TWM456071U - 藉流體噴流導熱之電能裝備均溫系統 - Google Patents

藉流體噴流導熱之電能裝備均溫系統 Download PDF

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Publication number
TWM456071U
TWM456071U TW101202319U TW101202319U TWM456071U TW M456071 U TWM456071 U TW M456071U TW 101202319 U TW101202319 U TW 101202319U TW 101202319 U TW101202319 U TW 101202319U TW M456071 U TWM456071 U TW M456071U
Authority
TW
Taiwan
Prior art keywords
heat transfer
fluid
transfer fluid
temperature
heat
Prior art date
Application number
TW101202319U
Other languages
English (en)
Chinese (zh)
Inventor
Tai-Her Yang
Original Assignee
Tai-Her Yang
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tai-Her Yang filed Critical Tai-Her Yang
Publication of TWM456071U publication Critical patent/TWM456071U/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20254—Cold plates transferring heat from heat source to coolant
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D20/00—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D20/00—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00
    • F28D20/0034—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00 using liquid heat storage material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H01L23/4735—Jet impingement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20345—Sprayers; Atomizers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20381—Thermal management, e.g. evaporation control
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F17—STORING OR DISTRIBUTING GASES OR LIQUIDS
    • F17C—VESSELS FOR CONTAINING OR STORING COMPRESSED, LIQUEFIED OR SOLIDIFIED GASES; FIXED-CAPACITY GAS-HOLDERS; FILLING VESSELS WITH, OR DISCHARGING FROM VESSELS, COMPRESSED, LIQUEFIED, OR SOLIDIFIED GASES
    • F17C2227/00—Transfer of fluids, i.e. method or means for transferring the fluid; Heat exchange with the fluid
    • F17C2227/03—Heat exchange with the fluid
    • F17C2227/0367—Localisation of heat exchange
    • F17C2227/0388—Localisation of heat exchange separate
    • F17C2227/0395—Localisation of heat exchange separate using a submerged heat exchanger
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/14—Thermal energy storage

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Sustainable Development (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Wind Motors (AREA)
  • Control Of Temperature (AREA)
  • Heat-Pump Type And Storage Water Heaters (AREA)
  • Inverter Devices (AREA)
TW101202319U 2011-02-11 2012-02-09 藉流體噴流導熱之電能裝備均溫系統 TWM456071U (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US13/025,337 US10051762B2 (en) 2011-02-11 2011-02-11 Temperature equalization apparatus jetting fluid for thermal conduction used in electrical equipment

Publications (1)

Publication Number Publication Date
TWM456071U true TWM456071U (zh) 2013-06-21

Family

ID=45581775

Family Applications (2)

Application Number Title Priority Date Filing Date
TW101202319U TWM456071U (zh) 2011-02-11 2012-02-09 藉流體噴流導熱之電能裝備均溫系統
TW101104145A TWI678509B (zh) 2011-02-11 2012-02-09 藉流體噴流導熱之電能裝備均溫系統

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW101104145A TWI678509B (zh) 2011-02-11 2012-02-09 藉流體噴流導熱之電能裝備均溫系統

Country Status (7)

Country Link
US (2) US10051762B2 (pt)
EP (1) EP2488006B1 (pt)
CN (2) CN102638956B (pt)
AU (1) AU2012200801A1 (pt)
BR (1) BR102012003095B1 (pt)
ES (1) ES2806028T3 (pt)
TW (2) TWM456071U (pt)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI795873B (zh) * 2021-02-17 2023-03-11 建準電機工業股份有限公司 整合式冷卻模組及具有該整合式冷卻模組的電子裝置

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10051762B2 (en) * 2011-02-11 2018-08-14 Tai-Her Yang Temperature equalization apparatus jetting fluid for thermal conduction used in electrical equipment
US9897400B2 (en) * 2013-10-29 2018-02-20 Tai-Her Yang Temperature control system having adjacently-installed temperature equalizer and heat transfer fluid and application device thereof
US10634397B2 (en) * 2015-09-17 2020-04-28 Purdue Research Foundation Devices, systems, and methods for the rapid transient cooling of pulsed heat sources
US10386091B2 (en) * 2016-01-29 2019-08-20 Robert S. Carter Water evaporative cooled refrigerant condensing radiator upgrade
DE112017005525T5 (de) 2016-11-01 2019-08-08 Massachusetts Institute Of Technology Wärmemanagement von HF-Vorrichtungen unter Verwendung eingebetteter Mikrojet-Anordnungen
DE112018003730T5 (de) 2017-07-21 2020-04-16 Massachusetts Institute Of Technology Modulare Mikrojet-Kühlung von gepackten elektronischen Komponenten
CN107414241A (zh) * 2017-07-31 2017-12-01 安徽华众焊业有限公司 一种钎焊用喷淋装置

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CA2053055C (en) * 1990-10-11 1997-02-25 Tsukasa Mizuno Liquid cooling system for lsi packages
US5924482A (en) * 1997-10-29 1999-07-20 Motorola, Inc. Multi-mode, two-phase cooling module
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US20050284607A1 (en) * 2002-06-27 2005-12-29 Eastman Kodak Company Cooling-assisted, heat-generating electrical component and method of manufacturing same
US6857283B2 (en) * 2002-09-13 2005-02-22 Isothermal Systems Research, Inc. Semiconductor burn-in thermal management system
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CN1532923A (zh) * 2003-03-20 2004-09-29 诺亚公司 喷射导热的方法与装置
US7043933B1 (en) * 2003-08-26 2006-05-16 Isothermal Systems Research, Inc. Spray coolant reservoir system
US7549298B2 (en) * 2004-12-04 2009-06-23 Hewlett-Packard Development Company, L.P. Spray cooling with spray deflection
TWI279256B (en) * 2005-12-13 2007-04-21 Ind Tech Res Inst A compact spray cooling module
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US8100172B2 (en) * 2006-05-26 2012-01-24 Tai-Her Yang Installation adapted with temperature equalization system
JP4464940B2 (ja) * 2006-07-11 2010-05-19 トヨタ自動車株式会社 冷却装置およびそれを備える車両
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI795873B (zh) * 2021-02-17 2023-03-11 建準電機工業股份有限公司 整合式冷卻模組及具有該整合式冷卻模組的電子裝置

Also Published As

Publication number Publication date
US20140202658A1 (en) 2014-07-24
CN102638956B (zh) 2017-07-07
EP2488006A2 (en) 2012-08-15
TW201303251A (zh) 2013-01-16
BR102012003095B1 (pt) 2021-09-21
ES2806028T3 (es) 2021-02-16
EP2488006B1 (en) 2020-06-10
US10051762B2 (en) 2018-08-14
BR102012003095A8 (pt) 2021-04-06
CN102638956A (zh) 2012-08-15
US20120205071A1 (en) 2012-08-16
BR102012003095A2 (pt) 2016-06-14
CN202514228U (zh) 2012-10-31
EP2488006A3 (en) 2017-04-19
AU2012200801A1 (en) 2012-08-30
TWI678509B (zh) 2019-12-01

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