TWI475758B - Connector and manufacturing method thereof - Google Patents

Description

Connector and manufacturing method thereof

The present invention relates to a connector and a method of manufacturing the same, and more particularly to a connector that is less expensive to manufacture and a method of manufacturing the same.

Generally, an electronic device is usually provided with a connector and has a connection hole exposing the connector, so that an external route such as a mesh route or a sound source line can be inserted into the connection hole. Electrically connected to the connector.

1A is a cross-sectional view of a conventional connector, and FIG. 1B is a bottom view of the connector of FIG. 1A. Referring to FIG. 1A , a conventional connector 100 has a substrate 110 , a first conductive layer 120 , a plurality of connection terminals 130 , a second conductive layer 140 , a gold layer 150 , and a plurality of solder balls 160 . The substrate 110 has a first surface 112 , a second surface 114 , and a plurality of through holes 116 penetrating the first surface 112 and the second surface 114 . The first conductive layer 120 covers the inner wall 116a of the through hole 116 and a portion of the first surface 112 and the second surface 114 adjacent to the through hole 116. The connection terminal 130 is disposed around the through hole 116. The second conductive layer 140 covers the connection terminal 130 and the first conductive layer 120 to electrically connect the connection terminal 130 to the first conductive layer 120 .

In the prior art, since the portion of the second conductive layer 140 located in the through hole 116 is easily affected by the subsequent process so that the electrical reliability is lowered, the conventional gold layer 150 not only covers the connection terminal 130 but also A portion of the second conductive layer 140 that is located in the through hole 116 is covered. Moreover, in order to ensure that the gold layer 150 completely covers the portion of the second conductive layer 140 located in the through hole 116, the gold layer 150 formed by the prior art is located on the second surface 114 from the through hole 116 to the second conductive layer 140. The portion extends to form a gold ring G on the second surface 114. The solder balls 160 are located on the second surface 114, and the solder balls 160 are connected to portions of the second conductive layer 140 that are not covered by the gold ring G.

Since the gold layer 150 formed by the prior art needs to completely cover the portion of the second conductive layer 140 located in the through hole 116, the amount of gold is relatively high, and the price of gold is relatively expensive. Therefore, the fabrication of the conventional connector is made. The cost is high.

In addition, in the prior art, in order to increase the wiring density, the formation positions of the gold ring G and the solder balls 160 are usually very close to reduce the wiring area occupied by the solder balls 160. Therefore, when the solder balls 160 are formed, the solder easily contacts the gold rings G. . However, when the solder comes into contact with the gold ring G, there is a phenomenon of solder wicking, so that the solder balls 160 shrink or disappear. In addition, in order to avoid contact with the gold ring G, the solder ball 160 needs to be disposed offset from the gold ring G. Therefore, the pitch between the solder balls 160 cannot be lowered.

The invention provides a method for manufacturing a connector, which can effectively reduce the manufacturing cost and avoid the phenomenon of solder climbing.

The present invention provides a connector that is relatively inexpensive to manufacture.

The present invention provides a method of fabricating a connector as follows. A substrate is provided, the substrate having a first surface, a second surface and at least a uniform aperture, the through hole penetrating the first surface and the second surface. A first conductive layer is formed on the substrate, and the first conductive layer covers the inner wall of the through hole. A plug material is filled in the through hole to form a plug post, and a portion of the first conductive layer is between the plug post and the substrate. Forming at least one conductive elastic cantilever on the first surface, and electrically connecting the conductive elastic cantilever to the first conductive layer, the conductive elastic cantilever has a fixed end portion, a free end portion and a fixed end portion and a free end portion A bent portion, the fixed end portion is connected to the substrate and located at the periphery of the through hole, and the bent portion is bent from the fixed end portion in a direction away from the substrate. A gold layer is formed on the conductive elastic cantilever and a portion of the first surface. Forming at least one solder ball on the second surface, the solder ball being electrically connected to the first conductive layer.

In an embodiment of the invention, the method of fabricating the connector further includes grinding a portion of the plug post protruding from the through hole after forming the plug post.

In an embodiment of the invention, a method of forming a first conductive layer includes performing a full-plate plating process to form a conductive material layer, the conductive material layer completely covering the substrate, and patterning the conductive material after forming the plug post A portion of the layer on the first surface and the second surface.

In one embodiment of the present invention, a method of forming a conductive elastic cantilever includes providing a glue layer and an elastic conductive sheet, wherein the glue layer is between the substrate and the elastic conductive sheet, and the elastic conductive sheet has a conductive elastic cantilever, and the glue layer has at least An opening, and pressing the elastic conductive sheet, the adhesive layer and the substrate, wherein the opening of the adhesive layer exposes the plug post and the first conductive layer, and the conductive elastic cantilever is located above the opening.

In an embodiment of the invention, the method further includes forming at least one pad on the second surface before the solder ball is formed, the pad covering the first conductive layer and the plug post, wherein the solder ball is formed on the solder ball The pad is electrically connected to the first conductive layer through the pad.

In an embodiment of the invention, the method for electrically connecting the conductive elastic cantilever to the first conductive layer comprises: forming a second conductive layer on the conductive elastic cantilever and the first surface, and electrically connecting the second conductive layer to the conductive elastic The cantilever is coupled to the first conductive layer.

In an embodiment of the invention, a method of forming a second conductive layer includes performing a full-plate plating process to form a conductive material layer, the conductive material layer covering the conductive elastic cantilever and the first surface, and the patterned conductive material layer The portion on the first surface.

In one embodiment of the invention, the free end and the solder balls are both on a vertical line perpendicular to the first surface.

In one embodiment of the invention, the plug post is on a vertical line.

In one embodiment of the invention, the plug post is located on one side of the vertical line.

The invention provides a connector comprising a circuit board, at least one electrically conductive elastic cantilever, a gold layer and at least one solder ball. The circuit board includes a substrate, a first conductive layer and a plug post. The substrate has a first surface, a second surface and at least a uniform hole. The through hole penetrates the first surface and the second surface, and the first conductive layer The inner wall of the through hole is disposed on the substrate, the plug hole is filled in the through hole, and a part of the first conductive layer is located between the plug post and the substrate. The conductive elastic cantilever is located on the first surface and electrically connected to the first conductive layer. The conductive elastic cantilever has a fixed end portion, a free end portion and a bent portion connected between the fixed end portion and the free end portion. The fixed end portion is connected to the circuit board and located at the periphery of the through hole, and the bent portion is bent from the fixed end portion in a direction away from the circuit board. The gold layer covers the electrically conductive elastic cantilever and a portion of the first surface. The solder ball is disposed on the second surface and electrically connected to the first conductive layer, wherein the free end and the solder ball are located on a vertical line perpendicular to the first surface.

In one embodiment of the invention, the free end and the solder balls are both on a vertical line perpendicular to the first surface.

In one embodiment of the invention, the plug post is on a vertical line.

In one embodiment of the invention, the plug post is located on one side of the vertical line.

In an embodiment of the invention, the first conductive layer extends from the first surface through the through hole to the second surface, and the plug post has an opposite third end and a fourth end, wherein the third end is The portion of the first conductive layer on the first surface is flush, and the fourth end is flush with the portion of the first conductive layer on the second surface.

In an embodiment of the invention, the connector further includes a glue layer connected between the circuit board and the conductive elastic cantilever.

In an embodiment of the invention, the glue layer covers the first surface and has at least one opening that exposes the plug post and the first conductive layer.

In an embodiment of the invention, the connector further includes a second conductive layer disposed on the first surface and covering the conductive elastic cantilever and the first conductive layer to electrically connect the conductive elastic cantilever to the first conductive layer .

In an embodiment of the invention, the connector further includes a pad disposed on the second surface and covering the first conductive layer and the plug post, wherein the solder ball is located on the pad and passes through the pad and the first conductive Layer electrical connection.

Based on the above, since the present invention forms a plug hole column filled in the through hole in the through hole, the plug hole column can protect the portion of the conductive layer located in the through hole in the subsequent process, so the gold layer of the present invention can be Formed only on the conductive elastic cantilever and the first surface of the substrate on which the conductive elastic cantilever is disposed, and the need to additionally be formed in the through hole and the second surface of the substrate on which the solder ball is disposed, as in the prior art. The amount of gold is reduced, thereby reducing the manufacturing cost of the connector of the present invention. Moreover, since the gold layer is not formed on the second surface of the substrate on which the solder balls are disposed, the method of fabricating the connector of the present invention can effectively avoid the solder creep phenomenon which occurs when the solder is in contact with gold.

The above described features and advantages of the present invention will be more apparent from the following description.

2A-2K are cross-sectional views showing a process of a connector according to an embodiment of the present invention. 3A is a cross-sectional view of the connector of the embodiment of the present invention, and FIG. 3B is a bottom view of the connector of FIG. 3A.

First, referring to FIG. 2A, a substrate 210 is provided. The substrate 210 has a first surface 212 and a second surface 214. The substrate 210 is, for example, a double panel (the two sides of the single dielectric layer respectively have a conductive layer). Sheet), a single panel (single mask of a single dielectric layer with a conductive layer of sheet), a single dielectric layer or a multilayer board (multiple layers of dielectric layers and multiple layers of conductive layers alternately stacked).

In this embodiment, the substrate 210 is a double-sided panel. The substrate 210 includes a dielectric layer I and two conductive layers C1 and C2. The dielectric layer I has the first surface 212 and the second surface 214, and the two conductive layers. C1 and C2 are located on the first surface 212 and the second surface 214, respectively.

Next, referring to FIG. 2B, a drilling process is performed on the substrate 210 to form a plurality of through holes 216, wherein the through holes 216 pass through the conductive layers C1 and C2 and penetrate the first surface 212 and the second surface 214.

Then, referring to FIG. 2C, in the embodiment, a full-plate plating process can be performed on the substrate 210 to form a conductive material layer 220a, and the conductive material layer 220a completely covers the substrate 210. In detail, the conductive material layer 220a covers the first surface 212, the second surface 214 of the substrate 210, and the inner wall 216a of the through hole 216.

Thereafter, referring to FIG. 2D, a plug material is filled in the through hole 216 to form a plug post 230. The plug post 230 is made of a plug ink or other suitable plug material. The plug post 230 has a third end 232 and a fourth end 234 opposite to each other. A portion of the conductive material layer 220a is between the plug post 230 and the substrate 210.

Then, referring to FIG. 2E, in the embodiment, the portion of the plug post 230 protruding from the through hole 216 (ie, the third end portion 232 and the fourth end portion 234) may be selectively polished to make the third End portion 232 is flush with a portion of conductive material layer 220a that is on first surface 212, and fourth end portion 234 is flush with a portion of conductive material layer 220a that is on second surface 214.

Next, referring to FIG. 2F, the portion of the conductive material layer 220a on the first surface 212 and the conductive layer C1 are patterned to form a patterned conductive material layer 220b and a patterned conductive layer C3.

Then, referring to FIG. 2G, a plurality of conductive elastic cantilevers 240 are formed on the first surface 212. The conductive elastic cantilever 240 has a fixed end portion 242, a free end portion 244, and a fixed end portion 242 and a free end portion 244. A bent portion 246, the fixed end portion 242 is connected to the substrate 210 and located at the periphery of the through hole 216, and the bent portion 246 is bent from the fixed end portion 242 in a direction away from the substrate 210.

In the present embodiment, one of the methods of forming the conductive elastic cantilever 240 is as follows, but the method of forming the conductive elastic cantilever 240 described below is merely illustrative and is not intended to limit the present invention. First, a glue layer A (for example, an insulating rubber layer) and an elastic conductive sheet F (for example, a patterned copper foil) are provided, wherein the glue layer A is located between the substrate 210 and the elastic conductive sheet F, and the elastic conductive sheet F has a plurality of electrically conductive elastic cantilevers 240, and the adhesive layer A has a plurality of openings O. Then, the elastic conductive sheet F, the adhesive layer A and the substrate 210 are pressed together, so that the elastic conductive sheet F is fixed on the substrate 210 via the adhesive layer A, wherein each opening O of the adhesive layer A exposes the corresponding plug post 230 and the pattern. The conductive material layer 220b is formed, and each of the conductive elastic cantilevers 240 is located above the corresponding opening O.

Then, referring to FIG. 2H, in the embodiment, a conductive material layer 250a is formed on the conductive elastic cantilever 240 and the first surface 212, and the conductive material layer 250a is electrically connected to the conductive elastic cantilever 240 and the patterned conductive material. Layer 220b. In detail, the conductive material layer 250a of the present embodiment includes a copper layer 252a and a nickel layer 254a, and the conductive material layer 250a is formed by first forming a copper layer 252a on the conductive elastic cantilever 240 and the first surface 212. Thereafter, a nickel layer 254a is formed entirely on the copper layer 252a. In the present embodiment, when the conductive material layer 250a is formed, a conductive material layer 260a that completely covers the second surface 214 may be simultaneously formed. The conductive material layer 260a of the present embodiment includes a copper layer 262a and a nickel layer 264a, and the conductive material layer 260a is formed by first forming a copper layer 262a on the second surface 214, and then forming the copper layer 262a on the copper layer 262a. Nickel layer 264a.

Next, referring to FIG. 2I, a gold layer 270 is formed on the conductive elastic cantilever 240 and a portion of the first surface 212. In this embodiment, the method of forming the gold layer 270 is, for example, first forming a plating mask (not shown) on the conductive material layer 250a. The plating mask is, for example, a patterned photoresist, and the plating mask exposes the conductive layer. The region of the material layer 250a is intended to form a gold layer, after which an electroplating process is performed using the aforementioned plating mask as a mask to form a gold layer 270, and then the plating mask is removed.

Then, referring to FIG. 2J, a portion of the conductive material layer 250a on the first surface 212 is patterned to form a second conductive layer 250. In this embodiment, when the conductive material layer 250a is patterned, a portion of the conductive material layer 260a and the patterned conductive material layer 220b on the second surface 214 and the conductive layer C2 may be simultaneously patterned to form a pattern. a plurality of pads 260, a first conductive layer 220, and a patterned conductive layer C4, wherein the first conductive layer 220 extends from the first surface 212 through the inner wall 216a of the through hole 216 to the second surface 214, each pad 260 is located on first conductive layer 220 and covers fourth end 234 of corresponding plug post 230.

Then, a solder ball 280 is formed on each of the pads 260, and the solder balls 280 are electrically connected to the first conductive layer 220 through the pads 260. At this time, the connector 200 of this embodiment has been initially completed. In the present embodiment, in the ideal state, both the free end portion 244 and the solder ball 280 may be located on a vertical line L perpendicular to the first surface 212, but actually still allow an error of about 0.2 mm to exist at the free end. Portion 244 or solder ball 280 is between the vertical line L. Further, the plug post 230 is located on one side of the vertical line L, in other words, the plug post 230 is not located on the vertical line L.

It should be noted that since the plug hole 230 filled in the through hole 216 is formed in the through hole 216 in this embodiment, the plug post 230 can protect the first conductive layer 220 in the through hole 216 in a subsequent process. The part in it. As such, the gold layer 270 of the present embodiment can be formed only on the conductive elastic cantilever 240 and a portion of the first surface 212 without the need for additional formation in the through hole 116 and the second surface 114 as in the prior art. (As shown in FIG. 1A), the amount of gold can be reduced, thereby reducing the manufacturing cost of the connector of the embodiment. Furthermore, since the gold layer 270 is not formed on the second surface 214 on which the solder balls 280 are disposed, the method of fabricating the connector of the present embodiment can effectively avoid the solder creep generated when the solder is in contact with the gold. The more the phenomenon.

The structural portion of the connector 200 in Fig. 2K will be described in detail below.

Referring to FIG. 2K, the connector 200 of the embodiment includes a circuit board B, a plurality of conductive elastic cantilevers 240, a gold layer 270, and a plurality of solder balls 280. The circuit board B includes a substrate 210, a first conductive layer 220 and a plug post 230. The substrate 210 has a first surface 212, a second surface 214, a plurality of through holes 216, and a dielectric layer I. The second patterned conductive layer C3, C4, wherein the dielectric layer I has the first surface 212 and the second surface 214, and the patterned conductive layers C3, C4 are respectively disposed on the first surface 212 and the second surface of the dielectric layer I. At 214, the through holes 216 pass through the conductive layers C1 and C2 and penetrate the first surface 212 and the second surface 214.

The first conductive layer 220 is disposed on the substrate 210 and covers the inner wall 216a of the through hole 216. In detail, in the present embodiment, the first conductive layer 220 extends from the first surface 212 through the through hole 216 to the second surface 214. The plug post 230 is filled in the through hole 216, and a portion of the first conductive layer 220 is located between the plug post 230 and the substrate 210. In addition, the plug post 230 can have a third end 232 and a fourth end 234 opposite to each other, and the third end 232 is flush with a portion of the first conductive layer 220 on the first surface 212, fourth End 234 is flush with a portion of first conductive layer 220 that is on second surface 214.

The conductive elastic cantilever 240 is located on the first surface 212 and electrically connected to the first conductive layer 220. The conductive elastic cantilever 240 has a fixed end portion 242, a free end portion 244 and a bent portion 246 connected between the fixed end portion 242 and the free end portion 244. The fixed end portion 242 is connected to the circuit board B and located in the through hole. Around the 216, the bent portion 246 is bent from the fixed end portion 242 in a direction away from the wiring board B. The gold layer 270 covers the conductive elastic cantilever 240 and the second conductive layer 250.

In detail, in the embodiment, the fixed end portion 242 can be connected to the circuit board B via a glue layer A disposed on the first surface 212, wherein the glue layer A has a plurality of openings O, and the openings O are exposed. Corresponding plug post 230 and a portion of first conductive layer 220. In addition, the conductive elastic cantilever 240 is electrically connected to the first conductive layer 220 via a second conductive layer 250 covering the conductive elastic cantilever 240 and the first conductive layer 220, for example. The second conductive layer 250 of the present embodiment includes a copper layer 252 and a nickel layer 254, wherein the copper layer 252 covers the conductive elastic cantilever 240 and the first conductive layer 220, and the nickel layer 254 covers the copper layer 252, and the gold layer 270 covers Nickel layer 254.

In this embodiment, a plurality of pads 260 may be disposed on the second surface 214 , and each of the pads 260 covers the corresponding plug post 230 and the first conductive layer 220 . In detail, the pad 260 includes a copper layer 262 and a nickel layer 264, wherein the copper layer 262 covers the plug post 230 and the first conductive layer 220, and the nickel layer 264 covers the copper layer 262.

The solder ball 280 is located on the pad 260 and electrically connected to the first conductive layer 220 through the pad 260. In the present embodiment, in the ideal state, both the free end portion 244 and the solder ball 280 may be located on a vertical line L perpendicular to the first surface 212, but actually still allow an error of about 0.2 mm to exist at the free end. Portion 244 or solder ball 280 is between the vertical line L. Further, the plug post 230 is located, for example, on one side of the vertical line L, in other words, the plug post 230 is not located on the vertical line L.

In addition, referring to FIG. 3A and FIG. 3B, in the embodiment, the plug post 230 can be located on the vertical line L. The structure of the connector 300 of the present embodiment is similar to that of the connector 200 of FIG. 2K. The difference between the two is that the free end portion 244 of the conductive elastic cantilever 240 of the present embodiment and the solder ball 280 are respectively located in the through hole 216. Just above and below.

In detail, since the plug post 230 of the embodiment is filled in the through hole 216 , the pad 260 can cover the plug post 230 and the solder ball 280 can be disposed directly below the through hole 216 . In this way, the area of each of the pads 260 can be reduced, and the spacing between the solder balls 280 can only be considered in consideration of the configuration of the conductive elastic cantilever 240, thereby helping to reduce the spacing between the solder balls 280.

In summary, since the present invention forms a plug hole column filled in the through hole in the through hole, the plug hole column can protect the portion of the conductive layer located in the through hole in the subsequent process, so the gold of the present invention The layer may be formed only on the conductive elastic cantilever and the first surface of the substrate on which the conductive elastic cantilever is disposed, without the need to additionally form in the through hole and the second surface of the substrate on which the solder ball is disposed, as in the prior art. Further, the amount of gold can be reduced, thereby reducing the manufacturing cost of the connector of the present invention. Furthermore, since the gold layer of the present invention is not formed on the second surface of the substrate on which the solder balls are disposed, the method of fabricating the connector of the present invention can effectively avoid the solder generated when the solder is in contact with gold. Climb the phenomenon.

In addition, since the plug post of the present invention fills the through hole of the substrate, the pad can cover the plug post and the solder ball can be disposed directly under the through hole, so that the area of each pad can be reduced, and the solder ball The spacing between the conductive elastic cantilever is only considered, which helps to reduce the spacing between the solder balls.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the invention, and any one of ordinary skill in the art can make some modifications and refinements without departing from the spirit and scope of the invention. The scope of the invention is defined by the scope of the appended claims.

100, 200, 300‧‧‧ connectors

110, 210‧‧‧ substrate

112, 212‧‧‧ first surface

114, 214‧‧‧ second surface

116, 216‧‧‧through holes

116a, 216a‧‧‧ inner wall

120, 220‧‧‧ first conductive layer

130‧‧‧Connecting terminal

140, 250‧‧‧ second conductive layer

150, 270‧‧ ‧ gold layer

160, 280‧‧‧ solder balls

220a, 250a‧‧‧ conductive material layer

220b‧‧‧ patterned conductive material layer

230‧‧‧ plug hole

232‧‧‧ third end

234‧‧‧fourth end

240‧‧‧Electrically conductive cantilever

242‧‧‧Fixed end

244‧‧‧Free end

246‧‧‧Bends

250a, 260a‧‧‧layer of conductive material

252, 252a, 262, 262a‧‧‧ copper layer

254, 254a, 264, 264a‧‧‧ nickel layer

260‧‧‧ pads

A‧‧‧ glue layer

B‧‧‧ circuit board

C1, C2‧‧‧ conductive layer

C3, C4‧‧‧ patterned conductive layer

F‧‧‧elastic conductive sheet

G‧‧‧Golden Ring

I‧‧‧ dielectric layer

L‧‧‧ vertical line

O‧‧‧ openings

1A is a cross-sectional view of a conventional connector, and FIG. 1B is a bottom view of the connector of FIG. 1A.

2A-2K are cross-sectional views showing a process of a connector according to an embodiment of the present invention.

3A is a cross-sectional view of the connector of the embodiment of the present invention, and FIG. 3B is a bottom view of the connector of FIG. 3A.

200. . . Connector

210. . . Substrate

212. . . First surface

214. . . Second surface

216. . . Through hole

216a. . . Inner wall

220. . . First conductive layer

230. . . Plug hole column

232. . . Third end

234. . . Fourth end

240. . . Conductive elastic cantilever

242. . . Fixed end

244. . . Free end

246. . . Bending section

250. . . Second conductive layer

252, 262. . . Copper layer

254, 264. . . Nickel layer

260. . . Pad

270. . . Gold layer

280. . . Solder ball

A. . . Glue layer

B. . . circuit board

C3, C4. . . Patterned conductive layer

I. . . Dielectric layer

L. . . Vertical line

O. . . Opening

Claims (9)

A method of manufacturing a connector, comprising: providing a substrate having a first surface, a second surface, and at least a uniform hole, the through hole penetrating the first surface and the second surface; forming on the substrate a first conductive layer covering the inner wall of the through hole; a plug material is filled in the through hole to form a plug post, and the first conductive layer is located at the plug post and Between the substrates, wherein the first conductive layer extends from the first surface to the second surface through the through hole, the plug post has an opposite third end and a fourth end, wherein the third end The end portion is flush with a portion of the first conductive layer on the first surface, the fourth end portion is flush with a portion of the first conductive layer on the second surface; formed on the first surface At least one conductive elastic cantilever and electrically connecting the conductive elastic cantilever to the first conductive layer, the conductive elastic cantilever having a fixed end, a free end and being connected between the fixed end and the free end a bent portion, the fixed end portion is connected to the substrate The bent portion is bent from the fixed end portion away from the substrate, and the method for forming the conductive elastic cantilever comprises: providing an insulating rubber layer and an elastic conductive sheet, wherein the insulating layer Between the substrate and the elastic conductive sheet, the elastic conductive sheet has the conductive elastic cantilever, the insulating rubber layer has at least one opening; and the elastic conductive sheet, the insulating rubber layer and the substrate are pressed, wherein the insulating rubber The opening of the layer exposes the plug post and the first conductive layer, and the conductive elastic cantilever is located above the opening; forming a first surface on the conductive elastic cantilever and a portion of the first surface a gold layer; and forming at least one solder ball on the second surface, the solder ball being electrically connected to the first conductive layer. The method of fabricating the connector of claim 1, wherein the method of forming the first conductive layer comprises: performing a full-plate electroplating process to form a conductive material layer, the conductive material layer covering the substrate; And after forming the plug post, patterning the portion of the conductive material layer on the first surface and the second surface. The method of manufacturing the connector of claim 1, further comprising: forming at least one pad on the second surface before forming the solder ball, the pad covering the first conductive layer and the plug a hole column, wherein the solder ball is formed on the pad and electrically connected to the first conductive layer through the pad. The method of manufacturing the connector of claim 1, wherein the method of electrically connecting the conductive elastic cantilever to the first conductive layer comprises: forming a second on the conductive elastic cantilever and the first surface a conductive layer, and the second conductive layer is electrically connected to the conductive elastic cantilever and the first conductive layer. The method of manufacturing the connector of claim 1, wherein the free end portion and the solder ball are located on a vertical line perpendicular to the first surface. A connector comprising a circuit board, at least one conductive elastic cantilever, an insulating adhesive layer, a gold layer and at least one solder ball, wherein the circuit board comprises a substrate, a first conductive layer and a plug post, wherein , The substrate has a first surface, a second surface and at least a uniform hole, the through hole penetrating the first surface and the second surface; the first conductive layer is disposed on the substrate and covers the through hole An inner wall; the plug hole is filled in the through hole, a portion of the first conductive layer is located between the plug post and the substrate, wherein the first conductive layer extends from the first surface through the through hole to the first a second surface, the plug post has an opposite third end and a fourth end, wherein the third end is flush with a portion of the first conductive layer on the first surface, the fourth end The portion is flush with a portion of the first conductive layer on the second surface; the at least one conductive elastic cantilever is located on the first surface and electrically connected to the first conductive layer, the conductive elastic cantilever has a fixed An end portion, a free end portion and a bent portion connected between the fixed end portion and the free end portion, the fixed end portion being connected to the circuit board and located at a periphery of the through hole, the bent portion being fixed from the fixed portion The end is bent away from the circuit board; the insulating layer is connected to the Between the circuit board and the conductive resilient cantilever; the gold layer covers the electrically conductive elastic cantilever and the first surface portion; and at least one solder ball disposed on the second surface and connected to the first electrically conductive layer. The connector of claim 6, wherein the free end and the solder ball are located on a vertical line perpendicular to the first surface. The connector of claim 7, wherein the plug post is located on the vertical line. The connector of claim 7, wherein the plug post is located on one side of the vertical line.