TWM448106U - Composite copper clad laminate - Google Patents

Description

Composite structure copper foil substrate

The present invention relates to a composite structural copper foil substrate, in particular to a composite structural copper foil substrate with high stiffness, high dimensional stability and easy processing.

The substrate for a flexible printed circuit (PCB) must have high thermal conductivity, high heat dissipation, high heat resistance, and low thermal expansion coefficient. Polyimine resin has high thermal stability and excellent heat dissipation, mechanical strength, and adhesion, and is commonly used in various electronic materials. At present, the electronic system is moving toward a light, short, and low-cost direction, so the selection direction of the substrate will become thinner and thinner. Due to the insufficient stiffness of the material, the yield and dimensional stability of the soft board production will be a major problem.

Polyimine composite membranes have been widely used in electronic materials. At present, the application of polyimine composite membranes is in the form of polyimine layers and polyaluminum in the non-adhesive single-sided copper foil substrate products of the FPC downstream factory. The amine composite film product is covered with pure rubber and pressed and cured to make it tightly combined. However, the problems encountered in the production and application of this structure are that the surface of the single-sided copper foil substrate and the composite film layer are easily contaminated. The influence of factors leads to poor bonding, and the surface of the high-temperature surface (SMT) causes the blasting of the reinforcing plate. On the other hand, it affects the soft plate process operation and yield.

Therefore, there is still a need for a special structural copper foil substrate that satisfies high stiffness, high dimensional stability, and ease of processing.

Related prior patents, such as Taiwan Patent No. M377823, this creation is a continuation of this structural patent.

In view of the above-mentioned shortcomings of the prior art, the object of the present invention is to provide a composite structural copper foil which has the characteristics of high dimensional stability, high stiffness and easy processing.

In order to achieve the above object, the present invention provides a composite structure copper foil substrate structure, comprising: a copper foil layer, a polymer layer formed on the surface of the copper foil layer, an adhesive layer formed on the polymer layer, and reinforcement a layer, the polymer layer being sandwiched between the copper foil layer and the adhesive layer, the adhesive layer being sandwiched between the polymer layer and the reinforcing layer, wherein the polymer layer and the thickness of the adhesive layer The sum is 8 to 50 microns

The adhesive layer has a thickness of 3 to 25 microns.

The polymer layer has a thickness of 5 to 25 microns.

The copper foil layer has a thickness of 8 to 70 microns.

The reinforcing layer has a thickness of 50 to 200 microns.

The copper foil layer is a rolled copper foil layer or an electrolytic copper foil layer.

The material used for the adhesive layer is an epoxy resin, an acrylic resin, a urethane resin, a ruthenium rubber resin, a polyparaxylene resin, a bismaleimide resin, or a polyimide resin. Or a mixture thereof.

The present invention provides a method for manufacturing a composite structural copper foil substrate, comprising: coating a polymer on any surface of a copper foil layer, and drying to form a polymer layer to obtain a single-sided copper foil substrate; coating or transferring The adhesive layer is formed on the surface of the polymer layer of the obtained single-sided copper foil substrate, and the adhesive layer is semi-polymerized and semi-cured. The reinforcing layer is applied to the adhesive layer, and the reinforcing layer is pressed to make the reinforcing layer closely adhere to obtain a composite structural copper foil substrate; and the composite structural copper foil substrate obtained by baking is obtained. The finished structural copper foil substrate is finished.

The beneficial effect of the creation is that the composite structural copper foil substrate of the present invention is composed of a copper foil layer, a polymer layer, an adhesive layer and a reinforcing layer in sequence, and is prepared by a simple method, and the adhesive layer and the polymer layer can be adjusted as needed. The thickness makes the composite structure copper foil substrate of the present invention meet the requirements of high dimensional stability, high stiffness and easy processing, and is particularly suitable for products such as mobile phone antenna boards.

The present invention will be described below by way of specific examples, and those skilled in the art can easily understand the advantages and effects of the present invention by the contents disclosed in the present specification. This creation can also be implemented in a variety of different ways, that is, without modification or change, without departing from the scope of the present disclosure.

In the present specification, the glass transition temperature (Tg) is related to the heat resistance of the adhesive layer. In the context of the present invention, the glass transition temperature is one of transition temperatures, especially the phase change temperature of a material, specifically, the temperature of the material is high or low with heating or cooling. At temperature, the phase changes to a rubbery or brittle glass state.

Embodiment: A composite structural copper foil substrate, as shown in FIG. 1, includes a copper foil layer 103, a polymer layer 102, and the polymer layer 102 has opposite first and second surfaces 1021, 1022, the copper The foil layer 103 is formed in the On the first surface 1021 of the polymer layer 102, an adhesive layer 101 is formed on the second surface 1022 of the polymer layer 102. The polymer layer 102 is sandwiched between the copper foil layer 103 and the adhesive layer 1301. The reinforcing layer 104 is formed on the adhesive layer 101, and the adhesive layer 101 is sandwiched between the polymer layer 102 and the reinforcing layer 104, and the polymer layer 102 is adhered to the adhesive layer. The sum of the thicknesses of the layers 101 is 8 to 50 μm.

In order to reduce the problem of insufficient bonding strength and blasting of the flexible printed circuit board manufactured by the copper foil substrate, the composite structural copper foil substrate of the present invention can adjust the composition and thickness of the adhesive layer in the copper foil substrate as needed. The material of the adhesive layer of the double-sided copper foil substrate is generally selected from the group consisting of epoxy resin, acrylic resin, urethane resin, ruthenium rubber resin, polyparaxylene resin, and bismaleimide. Resin, polyimine resin or a mixture thereof. The thickness of the adhesive layer of the present invention is 3 to 25 μm, and therefore, a copper foil substrate excellent in performance can be provided under conditions effective in cost control.

In the composite copper foil substrate, the material of the polymer layer to be used is not particularly limited, and it is preferable to use a halogen-free thermosetting polyimide material, and it is more preferable to use a self-adhesive and halogen-free material. Thermoset polyimine material. The polymer layer has a thickness of 5 to 25 microns.

In the composite structure copper foil substrate, the copper foil used for the copper foil layer is a rolled copper foil (RA copper foil) or an electrolytic copper foil (ED copper foil), and the copper foil layer has a thickness of 8 to 70 μm.

In the composite copper foil substrate, the reinforcing layer used is a 50 μm pure polyimine film or a 50 to 200 μm polyimide film. The thickness of the reinforcing layer is 50 to 200 microns.

The composite structure copper foil substrate can be obtained by coating a polymer on any surface of the copper foil layer and drying it to form a polymer layer to obtain a single-sided copper foil substrate; then, coating or transferring The printing method forms an adhesive layer on the surface of the polymer layer, and the adhesive layer is in a B-stage state (semi-polymerized and semi-hardened state, at which time there are few chemical bonds between the molecules and molecules of the adhesive layer, and it softens under high temperature and high pressure) Then, the reinforcing layer is applied to the reinforcing layer, and the reinforcing layer is pasted on the adhesive layer, and the reinforcing layer is pressed tightly to form a composite structural copper foil substrate; finally, the composite structural copper foil substrate is baked to complete The composite structural copper foil substrate product of the present invention.

The polyimine composite film includes a plurality of polyimide films; and a bonding film formed between the dimeric polyimide membranes; wherein the polyimide film has a modulus greater than 3.5 GPa, and the The total thickness Z of the polyimide film is in accordance with the following formula: mX+nY=Z

Wherein m is the number of the polyimide film; n is the number of the bonding film; X is the thickness of each of the polyimide films, and X is 1 to 2 mil; and Y is 1 mil and represents the bonding. The thickness of the film.

The rebound test of the composite composite copper foil substrate is as follows: the copper foil layer of the composite composite copper foil substrate is etched and removed for testing; Reinforcement material as the comparison group; test conditions for rebound force test: cut the test piece into 10mm × 30mm test piece, set the test R angle to 2.35 mm, measure 5 times for each test piece, calculate the average value and record it in the table. 1.

It can be seen from the results shown in Table 1 that the present invention utilizes a pure polyimine film thickness of 2 mil (SK IF-70) and a 8 mil thick polyimine composite film as a reinforcing layer; wherein the polyimine composite film structure is m A composite film composed of =3, X=2, n=2, and Y=1. The composite composite copper foil substrate has a very high rebound force, and the higher the rebound force, the better the stiffness. In addition, in the experimental group data, the thicker the polyimide layer and the reinforcing layer, the greater the rebound force and the better the stiffness. Under the same thickness conditions, the experimental group data of this creation was significantly better than the control group.

The sizing test of the composite composite copper foil substrate is as follows: Test conditions for dimensional stability: the composite structure copper foil base of the present invention The plate was used as an experimental group, and the general copper foil substrate was a comparison group. The copper foil substrate was cut into 25 mm × 28 mm test pieces, and four holes were punched in the upper four corners. Method B measures the change of the TD/MD direction size after the copper foil layer of the copper foil substrate is removed by etching, and the method C measures the TD/MD direction size change after baking for 30 minutes at 150 degrees. Each set of test pieces was measured 3 times, and the average value was calculated and recorded in Table 2.

It can be seen from the results shown in Table 2 that the present composite composite copper foil substrate It has excellent dimensional stability, and its size is up to -0.1% after etching and baking. In addition, in the experimental group data, the thicker the polyimide layer and the reinforcing layer, the better the dimensional stability. Under the same thickness conditions, the experimental group data of this creation was significantly better than the control group.

The above description and examples are merely illustrative of the principles and functions of the present invention and are not intended to limit the present invention. Any creations falling within the scope of this creation patent are covered by this creation.

100‧‧‧Composite structural copper foil substrate

101‧‧‧Adhesive layer

102‧‧‧ polymer layer

1021, 1022‧‧‧ first surface, second surface

103‧‧‧copper layer

104‧‧‧ reinforcing layer

Figure 1 is a cross-sectional view of a composite structural copper foil substrate of the present invention.

100‧‧‧Composite structural copper foil substrate

101‧‧‧Adhesive layer

102‧‧‧ polymer layer

1021, 1022‧‧‧ first surface, second surface

103‧‧‧copper layer

104‧‧‧ reinforcing layer

Claims (10)

A composite structural copper foil substrate comprising: a copper foil layer; a polymer layer formed on a surface of the copper foil layer; and an adhesive layer and a reinforcing layer formed on the polymer layer, wherein the polymer layer is interposed Between the copper foil layer and the adhesive layer, the adhesive layer is sandwiched between the polymer layer and the reinforcing layer, wherein the sum of the thickness of the polymer layer and the adhesive layer is 8 to 50 micrometers. The composite structural copper foil substrate according to claim 1, wherein the adhesive layer has a thickness of 3 to 25 μm. The composite structural copper foil substrate according to claim 1, wherein the polymer layer has a thickness of 5 to 25 μm. The composite structural copper foil substrate according to claim 1, wherein the copper foil layer has a thickness of 8 to 70 μm. The composite structural copper foil substrate according to claim 4, wherein the copper foil layer is one of a rolled copper foil layer and an electrolytic copper foil layer. The composite structural copper foil substrate according to claim 1, wherein the reinforcing layer has a thickness of 50 to 200 μm. The composite structural copper foil substrate according to claim 1 or 6, wherein the reinforcing layer is a 50 μm pure polyimine film or a 50 to 200 μm polyimide film. The composite structural copper foil substrate according to claim 7, wherein the polyimine composite film comprises a plurality of polyimide films; and a bonding film formed between the dimeric polyimide membranes Where the gathering The modulus of the quinone imine film is greater than 3.5 Gpa, and the total thickness Z of the polyimide film is in accordance with the following formula: mX+nY=Z where m is the number of the polyimide film; n is The number of the bonding films is shown; X is the thickness of each of the polyimide films, and X is 1 to 2 mils; and Y is 1 mil and indicates the thickness of the bonding film. The composite structural copper foil substrate according to claim 1, wherein the adhesive layer is made of an epoxy resin, an acrylic resin, a urethane resin, a ruthenium rubber resin, or a poly-ply ring. A xylene resin, a bismaleimide resin, a polyimine resin, or a mixture thereof. The composite structural copper foil substrate according to claim 1, wherein the polymer layer is made of polyimide.