TWM449693U - 易破真空的矽橡膠薄片 - Google Patents

易破真空的矽橡膠薄片 Download PDF

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Publication number
TWM449693U
TWM449693U TW101218030U TW101218030U TWM449693U TW M449693 U TWM449693 U TW M449693U TW 101218030 U TW101218030 U TW 101218030U TW 101218030 U TW101218030 U TW 101218030U TW M449693 U TWM449693 U TW M449693U
Authority
TW
Taiwan
Prior art keywords
rubber sheet
vacuum
silicone rubber
breakable
sheet according
Prior art date
Application number
TW101218030U
Other languages
English (en)
Chinese (zh)
Inventor
Ji-Jin Lin
Original Assignee
Hsin Yung Chien Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hsin Yung Chien Co Ltd filed Critical Hsin Yung Chien Co Ltd
Priority to TW101218030U priority Critical patent/TWM449693U/zh
Priority to JP2013000394U priority patent/JP3182763U/ja
Priority to DE201320000917 priority patent/DE202013000917U1/de
Publication of TWM449693U publication Critical patent/TWM449693U/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B30—PRESSES
    • B30B—PRESSES IN GENERAL
    • B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
    • B30B15/06—Platens or press rams
    • B30B15/061—Cushion plates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/26—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer which influences the bonding during the lamination process, e.g. release layers or pressure equalising layers
    • B32B2037/266—Cushioning layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Laminated Bodies (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
TW101218030U 2012-09-18 2012-09-18 易破真空的矽橡膠薄片 TWM449693U (zh)

Priority Applications (3)

Application Number Priority Date Filing Date Title
TW101218030U TWM449693U (zh) 2012-09-18 2012-09-18 易破真空的矽橡膠薄片
JP2013000394U JP3182763U (ja) 2012-09-18 2013-01-28 プレスパッド
DE201320000917 DE202013000917U1 (de) 2012-09-18 2013-01-30 Niederhalter

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW101218030U TWM449693U (zh) 2012-09-18 2012-09-18 易破真空的矽橡膠薄片

Publications (1)

Publication Number Publication Date
TWM449693U true TWM449693U (zh) 2013-04-01

Family

ID=47909386

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101218030U TWM449693U (zh) 2012-09-18 2012-09-18 易破真空的矽橡膠薄片

Country Status (3)

Country Link
JP (1) JP3182763U (ja)
DE (1) DE202013000917U1 (ja)
TW (1) TWM449693U (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102014204125B4 (de) 2014-03-06 2018-09-13 Solibro Hi-Tech Gmbh Laminiervorrichtung und Verfahren zur Herstellung eines Laminats

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0235582A3 (en) 1986-02-27 1989-03-29 Hewlett-Packard Company Bonded press pad

Also Published As

Publication number Publication date
DE202013000917U1 (de) 2013-02-18
JP3182763U (ja) 2013-04-11

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Legal Events

Date Code Title Description
MM4K Annulment or lapse of a utility model due to non-payment of fees