TWM441314U - Electromagnetic interference shielding structure and flexible printed circuit board having the structure - Google Patents

Electromagnetic interference shielding structure and flexible printed circuit board having the structure Download PDF

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TWM441314U
TWM441314U TW101209538U TW101209538U TWM441314U TW M441314 U TWM441314 U TW M441314U TW 101209538 U TW101209538 U TW 101209538U TW 101209538 U TW101209538 U TW 101209538U TW M441314 U TWM441314 U TW M441314U
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Taiwan
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layer
electromagnetic interference
metal
film
test
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TW101209538U
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Chinese (zh)
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Chih-Ming Lin
Chin-Hsien Hung
Hui-Feng Lin
Chien-Hui Lee
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Asia Electronic Material Co
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Description

M44131.4 . I · 五、新型說明: 【新型所屬之技術領域】 本創作係有關於一種遮蔽電磁干擾之層結構,更詳而 言之,係有關於一種用於軟性印刷電路板之遮蔽電磁干擾 之層結構。 【先前技術】 由於電子產品朝向輕薄短小型、高功能化以及高速度 化發展。因此,小型電子產品的配線材料大多採用設計自 Φ由度高、彎曲性良好的軟性印刷電路板(Flexible Printed Circuit,FPC),並且在不斷向高功能化及高速度化發展的 同時制定了各種電磁波干擾(EMI)的對策。目前,市場上已 推出適用於薄膜型FPC的遮罩膜,並廣泛應用在手機、數 位照相機、數位攝影機等小型電子產品中。 習知技術中,係採用塑膠材料作為電磁干擾之遮罩 膜,其製造方法可為於塑膠材與導電膠之間摻雜導電性之 $纖維或金屬顆粒,以形成導電型塑膠材料,然而,塑膠材 與導電性之纖維或金屬顆粒之膨脹係數、玻璃轉移溫度(Tg) 等特性不同,易造成結合性不佳、導電性降低等問題。另 一方面,或可藉由製程較繁複之離子束法、真空蒸鍍法、 濺鍍法、電鍍法等於塑膠材表面形成導電金屬膜,藉由導 電金屬膜對電磁波之遮罩效率以降低電磁波干擾。 另外,聚醯亞胺樹脂已廣泛地應用於電子材料中,其 中,主要係用於銅箔基板之絕緣層,一般復區分為單面板 或雙面板。習知製造銅箔基板的方式主要有三種:(1)濺鍍 3 M441314 法(Sputtering)或電鐘法(Electroplating):即是以聚酿亞胺膜 為基材,利用真空濺鍍在該聚醯亞胺膜鍍上一層銅箔後, 再以電鍍法使銅厚度增加;(2)塗佈法(Casting):即以銅箔 為基材,將合成好的聚醯胺酸以精度的模頭擠壓塗佈在成 卷的銅箔上,經烘箱乾燥及亞醯胺化後形成無膠軟板基 材。惟,此塗佈法僅適用於單面軟板,若銅厚低於12微米 以下,則不適於雙面軟板基材的製造;以及(3)熱壓法 (Lamination):即以聚醯亞胺膜為基材,先塗上一層薄的熱 可塑性聚醯亞胺樹脂,經高溫硬化後,再利用高溫高壓將 該熱可塑性聚醯亞胺重新熔融並壓合銅箔。惟,此熱壓法 同樣不適用於厚度為12微米以下的銅箔。 有鑑於此,亟需要開發一種新穎的銅箔厚度小於或等 於5微米之遮蔽電磁干擾之材料。 【新型内容】 鑑此,本創作提供一種遮蔽電磁干擾之層結構,包 括:具有相對之第一表面及第二表面的覆金屬箔層;形成 於該覆金屬箔層之第一表面上的載體膜;以及形成於該覆 金屬箔層之第二表面上的膠黏層,其中,該覆金屬羯層係 夾置於該載體膜與膠黏層之間,且該覆金屬箔層與該載體 膜之厚度總和係介於56至143微米間。 本創作亦揭示一種具有遮蔽電磁干擾之層結構之軟 性印刷電路板,包括:具有線路結構之本體層;以及本創 作之遮蔽電磁干擾之層結構,係藉由該.遮蔽電磁干擾之層 結構的膠黏層貼合於該本體層上。 M441314 本創作係利用具有支樓體之金屬銅落,於发上塗佈聚 =物膜,製得具有支#體之覆金屬㈣層,並在該聚合物 ,上貼合載體膜,之後剝離支撐體,再與膠_貼合後, 得到本創作之遮蔽電磁干擾之層結構,其中,由於該載體 =提:補強支撐作用’使得該覆金屬箱層更容易剝離支 ,體’提南加工性。由此方法製得之具有超薄銅箱之覆金 屬泊層可料取代卫程_作輕性㈣㈣路板之歷 遮罩材料,可在提高遮罩效果同時使軟性印刷電路板具有 較佳的柔軟性與撓曲性。 【實施方式】 以下係藉由特定的具體實例說明本創作之實施方 式,熟悉此技藝之人士可由本說明書所揭示之内容輕易地 瞭解本創作之優點及功效。本創作亦可以其它不同的方式 予以實施,即,在不惊離本創作所揭示之範缚下,能予不 同之修飾與改變。 鲁帛1 示本_之遮蔽電磁干擾之層結構110, 包括覆金屬羯層114;具有相對之第一表面心及第二表 面mb ;載體膜116,係形成於該覆金屬制ιΐ4之第一 表面U4a上;以及膠黏層112,係形成於該覆金屬箱層ιΐ4 之第二表面114b上,使該覆金屬箱層114夹置於該載體膜 116與膠黏層112之間,其中,該覆金屬落層U4與該載 體膜116之厚度總和係介於56至143微米間。 第2圖係顯示本創作具有遮蔽電磁干擾之層結構210 之軟性印刷電祕·,包括本㈣·係具有線路結構 5 M441314 (未圖示);以及設置於該本體層220之遮蔽電磁干擾之層 結構210,係包括覆金屬箔層214、形成於該覆金屬箔層 214上之載體膜216以及藉以黏合於該本體層220上之膠 黏層212,其中,該覆金屬箔層214係包括金屬箔2142、 以及形成其上之聚合物膜2141。 於本創作中,覆金屬箔層之聚合物膜可為聚醯胺-醯 亞胺膜或聚醯亞胺膜,較佳為聚醯胺-醯亞胺膜,且該覆金 屬箔層之金屬箔係夾置於膠黏層和聚合物膜之間,其中, 以重量百分比計,該聚合物膜含有3至40重量%之選自碳 黑、二氧化鈦、黑色顏料或其混合物之消光粉。 於本創作之具體實例中,係使用銅箔作為金屬箔,且 該金屬箔之厚度通常係介於1至5微米間之範圍,較佳係 介於1至3微米間之範圍,且更佳係介於1至2微米間之 範圍。 本創作所使用之聚合物膜之厚度通常係介於5至13 微米間,較佳係介於5至8微米間之範圍,且更佳係介於 5至6微米間之範圍。 作為本創作之載體膜,例如可使用(但不限於):聚乙 烯對苯二甲酸酯(PET)、聚乙烯(PE)、聚丙烯(PP)等,其中, 該載體膜之材質較佳係使用聚乙烯對苯二曱酸酯,且該載 體膜之厚度係介於50至125微米間。 本創作之遮蔽電磁干擾之層結構可利用塗佈法形 成。例如,以具有支撐體之銅箔為基材,將合成所得之聚 醯胺-醯亞胺溶於N-曱基-2-吡咯啶酮(NMP)中,並加入 M441314 . « · 20wt%比例的碳黑以調整黏度,待真空静置消泡後,以精 密塗佈方式塗佈於具有支撐體之銅箔,接著在230°C以下 的溫度烘烤,以形成無膠的黑色覆銅箔層。之後,在黑色 覆銅箔層上利用加壓貼合一厚度50至125微米的載體膜之 後,自該覆銅箔層剝離支撐體銅。據此,可有效率且確實 地獲得極薄銅箔與聚醯胺-醯亞胺之無膠覆銅箔層。 ' 本創作利用具有支撐體之銅箔直接塗佈聚合物膜製 得覆銅箔層,由於聚合物膜内摻雜有碳黑,故具有良好的 鲁遮蔽消光效果。 於另一具體實施例中,本創作之遮蔽電磁干擾之層結 構亦可將聚醯胺酸塗佈於銅箔上,經烘箱乾燥以及亞醯胺 化(imidization),以形成單面無膠的覆銅箔膜。 在聚醯胺酸或聚醯胺-醯亞胺塗料的結構設計上,係 利用捲繞式傳輸技術(Roll To Roll)薄銅化技術,以製得5 微米厚度以下之銅箔。 $ 較佳地,除了可將碳黑摻雜進聚醯胺-醯亞胺膜中 外,亦可摻雜二氧化鈦、黑色顏料或其混合物等之消光粉, 以使其具有良好的消光效果。於製作上,係利用含浸滾輪 沾附包含膠黏劑及消光粉之液體,使得該液體得以被塗佈 於該聚醯胺-醯亞胺層表面上,能在保持該聚醯胺-醯亞胺 膜的性能下,同時達到消光的效果。 綜上所述,本創作之遮蔽電磁干擾之層結構之覆銅箔 層係由極薄銅箔與聚醯胺-醯亞胺膜組成,其係將聚醯胺-醯亞胺塗料均勻的塗佈於成卷的具有支撐體之超薄銅箔 7 M441314 上,由於是在相對較低溫下成膜,故不會破壞支撐體與銅 箔之間的有機層,使支撐體易於剝離,並具有不污染銅箔 面的優點。 據此,本創作之遮蔽電磁干擾之層結構具有優異的遮 蔽電磁干擾效果、良好的柔軟性與可撓性、及優異強度與 電氣特性,適用於翻蓋、滑蓋手機及扁平化電子產品中。 實施例 實施例1至6 本創作之遮蔽電磁干擾之層結構可藉由使用塗佈 法,將合成所得之聚醯胺-醯亞胺(PAI)完全溶解於N-甲基 -2-吡咯啶酮(NMP)中,並加入20wt%的碳黑以調整黏度, 待真空靜置消泡後,以精密塗佈方式塗佈於具有支撐體(材 質為銅)之銅箔上,以形成半成品遮蔽電磁干擾之層結構 層。將該半成品遮蔽電磁干擾之層結構層置入密閉式氮氣 烘箱,氮氣烘箱之氧含量需控制在低於0.5%,最佳地,係 可保持在0.2%以下或是更低,而其加熱溫度為50°C〜350 度(°C)、烘烤時間為15至240分鐘。接著,進行脫水乾燥 及環化(imidization)或可直接乾燥,以製作成覆銅箔層。之 後,在該覆銅箔層上貼合一材質為聚乙烯對苯二曱酸酯 (PET)之載體膜,並將支撐體剝離。接著,藉異方向性導電 膠膜(ACF)或等方向性導電膠膜的膠黏層直接使用於已完 成線路部佈局的軟性印刷電路板上,並可剝離載體膜以形 成不同厚度且具有遮蔽電磁干擾之層結構之軟性印刷電路 M441314 . • ·M44131.4 . I · V. New description: [New technical field] This creation is about a layer structure that shields electromagnetic interference. More specifically, it relates to a shielding electromagnetic for flexible printed circuit boards. Interference layer structure. [Prior Art] As electronic products are becoming lighter, shorter, smaller, more functional, and more advanced. As a result, many of the wiring materials for small-sized electronic products have been designed with flexible printed circuits (FPC) with high Φ and high flexibility, and have been developed with various functions and high speeds. Countermeasures against electromagnetic interference (EMI). At present, a mask film suitable for a film type FPC has been introduced on the market, and is widely used in small electronic products such as mobile phones, digital cameras, and digital cameras. In the prior art, a plastic material is used as a mask film for electromagnetic interference, and the manufacturing method may be that a conductive material such as fiber or metal particles is doped between the plastic material and the conductive rubber to form a conductive plastic material. Plastic materials and conductive fibers or metal particles have different expansion coefficients and glass transition temperatures (Tg), which may cause problems such as poor bonding and reduced conductivity. On the other hand, the ion beam method, the vacuum evaporation method, the sputtering method, and the electroplating method can be used to form a conductive metal film on the surface of the plastic material, and the electromagnetic wave masking efficiency of the conductive metal film can reduce the electromagnetic wave. interference. Further, polyimine resins have been widely used in electronic materials, and are mainly used for insulating layers of copper foil substrates, and are generally classified into single-panel or double-panel. There are three main ways to manufacture copper foil substrates: (1) Sputtering 3 M441314 (Sputtering) or Electroplating (Electroplating): that is, using a polyiminoimide film as a substrate, using vacuum sputtering on the poly After the yttrium imide film is coated with a layer of copper foil, the thickness of the copper is increased by electroplating; (2) coating method (Casting): using copper foil as a substrate, the synthesized polylysine is accurately molded. The head is extrusion coated on a roll of copper foil, dried in an oven and amidated to form a glueless soft board substrate. However, the coating method is only applicable to a single-sided flexible board, and if the copper thickness is less than 12 μm, it is not suitable for the manufacture of a double-sided flexible board substrate; and (3) Lamination: The imine film is a substrate, which is first coated with a thin thermoplastic polyimine resin. After high temperature hardening, the thermoplastic polyimine is remelted and pressed with copper foil by high temperature and high pressure. However, this hot pressing method is also not applicable to copper foil having a thickness of 12 μm or less. In view of this, it is desirable to develop a novel material having a copper foil thickness less than or equal to 5 microns for shielding electromagnetic interference. [New content] Accordingly, the present invention provides a layer structure for shielding electromagnetic interference, comprising: a metal foil layer having a first surface and a second surface; and a carrier formed on the first surface of the metal foil layer a film; and an adhesive layer formed on the second surface of the metal foil layer, wherein the metal layer is sandwiched between the carrier film and the adhesive layer, and the metal foil layer and the carrier The sum of the thickness of the film is between 56 and 143 microns. The present invention also discloses a flexible printed circuit board having a layer structure for shielding electromagnetic interference, comprising: a body layer having a line structure; and a layer structure for shielding electromagnetic interference of the present invention, which is a layer structure for shielding electromagnetic interference An adhesive layer is attached to the body layer. M441314 This creation system uses a metal copper drop with a branch body to coat a poly-material film on the hair to produce a metal-clad (four) layer with a support body, and the carrier film is attached to the polymer, and then peeled off. After the support body is bonded to the glue _, the layer structure of the shielded electromagnetic interference of the present invention is obtained, wherein the metal-clad layer is more easily peeled off due to the carrier=reinforcing support function, and the body is processed. Sex. The metal-clad layer with the ultra-thin copper box obtained by the method can replace the shield _ as a light (four) (four) road board mask material, which can improve the mask effect and make the flexible printed circuit board have better Softness and flexibility. [Embodiment] The following describes the implementation of the present invention by a specific specific example, and those skilled in the art can easily understand the advantages and effects of the present invention by the contents disclosed in the present specification. This creation can also be implemented in a variety of different ways, that is, without modification and change without departing from the scope of this creation.帛 帛 遮蔽 遮蔽 遮蔽 电磁 电磁 电磁 电磁 电磁 电磁 电磁 电磁 电磁 遮蔽 遮蔽 遮蔽 遮蔽 遮蔽 遮蔽 遮蔽 遮蔽 遮蔽 遮蔽 遮蔽 遮蔽 遮蔽 遮蔽 遮蔽 遮蔽 遮蔽 遮蔽 遮蔽 遮蔽 遮蔽 遮蔽 遮蔽 遮蔽 遮蔽 电磁 遮蔽 电磁 电磁 电磁 电磁 电磁 电磁 电磁 电磁 电磁 电磁On the surface U4a, and the adhesive layer 112 is formed on the second surface 114b of the metal-clad layer ι4, so that the metal-clad layer 114 is sandwiched between the carrier film 116 and the adhesive layer 112, wherein The sum of the thickness of the metallized layer U4 and the carrier film 116 is between 56 and 143 microns. Fig. 2 is a view showing a soft printed circuit having a layer structure 210 for shielding electromagnetic interference, including the circuit structure 5 M441314 (not shown); and shielding electromagnetic interference provided in the body layer 220. The layer structure 210 includes a metal foil layer 214, a carrier film 216 formed on the metal foil layer 214, and an adhesive layer 212 adhered to the body layer 220. The metal foil layer 214 includes A metal foil 2142, and a polymer film 2141 formed thereon. In the present invention, the metal foil-coated polymer film may be a polyamide-imine film or a polyimide film, preferably a polyamide-imine film, and the metal of the metal foil layer The foil clip is interposed between the adhesive layer and the polymer film, wherein the polymer film contains, by weight percent, from 3 to 40% by weight of a matting powder selected from the group consisting of carbon black, titanium dioxide, black pigment or a mixture thereof. In a specific example of the present invention, a copper foil is used as the metal foil, and the thickness of the metal foil is usually in the range of 1 to 5 μm, preferably in the range of 1 to 3 μm, and more preferably The range is between 1 and 2 microns. The thickness of the polymeric film used in this creation is typically between 5 and 13 microns, preferably between 5 and 8 microns, and more preferably between 5 and 6 microns. As the carrier film of the present invention, for example, but not limited to: polyethylene terephthalate (PET), polyethylene (PE), polypropylene (PP), etc., wherein the carrier film is preferably made of a material Polyethylene terephthalate is used, and the thickness of the carrier film is between 50 and 125 microns. The layer structure for shielding electromagnetic interference of the present invention can be formed by a coating method. For example, using a copper foil having a support as a substrate, the synthetic polyamidoamine-imine is dissolved in N-mercapto-2-pyrrolidone (NMP) and added to M441314. « · 20wt% ratio The carbon black is adjusted in viscosity, and after being vacuum-deactivated and defoamed, it is applied to the copper foil having the support by precision coating, and then baked at a temperature below 230 ° C to form a black copper-free foil without glue. Floor. Thereafter, a carrier film having a thickness of 50 to 125 μm is bonded to the black copper clad layer by pressure, and the support copper is peeled off from the copper clad layer. According to this, the non-rubber-coated copper foil layer of the ultra-thin copper foil and the polyamidamine-imine can be obtained efficiently and surely. 'This creation uses a copper foil with a support to directly coat the polymer film to produce a copper-clad layer. Since the polymer film is doped with carbon black, it has a good ruin and matte effect. In another embodiment, the layered structure of the electromagnetic interference shielding of the present invention can also be coated with polylysine on copper foil, dried by oven and imidized to form a single-sided glueless Copper clad film. In the structural design of poly-plysine or polyamido-ylimine coatings, a roll-to-roll thinning technique is used to produce copper foils having a thickness of 5 microns or less. Preferably, in addition to doping the carbon black into the polyimide film, the matting powder such as titanium dioxide, black pigment or a mixture thereof may be doped to have a good matting effect. In the production, the liquid containing the adhesive and the matting powder is adhered by the impregnating roller, so that the liquid can be coated on the surface of the polyimide-imine layer, and the polyamine can be maintained. Under the performance of the amine film, the matting effect is simultaneously achieved. In summary, the copper-clad layer of the layer structure of the electromagnetic interference shielding of the present invention is composed of an ultra-thin copper foil and a polyimide-imine film, which is uniformly coated with a polyimide-imine coating. On the ultra-thin copper foil 7 M441314 with a support on a roll, since it is formed at a relatively low temperature, the organic layer between the support and the copper foil is not broken, and the support is easily peeled off, and has Does not pollute the advantages of the copper foil surface. Accordingly, the layered structure of the electromagnetic interference shielding of the present invention has excellent shielding electromagnetic interference effect, good flexibility and flexibility, and excellent strength and electrical characteristics, and is suitable for use in flip covers, slider phones, and flat electronic products. EXAMPLES Examples 1 to 6 The layer structure of the occlusion electromagnetic interference of the present invention can be completely dissolved in N-methyl-2-pyrrolidine by using a coating method by using a polyamine-quinone imine (PAI) synthesized by a coating method. In the ketone (NMP), 20wt% carbon black is added to adjust the viscosity. After the vacuum is allowed to defoam, it is applied to the copper foil with the support (copper material) by precision coating to form the semi-finished product. Layer structure layer of electromagnetic interference. The layer structure layer shielding the electromagnetic interference of the semi-finished product is placed in a closed nitrogen oven, and the oxygen content of the nitrogen oven is controlled to be less than 0.5%, and optimally, the temperature can be kept below 0.2% or lower, and the heating temperature thereof is maintained. It is from 50 ° C to 350 ° C (° C.) and the baking time is from 15 to 240 minutes. Next, dehydration drying and imidization or direct drying are carried out to prepare a copper clad layer. Thereafter, a carrier film made of polyethylene terephthalate (PET) was bonded to the copper clad layer, and the support was peeled off. Then, the adhesive layer of the directional conductive film (ACF) or the isotropic conductive film is directly used on the flexible printed circuit board on which the line portion layout has been completed, and the carrier film can be peeled off to form different thicknesses and have shielding. Soft printed circuit of layer structure of electromagnetic interference M441314 .

V 19— juX / » τΟ » -U- λ f — 板,兵結果如衣i所不。 比較例1 : 分別使用厚度為18μιη及9 μιη之南亞電解銅箔做為 金屬箔,形成如第1圖所示之遮蔽電磁干擾之層結構,製 作軟性印刷電路板測試樣品試片。 表1 實施 例1 實施 例2 貫施 例3 貫施 例4 貫施 例5 比較 例1 比較 例2 a.聚醯胺-醯亞胺膜 (μιη) 13 13 8 5 5 13 13 b.聚乙烯對苯二甲 酸西旨(ΡΕΤ) (μηι) 50 75 75 100 125 0 0 c.銅箔(μιη) 5 3 2 1 1 18 9 d.導電谬膜(μπι) 17 17 17 12 10 17 10 本體層(μηι) 45 45 45 45 45 45 45 總厚度(μηι) 85 108 102 118 141 48 32 測試例: 分別將上述實施例1至5及比較例1及2所製成不同 厚度之電路板樣品裁取成合適大小之測試樣片,進行柔軟 性、滑台測試與彎折測試,並於滑台測試與彎折測試後計 算阻值變化率與電磁波屏蔽率(%)、表面電阻及熱耐久性 (Heat Durability) 〇 柔軟性測試:使用第3圖所示之裝置進行,其測試條件為 9 M441314 電壓為AC220V、測量範圍為410克、可讀性為0.001克 以及測試R角2.35毫米(mm)。柔軟性之測試方法如下: 1. 調整測試天平測試座的兩個支撐腳,對其測試座進行水 平校正。 2. 開啟天平電源,按一下TARE鍵,將天平本身重量予以 歸零。 3. 開啟天平玻璃門,將試片300 (尺寸10mmx30mm) —端 固定於試片托盤上方的夾座處,另一端則卡在試片托盤 中心的卡座上,使試片300彎曲成一“U”字形,並於上方 夾座處放置一 500公克之砝碼,做為測試時之荷重。試 片300安置完畢後關上天平玻璃門。 4. 逆時針方向慢慢旋轉測試儀器右端旋鈕,使試片卡座緩 慢下降,直至其與下方墊片接觸,此時試片R角即為 2.35mm。 5. 待測試天平“OK”指示燈亮後,即可讀取天平上試片300 反彈力讀數。 6. 測試完畢後,將旋鈕順時針旋轉至原位,開啟玻璃門, 取下試片300。 7. 重複3-6步驟,測試其他試片300。 滑台測試:藉由滑台測試儀(ICP-TM-650)測試樣片以計算 其阻值變化率,其測試條 3.0mm、R角處1>5111 ;電屋為AC220V、間距 試方法如下: (轉迷)rpm。滑台測 1 ·調整測試儀的兩個支樓腳, 2·接通儀器電源,將儀器清零 設定:測試條件: 將試片固定在測試機臺上。 間距 3.0lnm,R 角處 1.5mm 速度=400 rpm 至原位,取下試片 3.待指示燈錢’既可記錄試驗職資料 4·測試完畢後,將旋鈕順時針旋 5.重複上述步驟,測試其他試片 猎Μ折實驗機⑽心观87)測試樣片以計 异其阻值變化率’其測試條件為電壓為从2請、彎曲角 ,為〇至160度、彎曲速度為4G次/分以及彎曲R角:15 毫米(半徑)。彎折測試之測試步驟如下: ^開機前檢查機器設備,確保無異常。 2. 把開關至於“開”檔,電源指示燈亮。 3. 計數器清零。 4·用透明膠安裝好試片,接通線路。 5. 按“啟動”鍵,開始彎折測試,調整速度旋紐至所需速度。 6. 待指示燈亮後,既可記錄測試資料。 M441314 上述測試結果如表2所示。 表2 實施 例1 貫施 例2 實施 例3 實施 例4 實施 例5 比較 例1 比較 例2 柔軟性(gf) 20.2 24.4 24.9 27.1 27.8 9.2 10.1 滑台 測試 次數 (萬次) 33 31 30 32 33 10 15 阻值變化 率(%) 2.7 2.6 2.0 2.1 2.0 5.2 4.1 彎折 測試 次數 (萬次) 20 19 18 17 14 4 6 阻值變化 率(%) 2.7 2.6 2.1 2.0 2.0 30.0 28 電磁波 屏蔽率 EMI屏蔽 (dB) (1GHz) 65 61 60 62 61 70 68 表面電阻(Ω/口) 0.30 0.30 0.33 0.35 0.32 0.29 0.28 熱耐久性(°C) 300 300 300 300 300 300 300 根據表2之測試結果可知,本創作之遮蔽電磁干擾之 層結構作為軟性印刷電路板之EMI遮罩材料,可以在具有 遮罩效果同時,使軟性印刷電路板具有較佳的柔軟性與撓 曲性,且該軟性印刷電路板測試樣品試片經三十萬次之滑 台測試後,阻值變化率均未超過3.0% ,遠低於比較例1 阻值變化率的30%。 綜上所述,本創作之遮蔽電磁干擾之層結構具有優異 的柔軟性及可撓性,因此適用於翻蓋或滑蓋手機、數位照 12 M441314 . « * 相機、數位攝影機、平版電腦、智慧型手機等應闬,可周 來取代一般電磁波遮罩膜中的電子EMI屏蔽材料。 上述實施例僅例示性說明本創作之原理及其功效,而 非用於限制本創作。任何熟習此項技藝之人士均可在不違 背本創作之精神及範疇下,對上述實施例進行修飾與改 變。因此,本創作之權利保護範圍,應如後述之申請專利 ' 範圍所列。 【圖式簡單說明】 • 第1圖係本創作遮蔽電磁干擾之層結構之示意圖; 第2圖係本創作具有遮蔽電磁干擾之層結構之軟性印 刷電路板之示意圖;以及 第3圖係繪示本創作用以進行柔軟性測試之裝置。 【主要元件符號說明】 110 、 210 遮蔽電磁干擾之層結構 112 、 212 膠黏層 114 、 214 覆金屬箔層 114a 第一表面 114b 第二表面 116 、 216 載體膜 200 軟性印刷電路板 220 本體層 2141 聚合物膜 2142 金屬箔 300 試片 13V 19— juX / » τΟ » -U- λ f — board, the result of the soldier is not what I want. Comparative Example 1: A South Asian electrolytic copper foil having a thickness of 18 μm and 9 μm was used as a metal foil to form a layer structure for shielding electromagnetic interference as shown in Fig. 1 to prepare a flexible printed circuit board test sample test piece. Table 1 Example 1 Example 2 Example 3 Example 4 Example 5 Example 1 Comparative Example 2 a. Polyamine-imine film (μιη) 13 13 8 5 5 13 13 b. Polyethylene Terephthalic acid (旨) (μηι) 50 75 75 100 125 0 0 c. Copper foil (μιη) 5 3 2 1 1 18 9 d. Conductive tantalum film (μπι) 17 17 17 12 10 17 10 Body layer (μηι) 45 45 45 45 45 45 45 Total Thickness (μηι) 85 108 102 118 141 48 32 Test Example: The circuit board samples of different thicknesses made in the above Examples 1 to 5 and Comparative Examples 1 and 2 were respectively cut. Test specimens of appropriate size for softness, slide test and bending test, and calculate resistance change rate and electromagnetic wave shielding rate (%), surface resistance and thermal durability after the slide test and bending test (Heat Durability: 〇 Flexibility test: using the device shown in Figure 3, the test conditions are 9 M441314 voltage is AC220V, measuring range is 410 grams, readability is 0.001 grams and test R angle is 2.35 millimeters (mm). The test method for softness is as follows: 1. Adjust the two support feet of the test balance test stand and level the test stand. 2. Turn on the balance and press the TARE button to zero the weight of the balance itself. 3. Open the balance glass door, fix the test piece 300 (size 10mmx30mm) end to the clamp seat above the test piece tray, and the other end is stuck on the card holder at the center of the test piece tray, so that the test piece 300 is bent into a "U" "Glyph, and put a 500 gram weight on the upper holder, as the load when testing. After the test piece 300 is placed, close the balance glass door. 4. Rotate the right end of the test instrument counterclockwise slowly to lower the test strip holder until it contacts the lower spacer. The R angle of the test piece is 2.35mm. 5. After the “OK” indicator of the balance to be tested is illuminated, the rebound force reading of the test piece 300 on the balance can be read. 6. After the test is completed, turn the knob clockwise to the original position, open the glass door, and remove the test piece 300. 7. Repeat steps 3-6 to test the other test strips 300. Slide test: The sample is tested by the slide tester (ICP-TM-650) to calculate the resistance change rate. The test strip is 3.0 mm, the R angle is 1 > 5111, and the electric house is AC 220V. The pitch test method is as follows: (rebound) rpm. Slide test 1 · Adjust the two legs of the tester, 2. Turn on the instrument and clear the instrument. Setting: Test conditions: Fix the test piece on the test machine. Distance 3.0lnm, R angle 1.5mm Speed = 400 rpm to the original position, remove the test piece 3. Wait for the indicator light 'can record the test job information 4 · After the test is completed, turn the knob clockwise 5. Repeat the above steps Test other test piece hunting and folding machine (10) Heart 87) Test sample to calculate the resistance change rate 'The test conditions are voltage from 2 please, bending angle, 〇 to 160 degrees, bending speed is 4G times / minute and curved R angle: 15 mm (radius). The test procedure for the bending test is as follows: ^ Check the machine equipment before starting to ensure that there are no abnormalities. 2. Turn the switch to “on” and the power indicator will light. 3. The counter is cleared. 4. Install the test piece with the transparent glue and connect the line. 5. Press the “Start” button to start the bending test and adjust the speed knob to the desired speed. 6. After the indicator light is on, you can record the test data. M441314 The above test results are shown in Table 2. Table 2 Example 1 Example 2 Example 3 Example 4 Example 5 Comparative Example 1 Comparative Example 2 Flexibility (gf) 20.2 24.4 24.9 27.1 27.8 9.2 10.1 Number of slide test times (10,000 times) 33 31 30 32 33 10 15 Resistance change rate (%) 2.7 2.6 2.0 2.1 2.0 5.2 4.1 Bending test times (10,000 times) 20 19 18 17 14 4 6 Resistance change rate (%) 2.7 2.6 2.1 2.0 2.0 30.0 28 Electromagnetic wave shielding rate EMI shielding ( dB) (1GHz) 65 61 60 62 61 70 68 Surface resistance (Ω/port) 0.30 0.30 0.33 0.35 0.32 0.29 0.28 Thermal durability (°C) 300 300 300 300 300 300 300 According to the test results in Table 2, this creation The layer structure for shielding electromagnetic interference serves as an EMI mask material for a flexible printed circuit board, which can have a masking effect and a softness and flexibility of the flexible printed circuit board, and the flexible printed circuit board test sample After the test piece was tested for 300,000 times of sliding table, the resistance change rate did not exceed 3.0%, which was much lower than 30% of the resistance change rate of Comparative Example 1. In summary, the layered structure of the electromagnetic interference shielding of this creation has excellent flexibility and flexibility, so it is suitable for flip or slider mobile phones, digital photography 12 M441314. « * Camera, digital camera, lithography computer, smart type Mobile phones and the like should be replaced by electronic EMI shielding materials in general electromagnetic wave mask films. The above embodiments are merely illustrative of the principles of the present invention and their effects, and are not intended to limit the present invention. Any person skilled in the art can modify and change the above embodiments without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the rights of this creation shall be as listed in the scope of the patent application described later. [Simple description of the diagram] • Figure 1 is a schematic diagram of the layer structure of the electromagnetic interference shielding; Figure 2 is a schematic diagram of a flexible printed circuit board having a layer structure for shielding electromagnetic interference; and Figure 3 is a diagram showing This creation is used to perform a softness test. [Main component symbol description] 110, 210 Shielding electromagnetic interference layer structure 112, 212 adhesive layer 114, 214 metal foil layer 114a first surface 114b second surface 116, 216 carrier film 200 flexible printed circuit board 220 body layer 2141 Polymer film 2142 metal foil 300 test piece 13

Claims (1)

M441314 六、申請專利範圍: 1. 一種遮蔽電磁干擾之層結構,包括: 覆金屬箱層,具有相對之第一表面及第二表面; 載體膜,係形成於該覆金屬落層之第一表面上’ 以及 膠黏層,係形成於該覆金屬羯層之第二表面上, 使該覆金屬箱層夾置於該载體膜與勝黏層之間,其 中,該覆金屬㈣與該賴膜之厚度總和係介於% ^ 143微米間。 2. 如申請專㈣圍第i項所述之錢電軒擾之〜士 構,其中,該覆金屬搭層包括金屬落以及形成盆上之 聚合物膜,且該金屬落係夹置於該膠黏層和聚合物膜 之間。 3. 如中請專職圍第2項所述之輕電磁干擾之_ 其中’以重量百分比計’該聚合物膜含有㈣聚 ::膜重量計,3至40議之選自碳黑、二氧化鈦、 黑色顏料或其混合物之消光粉。 4. 5. 如申請專㈣圍第2項所狀錢電軒擾之層結 =其t,該金屬之厚度係介於i至5微米間,且 〇聚合物膜之厚度係介於5至13微米間。 =申請專利範圍第2項所述之遮蔽電磁干擾之層結 構’其t,該金屬箔為銅箔。 如申請專㈣圍第i項所述之錢f斜擾之層社 構’其中,該載體膜之材質為聚乙歸對笨二甲酸醋 6. M441314 . · (PET)、聚乙烯(PE)或聚丙烯(PP),且該載體膜之厚度 係介於50至125微米間。 7. 如申請專利範圍第2項所述之遮蔽電磁干擾之層結 構,其中,該聚合物膜係聚醯胺-醯亞胺膜或聚醯亞胺 膜。 8. —種具有遮蔽電磁干擾之層結構之軟性印刷電路板, ‘ 包括: ' 本體層,係具有線路結構;以及 • 如申請專利範圍第1至7項所述之遮蔽電磁干擾 之層結構'係錯由該遮紅電磁干擾之層結構的膠黏層 貼合於該本體層上。 15M441314 VI. Scope of Application: 1. A layer structure for shielding electromagnetic interference, comprising: a metal-clad layer having opposite first and second surfaces; a carrier film formed on the first surface of the metallized layer The upper layer and the adhesive layer are formed on the second surface of the metal-clad layer, so that the metal-clad layer is sandwiched between the carrier film and the winning layer, wherein the metal coating (four) and the Laying layer The sum of the thicknesses of the films is between % ^ 143 microns. 2. In the case of the application, the metal-clad layer includes a metal falling layer and a polymer film forming the pot, and the metal falling clip is placed thereon. Between the adhesive layer and the polymer film. 3. For example, please refer to the light electromagnetic interference mentioned in item 2 of the full-time _ where 'in weight percent' the polymer film contains (iv) poly:: film weight, 3 to 40 is selected from carbon black, titanium dioxide, A matting powder of black pigment or a mixture thereof. 4. 5. If you apply for the special (4) of the second item, the splicing of the money is as follows: t, the thickness of the metal is between i and 5 microns, and the thickness of the bismuth polymer film is between 5 and 13 microns. = The layer structure of the electromagnetic interference shielding layer described in claim 2, wherein the metal foil is a copper foil. For example, the application of the special (4) surrounding the i-th item of the money f-sloping layer of the community', the material of the carrier film is poly-B to the benzoic acid vinegar 6. M441314. · (PET), polyethylene (PE) Or polypropylene (PP), and the thickness of the carrier film is between 50 and 125 microns. 7. The layer structure for shielding electromagnetic interference according to claim 2, wherein the polymer film is a polyimide-yttrium imide film or a polyimide film. 8. A flexible printed circuit board having a layer structure that shields electromagnetic interference, 'includes: ' a body layer having a line structure; and a layer structure for shielding electromagnetic interference as described in claims 1 to 7' The adhesive layer of the layer structure of the red-light electromagnetic interference is attached to the body layer. 15
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI738545B (en) * 2020-10-21 2021-09-01 大陸商華通精密線路板(惠州)有限公司 Processing technology to improve the convenience of emi removal film

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI738545B (en) * 2020-10-21 2021-09-01 大陸商華通精密線路板(惠州)有限公司 Processing technology to improve the convenience of emi removal film

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