BR102012003095A8 - aparelho de igualação de temperatura que esguicha fluido para condução térmica utilizado em equipamento elétrico - Google Patents

aparelho de igualação de temperatura que esguicha fluido para condução térmica utilizado em equipamento elétrico

Info

Publication number
BR102012003095A8
BR102012003095A8 BR102012003095A BR102012003095A BR102012003095A8 BR 102012003095 A8 BR102012003095 A8 BR 102012003095A8 BR 102012003095 A BR102012003095 A BR 102012003095A BR 102012003095 A BR102012003095 A BR 102012003095A BR 102012003095 A8 BR102012003095 A8 BR 102012003095A8
Authority
BR
Brazil
Prior art keywords
fluid
electrical equipment
thermal conduction
squirts
temperature
Prior art date
Application number
BR102012003095A
Other languages
English (en)
Other versions
BR102012003095B1 (pt
BR102012003095A2 (pt
Inventor
Yang Tai-Her
Original Assignee
Yang Tai Her
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yang Tai Her filed Critical Yang Tai Her
Publication of BR102012003095A2 publication Critical patent/BR102012003095A2/pt
Publication of BR102012003095A8 publication Critical patent/BR102012003095A8/pt
Publication of BR102012003095B1 publication Critical patent/BR102012003095B1/pt

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20254—Cold plates transferring heat from heat source to coolant
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H01L23/4735—Jet impingement
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D20/00—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D20/00—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00
    • F28D20/0034—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00 using liquid heat storage material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20345—Sprayers; Atomizers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20381—Thermal management, e.g. evaporation control
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F17—STORING OR DISTRIBUTING GASES OR LIQUIDS
    • F17C—VESSELS FOR CONTAINING OR STORING COMPRESSED, LIQUEFIED OR SOLIDIFIED GASES; FIXED-CAPACITY GAS-HOLDERS; FILLING VESSELS WITH, OR DISCHARGING FROM VESSELS, COMPRESSED, LIQUEFIED, OR SOLIDIFIED GASES
    • F17C2227/00—Transfer of fluids, i.e. method or means for transferring the fluid; Heat exchange with the fluid
    • F17C2227/03—Heat exchange with the fluid
    • F17C2227/0367—Localisation of heat exchange
    • F17C2227/0388—Localisation of heat exchange separate
    • F17C2227/0395—Localisation of heat exchange separate using a submerged heat exchanger
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/14—Thermal energy storage

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Wind Motors (AREA)
  • Inverter Devices (AREA)
  • Heat-Pump Type And Storage Water Heaters (AREA)
  • Control Of Temperature (AREA)

Abstract

aparelho de igualação de temperatura, que esguicha fluido para condução térmica utilizado em equipamento elétrico a presente invenção revela uma estrutura de interface de condução térmica externa de equipamento elétrico em que um dispositivo que esguicha fluido é utilizado para esguichar um fluido condutor térmico para permutar calor com a estrutura de interface de condução térmica externa de equipamento elétrico através da energia térmica do fluido condutor térmico esguichado, o meio de permuta de calor inclui a estrutura de interface de condução térmica externa de equipamento elétrico tendo temperatura elevada relativa sendo resfriado por um fluido com temperatura mais baixa relativa, e estrutura de interface de condução térmica externa de equipamento elétrico tendo temperatura mais baixa relativa sendo aquecido por um fluido tendo temperatura mais elevada relativa.
BR102012003095-0A 2011-02-11 2012-02-10 Aparelho de igualação de temperatura que esguicha fluido para condução térmica utilizado em equipamento elétrico BR102012003095B1 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/025,337 2011-02-11
US13/025,337 US10051762B2 (en) 2011-02-11 2011-02-11 Temperature equalization apparatus jetting fluid for thermal conduction used in electrical equipment

Publications (3)

Publication Number Publication Date
BR102012003095A2 BR102012003095A2 (pt) 2016-06-14
BR102012003095A8 true BR102012003095A8 (pt) 2021-04-06
BR102012003095B1 BR102012003095B1 (pt) 2021-09-21

Family

ID=45581775

Family Applications (1)

Application Number Title Priority Date Filing Date
BR102012003095-0A BR102012003095B1 (pt) 2011-02-11 2012-02-10 Aparelho de igualação de temperatura que esguicha fluido para condução térmica utilizado em equipamento elétrico

Country Status (7)

Country Link
US (2) US10051762B2 (pt)
EP (1) EP2488006B1 (pt)
CN (2) CN102638956B (pt)
AU (1) AU2012200801A1 (pt)
BR (1) BR102012003095B1 (pt)
ES (1) ES2806028T3 (pt)
TW (2) TWM456071U (pt)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10051762B2 (en) * 2011-02-11 2018-08-14 Tai-Her Yang Temperature equalization apparatus jetting fluid for thermal conduction used in electrical equipment
US9897400B2 (en) * 2013-10-29 2018-02-20 Tai-Her Yang Temperature control system having adjacently-installed temperature equalizer and heat transfer fluid and application device thereof
US10634397B2 (en) * 2015-09-17 2020-04-28 Purdue Research Foundation Devices, systems, and methods for the rapid transient cooling of pulsed heat sources
US10386091B2 (en) * 2016-01-29 2019-08-20 Robert S. Carter Water evaporative cooled refrigerant condensing radiator upgrade
WO2018085199A1 (en) 2016-11-01 2018-05-11 Massachusetts Institute Of Technology Thermal management of rf devices using embedded microjet arrays
DE112018003730T5 (de) 2017-07-21 2020-04-16 Massachusetts Institute Of Technology Modulare Mikrojet-Kühlung von gepackten elektronischen Komponenten
CN107414241A (zh) * 2017-07-31 2017-12-01 安徽华众焊业有限公司 一种钎焊用喷淋装置
CN214592558U (zh) * 2021-02-17 2021-11-02 建准电机工业股份有限公司 整合式冷却模块及具有该整合式冷却模块的电子装置

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JPH065700B2 (ja) * 1987-07-22 1994-01-19 株式会社日立製作所 電子回路デバイスの冷却装置
CA2053055C (en) * 1990-10-11 1997-02-25 Tsukasa Mizuno Liquid cooling system for lsi packages
US5924482A (en) * 1997-10-29 1999-07-20 Motorola, Inc. Multi-mode, two-phase cooling module
US7082778B2 (en) * 2001-02-22 2006-08-01 Hewlett-Packard Development Company, L.P. Self-contained spray cooling module
US20050284607A1 (en) * 2002-06-27 2005-12-29 Eastman Kodak Company Cooling-assisted, heat-generating electrical component and method of manufacturing same
US6880350B2 (en) * 2002-09-13 2005-04-19 Isothermal Systems Research, Inc. Dynamic spray system
US6857283B2 (en) * 2002-09-13 2005-02-22 Isothermal Systems Research, Inc. Semiconductor burn-in thermal management system
US6889509B1 (en) * 2002-09-13 2005-05-10 Isothermal Systems Research Inc. Coolant recovery system
CN1532923A (zh) * 2003-03-20 2004-09-29 诺亚公司 喷射导热的方法与装置
US7043933B1 (en) * 2003-08-26 2006-05-16 Isothermal Systems Research, Inc. Spray coolant reservoir system
US7549298B2 (en) * 2004-12-04 2009-06-23 Hewlett-Packard Development Company, L.P. Spray cooling with spray deflection
TWI279256B (en) * 2005-12-13 2007-04-21 Ind Tech Res Inst A compact spray cooling module
DE102006012855A1 (de) * 2006-03-21 2007-09-27 Robert Bosch Gmbh Verfahren und Dosiersystem zur Schadstoffreduktion in Kraftfahrzeugabgasen
US8100172B2 (en) * 2006-05-26 2012-01-24 Tai-Her Yang Installation adapted with temperature equalization system
JP4464940B2 (ja) * 2006-07-11 2010-05-19 トヨタ自動車株式会社 冷却装置およびそれを備える車両
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US10051762B2 (en) * 2011-02-11 2018-08-14 Tai-Her Yang Temperature equalization apparatus jetting fluid for thermal conduction used in electrical equipment

Also Published As

Publication number Publication date
CN102638956B (zh) 2017-07-07
EP2488006A2 (en) 2012-08-15
EP2488006B1 (en) 2020-06-10
EP2488006A3 (en) 2017-04-19
TWM456071U (zh) 2013-06-21
ES2806028T3 (es) 2021-02-16
US20120205071A1 (en) 2012-08-16
BR102012003095B1 (pt) 2021-09-21
TW201303251A (zh) 2013-01-16
AU2012200801A1 (en) 2012-08-30
TWI678509B (zh) 2019-12-01
CN202514228U (zh) 2012-10-31
CN102638956A (zh) 2012-08-15
US20140202658A1 (en) 2014-07-24
BR102012003095A2 (pt) 2016-06-14
US10051762B2 (en) 2018-08-14

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Legal Events

Date Code Title Description
B03A Publication of a patent application or of a certificate of addition of invention [chapter 3.1 patent gazette]
B15K Others concerning applications: alteration of classification

Ipc: F24F 13/30 (2006.01), F24V 50/00 (2018.01)

B06V Preliminary requirement: patent application procedure suspended [chapter 6.22 patent gazette]
B03H Publication of an application: rectification [chapter 3.8 patent gazette]

Free format text: REFERENTE A RPI 2371 DE 14/06/2016, QUANTO AO ITEM (30)

B09A Decision: intention to grant [chapter 9.1 patent gazette]
B16A Patent or certificate of addition of invention granted [chapter 16.1 patent gazette]

Free format text: PRAZO DE VALIDADE: 20 (VINTE) ANOS CONTADOS A PARTIR DE 10/02/2012, OBSERVADAS AS CONDICOES LEGAIS.