG. 3) on the substrate 200, and then pressing the metal foil 30 against the substrate 200. Upper, the adhesive layer is connected between the metal foil 30 and the substrate 200.

Next, as shown in FIG. 4C, portions other than the first elastic cantilever 310, the second elastic cantilever 320, and the line pattern 330 in the metal foil 30 shown in FIG. 4B are removed to make the metals shown in FIG. 4B. The patterns 35 are separated from each other to form a plurality of patterned metal foils 300 that are independent of each other, and each of the patterned metal foils 300 includes the first elastic cantilever 310, the second elastic cantilever 320, and the line pattern 330 described above. In this embodiment, the metal foil 30 is removed except for the first elastic cantilever 310 and the second elastic cantilever 320. The method of the portion other than the line pattern 330 includes etching.

Next, referring to FIG. 3 and FIG. 4D, the first insulating paste 500 and the second insulating paste 600 are respectively pressed onto the first surface 210 and the second surface 220 of the substrate 200 to serve as a stand-off. ) layer use. In the present embodiment, the material of the first insulating paste 500 and the second insulating paste 600 is, for example, polyimide (PI). The first insulating adhesive 500 and the second insulating adhesive 600 each have a second through hole 510, 610 corresponding to the first through hole 230, so that each first elastic cantilever 310 passes through the corresponding second through hole as shown in FIG. 4D. 510, 610 extends and is bent away from the first surface 210, and the first elastic cantilever 310 includes a first free end 312 that protrudes from the surface of the first insulating paste 500. Symmetrically, each of the second elastic cantilevers 320 extends through the corresponding second through holes 510, 610 and the corresponding first through holes 230 as shown in FIG. 4D, and is bent away from the second surface 220, and is bent. The second resilient cantilever 320 includes a second free end 322 that protrudes from the surface of the second insulating paste 600.

Thereafter, the substrate 200, the first insulating paste 500, and the second insulating paste 600 are further diced to singulate, thereby completing the fabrication of the plurality of connectors 20. The connector 20 is formed by the above steps, and the patterned metal foil 300 can be electrically connected to the external components of the first surface 210 and the second surface 220 of the substrate 200 through the first elastic cantilever 310 and the second elastic cantilever 320, respectively. connection.

In summary, the present invention places the patterned metal foil on a substrate having a through hole. The patterned metal foil includes a first elastic cantilever, a second elastic cantilever, and a line pattern, and the circuit pattern connects the first elastic cantilever and the second elastic cantilever and is disposed around the through hole, and the first elastic cantilever and the second elastic cantilever respectively Moving away from the substrate The direction of the lower surface extends. In this way, the present invention does not need to use the conventional circuit board substrate, but directly adheres the patterned metal foil to the substrate with the through hole, so that the patterned metal foil can pass through the first elastic cantilever and the second elastic cantilever respectively. Electrically connected to external components located on the upper and lower surfaces of the substrate. Therefore, the creation can eliminate the complicated connector process such as chemical plating, plating through hole, plating forming circuit layer, surface treatment, etc., thereby improving production efficiency and saving production cost. In addition, since the connector of the present invention has a small number of layers, the overall thickness of the connector can be reduced, thereby shortening the conduction path of the current. Therefore, this creation can improve the current carrying capacity of the connector.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and any person having ordinary knowledge in the art can make some changes and refinements without departing from the spirit and scope of the present invention. The scope of protection of this creation is subject to the definition of the scope of the patent application.

20‧‧‧Connector

200‧‧‧Substrate

210‧‧‧ first surface

220‧‧‧ second surface

700‧‧‧Adhesive layer

400‧‧‧ gold layer

230‧‧‧ first through hole

300‧‧‧ patterned metal foil

310‧‧‧First elastic cantilever

312‧‧‧The first free end

320‧‧‧Second elastic cantilever

322‧‧‧Second free end

330‧‧‧ line pattern

500‧‧‧First insulating glue

510, 610‧‧‧ second through hole

600‧‧‧Second insulation adhesive

Claims (6)

A connector includes: a substrate having a first surface, a second surface opposite the first surface, and at least one first through hole, the first through hole penetrating the first surface and the second surface; At least one patterned metal foil is disposed on the first surface, the patterned metal foil includes a first elastic cantilever, a second elastic cantilever, and a line pattern connecting the first elastic cantilever and the second An elastic cantilever is disposed around the first through hole, the first elastic cantilever extends away from the first surface, and the second elastic cantilever extends through the first through hole away from the second surface . The connector of claim 1, wherein the first elastic cantilever, the second elastic cantilever, and the line pattern are integrally formed. The connector of claim 1 or 2 further comprising a gold layer covering or partially covering the surface of the patterned metal foil. The connector of claim 1, 2 or 3, further comprising a first insulating glue and a second insulating glue respectively disposed on the first surface and the second surface, wherein the first insulation The rubber and the second insulating rubber each have at least one second through hole corresponding to the at least one first through hole, and the first elastic cantilever passes through the second through hole of the first insulating rubber and faces away from the first surface The direction of the second elastic cantilever extends through the second through hole of the second insulating glue and the first through hole of the substrate toward a direction away from the second surface. The connector of claim 4, wherein the first elastic suspension The arm includes a first free end protruding from the surface of the first insulating adhesive, the second elastic cantilever including a second free end protruding from the second insulating adhesive surface. The connector of claim 1, further comprising an adhesive layer disposed on the substrate and connected between the substrate and the patterned metal foil.