TWM451799U - Heat dissipation device - Google Patents

Description

Heat sink

The present invention relates to a heat sink, and more particularly to a heat sink having a remote heat dissipation effect and increasing the heat dissipation range.

With the rapid advancement of the technology industry, the functions of electronic devices are becoming more and more powerful. For example, the operation speed of electronic components such as a central processing unit (CPU), a chipset or a display unit is also increasing, resulting in an electronic component unit time. The generated heat is relatively increased; therefore, if the heat emitted by the electronic component cannot be dissipated in time, it may affect the overall operation of the electronic device or cause damage to the electronic component.
Most of the heat dissipation devices used in the industry use a heat dissipating component such as a fan, a heat sink or a heat pipe to dissipate heat, and the heat sink contacts the heat source, and then transmits heat to the remote end through the heat pipe, or the air is forcibly guided by the fan. The heat sink is forcibly dissipated, and the heat source is used as a heat conduction element as a heat conduction source for a heat source having a narrow space or a large area.
The conventional uniform temperature plate is made by correspondingly covering two sheets, and the corresponding side of the plate is provided with a sum of any one or any one of a groove and a capillary structure (such as a mesh, a sintered body). The plates are correspondingly closed to form a closed chamber, the closed chamber is in a vacuum state and filled with a working fluid therein, and in order to increase the capillary limit, a capillary structure such as a copper column coating sintering, a sintered column, a foaming column or the like is used. For supporting as a return flow, when the working fluid in the aforementioned temperature equalizing plate is heated by the evaporation zone to generate evaporation, the working fluid is converted from a liquid state to a vapor state, and the working fluid in the vapor state is converted into a condensation zone of the uniform temperature plate and then converted by vapor condensation. It is liquid, and then flows back through the copper column to the evaporation zone to continue the circulation. After the vaporous working fluid is condensed into a liquid small water droplet in the condensation zone, the working fluid can be returned to the evaporation zone due to the relationship of gravity or capillary action. Effectively achieves the same temperature and heat dissipation effect.
However, since the heat dissipation characteristics of the conventional temperature equalizing plate are only the heat dissipation effect of the heat around the electronic component attached to the temperature equalizing plate or the electronic component thereof, the heat of the electronic component cannot be conducted to the distal end for heat dissipation, so that The heat dissipation range is narrow.
As mentioned above, the conventional disadvantages have the following disadvantages:
1. There is no remote cooling effect;
2. The heat dissipation range is narrow;
3. The heat dissipation speed is poor.
Therefore, how to solve the above problems and problems in the past, that is, the creators of the case and the relevant manufacturers engaged in this industry are eager to study the direction of improvement.

Therefore, in order to effectively solve the above problems, the main purpose of the present invention is to provide a heat sink having a remote heat dissipation effect.
The second objective of this creation is to provide a heat sink that can increase the heat dissipation range.
The secondary purpose of this creation is to provide a heat sink that increases the speed of heat dissipation.
In order to achieve the above object, the present invention provides a heat dissipating device, comprising a first body, a second body and a working fluid, the first body having a first plate body and a second body opposite to the first plate body a first body, the first and second plate systems corresponding to the cover together define a first chamber, the first chamber inner wall is provided with a first capillary structure, the second body is connected to the first body, and opposite Extending in a direction of the first body, the second body has a second chamber corresponding to the first chamber, the second chamber inner wall is provided with a second capillary structure, and the working flow system is filled in the The first and second chambers are described.
Through the design of the structure of the present invention, by the structure in which the first chamber of the first body and the second chamber of the second body are correspondingly connected, when the first body is heated, the liquid working fluid is heated. And evaporating into a vapor working fluid, and then part of the vapor working fluid in the first chamber flows toward the second chamber of the second body due to the communication structure of the first and second chambers, thereby taking the vapor state The working fluid acts as a circulating flow in the first and second chambers to achieve the effect of having a remote heat dissipation; in addition, the heat dissipation range can be expanded and the heat dissipation speed can be improved.

The above object of the present invention, as well as its structural and functional features, will be described in accordance with the preferred embodiments of the drawings.
1A and 1B are a perspective view and a cross-sectional view of a first embodiment of a heat sink according to the present invention. A heat dissipating device includes a first body 1 , a second body 2 and a working fluid 3 . The first body 1 has a first plate body 10 and a second plate body 11 opposite to the first plate body 10. The first and second plates 10 and 11 are corresponding to the cover and jointly define a first chamber 101. The first capillary structure 102 is provided with a first capillary structure 102, and the first capillary structure 102 can be any one of a sintered powder body and a mesh body and a fiber body, and a foam material and a porous material. The first body 1 further has an aperture 103;
The second body 2 is connected to the first body 1 and extends in a direction opposite to the first body 1. The second body 2 has a second chamber 211 corresponding to the first chamber 101. A second capillary structure 212 is disposed on the inner wall of the second chamber 211. The second capillary structure 212 is a sintered powder body and a mesh body and a fiber body and a groove. One end of the second body 2 Further having an open end 213 (the other end is a closed end (not shown) is disposed away from the first body 1), and is correspondingly connected to the first and second plates 10, 11 and the open end The 213 extends into the first chamber 101 of the first body 1 and is correspondingly engaged with the aperture 103;
The working fluid 3 is filled in the first chamber 101 of the first body 1 and the second chamber 211 of the second body 2.
In the present embodiment, the first body 1 is described by a hot plate, and the second body 2 is illustrated by a heat pipe, but is not limited thereto;
Therefore, through the design of the heat sink of the present invention, the opening 103 of the first body 1 is correspondingly engaged with the open end 213 of the second body 2, so that the first chamber 101 and the second body of the first body 1 are The second chamber 211 of the body 2 is correspondingly connected. When the first body 1 is heated, the liquid working fluid 3 evaporates into a vapor working fluid 3 due to heat, and then, part of the steam in the first chamber 101 The working fluid 3 flows toward the second chamber 211 of the second body 2 due to the structure in which the first and second chambers 101 and 211 communicate with each other, so that a part of the vapor working fluid 3 is caused by the first The chamber 101 is brought to the second chamber 211 for heat dissipation, and the working fluid 3 forms a continuous circulating flow in the first and second chambers 101, 211, so that it has a uniform temperature effect in addition to the first body 1. The second body 2 can achieve the remote heat dissipation effect; in addition, the range can be expanded and the heat dissipation speed can be improved.
Please refer to FIG. 2 and refer to FIG. 1A , which is a perspective view of a second embodiment of the heat sink of the present invention. The corresponding relationship between some components and components of the heat sink is the same as the heat sink described above. Therefore, the main difference between the heat sink and the foregoing is that the second body 2 has an upper tube surface 21 and a lower tube surface 22, and the upper and lower tube surfaces 21 and 22 are common. Defining the second chamber 211, the second body 2 is flat, and the first chamber 101 is configured to communicate with the second chamber 211 through the first chamber 101. a portion of the vaporous working fluid 3 flows toward the second chamber 211 of the second body 2, so that the working fluid 3 forms a continuous circulating flow in the first and second chambers 101, 211, so that it has a uniform temperature effect. In addition, it has a far-end heat dissipation effect.
Please refer to FIG. 3 and FIG. 1A together, which is a cross-sectional view of a third embodiment of the heat dissipating device. The corresponding relationship between the components and the components of the heat dissipating device is the same as that of the heat dissipating device described above. Therefore, the first main body 1 further has at least one supporting structure 4, which is a copper column, a sintered powder column and an annular cylinder. Any one of the two ends of the supporting structure 4 is connected to the first and second plates 10 and 11 respectively, and through the foregoing supporting structure 4, when the second plate 11 is heated, the liquid working fluid 3 evaporates into a vapor state. After the fluid 3, the vaporous working fluid 3 will be condensed and converted into a liquid working fluid 3 after being in contact with the first plate body 10 and contacting the inner wall of the first plate body 10, and then the liquid working fluid 3 is pulled by the supporting structures 4. Return to the second plate body 11.
Please refer to FIG. 4 and FIG. 1A together, which is a cross-sectional view of a fourth embodiment of the heat dissipating device. The corresponding relationship between the components and the components of the heat dissipating device is the same as that of the heat dissipating device described above. The second main body 2 further has at least one supporting structure 4, which is a copper column, a sintered powder column and an annular column. In either case, the upper and lower tube faces 21, 22 are respectively connected to the two ends of the support structure 4.
Please refer to FIG. 5 and FIG. 1A together, which is a cross-sectional view of a fifth embodiment of the heat dissipating device. The corresponding relationship between the components and components of the heat dissipating device is the same as that of the heat dissipating device described above. The first main body 1 and the second body 2 have at least one supporting structure 4 at the same time, through the supporting structure 4, and when the second board is omitted. When the body 11 is heated, the liquid working fluid 3 evaporates into the vapor working fluid 3, is condensed in the first and second chambers 101, 211, and is converted into a liquid working fluid 3, and the liquid working fluid is transferred by the supporting structures 4. 3 Pull back the second plate body 11 and the lower tube surface 22.
Moreover, the first body 1 and the second body 2 of the present invention may be made of any of copper, aluminum, and high thermal conductivity materials.
Finally, please refer to FIGS. 6 and 7 , which are respectively a three-dimensional combination diagram of the sixth and seventh embodiments of the heat dissipation device, and the corresponding relationship between the components and components of the heat dissipation device and the aforementioned heat dissipation device. The same is true, and therefore, the main difference between the heat sink and the foregoing is that the application of the present invention can be implemented by connecting a first body 1 to a plurality of second bodies 2 or a second body 2 to be connected. The two second bodies 1 or a plurality of phase combinations of the first body 1 and the second body 2 are simultaneously connected.
As mentioned above, this creation has the following advantages over the prior art:
1. Has the effect of remote heat dissipation;
2. Large heat dissipation range;
3. Improve the heat dissipation speed.
The present invention has been described in detail above, but the above is only the preferred embodiment of the present invention, and the scope of the present invention cannot be limited. That is, all changes and modifications made in accordance with the scope of this creation application shall remain covered by the patents of this creation.

1‧‧‧ first ontology
10‧‧‧ first board
11‧‧‧Second plate
101‧‧‧ first chamber
102‧‧‧First capillary structure
103‧‧‧孔口
2‧‧‧Second ontology
21‧‧‧Upper pipe surface
22‧‧‧ Lower tube
211‧‧‧ second chamber
212‧‧‧Second capillary structure
213‧‧‧Open end
3‧‧‧Working fluid
4‧‧‧Support structure

1A is a perspective assembled view of the first embodiment of the heat sink device;
1B is a cross-sectional view of the first embodiment of the heat sink of the present invention;
Figure 2 is a perspective assembled view of the second embodiment of the heat sink device;
Figure 3 is a cross-sectional view showing a third embodiment of the heat sink of the present invention;
Figure 4 is a cross-sectional view showing a fourth embodiment of the heat sink of the present invention;
Figure 5 is a cross-sectional view showing a fifth embodiment of the heat sink of the present invention;
Figure 6 is a perspective assembled view of the sixth embodiment of the heat sink device;
Figure 7 is a perspective assembled view of the seventh embodiment of the heat sink device.

101‧‧‧ first chamber

102‧‧‧First capillary structure

103‧‧‧孔口

211‧‧‧ second chamber

212‧‧‧Second capillary structure

213‧‧‧Open end

3‧‧‧Working fluid

Claims (10)

A heat sink includes:
a first body having a first plate body and a second plate body opposite to the first plate body, the first and second plate systems corresponding to the cover and jointly defining a first chamber, the first chamber inner wall Providing a first capillary structure;
a second body having one end connected to the first body, the other end extending in a direction opposite to the first body, the second body having a second chamber corresponding to the first chamber, the first body The inner wall of the two chambers is provided with a second capillary structure; and a working fluid is filled in the first and second chambers. The heat dissipation device of claim 1, wherein the second body further has an upper tube surface and a lower tube surface, and the upper and lower tube surfaces collectively define the second chamber. The heat dissipation device of claim 2, wherein one end of the second body further has an open end corresponding to the first and second plates. The heat dissipating device of claim 3, wherein the first body further has an opening corresponding to the open end. The heat dissipation device according to claim 1, wherein the first capillary structure is a sintered powder body, a mesh body and a fiber body, and a foam material and a porous material. The heat dissipation device according to claim 1, wherein the second capillary structure is a sintered powder body and a mesh body, a fiber body and a groove. The heat dissipating device of claim 1, wherein the first body further has at least one supporting structure, wherein the supporting structure is any one of a copper column, a sintered powder column and an annular column, and the supporting structure The first and second plates are respectively connected at both ends. The heat dissipating device of claim 2, wherein the second body further has at least one supporting structure, wherein the supporting structure is any one of a copper column, a sintered powder column and an annular column. For example, please apply the heat sink according to item 1 of the patent scope, wherein the first system is a hot plate. The heat dissipation structure according to claim 1, wherein the second system is a heat pipe.