TWM482923U - Protective film - Google Patents
Protective film Download PDFInfo
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- TWM482923U TWM482923U TW103205589U TW103205589U TWM482923U TW M482923 U TWM482923 U TW M482923U TW 103205589 U TW103205589 U TW 103205589U TW 103205589 U TW103205589 U TW 103205589U TW M482923 U TWM482923 U TW M482923U
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- Prior art keywords
- protective film
- layer
- resin
- ink layer
- release
- Prior art date
Links
- 230000001681 protective effect Effects 0.000 title claims description 73
- 239000010410 layer Substances 0.000 claims description 71
- 239000012790 adhesive layer Substances 0.000 claims description 24
- 239000011347 resin Substances 0.000 claims description 14
- 229920005989 resin Polymers 0.000 claims description 14
- 239000000463 material Substances 0.000 claims description 12
- 229920001721 polyimide Polymers 0.000 claims description 9
- 239000000654 additive Substances 0.000 claims description 8
- 230000000996 additive effect Effects 0.000 claims description 8
- 239000003795 chemical substances by application Substances 0.000 claims description 7
- 239000003822 epoxy resin Substances 0.000 claims description 7
- 229920000647 polyepoxide Polymers 0.000 claims description 7
- 229920000642 polymer Polymers 0.000 claims description 6
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 claims description 4
- 239000004925 Acrylic resin Substances 0.000 claims description 4
- 229920000178 Acrylic resin Polymers 0.000 claims description 4
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 claims description 4
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 4
- 229920003192 poly(bis maleimide) Polymers 0.000 claims description 4
- 229910052707 ruthenium Inorganic materials 0.000 claims description 4
- 229920002803 thermoplastic polyurethane Polymers 0.000 claims description 4
- 229920001971 elastomer Polymers 0.000 claims description 3
- 239000000049 pigment Substances 0.000 claims description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims description 2
- 229910052731 fluorine Inorganic materials 0.000 claims description 2
- 239000011737 fluorine Substances 0.000 claims description 2
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 claims description 2
- 239000009719 polyimide resin Substances 0.000 claims description 2
- 239000004408 titanium dioxide Substances 0.000 claims description 2
- 239000010776 emu oil Substances 0.000 claims 1
- 229920002379 silicone rubber Polymers 0.000 claims 1
- 239000004945 silicone rubber Substances 0.000 claims 1
- 239000010408 film Substances 0.000 description 68
- 238000012360 testing method Methods 0.000 description 11
- 230000000052 comparative effect Effects 0.000 description 10
- 239000004642 Polyimide Substances 0.000 description 5
- 238000013461 design Methods 0.000 description 5
- 229920000139 polyethylene terephthalate Polymers 0.000 description 5
- 239000005020 polyethylene terephthalate Substances 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 239000002131 composite material Substances 0.000 description 4
- 239000013039 cover film Substances 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 239000004698 Polyethylene Substances 0.000 description 3
- 238000005452 bending Methods 0.000 description 3
- 239000006229 carbon black Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 229920000573 polyethylene Polymers 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000007641 inkjet printing Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 2
- -1 polyethylene terephthalate Polymers 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 238000010998 test method Methods 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229940044949 eucalyptus oil Drugs 0.000 description 1
- 239000010642 eucalyptus oil Substances 0.000 description 1
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000001023 inorganic pigment Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 238000013035 low temperature curing Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 239000012860 organic pigment Substances 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 238000001028 reflection method Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000001038 titanium pigment Substances 0.000 description 1
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Laminated Bodies (AREA)
- Inks, Pencil-Leads, Or Crayons (AREA)
Description
本創作係關於保護膜，更詳而言，尤指一種用於保護銅箔基板或印刷電路板之保護膜。This creation relates to protective films, and more particularly to a protective film for protecting a copper foil substrate or a printed circuit board.
印刷電路板是電子產品中不可或缺的材料，而隨著消費性電子產品需求增加，對於印刷電路板的需求也是與日俱增。目前商業上小型電子產品不僅要向更小型、輕量化發展，具自由度的設計性也是一大要素。因此配線材料大多採用設計自由度高、彎曲性良好的軟性印刷電路板(Flexible Printed Circuit，FPC)，在FPC領域，不僅是對主流的智慧型手機，對觸控面板設計的新需求也在不斷擴大，並且在FPC不斷向高速度化、高撓曲發展也同時希望能於各種厚度、作業性有所突破。Printed circuit boards are an indispensable material in electronic products, and as the demand for consumer electronics increases, so does the demand for printed circuit boards. At present, commercial small-sized electronic products not only have to be smaller and lighter, but also have a degree of freedom in design. Therefore, most of the wiring materials are flexible printed circuit (FPC) with high design freedom and good flexibility. In the FPC field, not only the mainstream smart phones, but also new demands for touch panel design. In the FPC, it is expected to be able to achieve breakthroughs in various thicknesses and workability as the FPC continues to develop at a high speed and high flexibility.
一般而言，軟性印刷電路板主要係由銅箔基板(FCCL，Flexible Copper Clad Laminate)和保護膜(CL，Coverlay)所構成，一般使用塑膠膜片作為保護膜，或者利用網版印刷技術形成一層薄絕緣油墨作為保護膜。這些習知保護膜存在著厚度膠厚、填充性不均勻、保護膜自身使用壽命的問題。In general, flexible printed circuit boards are mainly composed of a copper foil substrate (FCCL, Flexible Copper Clad Laminate) and a protective film (CL, Coverlay). Generally, a plastic film is used as a protective film, or a layer is formed by screen printing technology. A thin insulating ink acts as a protective film. These conventional protective films have problems in that the thickness of the protective film is thick, the filling property is uneven, and the life of the protective film itself is long.
聚醯亞胺樹脂(Polyimide，PI)目前已廣泛地應用於電 子材料中，除了可作為FPC之基板外，目前市場上已推出了傳統PI複合膜、感光型PI(或壓克力系)複合膜、非感光型PI複合膜或感光型壓克力系複合膜等。然而，聚醯亞胺樹脂多為高度透光性的色度，導致用作為FPC保護膜時，使FPC的線路層之線路設計輕易解讀而被競爭同業抄襲，進而對產品市場銷售造成影響。因此，目前市場上大部分的保護膜為亮光性聚醯亞胺薄膜，而為了使聚醯亞胺複合膜具有遮蔽電路佈局的功能，習知保護膜使用兩層油墨層以達到遮蔽線路之效果，如第1圖所示。Polyimide (PI) is widely used in electricity. Among the sub-materials, in addition to being used as a substrate for FPC, a conventional PI composite film, a photosensitive PI (or acrylic) composite film, a non-photosensitive PI composite film or a photosensitive acrylic composite has been introduced on the market. Membrane and the like. However, the polyimine resin is mostly highly translucent, which results in the use of the FPC protective film to make the circuit design of the circuit layer of the FPC easy to interpret and be plagiarized by the same industry, thereby affecting the sales of the product market. Therefore, most of the protective films on the market are bright-light polyimide films, and in order to make the polyimide film have the function of shielding the circuit layout, the conventional protective film uses two layers of ink to achieve the effect of shielding the circuit. As shown in Figure 1.
請參閱第1圖，係習知保護膜之剖面示意圖。如第1圖所示之保護膜1係包括：離型紙15；黏著層14，係形成於該離型紙15上；第二覆蓋層13，係形成於該黏著層14上；第一覆蓋層12，係形成於該第二覆蓋層13上；以及離型層11，係形成於該第一覆蓋層12上。然而，進行二次塗佈形成第一覆蓋層12及第二覆蓋層13雖可滿足遮蔽線路及滿足啞光(matte)的霧面的要求，卻也同時造成保護膜之厚度增加，而後用於FPC更降低FPC之撓曲性。又，為防止習知保護膜於保存或製造時發生捲曲，通常會於黏著層14上貼合離型紙15，並於使用前將將該離型紙15移除。有鑑於此，業界亟須開發一種不會捲曲、不需離型紙，又具有高遮蔽性、輕量化及高撓曲等特性之保護膜，以使軟性印刷電路板不僅具有輕量化及高撓曲之特性，更能保護線路設計不為同業剽竊。Please refer to Fig. 1, which is a schematic cross-sectional view of a conventional protective film. The protective film 1 as shown in FIG. 1 includes: a release paper 15; an adhesive layer 14 formed on the release paper 15; and a second cover layer 13 formed on the adhesive layer 14; the first cover layer 12 And formed on the second cover layer 13; and the release layer 11 is formed on the first cover layer 12. However, the secondary coating to form the first cover layer 12 and the second cover layer 13 can satisfy the requirements of the shielding line and the matte matte surface, but at the same time, the thickness of the protective film is increased, and then used for FPC reduces the flexibility of FPC. Further, in order to prevent the conventional protective film from being curled during storage or manufacture, the release paper 15 is usually attached to the adhesive layer 14, and the release paper 15 is removed before use. In view of this, there is no need for the industry to develop a protective film that does not require curling, does not require release paper, and has high shielding properties, light weight, and high flexibility, so that the flexible printed circuit board is not only lightweight and highly flexible. Its characteristics can better protect the circuit design from plagiarism.
鑑此，本創作提供一種保護膜，係包括：黏著層；形成於該黏著層上之油墨層；以及形成於該油墨層上之離型層，使該油墨層夾置於離型層與黏著層之間。Accordingly, the present invention provides a protective film comprising: an adhesive layer; an ink layer formed on the adhesive layer; and a release layer formed on the ink layer, the ink layer being sandwiched between the release layer and the adhesive layer Between the layers.
於前述之保護膜中，該油墨層之厚度係介於1至10微米，較佳係介於3至5微米，最佳為5微米。In the foregoing protective film, the ink layer has a thickness of from 1 to 10 μm, preferably from 3 to 5 μm, most preferably 5 μm.
於前述之保護膜中，該油墨層包括聚合物及添加物。於前述之保護膜中，該聚合物係選自環氧樹脂、丙烯酸系樹脂、胺基甲酸酯系樹脂、矽橡膠系樹脂、聚對環二甲苯系樹脂、雙馬來醯亞胺系樹脂及聚醯亞胺樹脂所組成群組之至少一者。In the foregoing protective film, the ink layer includes a polymer and an additive. In the above protective film, the polymer is selected from the group consisting of an epoxy resin, an acrylic resin, a urethane resin, a ruthenium rubber resin, a polyparaxylene resin, and a bismaleimide resin. And at least one of the group consisting of polyimine resins.
於較佳實施例中，該聚合物係為聚醯亞胺，相較於一般覆蓋膜所用之材料，其於彩色遮蔽、柔軟性、厚度、抗化學性及可撓性方面具有較佳特性，亦具有良好的電氣特性。In a preferred embodiment, the polymer is a polyimine which has better properties in terms of color masking, softness, thickness, chemical resistance and flexibility than the material used for the general cover film. It also has good electrical properties.
此外，其低溫固化的特性，特別適合以噴塗或印刷形成本創作之油墨層。本創作之油墨層係藉由噴墨或印刷的方式形成，是以，該油墨層之厚度可低於5微米，為習知保護膜難以達到之厚度。In addition, its low-temperature curing characteristics are particularly suitable for spraying or printing to form the ink layer of the present invention. The ink layer of the present invention is formed by inkjet or printing, so that the thickness of the ink layer can be less than 5 micrometers, which is a thickness which is difficult to achieve by a conventional protective film.
於前述之保護膜中，該添加物係選自碳粉、二氧化鈦、顏料或染料，其中，以該油墨層之重量計，該添加物之含量係介於3至25%。於前述保護膜中，該顏料包括有機顏料或無機顏料。In the foregoing protective film, the additive is selected from the group consisting of carbon powder, titanium dioxide, pigment or dye, wherein the content of the additive is from 3 to 25% by weight of the ink layer. In the aforementioned protective film, the pigment includes an organic pigment or an inorganic pigment.
於前述之保護膜中，該油墨層之明度為35以下。於前述之保護膜中，於光入射角為60°之條件下該油墨層之光 澤度為20以下。In the above protective film, the ink layer has a lightness of 35 or less. In the foregoing protective film, the light of the ink layer is at a light incident angle of 60°. Zedu is 20 or less.
於前述之保護膜中，該黏著層之材料係選自環氧樹脂、丙烯酸系樹脂、胺基甲酸酯系樹脂、矽橡膠系樹脂、聚對環二甲苯系樹脂、雙馬來醯亞胺系樹脂及聚醯亞胺樹脂所組成群組之至少一者。於前述之保護膜中，該黏著層之厚度係介於8至60微米。In the above protective film, the material of the adhesive layer is selected from the group consisting of an epoxy resin, an acrylic resin, a urethane resin, a ruthenium rubber resin, a polyparaxylene resin, and a bismaleimide. At least one of a group consisting of a resin and a polyimide resin. In the foregoing protective film, the thickness of the adhesive layer is between 8 and 60 microns.
於前述之保護膜中，該離型層具有相對之第一及第二表面，且該第一及第二表面皆具有離型劑。於前述之保護膜中，該離型層之厚度係介於25至150微米。In the foregoing protective film, the release layer has opposite first and second surfaces, and the first and second surfaces each have a release agent. In the foregoing protective film, the release layer has a thickness of 25 to 150 μm.
於前述之保護膜中，該離型層之材料並未有特殊限制，較佳之離型層材料係包括聚對苯二甲酸乙二酯(polyethylene terephthalate，PET)或聚乙烯(polyethylene，PE)。In the foregoing protective film, the material of the release layer is not particularly limited. Preferably, the release layer material comprises polyethylene terephthalate (PET) or polyethylene (PE).
於前述之保護膜中，該離型劑包括，但不限於：矽油、氟素離型劑、硬脂酸鹽。於較佳實施例中，該離型層為PET氟素離型膜、PET含矽油離型膜或PE離型膜。由於離型層兩表面具有離型劑，故製作完成保護膜後即可收捲，縮短製程時間，並可避免習知技術貼合離型紙，在後續裁切時造成毛邊、掉屑等問題。In the foregoing protective film, the release agent includes, but is not limited to, eucalyptus oil, a fluorine release agent, and a stearate. In a preferred embodiment, the release layer is a PET fluorocarbon release film, a PET ruthenium oil release film or a PE release film. Since the two surfaces of the release layer have a release agent, the film can be wound up after the completion of the protective film, shortening the process time, and avoiding the prior art to fit the release paper, causing problems such as burrs and chipping during subsequent cutting.
於前述之保護膜中，該保護膜之厚度係介於11至68微米，於較佳實施例中，該保護膜之厚度係介於13至65微米。In the foregoing protective film, the protective film has a thickness of 11 to 68 μm. In a preferred embodiment, the protective film has a thickness of 13 to 65 μm.
綜上所述，本創作之保護膜中的油墨層除了具有抗化學性及可撓性外，更具有較薄之厚度、較佳之柔軟性及良 好的電氣特性，又具有彩色遮蔽性可遮蔽線路圖案。適用於翻蓋、滑蓋手機、數位照相機、數位攝影機、平版電腦、智慧型手機等有彎折或滑動電路板需求的產品應用，用以取代習知保護膜。In summary, the ink layer in the protective film of the present invention has thinner thickness, better softness and goodness in addition to chemical resistance and flexibility. Good electrical characteristics, and color shielding can shield the line pattern. It is suitable for product applications such as flip-tops, slider phones, digital cameras, digital cameras, lithography computers, smart phones, etc., which have the requirements of bending or sliding circuit boards, to replace the conventional protective film.
1、2‧‧‧保護膜1, 2‧‧‧ protective film
11、21‧‧‧離型層11, 21‧‧‧ release layer
12‧‧‧第一覆蓋層12‧‧‧First cover
13‧‧‧第二覆蓋層13‧‧‧Second overlay
14、24‧‧‧黏著層14, 24‧‧‧ adhesive layer
15‧‧‧離型紙15‧‧‧ release paper
22‧‧‧油墨層22‧‧‧Ink layer
第1圖係顯示習知保護膜的剖面示意圖；以及第2圖係顯示本創作之保護膜的剖面示意圖。Fig. 1 is a schematic cross-sectional view showing a conventional protective film; and Fig. 2 is a schematic cross-sectional view showing the protective film of the present invention.
本創作可藉由參照下列詳細說明與例示性實施例而充分了解本創作，該等說明及實施例係用於舉例說明本創作之非限制性具體實施例。The present invention is fully understood by reference to the following detailed description and exemplary embodiments, which are intended to illustrate non-limiting embodiments of the present invention.
須知，本說明書所附圖式所繪示之結構、比例、大小等，均僅用以配合說明書所揭示之內容，以供熟悉此技藝之人士之瞭解與閱讀，並非用以限定本創作可實施之限定條件，任何結構之修飾、比例關係之改變或大小之調整，在不影響本創作所能產生之功效及所能達成之目的下，均應仍落在本創作所揭示之技術內容得能涵蓋之範圍內。同時，本說明書中所引用之如「上」及「一」等之用語，亦僅為便於敘述之明瞭，而非用以限定本創作可實施之範圍，其相對關係之改變或調整，在無實質變更技術內容下，當亦視為本創作可實施之範疇。It is to be understood that the structure, the proportions, the size and the like of the drawings are only used in conjunction with the disclosure of the specification for the understanding and reading of those skilled in the art, and are not intended to limit the implementation of the present invention. The qualifications, the modification of any structure, the change of the proportional relationship or the adjustment of the size, should not fall under the purpose of the creation and the purpose of the creation, should still fall within the technical content revealed by this creation. Within the scope of coverage. In the meantime, the terms "upper" and "one" as used in this specification are for convenience of description only, and are not intended to limit the scope of implementation of the creation, and the relative relationship is changed or adjusted. Under the technical content of substantive changes, it is also considered to be the scope of implementation of this creation.
請參閱第2圖，係為本創作之保護膜的剖面示意圖。如第2圖所示，本創作之保護膜2係包括：黏著層24；油墨層22，係形成於該黏著層24上；以及離型層21，係形 成於該油墨層22上，使該油墨層22夾置於離型層21與黏著層24間，於欲使用本創作之保護膜2遮蔽線路時，可將輔助用之離型層21移除。Please refer to Fig. 2, which is a schematic cross-sectional view of the protective film of the present invention. As shown in FIG. 2, the protective film 2 of the present invention comprises: an adhesive layer 24; an ink layer 22 formed on the adhesive layer 24; and a release layer 21, a shape Formed on the ink layer 22, the ink layer 22 is sandwiched between the release layer 21 and the adhesive layer 24. When the protective film 2 of the present invention is used to shield the wiring, the auxiliary release layer 21 can be removed. .
於本實施例中，該油墨層22係將含有添加物與聚合物之混合物形成於該離型層21上，並於150℃至180℃低溫烘烤固化該混合物，以形成油墨層。In the present embodiment, the ink layer 22 is formed on the release layer 21 with a mixture of an additive and a polymer, and the mixture is cured at a low temperature of 150 ° C to 180 ° C to form an ink layer.
於本實施例中，於該離型層上形成該混合物之方法並沒有特殊限制，能以塗佈或噴墨之方式形成，亦可利用網版印刷方式將該混合物形成於該離型層上。In the present embodiment, the method of forming the mixture on the release layer is not particularly limited, and may be formed by coating or ink jetting, and the mixture may be formed on the release layer by screen printing. .
根據表1之記載，形成如第2圖所示之本創作保護膜。According to the description of Table 1, the present protective film as shown in Fig. 2 was formed.
於該等實施例中，該保護膜係包括：離型層、油墨層及黏著層，其中，該油墨層及黏著層之厚度係如表1所記載。該油墨層係包括由碳黑(色素碳黑C111，天津津實化工)與聚醯亞胺，且以該油墨層之總重計，該碳黑的含量為10%，混合後於150-180℃下低溫烘烤而成，黏著層之材料為環氧樹脂；離型層之材料為PET氟素離型膜。In these embodiments, the protective film comprises: a release layer, an ink layer and an adhesive layer, wherein the thickness of the ink layer and the adhesive layer are as described in Table 1. The ink layer comprises carbon black (pigment carbon black C111, Tianjin Jinshi Chemical) and polyimine, and the carbon black content is 10% based on the total weight of the ink layer, and is mixed at 150-180. It is baked at a low temperature of °C, and the material of the adhesive layer is epoxy resin; the material of the release layer is a PET fluorinated release film.
使用厚度12.5微米的黑色覆蓋薄膜(Teijin Advanced Films公司；商品名Kapton)作為油墨層，利用環氧樹脂黏著劑轉印或塗佈於該油墨層上，得到比較例1之保護膜。A black cover film (Teijin Advanced Films, trade name: Kapton) having a thickness of 12.5 μm was used as an ink layer, and transferred or coated on the ink layer with an epoxy resin adhesive to obtain a protective film of Comparative Example 1.
使用厚度3微米的覆蓋薄膜(Teijin Advanced Films公 司；商品名Kapton)，將環氧樹脂黏著劑塗佈於該油墨層上，俾於該油墨層上形成黏著層，並於該黏著層貼合一110微米材質之離型紙(大昭和公司；商品名F8)，得到比較例2之具離型紙之保護膜，且其油墨層及黏著層之厚度如表3所示。Use a 3 micron thick cover film (Teijin Advanced Films) Division; trade name Kapton), an epoxy resin adhesive is applied to the ink layer, an adhesive layer is formed on the ink layer, and a 110 μm material release paper is attached to the adhesive layer (Da Zhaohe Company; As a trade name of F8), a protective film of release paper of Comparative Example 2 was obtained, and the thicknesses of the ink layer and the adhesive layer were as shown in Table 3.
將實施例1至3及比較例1之保護膜，貼附於松電工公司出產之型號為R-F775之軟性印刷電路板上，該軟性印刷電路板之基板材質為聚醯亞胺板，線路層材質為銅。並以如下述之檢測方法測量試片之光澤度、明度、柔軟性及撓曲性，並測試之測試結果，係紀錄於下表2。The protective films of Examples 1 to 3 and Comparative Example 1 were attached to a flexible printed circuit board of the model R-F775 produced by Matsuda Electric Co., Ltd., and the substrate of the flexible printed circuit board was made of polyimine plate. The layer material is copper. The gloss, brightness, flexibility and flexibility of the test piece were measured by the following test methods, and the test results of the test were recorded in Table 2 below.
將實施例1至3及比較例2之保護膜，裁切為10cm×10cm大小，並依據毛邊檢驗標準(外露毛邊≦0.1mm，為無毛邊；外露毛邊>0.1mm，為有毛邊)，測量是否產生毛邊及捲曲之現象。The protective films of Examples 1 to 3 and Comparative Example 2 were cut to a size of 10 cm × 10 cm, and were measured according to the raw edge inspection standard (exposed burr ≦ 0.1 mm, no burrs; exposed burrs > 0.1 mm, with burrs), and measurement Whether there is a phenomenon of burrs and curls.
測試例所使用之檢測方法如下：The test methods used in the test cases are as follows:
光澤度(Gloss)測試：使用光澤度測試儀(HORIBA公司；型號micro-gloss 60°型)，依據物體表面定向選擇反射方法進行，亦即，以光入射角為60°之條件下量測其長度方向(machine direction,MD)之光澤度。Gloss test: using a gloss tester (HORIBA; model micro-gloss 60° type), depending on the surface orientation of the object, select the reflection method, that is, measure it at a light incident angle of 60°. The gloss of the machine direction (MD).
本文所使用之術語「光澤度」係意指待測試片表面的反光程度，光澤度不具有單位，但其數值越大，代表其反射光之強度越強，反之，數值越小，代表其反射光的強度越弱。The term "gloss" as used herein means the degree of reflection of the surface of the sheet to be tested. The gloss does not have a unit, but the larger the value, the stronger the intensity of the reflected light. Conversely, the smaller the value, the reflection. The weaker the intensity of light.
明度(lightness)測試：使用明度測試儀(KONICA公司；型號CM-A145)，以光入射角為45°之條件下量測其長度方向(machine direction,MD)之明度，亦即，依據有色物體反射光量區別而產生顏色明暗強弱進行測量。Lightness test: The brightness of the machine direction (MD) is measured using a lightness tester (KONICA; model CM-A145) at a light incident angle of 45°, that is, according to a colored object The amount of reflected light is different and the intensity of the light is measured.
本文所使用之術語「明度」係根據國際照明委員會(International Commission on Illumination)對色彩的明暗程度的定義(通常，白色明度最高；黑色明度最低)。因此，明度越低遮蔽線路之效果越好。The term "lightness" as used herein is defined by the International Commission on Illumination for the degree of color shading (usually, white has the highest brightness; black has the lowest brightness). Therefore, the lower the brightness, the better the effect of shielding the line.
柔軟性測試：測定係使用柔軟性測試儀(Setra，BL-410S)，將具有實施例1至3及比較例1之保護膜的軟性印刷電路板材切為10mm×30mm尺寸大小，並將其固定於柔軟性測試儀(Setra，BL-410S)並彎折成「U」字形，使其形成2.35mm之R角，以測量反變力(Stiffness)數據。Softness test: The measurement was performed by using a softness tester (Setra, BL-410S), and the flexible printed circuit board having the protective films of Examples 1 to 3 and Comparative Example 1 was cut into a size of 10 mm × 30 mm, and fixed. The softness tester (Setra, BL-410S) was bent into a "U" shape to form an R angle of 2.35 mm to measure the anti-stiffness data.
撓曲性測試：測定係使用Hung Ta公司出產之型號為HT8636之撓曲性測試儀，將具有實施例1至3及比較例1 之保護膜的軟性印刷電路板切為10mm×30mm尺寸大小，以2.0mm之間距，並形成0.8mm之R角，抗撓曲之試驗行程為32mm，並以30次/分鐘速度不斷的彎折或彎曲動作直到斷裂或產生尖點，測得之彎曲次數。Flexibility test: The measurement system uses a flexural tester model HT8636 produced by Hung Ta Co., Ltd., and will have Examples 1 to 3 and Comparative Example 1. The flexible printed circuit board of the protective film is cut into a size of 10 mm × 30 mm, with a distance of 2.0 mm, and forms an R angle of 0.8 mm, and the test stroke for flexing resistance is 32 mm, and the bending is continuously performed at a speed of 30 times per minute. Or bending action until the break or cusp, the number of bends measured.
由上述測試例結果可知，相較於比較例1，本創作之保護膜具有較低之光澤度，除了保有覆蓋膜應有良好之抗化性，更使油墨層具有較薄之厚度外，還具有良好的電氣特性。又，相較於習知保護膜，本創作之保護膜的明度極低亦具有可遮蔽線路圖案之功能。因此，本創作之保護膜不僅可作為FPC之保護膜，亦適用於LCM板，可廣泛應用於有彎折或滑動電路板需求的產品。It can be seen from the results of the above test examples that the protective film of the present invention has a lower gloss than that of Comparative Example 1, except that the cover film should have good chemical resistance, and the ink layer has a thin thickness. Has good electrical properties. Moreover, compared with the conventional protective film, the protective film of the present invention has a function of shielding the line pattern with extremely low brightness. Therefore, the protective film of the present invention can be used not only as a protective film for FPC but also as an LCM plate, and can be widely applied to products having the demand for bent or sliding circuit boards.
○：外露毛邊≦0.1mm，無毛邊。○: Exposed burrs ≦ 0.1 mm, no burrs.
×：外露毛邊≧0.1mm，有毛邊。×: The exposed burrs are 0.1 mm and have burrs.
此外，請參閱表3，相較於比較例2，本創作之保護膜不需要離型紙輔助即可避免捲曲之缺點產生，且由於本創作不需要離型紙，因此亦不會產生毛邊之缺點。In addition, referring to Table 3, compared with Comparative Example 2, the protective film of the present invention can avoid the disadvantage of curling without the need of release paper, and since the present invention does not require a release paper, there is no disadvantage of burrs.
上述實施例僅例示說明本創作之原理及其功效，而非用於限制本創作。任何熟習此項技藝之人士均可在不違背本創作之精神及範疇下，對上述實施例進行修飾與改變。因此，本創作之權利保護範圍，應如後述之申請專利範圍所列。The above embodiments are merely illustrative of the principles of the present invention and their effects, and are not intended to limit the present invention. Any person skilled in the art can modify and change the above embodiments without departing from the spirit and scope of the present invention. Therefore, the scope of protection of this creation should be as listed in the scope of the patent application described later.
2‧‧‧保護膜2‧‧‧Protective film
21‧‧‧離型層21‧‧‧ release layer
22‧‧‧油墨層22‧‧‧Ink layer
24‧‧‧黏著層24‧‧‧Adhesive layer
Claims (14)
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| CN201310113194.1A CN104105331A (en) | 2013-04-02 | 2013-04-02 | Paperless and no-scrap ink protective film and manufacturing method thereof |
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| TWM482923U true TWM482923U (en) | 2014-07-21 |
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| TW103205589U TWM482923U (en) | 2013-04-02 | 2014-04-01 | Protective film |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| TWI560619B (en) * | 2016-03-01 | 2016-12-01 | Chipmos Technologies Inc | Manufacturing method and manufacturing apparatus of fingerprint identification chip package structure |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104371401A (en) * | 2014-11-14 | 2015-02-25 | 昆山上艺电子有限公司 | Metallic non-metal ink |
| JP6983633B2 (en) | 2017-11-24 | 2021-12-17 | 浜松ホトニクス株式会社 | Wafer inspection method and wafer |
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| JP4319167B2 (en) * | 2005-05-13 | 2009-08-26 | タツタ システム・エレクトロニクス株式会社 | Shield film, shield printed wiring board, shield flexible printed wiring board, shield film manufacturing method, and shield printed wiring board manufacturing method |
| CN102079956B (en) * | 2010-12-18 | 2012-06-27 | 广东生益科技股份有限公司 | White covering film and manufacturing method thereof |
| CN102568305A (en) * | 2012-01-29 | 2012-07-11 | 海南亚元防伪技术研究所 | Adhesive precoated release paper and method for processing labels of adhesive precoated release paper |
| CN203194011U (en) * | 2013-04-02 | 2013-09-11 | 昆山雅森电子材料科技有限公司 | Paper-free chipless printing ink protection film |
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| TWI560619B (en) * | 2016-03-01 | 2016-12-01 | Chipmos Technologies Inc | Manufacturing method and manufacturing apparatus of fingerprint identification chip package structure |
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