TWM449795U - Substrate conveying system - Google Patents

Substrate conveying system Download PDF

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Publication number
TWM449795U
TWM449795U TW101220212U TW101220212U TWM449795U TW M449795 U TWM449795 U TW M449795U TW 101220212 U TW101220212 U TW 101220212U TW 101220212 U TW101220212 U TW 101220212U TW M449795 U TWM449795 U TW M449795U
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Taiwan
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substrate
section
processing
height
segment
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TW101220212U
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Chinese (zh)
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qi-wen Chen
Qian-Yang Zhan
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Manz Taiwan Ltd
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Priority to TW101220212U priority Critical patent/TWM449795U/en
Publication of TWM449795U publication Critical patent/TWM449795U/en

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Description

基板輸送系統Substrate delivery system

本創作係有關於一種基板輸送系統,尤指一種可避免處理液體洩漏之基板輸送系統。This creation relates to a substrate transport system, and more particularly to a substrate transport system that avoids liquid leakage.

在例如PCB(印刷電路板)、FPD(平板顯示器)、PV(光能電池)等的現代高科技產業中,其產物結構可包括一薄片形且具有彈性之軟性基板。於PCB產業中,該軟性基板可藉由化學前處理流程、顯影/蝕刻/剝膜流程、水平除膠渣及鍍銅流程、水平棕化流程及水平化學銀流程而形成。In modern high-tech industries such as PCB (printed circuit board), FPD (flat panel display), PV (light energy battery), etc., the product structure may include a sheet-shaped and flexible flexible substrate. In the PCB industry, the flexible substrate can be formed by a chemical pretreatment process, a development/etching/stripping process, a horizontal desmear and copper plating process, a horizontal browning process, and a horizontal chemical silver process.

上述軟性基板處理流程的處理方式包括浸泡式及噴淋式,其中,浸泡式係於一處理槽內設有化學處理液體,藉由滾輪裝置將軟性基板送入處理槽內,由化學處理液體對軟性基板進行化學處理,再由滾輪裝置將化學反應完成之軟性基板送出處理槽。而噴淋式係將軟性基板送入一處理室,利用噴灑方式將化學處理液體噴灑於軟性基板進行化學處理,再由滾輪裝置將化學反應完成之軟性基板送出處理室。然無論採取何種方式,當軟性基板被送出處理槽或處理室時,都會夾帶著化學處理液體,不僅造成化學處理液體的浪費,同時也會污染滾輪裝置、輸送系統以及環境。The processing method of the soft substrate processing flow includes a immersion type and a spray type, wherein the immersion type is provided with a chemical treatment liquid in a treatment tank, and the soft substrate is sent into the treatment tank by the roller device, and the chemical treatment liquid is The flexible substrate is chemically treated, and the soft substrate from which the chemical reaction is completed is sent out of the treatment tank by a roller device. In the shower type, the flexible substrate is sent to a processing chamber, and the chemical treatment liquid is sprayed on the flexible substrate for chemical treatment by spraying, and the soft substrate completed by the chemical reaction is sent out to the processing chamber by the roller device. Regardless of the method, when the flexible substrate is sent out of the treatment tank or the processing chamber, the chemical treatment liquid is trapped, which not only causes waste of the chemical treatment liquid, but also pollutes the roller device, the conveying system and the environment.

此外,在臺灣新型專利M363073所述的一種習知蝕刻設備中,其係於一浸泡槽之入口及出口分別設有一入料浮動輪以及一出料浮動輪,該入料浮動輪與出料浮動輪之一作用係用以封閉浸泡槽之入口及出口,避免浸泡液洩漏, 當基板欲進入該浸泡槽時,挾持基板之夾具會將入料浮動輪向上頂,以順利將基板送入浸泡槽,當基板被處理完成時,夾具會將基板送出浸泡槽,此時夾具會將出料浮動輪向上頂,以順利將基板送出浸泡槽,於入料浮動輪及出料浮動輪被上頂之過程中,都會導致若干浸泡液由浸泡槽洩漏。In addition, in a conventional etching apparatus described in Taiwan Patent No. M363073, a feeding floating wheel and an discharging floating wheel are respectively arranged at the inlet and the outlet of a soaking tank, and the floating wheel and the discharging float are respectively arranged. One of the wheels is used to close the inlet and outlet of the soaking tank to avoid leakage of the soaking liquid. When the substrate is to enter the immersion tank, the clamp holding the substrate will top the feed floating wheel to smoothly feed the substrate into the immersion tank. When the substrate is processed, the clamp will send the substrate out of the immersion tank, and the fixture will The discharge floating wheel is topped up to smoothly send the substrate out of the soaking tank. During the process of the feeding floating wheel and the discharging floating wheel being topped, some soaking liquids are leaked from the soaking tank.

有鑑於習知技術之缺失,本創作提出一種基板輸送系統,可避免處理液體洩漏。In view of the lack of prior art, the present invention proposes a substrate delivery system that avoids handling liquid leakage.

為達到上述目的,在本創作之實施態樣中,提出一種基板輸送系統,包括一處理段、一輸入段及一輸出段,處理段係位於一第一高度,輸入段具有相對之一第一端及一第二端,該第一端係位於一第二高度,該第二高度係高於該第一高度,該第二端係與該處理段之其中一端串聯,該輸入段係提供一基板被傳輸進入該處理段,輸出段具有相對之一第三端及一第四端,該第三端係與該處理段相對於連接該輸入段之一端串聯,該第四端係位於一第三高度,該第三高度係高於該第一高度,該基板係由該處理段被傳輸進入該輸出段。In order to achieve the above object, in the implementation of the present invention, a substrate transport system is provided, including a processing section, an input section and an output section, the processing section is located at a first height, and the input section has a relative first And a second end, the first end is located at a second height, the second height is higher than the first height, and the second end is connected in series with one end of the processing segment, and the input segment provides a The substrate is transported into the processing section, the output section has a third end and a fourth end, the third end is connected in series with the processing section with respect to one end of the input section, and the fourth end is located at a The third height is higher than the first height, and the substrate is transported into the output section by the processing section.

為使 貴審查委員對於本創作之結構目的和功效有更進一步之了解與認同,茲配合圖示詳細說明如后。In order to enable your review committee to have a better understanding and recognition of the structural purpose and efficacy of this creation, please follow the detailed description of the illustration.

以下將參照隨附之圖式來描述本創作為達成目的所使 用的技術手段與功效,而以下圖式所列舉之實施例僅為輔助說明,以利 貴審查委員瞭解,但本案之技術手段並不限於所列舉圖式。The following description will be made with reference to the accompanying drawings to make this creation The technical means and functions used, and the embodiments listed in the following figures are only supplementary explanations, which are useful to the reviewers, but the technical means of the case are not limited to the listed figures.

請參閱第一圖至第三圖所示,該基板輸送系統100包括一處理段10、一輸入段20及一輸出段30。於本實施例中,該基板輸送系統100包括二對稱設置之軌道1A、1B,每一該軌道1A、1B呈現一梯形下凹式結構。Referring to the first to third figures, the substrate transport system 100 includes a processing section 10, an input section 20, and an output section 30. In the present embodiment, the substrate transport system 100 includes two symmetrically disposed tracks 1A, 1B, each of which presents a trapezoidal concave structure.

該處理段10係位於一第一高度H1,於該處理段10設有一處理槽40,於處理槽40內設有處理液體41,該處理液體41具有一液面高度H,而該第一高度H1較佳地大於該液面高度H。該處理液體41係用以對一基板50進行化學處理,例如顯影/蝕刻/剝膜處理、水平除膠渣及鍍銅處理、水平棕化處理及水平化學銀處理,依處理製程不同,該處理液體41之種類以及所具有之化學特性也不同。該基板50可為一軟性電子材料、軟性電子基板、可延展材料、或具有彈性或撓曲性之材料、或適用於PCB產業的銅箔等材料。於本實施例中,係由一夾具60夾持且支撐該基板50,夾具60之型態沒有一定限制,例如可採用磁力夾具,利用磁力吸引並夾持於基板50相對二側;亦可採用申請人於2012年7月27日提出申請的申請號為101214591、101214593之台灣新型專利所述的壓制件或張力裝置來夾持基板50,上述申請案之內容係併於此作為參考。該夾具60二側延伸相對應於軌道1A、1B之位置設有複數滾輪61,該夾具60可由鏈條(圖中未示出)驅動,滾輪61於軌道1A、1B內滾動,可輔助夾具60連同基板50移動,以將基板50 由該輸入段20傳輸至該處理段10,再由處理段10將基板50傳輸至該輸出段30。The processing section 10 is located at a first height H1. The processing section 10 is provided with a processing tank 40. The processing tank 40 is provided with a processing liquid 41 having a liquid level height H and the first height. H1 is preferably greater than the liquid level H. The processing liquid 41 is used for chemical treatment of a substrate 50, such as development/etching/stripping treatment, horizontal degreasing and copper plating, horizontal browning, and horizontal chemical silver processing, depending on the processing process. The type of liquid 41 and the chemical properties it has are also different. The substrate 50 can be a soft electronic material, a flexible electronic substrate, a malleable material, or a material having elasticity or flexibility, or a copper foil suitable for the PCB industry. In this embodiment, the substrate 50 is clamped and supported by a clamp 60. The shape of the clamp 60 is not limited. For example, a magnetic clamp can be used, and the magnetic force is used to attract and clamp the opposite sides of the substrate 50. The substrate or the tension device described in the Taiwan Patent Application No. 101, 214, 591, issued to the Japanese Patent Application Serial No The clamp 60 has two sides extending corresponding to the positions of the rails 1A, 1B. The plurality of rollers 61 are provided. The clamp 60 can be driven by a chain (not shown), and the rollers 61 roll in the rails 1A, 1B to assist the clamp 60 together. The substrate 50 is moved to transfer the substrate 50 The input segment 20 is transmitted to the processing segment 10, and the substrate 50 is transferred to the output segment 30 by the processing segment 10.

該輸入段20包括一第一水平段21以及一第一緩衝段22,第一水平段21係位於一第二高度H2,第二高度H2係高於第一高度H1,且第一水平段21於該第二高度H2水平延伸具有一長度。該第一緩衝段22具有相對二端,第一緩衝段22其中一端(亦即圖示第一緩衝段22之左端)係與第一水平段21連接,第一緩衝段22另外一端(亦即圖示第一緩衝段22之右端)係與處理段10連接。The input section 20 includes a first horizontal section 21 and a first buffer section 22, the first horizontal section 21 is located at a second height H2, the second height H2 is higher than the first height H1, and the first horizontal section 21 Extending horizontally at the second height H2 has a length. The first buffer section 22 has opposite ends, and one end of the first buffer section 22 (that is, the left end of the first buffer section 22 is shown) is connected to the first horizontal section 21, and the other end of the first buffer section 22 (ie, The right end of the first buffer section 22 is shown connected to the processing section 10.

該輸出段30包括一第二緩衝段31以及一第二水平段32。第二緩衝段31具有相對二端,第二緩衝段31其中一端(亦即圖示第二緩衝段31之左端)係與該處理段10相對於連接該輸入段20之一端連接,第二緩衝段31另外一端(亦即圖示第二緩衝段31之右端)之高度係位於一第三高度H3。該第二水平段32係位於該第三高度H3,且該第二水平段32於該第三高度H3水平延伸具有一長度,該第二水平段32其中一端(亦即圖示第二水平段32之左端)係與該第二緩衝段31位於該第三高度H3之該端串聯。該第三高度H3可與該第二高度H2相同或不同,但是第二高度H2與第三高度H3都高於第一高度H1。The output section 30 includes a second buffer section 31 and a second horizontal section 32. The second buffer section 31 has opposite ends, and one end of the second buffer section 31 (that is, the left end of the second buffer section 31 is shown) is connected to the processing section 10 with respect to one end of the input section 20, and the second buffer is connected. The other end of the segment 31 (i.e., the right end of the second buffer segment 31 is shown) is located at a third height H3. The second horizontal section 32 is located at the third height H3, and the second horizontal section 32 extends horizontally at the third height H3 to have a length, and one end of the second horizontal section 32 (ie, the second horizontal section is illustrated) The left end of 32 is connected in series with the end of the second buffer section 31 at the third height H3. The third height H3 may be the same as or different from the second height H2, but the second height H2 and the third height H3 are both higher than the first height H1.

請參閱第四圖至第六圖所示,說明本案輸送基板之連續動作,於第四圖至第六圖中簡化部份結構,以明確顯示基板行進之過程。基板50由第一水平段21通過第一緩衝段22後,再進入該處理段10(如第四圖所示),當基板50被傳輸位於該處理段10時,基板50係位於處理槽40,且 基板50係被淹沒於處理液體41內(如第五圖所示),此時,基板50停留於處理槽40內,可與處理槽40內之處理液體41產生化學反應,待反應完成後,再將基板50送出該處理槽40(如第六圖所示),基板50可由第二緩衝段31爬升至第二水平段32。當基板50離開處理槽40時,附著於基板50之處理液體41可滴落於第二緩衝段31,並回流至處理槽40內。在本實施例中,由於利用額外的夾具,使得基板於改變行進方向時,仍然可保持平整而幾乎不變形,再配合本案之輸送系統,藉此於浸泡前後均可保持處理液體不洩漏。Referring to the fourth to sixth figures, the continuous operation of the substrate for transporting the present invention will be described. The partial structure is simplified in the fourth to sixth figures to clearly show the progress of the substrate. The substrate 50 passes through the first buffer section 22 from the first horizontal section 21 and then enters the processing section 10 (as shown in the fourth figure). When the substrate 50 is transported in the processing section 10, the substrate 50 is located in the processing tank 40. And The substrate 50 is submerged in the processing liquid 41 (as shown in FIG. 5). At this time, the substrate 50 stays in the processing tank 40, and can react with the processing liquid 41 in the processing tank 40. After the reaction is completed, The substrate 50 is then sent out of the processing tank 40 (as shown in FIG. 6), and the substrate 50 can be climbed by the second buffer section 31 to the second horizontal section 32. When the substrate 50 leaves the processing tank 40, the processing liquid 41 attached to the substrate 50 may drip into the second buffer section 31 and be returned to the processing tank 40. In the present embodiment, since the additional jig is used, the substrate can be kept flat and hardly deformed when changing the traveling direction, and the conveying system of the present invention can be used to keep the processing liquid from leaking before and after the immersion.

請參閱第七圖所示,該實施例顯示於該輸出段30設有一清洗裝置70,清洗裝置70係朝向該輸出段30噴灑清洗液體71,該清洗液體71可採用水。藉由清洗裝置70對基板50噴灑清洗液體71,藉由清洗液體71清洗基板50所攜帶之處理液體,避免處理液體殘留於基板50。依基板50尺寸及處理液體41種類的不同,可控制實際所需噴灑的清洗液體71的量。噴灑出的清洗液體71連同由基板50沖刷掉的處理液體,可一併流入處理槽40內,因此不會造成處理液體41的浪費。相對於處理槽40中處理液體41的量,清洗裝置70每次清洗基板50之清洗液體71的量很小,換言之,在一容許量的範圍內,即使清洗液體71流入處理槽40內與處理液體41混合,雖然會造成處理液體41被稀釋,但並不會影響處理液體41對基板50的化學反應能力。而使用者也可以視實際需要監測處理液體41的純度,當處理液體41純度低於容許值,可再添加處理液體41,使處理 液體41的純度始終可維持於許可範圍內。Referring to the seventh embodiment, the embodiment shows that the output section 30 is provided with a cleaning device 70 for spraying the cleaning liquid 71 toward the output section 30, and the cleaning liquid 71 can use water. The cleaning liquid 71 is sprayed on the substrate 50 by the cleaning device 70, and the processing liquid carried by the substrate 50 is cleaned by the cleaning liquid 71 to prevent the processing liquid from remaining on the substrate 50. The amount of the cleaning liquid 71 actually required to be sprayed can be controlled depending on the size of the substrate 50 and the type of the processing liquid 41. The sprayed cleaning liquid 71 together with the processing liquid flushed by the substrate 50 can flow into the processing tank 40 at the same time, so that waste of the processing liquid 41 is not caused. The amount of the cleaning liquid 71 that the cleaning device 70 cleans the substrate 50 each time is small with respect to the amount of the processing liquid 41 in the processing tank 40, in other words, within a tolerance range, even if the cleaning liquid 71 flows into the processing tank 40 and is processed The mixing of the liquid 41, although causing the treatment liquid 41 to be diluted, does not affect the chemical reaction ability of the treatment liquid 41 to the substrate 50. The user can also monitor the purity of the treatment liquid 41 according to actual needs. When the purity of the treatment liquid 41 is lower than the allowable value, the treatment liquid 41 can be further added to make the treatment The purity of the liquid 41 can always be maintained within the permissible range.

請參閱第八圖所示實施例,該基板輸送系統200包括依序串聯之一輸入段210、一處理段220以及一輸出段230。於基板50二側設有複數夾具240,該夾具240係由一鏈帶250及複數滾輪260驅動,使夾具240帶動基板50由輸入段210、處理段220移動至該輸出段230。於處理段220設有一處理槽40,於處理槽40設有處理液體41,於輸出段230設有一清洗裝置70。本實施例之主要特徵仍在於,該處理段220之高度低於該輸入段210及該輸出230之高度,因此基板50所攜帶之處理液體41可回流至處理液體41,不致產生洩漏。Referring to the embodiment shown in FIG. 8, the substrate transport system 200 includes an input section 210, a processing section 220, and an output section 230 in series. A plurality of clamps 240 are disposed on two sides of the substrate 50. The clamps 240 are driven by a chain belt 250 and a plurality of rollers 260 to move the substrate 50 from the input section 210 and the processing section 220 to the output section 230. A processing tank 40 is disposed in the processing section 220, a processing liquid 41 is disposed in the processing tank 40, and a cleaning device 70 is disposed in the output section 230. The main feature of this embodiment is that the height of the processing section 220 is lower than the height of the input section 210 and the output 230, so that the processing liquid 41 carried by the substrate 50 can be returned to the processing liquid 41 without causing leakage.

上述不同實施例架構說明,本案具有多種不同的實施方式,本案之最主要特徵在於利用梯形下陷式之處理槽配合緩降式之輸入段以及爬升式之輸出段,並搭配清洗裝置清洗基板所攜帶之處理液體,可使基板攜出之處理液體回流至處理槽中,確實可達到避免處理液體洩漏之目的,使處理液體發揮最佳處理效益及反應作用。The architecture of the different embodiments described above has many different implementation modes. The main feature of the present invention is that the trapezoidal recessed processing tank is used with the descending input section and the climbed output section, and is carried by the cleaning device with the cleaning device. The treatment liquid can reflow the processing liquid carried by the substrate into the treatment tank, and the purpose of avoiding the leakage of the treatment liquid can be achieved, so that the treatment liquid can exert the optimal treatment benefit and reaction effect.

為避免不必要地混淆本創作之技術內容,以上說明省略若干構件或裝置。例言之,鏈條、鍊帶或滾輪須藉由馬達、齒輪等傳動機構之連接而加以運行。該等傳動機構皆為熟悉本技術領域者參考本案技術內容而能輕易完成。In order to avoid unnecessarily obscuring the technical content of the present invention, the above description omits several components or devices. In other words, the chain, chain belt or roller must be operated by the connection of a transmission mechanism such as a motor or a gear. These transmission mechanisms can be easily accomplished by those skilled in the art with reference to the technical content of the present invention.

惟以上所述者,僅為本創作之實施例而已,當不能以之限定本創作所實施之範圍。即大凡依本創作申請專利範圍所作之均等變化與修飾,皆應仍屬於本創作專利涵蓋之範圍內,謹請 貴審查委員明鑑,並祈惠准,是所至禱。However, the above is only an embodiment of the present invention, and the scope of the creation of the present invention cannot be limited. That is to say, the equal changes and modifications made by Dafan in accordance with the scope of application for the creation of this creation should still fall within the scope covered by this creation patent. I would like to ask your review committee to give a clear understanding and pray for it. It is the prayer.

100、200‧‧‧基板輸送系統100, 200‧‧‧ substrate transport system

1A、1B‧‧‧軌道1A, 1B‧‧ Track

10、220‧‧‧處理段10, 220‧‧ ‧ processing section

20、210‧‧‧輸入段20, 210‧‧‧ input section

21‧‧‧第一水平段21‧‧‧First horizontal section

22‧‧‧第一緩衝段22‧‧‧First buffer section

30、230‧‧‧輸出段30, 230‧‧‧ Output section

31‧‧‧第二緩衝段31‧‧‧Second buffer

32‧‧‧第二水平段32‧‧‧Second horizontal section

40‧‧‧處理槽40‧‧‧Processing tank

41‧‧‧處理液體41‧‧‧Processing liquid

50‧‧‧基板50‧‧‧Substrate

60、240‧‧‧夾具60, 240‧‧ ‧ fixture

61、260‧‧‧滾輪61, 260‧‧‧ Wheels

70‧‧‧清洗裝置70‧‧‧cleaning device

71‧‧‧清洗液體71‧‧‧ Cleaning liquid

250‧‧‧鏈帶250‧‧‧Chain

H‧‧‧液面高度H‧‧‧ liquid level

H1‧‧‧第一高度H1‧‧‧ first height

H2‧‧‧第二高度H2‧‧‧second height

H3‧‧‧第三高度H3‧‧‧ third height

第一圖係本創作之一實施例之側視結構示意圖。The first figure is a schematic side view of one embodiment of the present creation.

第二圖係第一圖實施例搭配夾具之俯視結構示意圖。The second figure is a schematic view of the top view of the first embodiment with the fixture.

第三圖係第二圖之A-A剖面結構示意圖。The third figure is a schematic view of the A-A cross-sectional structure of the second figure.

第四圖至第六圖係第一圖實施例搭配夾具之動作示意圖。The fourth to sixth figures are schematic diagrams of the actions of the first embodiment with the jig.

第七圖係本創作設置清洗裝置之結構示意圖。The seventh figure is a schematic diagram of the structure of the cleaning device.

第八圖係本創作另一實施例之前視結構示意圖。The eighth figure is a schematic view of a front view of another embodiment of the present creation.

100‧‧‧基板輸送系統100‧‧‧Substrate delivery system

10‧‧‧處理段10‧‧‧Processing section

20‧‧‧輸入段20‧‧‧ Input section

21‧‧‧第一水平段21‧‧‧First horizontal section

22‧‧‧第一緩衝段22‧‧‧First buffer section

30‧‧‧輸出段30‧‧‧Output segment

31‧‧‧第二緩衝段31‧‧‧Second buffer

32‧‧‧第二水平段32‧‧‧Second horizontal section

40‧‧‧處理槽40‧‧‧Processing tank

41‧‧‧處理液體41‧‧‧Processing liquid

50‧‧‧基板50‧‧‧Substrate

60‧‧‧夾具60‧‧‧ fixture

61‧‧‧滾輪61‧‧‧Roller

H‧‧‧液面高度H‧‧‧ liquid level

H1‧‧‧第一高度H1‧‧‧ first height

H2‧‧‧第二高度H2‧‧‧second height

H3‧‧‧第三高度H3‧‧‧ third height

Claims (6)

一種基板輸送系統,包含:一處理段,係位於一第一高度;一輸入段,其具有相對之一第一端及一第二端,該第一端係位於一第二高度,該第二高度係高於該第一高度,該第二端係與該處理段之其中一端串聯,該輸入段係提供一基板被傳輸進入該處理段;以及一輸出段,其具有相對之一第三端及一第四端,該第三端係與該處理段相對於連接該輸入段之一端串聯,該第四端係位於一第三高度,該第三高度係高於該第一高度,該基板係由該處理段被傳輸進入該輸出段。A substrate transport system comprising: a processing section at a first height; an input section having a first end and a second end, the first end being at a second height, the second a height system is higher than the first height, the second end is connected in series with one end of the processing section, the input section provides a substrate to be transported into the processing section; and an output section having a third end And a fourth end, the third end is connected in series with the processing segment with respect to one end of the input segment, the fourth end is located at a third height, and the third height is higher than the first height, the substrate The processing segment is transmitted into the output segment. 如申請專利範圍第1項所述之基板輸送系統,其中該輸入段包括:一第一水平段,該第一水平段係位於該第二高度,且該第一水平段於該第二高度水平延伸一長度;以及一第一緩衝段,其具有相對二端,該第一緩衝段其中一端係與該第一水平段連接,該第一緩衝段另外一端係與該處理段連接。The substrate transport system of claim 1, wherein the input segment comprises: a first horizontal segment, the first horizontal segment is located at the second height, and the first horizontal segment is at the second height level And extending a length; and a first buffer segment having opposite ends, wherein one end of the first buffer segment is connected to the first horizontal segment, and the other end of the first buffer segment is connected to the processing segment. 如申請專利範圍第1項所述之基板輸送系統,其中該輸出段包括:一第二緩衝段,其具有相對二端,該第二緩衝段其中一端係與該處理段相對於連接該輸入段之一端連接,該第二緩衝段另外一端之高度係位於該第三高度;以及一第二水平段,係位於該第三高度,且該第二水平段於該第三高度水平延伸一長度,該第二水平段其中一端係 與該第二緩衝段位於該第三高度之該端串聯。The substrate transport system of claim 1, wherein the output section comprises: a second buffer section having opposite ends, wherein one end of the second buffer section is connected to the processing section with respect to the input section One end is connected, the other end of the second buffer segment is located at the third height; and a second horizontal segment is located at the third height, and the second horizontal segment extends a length horizontally at the third height. One end of the second horizontal section The end of the second buffer segment is located in series with the third height. 如申請專利範圍第1項所述之基板輸送系統,其中該處理段係位於一處理槽內,該處理槽內設有處理液體,該處理液體具有一液面高度,該基板被傳輸位於該處理段時,該基板係位於該處理槽中,且該基板係被淹沒於該處理液體內。The substrate transport system of claim 1, wherein the processing section is located in a processing tank, the processing tank is provided with a processing liquid, the processing liquid has a liquid level, and the substrate is transported at the processing In the segment, the substrate is located in the processing tank, and the substrate is submerged in the processing liquid. 如申請專利範圍第1項所述之基板輸送系統,其中該輸出段設有至少一清洗裝置,該清洗裝置係朝向位於該輸出段之該基板噴灑清洗液體。The substrate transport system of claim 1, wherein the output section is provided with at least one cleaning device that sprays the cleaning liquid toward the substrate located at the output section. 如申請專利範圍第5項所述之基板輸送系統,其中該清洗液體為水。The substrate delivery system of claim 5, wherein the cleaning liquid is water.
TW101220212U 2012-10-19 2012-10-19 Substrate conveying system TWM449795U (en)

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