M443360 五、新型說明： 【新型所屬之技術領域】 本創作是關於一種軟性印刷電路板的監測標記尤浐 一種應用於軟性印刷電路板導通孔鑽孔加卫時，補助„ 鑽孔誤差是否超出容許範圍， 吗用以減 > 不良0口之軟性印刷 電路板的監測標記創作。 【先前技術】 • 目前内層美有㈣線路層的多層式（三層以上）之， 性印刷電路板於製造過程中，因其電路板基材兩面均需二 鐳射加工及機械鑽孔等手段進行貫通或盲孔型式的導通孔 加工作業。由於線路層間的導通孔連通位置必須符合可容 許之公差範圍，否則即A麻〇 m , , P為廢，因此，如何精確控制印刷 電路板之鑽孔加工精度即十分重要。 現有的軟性印刷電路板構造中，因線路 路層間須作上下貫通的貫穿孔1甘使其線 只心〜員茅孔型式或未完全貫通的盲孔型 •式的導通孔，故須採取-機械鑽孔與-鐳射鑽孔之二次鑽 孔作業方式進行，因二次鑽孔作業會有對位之公差，—旦 鑽孔位置之公差超出可容許範圍，於鐵孔作業中無法立艮: 判斷，必須等到X光檢測時才能發現，一經判斷鑽孔位置 超出可容許範圍時，該軟性印刷電路板已為廢品，並無法 予以補救’影響製品的良率甚鉅，對此有必要進一步加以 改善。 【新型内容】 監 本創作之主要目的在於提供一種軟性印刷電路板的 M443360 測標記’希藉此創作’解決現有軟性印刷電路板難以預防 導通孔加工時因鑽孔位置誤差過大而致孔破造成軟性印刷 電路板報廢之問題。 為達成前揭目的，本創作所提出之軟性印刷電路板的 監測標記係用以成形於所述軟性印刷電路板最外側線路層 外圍之非佈線區’所述監測標記包含一標記中心圓片、一 位於標記中心圓片外圍呈鏤空狀之圓環形監測環區，以及 位於監測環區外圍的周邊區塊，所述圓環形監測環區與標 §己中心圓片為同心圓，所述標記中心圓片係用以提供鑽設 監視孔。 藉此軟性印刷電路板的監測標記創作，使其應用於軟 性印刷電路板的導通孔成形加工過程中，先行藉由監測標 記預先對位鑽設監視孔，來判斷所鑽設監視孔範圍是否超 過各許公差的範圍，若鑽設之監視孔範圍符合容許公差範 圍’即接續進行後續鑽孔加工作業’若判斷所鑽設之監視 孔位置超出範圍時，則先行微調對位鑽孔位置，確保後續 導通孔鑽孔位置得以落在容許公差範圍内，避免導通孔鑽 孔位置偏差所造成之破孔情形，以期降低軟性印刷電路板 製品的不良率。 【實施方式】 如圖1所示’係揭示本創作軟性印刷電路板的監測標 記2係成形於所述軟性印刷電路板彳上，所述軟性印刷電 路板1包含至少三呈上下排列的線路層10、11以及分設 每二上下相鄰的線路層10、11之間的絕緣層12，所述軟 性印刷電路板1於其一最外側之線路層彳彳外圍具有非佈 M443360 線區間，於本較佳實施例中，所述軟性印刷電路板彳為矩 形’非佈線區位於該軟性印刷電路板1之四角隅處。M443360 V. New description: [New technical field] This creation is about a kind of monitoring mark of soft printed circuit board. Especially when it is applied to the hole of the flexible printed circuit board, it is subsidized whether the drilling error exceeds the allowable Scope, it is used to reduce the detection mark of the soft printed circuit board of the bad 0. [Prior Art] • At present, the inner layer has a (4) multi-layer (three or more layers) of the circuit layer, and the printed circuit board is in the manufacturing process. In the middle, the two sides of the circuit board substrate require two laser processing and mechanical drilling to perform through-hole or blind-hole type through-hole processing. Since the conduction position of the via holes between the circuit layers must meet the allowable tolerance range, otherwise A paralysis m , , P is waste, therefore, how to accurately control the drilling precision of the printed circuit board is very important. In the existing flexible printed circuit board structure, the through-holes 1 must be made up and down through the line layers. The wire is only a heart-shaped hole type or a blind hole type-type through hole that is not completely penetrated, so it is necessary to take - mechanical drilling and - laser drilling The secondary drilling operation mode is carried out, because the secondary drilling operation will have the tolerance of the alignment. Once the tolerance of the drilling position exceeds the allowable range, it cannot be erected in the iron hole operation: Judging, it must wait until the X-ray inspection It can be found that once the drilling position is judged to be beyond the allowable range, the flexible printed circuit board has been scrapped and cannot be remedied. 'The yield of the affected product is very large, and it is necessary to further improve it. [New content] The main purpose of the creation is to provide a flexible printed circuit board M443360 test mark 'I hope to create' to solve the existing flexible printed circuit board is difficult to prevent the hole hole processing caused by the hole position error caused by the hole breakage caused by the soft printed circuit board scrapped In order to achieve the foregoing, the monitoring mark of the flexible printed circuit board proposed by the present invention is used to form a non-wiring area on the outermost circuit layer periphery of the flexible printed circuit board. The monitoring mark includes a mark center circle. a circular monitoring ring area with a hollow outer periphery on the periphery of the marking center disc, and located outside the monitoring loop area a peripheral block, the circular monitoring ring area is concentric with the central wafer, and the marking center wafer is used to provide a drilling monitoring hole. thereby creating a monitoring mark of the flexible printed circuit board, When it is applied to the through hole forming process of the flexible printed circuit board, the monitoring hole is drilled in advance by the monitoring mark to determine whether the range of the drilled hole to be drilled exceeds the range of the tolerance, if the monitoring of the drilling is performed If the hole range meets the tolerance range, that is, the subsequent drilling operation is continued. If it is judged that the position of the monitoring hole drilled is out of range, the position of the alignment hole is finely adjusted first to ensure that the drilling position of the subsequent via hole falls within the tolerance. In the range, avoiding the hole breakage caused by the deviation of the drilling position of the via hole, in order to reduce the defect rate of the flexible printed circuit board product. [Embodiment] As shown in FIG. 1 , the monitoring mark of the flexible printed circuit board is revealed. Formed on the flexible printed circuit board 1 , the flexible printed circuit board 1 includes at least three circuit layers 10 , 11 and a plurality of vertically arranged lines In the insulating layer 12 between the adjacent circuit layers 10 and 11, the flexible printed circuit board 1 has a non-distributed M443360 line interval on the outermost layer of the circuit layer. In the preferred embodiment, The flexible printed circuit board 彳 is a rectangular 'non-wiring area located at four corners of the flexible printed circuit board 1.
如圖1所示，本創作之監測標記2係成形於該軟性印 刷電路板1最外側之線路層W外圍之非佈線區間，使監 測標記2可與該最外側之線路層彳彳同由該軟性印刷電路 板1 一外側的絕緣層12上的鋼箔層i 3以蝕刻手段—同成 形，如圖2所示，所述監測標記2係包含一標記中心圓片 2〇、一位於標記中心圓片20外圍呈鏤空狀之圓環形監測 環區21，以及位於圓環形監測環區21外圍的周邊區塊 22,所述圓環形監測環區21與標記中心圓片2〇為同心 圓，所述周邊區塊22亦可為矩形或其他幾何形狀。 ^本創作監測標記2之尺寸設定，可依鑽孔加工作業的 需要’以下兩種方式來進行： _其一，係固定監測標記2之圓環形監測環區2彳的直 徑’更換鑽孔的孔徑達到所需的公差。其中，設定該監洌 標記2之圓環形監測環區21外圓之直徑為一預定值A1， 使該監測標記2之標記中心圓片20之直徑C1為該預定值 A1減去兩倍之待鑽導通孔可容許的位置公差b之值（亦 =c1=A1_2*B)。例如：將該監測標記2之圓環形監測 衣外圓之直徑固定設定為1〇咖(即預定值a”，假 =性印刷電路板]之盲孔型導通孔可容許的位置公差（即 )為，則設定該監測標記2的標記中心圓片2〇的 直抱（即 C1)為 i.0_(015*2) = 0.7mm。 更改’係固定監測標記2的標記中心圓片20直徑， 文換圓環形監測環區21夕卜圓直徑達到所需的公差。其 M443360 中，設定該監測標記2的標記中心圓片2〇之直徑為一預 定值C2,使該監測標記2之圓環形監測環區21外圓之直 徑A2為該標記中心圓片2〇之直栌 四乃 且乜C2加上兩倍之待鑽導 it孔可容許的位置公差B之值（亦即A2 = c2 + 2*B)。例 如：將監測標記2的標記中心圓片2〇的直徑固定設定為 0.7mm(即C2)，假設盲孔型導通孔可容許的位置公差（即b) 為0 · 2 m m，則設定該龄泪丨丨炉却9 λα m 疋通孤冽榇°己2的圓環形監測環區21外 圓的直徑（即 A2)為 〇.7 + (〇.2*2)=1.imm。 所述軟性印刷電路板i藉由前揭監測標記2創作如 圖3所示，當該軟性印刷電路板）進行導通孔之二次鑽孔 加工作業時，係先行利用該監測標記2提供作業人員先行 對位鑽設監測1 3 ’並以該監測標記2上所鑽設的監測孔 位置來判斷其鑽設之監視孔3範圍是否超過容許公差的 範圍，如圖4所示，若監測孔3範圍符合可容許之公差範 圍内，亦即監測孔3落在標記中心圓片2〇的範圍内，故 能接續進行後續導通孔14鑽孔加工作業；若判斷監測孔3 位置超出範圍時，如圖5所示，亦即監測孔3超出可容許 的標記中心圓片20範圍外而接觸鏤空的圓環形監測環區 21之狀態，則先進行微調對位調整預定導通孔14之鑽孔 位置，確保後續導通孔14之鑽孔位置得以落在容許公差 範圍内，避免導通孔14鑽孔位置偏差所造成之破孔情 形’以期降低軟性印刷電路板製品的不良率。 【圖式簡單說明】 圖1係本創作軟性印刷電路板的監測標記與最外側之 線路層一同經由軟性印刷電路板最外側的銅箔層一起成形 的流程圖。 印刷 圖2係本創作軟性印刷電路板的監測標記成形於軟性 電路板的非佈線區的俯视平面示意圖。 圖3係軟性印刷電路板鑽設有監測孔、貫穿及盲孔型 式的導通孔平面示意圖。 圖4係對本創作軟性印刷電路板的監測標記鑽設監測 孔’且監測孔落在可容許的標記中心圓片範圍的平面示意 圖。 圖5係對本創作軟性印刷電路板的監測標記鑽設監測 孔’且監測孔超出可容許的標記中心圓片範圍外而接觸鏤 空的圓環形監測環區的平面示意圖。 【主要元件符號說明】 1軟性印刷電路板 1 0線路層 1 1線路層 1 2絕緣層 1 3鋼箔層 14導通孔 2監測標記 2 0禪記中心圓片 21圓環形監測環區 22周邊區塊 3監測孔As shown in FIG. 1, the monitoring mark 2 of the present invention is formed in a non-wiring section formed on the outermost side of the circuit layer W of the flexible printed circuit board 1, so that the monitoring mark 2 can be identical to the outermost circuit layer. The flexible printed circuit board 1 has a steel foil layer i 3 on the outer insulating layer 12 formed by etching means, as shown in FIG. 2, the monitoring mark 2 includes a mark center wafer 2〇, and a mark center The periphery of the wafer 20 has a hollow annular monitoring ring zone 21 and a peripheral block 22 located at the periphery of the annular monitoring ring zone 21, the annular monitoring ring zone 21 being concentric with the marking center disk 2〇 Round, the perimeter block 22 can also be rectangular or other geometric shape. ^The size setting of the creation monitoring mark 2 can be carried out according to the needs of the drilling processing operation in the following two ways: _ First, the diameter of the circular monitoring ring area 2固定 of the fixed monitoring mark 2 The aperture is up to the required tolerance. Wherein, the diameter of the outer circle of the annular monitoring ring region 21 of the monitoring mark 2 is set to a predetermined value A1, so that the diameter C1 of the marking center disk 20 of the monitoring mark 2 is twice the predetermined value A1. The value of the position tolerance b that can be tolerated by the through hole to be drilled (also = c1 = A1_2 * B). For example, the diameter of the outer circumference of the circular monitoring device of the monitoring mark 2 is fixedly set to a position tolerance of the blind hole type through hole of the first coffee (ie, the predetermined value a", the false printed circuit board] (ie, If so, set the straight hug (ie C1) of the mark center wafer 2〇 of the monitoring mark 2 to i.0_(015*2) = 0.7 mm. Change the diameter of the mark center wafer 20 of the fixed monitoring mark 2. , in the M443360, the diameter of the marking center wafer 2〇 of the monitoring mark 2 is set to a predetermined value C2, so that the monitoring mark 2 The diameter A2 of the outer circle of the annular monitoring ring zone 21 is the value of the positional tolerance B of the marking center disk 2〇 and the C2 plus twice the allowable position of the hole to be drilled (ie, A2) = c2 + 2*B). For example, the diameter of the mark center disc 2〇 of the monitoring mark 2 is fixed to 0.7 mm (ie, C2), assuming that the position tolerance of the blind hole type through hole (ie b) is 0. · 2 mm, set the diameter of the outer circle of the circular monitoring ring zone 21 (ie A2) of the age of the tear gas furnace but 9 λα m 疋 冽榇 冽榇 己 2 + (〇.2*2)=1.imm. The flexible printed circuit board i is created by the front monitoring mark 2 as shown in FIG. 3, when the flexible printed circuit board is subjected to the secondary drilling of the via hole. During the operation, the monitoring mark 2 is firstly used to provide the operator with the first alignment drilling monitoring 1 3 ' and the monitoring hole position drilled on the monitoring mark 2 to determine whether the range of the monitoring hole 3 of the drilling exceeds the allowable tolerance. The range of the monitoring hole 3 is as shown in FIG. 4, and if the monitoring hole 3 is within the allowable tolerance range, that is, the monitoring hole 3 falls within the range of the marking center wafer 2, the subsequent drilling of the through hole 14 can be continued. If it is judged that the position of the monitoring hole 3 is out of range, as shown in FIG. 5, that is, the state in which the monitoring hole 3 is outside the range of the tolerable marking center wafer 20 and is in contact with the hollow circular monitoring ring area 21, Performing fine-tuning alignment adjustment of the drilling position of the predetermined through-hole 14 ensures that the drilling position of the subsequent via hole 14 falls within the allowable tolerance range, and avoids the hole-breaking situation caused by the deviation of the drilling position of the via-hole 14 in order to reduce the soft printing. Circuit board products are not [Brief Description] Fig. 1 is a flow chart in which the monitoring mark of the flexible printed circuit board is formed together with the outermost circuit layer via the outermost copper foil layer of the flexible printed circuit board. A schematic plan view of the non-wiring area of the flexible printed circuit board is formed in a plan view of the non-wiring area of the flexible printed circuit board. Fig. 3 is a plan view of the conductive hole of the flexible printed circuit board with the monitoring hole, the through hole and the blind hole type. A schematic diagram of the monitoring mark drilling the monitoring hole of the flexible printed circuit board and the monitoring hole falling within the range of the allowable mark center wafer. FIG. 5 is a monitoring mark drilling monitoring hole of the present flexible printed circuit board and monitoring hole A schematic plan view of a toroidal monitoring loop that is out of contact with the hollowed out center of the mark. [Main component symbol description] 1 Flexible printed circuit board 1 0 circuit layer 1 1 circuit layer 1 2 insulating layer 1 3 steel foil layer 14 via hole 2 monitoring mark 2 0 zen center disk 21 round ring monitoring ring area 22 periphery Block 3 monitoring hole