WO2016051695A1

WO2016051695A1 - Film having transparent conductive film, film having transparent wiring, transparent shield film, touch panel, and display device

Info

Publication number: WO2016051695A1
Application number: PCT/JP2015/004664
Authority: WO
Inventors: 川村　基; 田丸　博
Original assignee: パナソニックＩｐマネジメント株式会社
Priority date: 2014-09-30
Filing date: 2015-09-14
Publication date: 2016-04-07
Also published as: JPWO2016051695A1

Abstract

This film having a transparent conductive film has a film-like transparent base material, and the transparent conductive film. The transparent base material has a first surface, and a second surface on the reverse side of the first surface. The transparent conductive film includes metal nano wires, and a transparent binder containing a water-repellent additive. The transparent conductive film is formed on the first surface and/or the second surface of the transparent base material. Parts of the metal nano wires are exposed from the surface of the transparent conductive film. The contact angle of the surface of the transparent conductive film is 80-125 degrees.

Description

Film with transparent conductive film, film with transparent wiring, transparent shield film, touch panel and display device

The present invention relates to a film having a transparent conductive film on the surface, a film with a transparent wiring, a transparent shield film, a touch panel, and a display device.

Transparent conductive films are widely used in fields such as liquid crystal display (LCD), plasma display (PDP), touch panel, organic electroluminescence (EL), and solar cell. Such a transparent conductive film that exhibits conductivity can be formed by various methods. For example, the film is formed using a transparent and conductive material. Alternatively, a film is formed by containing a conductive filler in a transparent resin. In this method, even if it is colored, it is possible to form a transparent conductive film that exhibits conductivity while ensuring transparency by the shape and orientation of the conductive filler.

For example, Patent Document 1 proposes forming a transparent conductive film using a metal nanowire as a conductive filler. The conductivity of the metal nanowire depends on the metal used. For example, since silver has a very excellent conductivity of 10 ⁻⁷ Ω · cm, it is possible to apply silver nanowires to the transparent electrode. In order to form a transparent conductive film containing metal nanowires, for example, a method of forming a film by applying a resin solution in which metal nanowires are dispersed to the surface of a transparent substrate can be applied. In this method, metal nanowires are contained in a transparent resin coating film to form a transparent conductive film. In this case, a transparent conductive film expresses electroconductivity by contact between metal nanowires.

Thus, the strength of the transparent conductive film formed by containing the metal nanowires in the transparent resin is weak, easily damaged, and has low wear resistance. For this reason, in order to protect a transparent conductive film, an overcoat layer is provided on the surface of the transparent conductive film. For example, in Patent Document 1, an overcoat layer is provided by forming a film such as urethane resin on the surface of a transparent conductive film.

In Patent Document 2, it is proposed that a condensate of a hydrolyzable silane compound is formed as a matrix resin on a transparent coating film containing metal nanowires.

Special table 2009-505358 JP 2011-204649 A

In the present invention, a transparent binder having a conductive pattern portion and an insulating pattern portion can be formed by patterning a metal nanowire through the transparent binder in a state where a transparent binder made of an overcoat or the like is formed. A film with a high transparent conductive film is provided.

The film with a transparent conductive film according to the present invention has a film-like transparent substrate and a transparent conductive film. The transparent substrate has a first surface and a second surface opposite to the first surface. The transparent conductive film includes metal nanowires and a transparent binder containing a water repellent additive. And it is formed in at least one of the 1st surface and 2nd surface of a transparent base material. A part of the metal nanowire is exposed on the surface of the transparent conductive film. The contact angle of the surface of the transparent conductive film is 80 degrees or more and 125 degrees or less.

Thus, by exposing a part of the metal nanowire on the surface of the transparent conductive film, the contact resistance between the transparent conductive film and other wiring can be reduced. Furthermore, since the contact angle of the surface of the transparent conductive film is 80 degrees or more and 125 degrees or less, it is easy to etch the metal nanowires with the transparent binder formed, and the reliability in the transparent wiring after the metal nanowires are removed by etching. And optical properties can be improved. That is, the metal nanowire can be patterned through the transparent binder in a state where the transparent binder for fixing the metal nanowire is formed. Further, it is possible to improve moisture resistance and reliability in a state in which a part of the metal nanowire is removed and the insulating pattern portion is formed.

FIG. 1A is a perspective view of a film with a transparent conductive film according to Embodiment 1 of the present invention. 1B is a cross-sectional view of the film with a transparent conductive film shown in FIG. 1A. FIG. 1C is a cross-sectional view of another film with a transparent conductive film according to Embodiment 1 of the present invention. FIG. 2A is a cross-sectional view illustrating an example of a method for producing the film with a transparent conductive film shown in FIG. 1B or 1C. Drawing 2B is a sectional view explaining an example of a manufacturing method of a film with a transparent conductive film following Drawing 2A. FIG. 2C is a cross-sectional view illustrating an example of a method for producing a film with a transparent conductive film, following FIG. 2B. FIG. 3A is a cross-sectional view illustrating how the film with a transparent conductive film shown in FIG. 1C is patterned. FIG. 3B is a cross-sectional view for explaining the patterning of the film with a transparent conductive film, following FIG. 3A. FIG. 3C is a cross-sectional view illustrating the patterning of the film with a transparent conductive film, following FIG. 3B. FIG. 4 is a cross-sectional view for explaining how the contact angle of the film with transparent wiring according to Embodiment 1 of the present invention is measured. FIG. 5 is a schematic diagram for explaining an example of the structure near the surface of the conductive pattern portion of the film with transparent wiring shown in FIG. FIG. 6 is a schematic diagram showing an example of the structure near the surface of the insulating pattern portion of the film with transparent wiring shown in FIG. FIG. 7 is a cross-sectional view showing an example of a touch panel using the film with transparent wiring according to Embodiment 1 of the present invention and a display device. FIG. 8A is a perspective view of a transparent shield film according to Embodiment 2 of the present invention. FIG. 8B is a cross-sectional view of the periphery of the transparent shield film shown in FIG. 8A. FIG. 9A is a perspective view of another transparent shield film according to Embodiment 2 of the present invention. FIG. 9B is a cross-sectional view of the peripheral edge of the transparent shield film shown in FIG. 9A. FIG. 10 is a perspective view showing a state in which a large transparent multi-layer transparent shield film is cut into individual pieces to form individual transparent shield films in Embodiment 2 of the present invention. FIG. 11 is a cross-sectional view illustrating an example of measurement of the contact angle at the cut surface in the second embodiment of the present invention. FIG. 12A is a cross-sectional view illustrating a state in which a part of the metal nanowire comes into contact with the conductive paste composition in the transparent shield film manufacturing process illustrated in FIG. 8B. FIG. 12B is a cross-sectional view illustrating a state in which a part of the metal nanowire comes into contact with the conductive paste composition in the transparent shield film manufacturing process illustrated in FIG. 9B. FIG. 13A is a side view of a display device according to Embodiment 2 of the present invention. FIG. 13B is a side view of another display device according to the second embodiment of the present invention. FIG. 14 is a diagram illustrating an example of a measurement result of the shielding effect against noise in the display device according to the second embodiment of the present invention.

Prior to the description of the embodiment of the present invention, problems in the conventional transparent conductive film will be briefly described. When a porous overcoat part is provided on a transparent conductive film, depending on the overcoat material used, a problem may occur in moisture resistance and migration characteristics.

Embodiments of the present invention will be described below with reference to the drawings. Note that in each embodiment, the same components as those in the preceding embodiments are denoted by the same reference numerals, and detailed description may be omitted.

The present invention is not limited to the following embodiment. The embodiment can be changed within the scope of the idea of the present invention. It is also possible to combine two or more of the embodiments.

(Embodiment 1)
FIG. 1A is a perspective view of a film 110 with a transparent conductive film (hereinafter referred to as film) 110 according to Embodiment 1 of the present invention. One form of the film 110 is a long roll shape as shown in FIG. 1A or a sheet-like sheet shape (not shown).

FIG. 1B is a schematic diagram for explaining an example of a cross-sectional structure of the film 110. As illustrated in FIG. 1B, the film 110 includes a transparent base material 130 and a transparent conductive film 150. The transparent substrate 130 is, for example, a polyethylene terephthalate (PET) film. The transparent conductive film 150 is formed on both surfaces of the transparent substrate 130 and includes the metal nanowire 120 and the transparent binder 140. The transparent binder 140 is formed so as to fill between the plurality of metal nanowires 120. A part of the metal nanowire 120 is exposed on the surface of the transparent conductive film 150.

FIG. 1C is a schematic diagram for explaining an example of a cross-sectional structure of another transparent conductive film-attached film (hereinafter referred to as a film) 111 according to Embodiment 1 of the present invention. The film 111 has a transparent substrate 130, a transparent conductive film 150 formed on the first surface of the transparent substrate 130, and an antiblocking layer 160 formed on the second surface of the transparent substrate 130. . The configuration of the transparent conductive film 150 is the same as that of the film 110. The anti-blocking layer 160 is formed on the opposite surface where the transparent conductive film 150 is not formed. By providing the anti-blocking layer 160 as needed, the effect which suppresses the blocking generate | occur | produced when the film 110 is wound in roll shape is acquired.

1B and 1C, the contact angle 190 of the water droplet 170 dropped on the transparent conductive film 150 corresponds to the angle between the auxiliary line 180 and the transparent conductive film 150. The contact angle 190 of the transparent conductive film 150 is not less than 80 degrees and not more than 125 degrees. When the contact angle 190 is less than 80 degrees, there may be a problem in reliability such as moisture resistance. Moreover, when the contact angle of the transparent conductive film 150 exceeds 125 degrees, a problem may occur in the optical characteristics (for example, haze and transmittance) of the film. In addition, in order to control the contact angle 190 to 80 degrees or more and 125 degrees or less, the transparent binder 140 contains a water repellent additive (refer FIG. 5). For the measurement of the contact angle 190, JIS standard R3257 may be referred to.

Here, the JIS standard R3257 will be briefly described. In this standard, the contact angle is measured by the sessile drop method. That is, a 4 μL or less water droplet is left on the test piece. In this case, since the shape of the water droplet can be regarded as a part of the sphere, the following relationship is established between the contact angle θ and the shape of the water droplet.
θ = 2 tan ⁻¹ (h / r)
r is the radius (mm) of the surface of the water drop in contact with the test piece, and h is the height (mm) from the test piece surface to the top of the water drop. r and h are arranged such that the light source, the optical reader, and the test piece are arranged so that the water drop placed on the test piece is positioned at the center of the optical axis of the light source and the optical reader, and an image of the water drop on the test piece is obtained. It is measured by reading with an optical reader. Alternatively, the angle formed by the straight line connecting the apex of the water droplet and the end of the water droplet on the surface of the test piece and the surface of the test piece may be read, and the contact angle may be twice that angle.

Next, the transparent substrate 130 in FIGS. 1A to 1C will be described. The transparent substrate 130 is light transmissive. The light transmittance of the transparent substrate 130 is preferably 50% or more, more preferably 70% or more, and particularly preferably 80% or more.

The shape of the transparent substrate 130 is not particularly limited, but is preferably a plate shape or a film shape. In particular, from the viewpoint of improving the productivity and transportability of the

films

110 and 111, the shape of the transparent substrate 130 is preferably a film.

When the transparent base material 130 is a film shape, it is preferable that the thickness of the transparent base material 130 is in the range of 10 μm or more and 500 μm or less. In this case, the transparency of the transparent substrate 130 is particularly good, and the workability during production and handling of the

films

110 and 111 is also good. The thickness of the transparent substrate 130 is more preferably in the range of 25 μm or more and 200 μm or less. In particular, when the thickness of the transparent substrate 130 is 25 μm or more and 150 μm or less, the

films

110 and 111 can be reduced in thickness and weight. Further, the occurrence of interference on the front and back of the

films

110 and 111 is suppressed. Further, thermal shrinkage when the transparent base material 130 is heated is suppressed, and problems such as deterioration in workability due to thermal shrinkage of the transparent base material 130 are suppressed.

The material of the transparent substrate 130 is not particularly limited. Examples of the material of the transparent substrate 130 include glass (or thin glass), a resin film (or resin plate), and the like in the case of a sheet. Examples of transparent resins include PET, polybutylene terephthalate, polyethylene naphthalate (PEN), polycarbonate, polymethyl methacrylate copolymer, triacetyl cellulose, polyolefin, polyamide, polyvinyl chloride, amorphous polyolefin, cycloolefin polymer , Cycloolefin copolymer, acrylate resin, urethane acrylate resin and the like.

In particular, it is preferable that the transparent base material 130 is formed of polyester. Among polyesters, a biaxially stretched film made of PET or PEN is particularly preferable because it has excellent mechanical properties, heat resistance, chemical resistance, and the like. Such biaxially stretched films include magnetic tapes, ferromagnetic thin film tapes, packaging films, films for electronic parts, electrical insulating films, laminating films, films to be attached to the surface of displays, protective films for various members, etc. Widely used as a material. Especially for display applications, base films such as prism lens sheets, touch panels, and backlights, which are members of liquid crystal display devices, TV optical film base films, optical films used for plasma TV front optical filters, and near infrared rays It is used as a base film for cut films and electromagnetic shielding films.

Also, aromatic polyester is preferable as the polyester. Aromatic polyester is produced by the reaction of aromatic dicarboxylic acid and glycol. Examples of aromatic dicarboxylic acids include terephthalic acid, isophthalic acid, 2,6-naphthalene dicarboxylic acid, 4,4'-diphenyldicarboxylic acid, and examples of glycols include ethylene glycol, 1,4-butanediol, 1,4 -Contains cyclohexanedimethanol and 1,6-hexanediol. In particular, PET, polyethylene-2,6-naphthalene dicarboxylate and the like are preferable. The polyester may be produced by copolymerizing a plurality of the above exemplified components.

The transparent substrate 130 may contain organic or inorganic particles. In this case, the winding property and transportability of the transparent substrate 130 are improved. As particles that can be contained in the transparent substrate 130, calcium carbonate particles, calcium oxide particles, aluminum oxide particles, kaolin, silicon oxide particles, zinc oxide particles, crosslinked acrylic resin particles, crosslinked polystyrene resin particles, urea resin particles, melamine Examples thereof include resin particles and crosslinked silicone resin particles.

The transparent substrate 130 may further contain a colorant, an antistatic agent, an ultraviolet absorber, an antioxidant, a lubricant, a catalyst, other resins, and the like as long as the transparency is not impaired.

The haze of the transparent substrate 130 is preferably 3% or less. In this case, the visibility of images and the like through the conductive optical member 1 is improved, and it is particularly suitable as a member for optical applications. More preferably, the haze is 1.5% or less. In addition, haze is the value which expressed the ratio of the diffuse transmittance in a total light transmittance in percentage, and is about 4% in a general PET film, and is 0% in glass.

For the transparent substrate 130, it is preferable to use a material with low precipitation such as a low molecular weight oligomer (a material with high anti-oligomer property). For example, when a polyester film that does not take any measures against the oligomer is used as the material of the transparent substrate, the surface resistance value may increase, for example, in a film with a transparent conductive film placed under high temperature and high humidity conditions. One possible reason is that the oligomer contained in the polyester film precipitates under high temperature conditions, and the oligomer affects the transparent conductive film, thereby possibly increasing the surface resistance value.

Therefore, the reliability of the

films

110 and 111 can be increased by using a material that has been processed to suppress the precipitation of the oligomer for the transparent substrate 130. Specifically, the transparent substrate 130 preferably has an increase in haze of 0.3% or less after heating at 100 ° C. for 60 minutes.

When the oligomer is deposited on the

films

110 and 111, the surfaces of the

films

110 and 111 become cloudy, and an increase in haze is observed. For this reason, it is possible to confirm the degree of oligomer precipitation by increasing the haze.

In order to suppress oligomer precipitation, for example, a method using a transparent substrate 130 manufactured by a construction method in which oligomers are hardly generated has been studied. Alternatively, it is also preferable to form a transparent coating layer (not shown) for reducing precipitation of oligomers or the like on the surface of the transparent substrate 130. By forming a transparent coating layer on the surface of the transparent substrate 130, it becomes difficult for low molecular weight components to precipitate from the transparent substrate 130. Therefore, whitening of the transparent base material 130 is suppressed, and the good transparency is maintained.

The material of the transparent coating layer for reducing the precipitation of oligomers and the like is not particularly limited, but is formed from, for example, an acrylate resin or a urethane acrylate resin. Further, in order for the transparent coating layer to sufficiently suppress the precipitation of the low molecular weight component from the transparent substrate 130, the thickness of the transparent coating layer is preferably in the range of 0.5 μm or more and 10 μm or less.

When the film 111 shown in FIG. 1C is overlapped by being wound into a roll shape as shown in FIG. 1A, blocking is preferably suppressed by the anti-blocking layer 160. Therefore, the anti-blocking layer 160 is preferably a transparent layer having anti-blocking properties having irregularities on the surface. In order to form irregularities on the surface of the anti-blocking layer 160, for example, the surface of the anti-blocking layer 160 is mechanically processed.

Further, the anti-blocking layer 160 may contain irregularities on the surface of the anti-blocking layer 160 by containing a filler such as silica particles. In this case, the anti-blocking layer 160 contains, for example, an acrylate resin or a urethane acrylate resin in the range of 80% by mass or more and 95% by mass or less, and further silica particles having an average particle diameter of about 250 nm are 5% by mass or more and 20% by mass. It is preferable to contain in the following ranges.

Also, the anti-blocking layer 160 preferably contains, for example, a silicone leveling agent. With this configuration, the slipperiness of the film 111 can be improved.

It is preferable that a surface treatment is performed on the second surface of the transparent substrate 130 overlapping the anti-blocking layer 160 before the anti-blocking layer 160 is formed. In this case, the wettability and adhesion between the transparent substrate 130 and the anti-blocking layer 160 are improved. Examples of the surface treatment method include physical surface treatment such as plasma treatment, corona discharge treatment and flame treatment, and chemical surface treatment with a coupling agent, acidic component, alkaline component and the like. Alternatively, an easy adhesion layer (not shown) may be provided on the surface of the transparent substrate 130. By using the transparent base material 130 provided with the easy adhesion layer, wettability and adhesion between the transparent base material 130 and the anti-blocking layer 160 are improved. In addition to the formation of the easy-adhesion layer, it is also useful to perform physical surface treatment such as plasma treatment, corona discharge treatment, flame treatment, etc., chemical surface treatment with a coupling agent, acid, or alkali. In addition, you may give these processes to the 1st surface of the transparent base material 130, or form an easily bonding layer. In this case, the wettability and adhesion between the transparent substrate 130 and the transparent conductive film 150 are improved. Such processing is also effective for the film 110.

Next, the transparent conductive film 150 will be described. The transparent conductive film 150 contains the metal nanowire 120 and the transparent binder 140. The metal nanowire 120 is a metal fiber having a nano-sized (1 to 1000 nm) diameter. The type of metal constituting the metal nanowire 120 is not particularly limited, and examples thereof include Ag, Au, Cu, Co, Al, and Pt. In particular, in order to further improve the conductivity of the transparent conductive film 150, the metal constituting the metal nanowire 120 preferably includes at least one selected from Au, Ag, Cu, and Pt, and in particular, at least selected from Ag and Cu. It is preferable to include one kind.

The metal nanowire 120 is particularly preferably a silver nanowire or a copper nanowire. By using metal nanowires with high conductivity such as silver and copper, the use of metal nanowires 120 is suppressed and high transparency of the transparent conductive film 150 is ensured, while the conductive film 150 has high conductivity. It becomes possible to grant.

The method for producing the metal nanowire 120 is not particularly limited, and for example, a known method such as a liquid phase method or a gas phase method can be employed. For example, as a specific example of a method for producing silver nanowires, Adv. Mater. 2002, 14, P833-837, Chem. Mater. Examples include methods disclosed in documents such as 2002, 14, P4736 to 4745, and JP-T 2009-505358. A specific example of a method for producing Au nanowires (gold nanowires) includes a method disclosed in JP-A-2006-233252. Moreover, as a method for producing Cu nanowires (copper nanowires), a method disclosed in Japanese Patent Application Laid-Open No. 2002-266007 can be cited. Examples of the method for producing Co nanowires (cobalt nanowires) include those disclosed in Japanese Patent Application Laid-Open No. 2004-149871. In particular, Adv. Mater. 2002, 14, P833-837, and Chem. Mater. In the method for producing Ag nanowires disclosed in 2002, 14, P4736-4745, silver nanowires can be produced easily and in large quantities in an aqueous system.

The average diameter of the metal nanowire 120 is preferably in the range of 10 nm or more and 100 nm or less. When the average diameter is 10 nm or more, the conductivity of the transparent conductive film 150 is particularly high. Further, when the average particle size is 100 nm or less, the transparency of the transparent conductive film 150 is particularly high. The average diameter of the metal nanowire 120 is more preferably in the range of 20 nm to 100 nm, and most preferably in the range of 40 nm to 100 nm.

Further, the average length of the metal nanowire 120 is preferably in the range of 1 μm or more and 100 μm or less. When the average length is 1 μm or more, the conductivity of the transparent conductive film 150 is particularly high. Further, when the average length is 100 μm or less, the metal nanowires 120 are less likely to aggregate in the transparent conductive film 150. For this reason, the transparency of the transparent conductive film 150 is improved. The average length of the metal nanowire 120 is more preferably in the range of 1 μm or more and 50 μm or less, and most preferably in the range of 3 μm or more and 50 μm or less.

Note that the average diameter of the metal nanowires 120 is a value obtained by measuring the diameters of a sufficient number of metal nanowires 120 and arithmetically averaging the results. The average length of the metal nanowires 120 is a value obtained by measuring the length of a sufficient number of metal nanowires 120 and arithmetically averaging the results. The diameter and length of the metal nanowire 120 are derived by image analysis of an electron microscope image of the metal nanowire 120. For example, when the metal nanowire 120 is bent in the electron microscope image, the diameter (projection diameter (D)) and area (projection area (S)) of the metal nanowire 120 are calculated by image analysis. Furthermore, the length (L = S / D) of the metal nanowire 120 can be obtained by dividing the projected area (S) by the projected diameter (D). In order to derive the average diameter and average length of the metal nanowires 120, it is preferable to measure the diameter and length of at least 100 metal nanowires 120, and to measure the diameter and length of 300 or more metal nanowires 120 More preferably.

The ratio of the metal nanowire 120 in the transparent conductive film 150 is not particularly limited, but is preferably in the range of 0.01% by mass to 90% by mass, and in the range of 0.1% by mass to 30% by mass. It is more preferable if it is in the range of 0.5% by mass or more and 10% by mass or less.

The transparent conductive film 150 is formed from, for example, the metal nanowire 120 and a composition containing a resin component. In this case, the transparent conductive film 150 can be formed by a wet film formation method.

Examples of the transparent binder 140 for forming the transparent conductive film 150 include cellulose resin, silicone resin, fluorine resin, acrylic resin, polyethylene resin, polypropylene resin, polyethylene terephthalate resin, polymethyl methacrylate resin, polystyrene resin, and polyethersulfone. Resin, polyarylate resin, polycarbonate resin, polyurethane resin, polyacrylonitrile resin, polyvinyl acetal resin, polyamide resin, polyimide resin, diacryl phthalate resin, polyvinyl chloride resin, polyvinylidene chloride resin, polyvinyl acetate resin, other heat A plastic resin is mentioned. Moreover, the copolymer formed by superposing | polymerizing 2 or more types of monomers which comprise these resin may be sufficient. With these resin components, the metal nanowires 120 are bound to the surface of the transparent substrate 130.

The resin component for forming the transparent binder 140 preferably contains a reactive curable resin. As the reactive curable resin, for example, at least one of a thermosetting resin and an ionizing radiation curable resin is used.

The thermosetting resin for forming the transparent binder 140 includes phenol resin, urea resin, diallyl phthalate resin, melamine resin, unsaturated polyester resin, polyurethane resin, epoxy resin, aminoalkyd resin, silicon resin, polysiloxane resin, etc. Is mentioned. The composition may contain a crosslinking agent, a polymerization initiator, a curing agent, a curing accelerator, a solvent, and the like as necessary together with the thermosetting resin.

The ionizing radiation curable resin for forming the transparent binder 140 is preferably a resin having an acrylate functional group. Examples of the resin having an acrylate functional group include oligomers such as (meth) acrylates of a relatively low molecular weight polyfunctional compound, prepolymers, and the like. Specific examples of the polyfunctional compound include polyester resins, polyether resins, acrylic resins, epoxy resins, urethane resins, alkyd resins, spiroacetal resins, polybutadiene resins, polythiol polyene resins, and polyhydric alcohols. The composition containing the ionizing radiation curable resin preferably further contains a reactive diluent. Examples of reactive diluents include monofunctional monomers such as ethyl (meth) acrylate, ethylhexyl (meth) acrylate, styrene, methylstyrene, N-vinylpyrrolidone, trimethylolpropane tri (meth) acrylate, and hexanediol (meth) acrylate. , Tripropylene glycol di (meth) acrylate, diethylene glycol di (meth) acrylate, pentaerythritol tri (meth) acrylate, dipentaerythritol hexa (meth) acrylate, 1,6-hexanediol di (meth) acrylate, neopentyl glycol di The polyfunctional monomer of (meth) acrylate is mentioned.

When the ionizing radiation curable resin for forming the transparent binder 140 is a photocurable resin such as an ultraviolet curable resin, the composition preferably further contains a photopolymerization initiator. Examples of the photopolymerization initiator include acetophenones, benzophenones, α-amyloxime esters, thioxanthones, and the like. The composition containing the photocurable resin may contain a photosensitizer in addition to the photopolymerization initiator or in place of the photopolymerization initiator. Examples of the photosensitizer include n-butylamine, triethylamine, tri-n-butylphosphine, and thioxanthone.

In addition, it is also preferable to contain at least one of methacryl functional silane and acryl functional silane as a resin for forming the transparent binder 140. With this configuration, the adhesion with the transparent substrate 130 and the plurality of metal nanowires 120 is improved. Examples of the methacryl functional silane include 3-methacryloxypropyltrimethoxysilane and 3-methacryloxypropylmethyldimethoxysilane. Examples of the acrylic functional silane include 3-acryloxypropyltrimethoxysilane and 3-acryloxypropylmethyldimethoxysilane.

The content of the methacryl functional silane and the acryl functional silane is not particularly limited, but the ratio of the total amount of the methacryl functional silane and the acrylic functional silane in the transparent binder 140 is preferably in the range of 5 to 30% by mass. When this ratio is 5% by mass or more, the adhesion between the transparent substrate 130 and the plurality of metal nanowires 120 is sufficiently high. Moreover, the crosslinking density in the transparent binder 140 fully improves that it is 30 mass% or less.

The refractive index of the transparent conductive film 150 is not particularly limited, but is preferably in the range of 1.35 to 1.65 in order to make the presence of the transparent conductive film 150 inconspicuous. The thickness of the transparent conductive film 150 is not particularly limited, but is preferably in the range of 10 to 300 nm. The refractive index of the transparent conductive film 150 is easily adjusted by changing the composition of the composition for forming the transparent conductive film 150.

The transparent binder 140 contains a water repellent additive. The water repellent additive preferably contains a compound containing a fluoroalkyl group or a fluoroalkylene group. It is preferable that a part of the water repellent additive, particularly a fluoroalkyl group or a fluoroalkylene group serving as a water repellent group is exposed on the surface of the transparent conductive film 150. With this configuration, the contact angle of the surface of the transparent conductive film 150 can be reliably adjusted to 80 degrees or more and 125 degrees or less.

The composition (or coating solution) for forming the transparent conductive film 150 may contain a solvent as necessary. As the solvent, for example, an organic solvent or water is used, or an organic solvent and water are used in combination. Examples of the organic solvent include alcohols, ketones, esters, halogenated hydrocarbons, aromatic hydrocarbons, and mixtures thereof. Examples of alcohols include methanol, ethanol, isopropyl alcohol (IPA). Examples of ketones include methyl ethyl ketone, methyl isobutyl ketone, and cyclohexanone. Examples of esters include ethyl acetate and butyl acetate. Examples of the aromatic hydrocarbons include toluene and xylene.

The amount of the solvent in the composition for forming the transparent conductive film 150 is appropriately adjusted so that the solid content can be uniformly dissolved or dispersed in the composition. The solid content concentration in the composition is preferably in the range of 0.1 to 50% by mass, more preferably in the range of 0.5 to 30% by mass.

The transparent conductive film 150 is formed by applying a composition for forming the transparent conductive film 150 to the transparent substrate 130 and forming a film. When applying the composition, an appropriate method such as a roll coating method, a spin coating method, or a dip coating method is employed. The method for forming the composition into a film is appropriately selected according to the type of the resin component or the like in the composition. For example, when the composition contains a thermosetting resin, the transparent conductive film 150 is formed by heating and thermosetting the composition. Further, when the composition contains an ionizing radiation curable resin, the composition is cured by irradiating the composition with ionizing radiation such as ultraviolet rays, and the transparent conductive film 150 is formed.

The sheet resistance of the transparent conductive film 150 is preferably 0.1Ω / □ or more and 200Ω / □ or less, and more preferably 2Ω / □ or more and 100Ω / □ or less. When the sheet resistance of the transparent conductive film 150 is less than 0.1 Ω / □, the density of the metal nanowires 120 included in the transparent conductive film 150 increases, and the transparency of the film 110 may decrease. In addition, when the sheet resistance is higher than 200Ω / □, its usage is limited.

The film thickness of the transparent conductive film 150 is desirably 20 nm or more and 300 nm or less. When the film thickness of the transparent conductive film 150 is less than 20 nm, the overall resistance of the transparent conductive film 150 may increase and the physical strength of the transparent conductive film 150 may decrease. Moreover, when the film thickness of the transparent conductive film 150 exceeds 300 nm, the light transmission property of the transparent conductive film 150 may deteriorate, or the coating workability of the transparent conductive film 150 may decrease.

Next, an example of a method for forming the transparent conductive film 150 on the transparent substrate 130 will be described with reference to FIGS. 2A to 2C. In the following description, the transparent conductive film 150 is formed as follows. First, a resin liquid containing the metal nanowire 120 is applied to the transparent substrate 130 to form the metal nanowire layer 220. Thereafter, the overcoat liquid 230 is applied on the metal nanowire layer 220, and the overcoat liquid 230 is dried and cured to form the transparent binder 140.

FIG. 2A is a cross-sectional view illustrating a state in which the metal nanowire layer 220 is formed on the first surface of the transparent substrate 130. The metal nanowire layer 220 includes at least a binder resin portion 210a that binds the plurality of metal nanowires 120 to each other and a binder resin portion 210b that binds the metal nanowire 120 onto the transparent substrate 130. Note that the binder resin portion 210a and the binder resin portion 210b may be formed of the same binder resin. Hereinafter, the binder resin portion 210a and the binder resin portion 210b may be collectively referred to as the binder resin portion 210.

As shown in FIG. 2A, the plurality of metal nanowires 120 are attached to the transparent substrate 130 by the binder resin portion 210a and the binder resin portion 210b. Further, it is desirable to provide a gap portion 200 between the plurality of metal nanowires 120. The void portion 200 does not include the binder resin portion 210a or the binder resin portion 210b. By providing the gap portion 200, stress concentration between the plurality of metal nanowires 120 that occurs when the film 110 is curved as illustrated in FIG. 1A can be reduced. Furthermore, as will be described with reference to FIG. 2B, the overcoat liquid 230 can be filled to every corner of the metal nanowire layer 220 through the gap portion 200.

In addition, when a water repellent additive is added to the binder resin part 210 shown in FIG. 2A, the uniformity of dispersion of the metal nanowires 120 in the liquid composition may be affected.

In addition, the stability of the electrical connection between the plurality of metal nanowires 120 can be enhanced by pressurizing the metal nanowire layer 220 in the state of FIG. 2A. However, when there is no gap portion 200 and the binder resin portion 210 embeds the metal nanowires 120 densely, even if the metal nanowire layer 220 is pressed using a press device or the like, the plurality of metal nanowires 120 are connected to each other. It may be difficult to improve the electrical connection stability. When pressurizing using a press apparatus etc., it is preferable to carry out in the state of FIG.

The metal nanowire layer 220 shown in FIG. 2A is formed by coating a resin solution in which the metal nanowires 120 are dispersed on the surface of the transparent substrate 130 to form a film. Any method such as spin coating, screen printing, dip coating, die coating, casting, spray coating, and gravure coating can be applied to this coating.

Next, as shown in FIG. 2B, an overcoat liquid 230 is applied on the metal nanowire layer 220, and a transparent binder 140 is formed as shown in FIG. 2C. The overcoat liquid 230 for forming the transparent binder 140 preferably contains at least one of a thermosetting resin composition, an ionizing radiation curable resin composition, and a water repellent additive. The overcoat liquid 230 permeates the surface of the plurality of metal nanowires 120 and the binding portion between the metal nanowires 120 and the transparent substrate 130 through the gap portion 200.

The binder resin part 210 preferably has a certain degree of compatibility with the overcoat liquid 230. Since the binder resin portion 210 a is compatible with the overcoat liquid 230, a part of the surface of the plurality of metal nanowires 120 can be directly wetted with the overcoat liquid 230. Further, at least a part of the binder resin portion 210a can be replaced with the overcoat liquid 230, and the adhesion between the plurality of metal nanowires 120 can be enhanced. Similarly, since the binder resin portion 210 b is compatible with the overcoat liquid 230, a part or more of the surface of the transparent substrate 130 can be directly wetted with the overcoat liquid 230. Moreover, the adhesiveness between the transparent base material 130 and the metal nanowire 120 can be enhanced by replacing at least a part of the binder resin portion 210b with the overcoat liquid 230. In this way, a part or the whole of the binder resin part 210 may be replaced with the transparent binder 140 by wetting the binder resin part 210 with the overcoat liquid 230.

By covering the metal nanowire 120 with the binder resin portion 210, the metal surface can be replaced with the transparent binder 140 without the metal surface directly touching the outside air (or in the atmosphere). As a result, segregation of the water repellent additive on the surface of the metal nanowire 120 can be reduced. This point will be described later.

After the state of FIG. 2B, a volatile component such as a solvent contained in the overcoat liquid 230 is removed in a drying furnace or a curing furnace, and the remaining resin component is cured to form a transparent binder 140 from the overcoat liquid 230. Is done. That is, the state of FIG. 2C is formed after the state of FIG. 2B. If the transparent conductive film 150 is also formed on the second surface of the transparent substrate 130, the film 110 is produced. If the anti-blocking layer 160 is formed on the second surface of the transparent substrate 130, the film 110 is produced.

As shown in FIG. 2C, in the transparent conductive film 150, a part of the metal nanowire 120 protrudes or is exposed from the surface of the transparent binder 140 to the outside (or in the air). As shown in FIG. 2C, a part of the metal nanowire 120 is exposed to the outside from the surface of the transparent binder 140, so that the connectivity between the transparent conductive film 150 and an external circuit (not shown) is improved.

The anti-blocking layer 160 is preferably formed from at least one of a thermosetting resin composition and an ionizing radiation curable resin composition, like the transparent binder 140.

In addition, it is desirable that a part of the water repellent additive is exposed on the surface of the transparent conductive film 150. Details will be described later.

Next, a method for patterning the transparent conductive film 150 will be described with reference to FIGS. 3A to 3C, taking the film 111 shown in FIG. 1C as an example. As shown in FIGS. 3A to 3C, the transparent conductive film 150 is patterned to form a film with transparent wiring (hereinafter referred to as film) 300.

FIG. 3A is a cross-sectional view showing a state in which a resist pattern portion 240 is formed on the film 111. The resist pattern portion 240 is formed on the transparent conductive film 150. That is, since the resist pattern part 240 is formed on the transparent binder 140, even when the transparent binder 140 includes a porous part, the porous part can be covered with the resist pattern part 240. The resist pattern part 240 is formed so as to cover the metal nanowire 120 exposed from the transparent conductive film 150 in addition to the transparent binder 140. The metal nanowire 120 exposed from the transparent conductive film 150 is covered with the resist pattern portion 240, and after removing the resist pattern portion 240 (the state of FIG. 3C), the metal nanowire 120 exposed from the transparent conductive film 150 is exposed. Can be left in state.

The resist pattern portion 240 can be formed using a commercially available photosensitive resist. As shown in FIG. 3A, an opening 250 is formed between the plurality of resist pattern portions 240. The opening 250 is a portion where the resist pattern portion 240 is not formed. Then, the film 111 in the state shown in FIG. 3A is immersed in an etching solution for the metal nanowire 120 to remove the metal nanowire 120 exposed at the opening 250. Thereafter, the residue of the etching solution is removed by washing with water or the like, and the state shown in FIG. 3B is obtained.

FIG. 3B is a cross-sectional view illustrating a state after the metal nanowire 120 partially exposed at the opening 250 is removed by etching. The pore 260 in FIG. 3B is formed by etching away the metal nanowire 120 in which the opening 250 is formed.

FIG. 3C is a cross-sectional view showing a state after the resist pattern portion 240 is removed. The region where the resist pattern portion 240 is formed and protected becomes a conductive pattern portion 280. The region indicated by the opening 250 where the resist pattern 240 is not formed becomes the insulating pattern 270. As described above, the transparent wiring 290 includes the insulating pattern portion 270 and the conductive pattern portion 280. By forming the same height without forming a step between the insulating pattern part 270 and the conductive pattern part 280, the invisibility of the wiring pattern by the metal nanowire 120 can be enhanced. Further, if necessary, a protective hard protective sheet (for example, a protective plate such as a PET film or a cover glass) may be placed so as to cover the conductive pattern portion 280 and the insulating pattern portion 270.

Thus, the transparent wiring 290 including the conductive pattern portion 280 including the transparent binder 140 and the metal nanowire 120 and the insulating pattern portion 270 including the pore portion 260 formed by removing the transparent binder 140 and the metal nanowire 120 is provided. The film-like transparent substrate 130 is formed on one side or both sides. Further, the conductive pattern portion 280 and the insulating pattern portion 270 are both transparent, and no unevenness or step is generated at the boundary between the conductive pattern portion 280 and the insulating pattern portion 270. Therefore, the presence or absence of the wiring pattern portion 279 is not easily recognized with the naked eye.

Next, the contact angle of the surface of the film 300 will be described with reference to FIG.

The water droplet 170a and the water droplet 170c are on the conductive pattern portion 280a and the conductive pattern portion 280b, respectively. The water droplet 170b is on the insulating pattern portion 270. The contact angle 190a of the water droplet 170a, the contact angle 190b of the water droplet 170b, and the contact angle 190a of the water droplet 170c are both 80 degrees or more and 125 degrees or less. By setting the contact angle 190a, the contact angle 190b, and the contact angle 190c to 80 degrees or more and 125 degrees or less, the patterning property (for example, etching property) of the metal nanowire 120 and the reliability (for example, electrical property in a high humidity state). Both of the reliability are improved.

When the contact angle 190a, the contact angle 190b, and the contact angle 190c are less than 80 degrees, there may be a problem in reliability even if the patterning property of the metal nanowire 120 is good. Note that the surfaces of the conductive pattern portions 280a and 280b shown in FIG. 4 are the same as the surfaces of the transparent conductive film 150 before patterning shown in FIGS. 1B and 1C. Therefore, the contact angle 190a and the contact angle 190c shown in FIG. 4 are the same as the contact angle 190 of FIGS. 1A and 2B.

When the contact angle 190a, the contact angle 190b, and the contact angle 190c are larger than 125 degrees, and further when the contact angle is 130 degrees or more, there may be a problem in patterning property even if the reliability is good.

As described above, the contact angle 190 of the transparent conductive film 150 is not less than 80 degrees and not more than 125 degrees before the metal nanowire 120 is patterned as illustrated in FIGS. 1B and 1C, and is illustrated in FIG. 4. Thus, even after the metal nanowire 120 is patterned, the contact angle 190a, the contact angle 190b, and the contact angle 190c are 80 degrees or more and 125 degrees or less. Furthermore, as shown in FIG. 4, in the state after patterning, the contact angle 190a and contact angle 190c in the conductive pattern portion 280 and the contact angle 190b in the insulating pattern portion 270 are 80 degrees or more and 125 degrees or less.

Furthermore, the difference between the contact angle 190a and contact angle 190c in the conductive pattern portion 280 and the contact angle 190b in the insulating pattern portion 270 is preferably 10% or less or 10 degrees or less in the range of 3σ. Further, it is more desirable that the values are substantially the same at 5% or less or 5 degrees or less. If the difference in contact angle between the two exceeds 10% at 3σ, or exceeds 10 degrees at 3σ, there is a risk of variations during patterning and reliability evaluation.

Next, referring to FIGS. 5 and 6, the difference between the contact angle 190 a and the contact angle 190 c in the conductive pattern portion 280 and the contact angle 190 b in the insulating pattern portion 270 is 10% or less or 10 degrees or less in the range of 3σ. The reason why this is preferable will be described. That is, the same applies to the difference in contact angle between the film 111 before etching shown in FIG. 3A and after etching shown in FIG. 3B.

FIG. 5 schematically shows an example of the surface structure of the conductive pattern portion 280. This surface structure is the same as the surface structure of the transparent conductive film 150 before etching shown in FIGS. 3A and 2C.

The transparent conductive film 150 includes a transparent binder 140 and the metal nanowire 120. A part of the metal nanowire 120 is exposed from the surface of the transparent binder 140. Moreover, it is preferable that the outermost surface of the transparent binder 140 is exposed so that the water repellent additive 310 added to the transparent binder 140 is oriented. A part of the water repellent additive 310 is also attached to the surface of the metal nanowire 120.

The transparent binder 140 includes a water repellent additive 310 that is a compound having a water repellent group. Therefore, the contact angle of the transparent conductive film 150 can be controlled to 80 degrees or more and 125 degrees or less. The water repellent group is a functional group having a particularly low surface free energy, such as a fluoroalkyl group or a fluoroalkylene group. In order for the molecular chain having such a chemical structure to exist on the outermost surface of the transparent conductive film 150, that is, the outermost surface of the transparent binder 140, for example, a perfluoropolyether group-containing silane is used as a water repellent additive. It is preferable to use as 310. As perfluoropolyether group-containing silane compounds, Daikin Industries, Ltd. Opsule DSX, Optool AES4, Shin-Etsu Chemical Co., Ltd. KY-164 and KY-130, Fluoro Technology Co., Ltd. Fluorosurf FG-5020, Solvay Specialty Polymers Japan FluoroLink S10 etc. are provided by the corporation.

The water repellent additive 310 added to the transparent binder 140 generates a driving force for minimizing surface free energy by the water repellent function of the water repellent additive 310 such as a fluoroalkyl group or a fluoroalkylene group. . This driving force is considered to occur mainly on the surface in contact with the outside air (or the atmosphere). As a result, water repellent groups such as a fluoroalkyl group and a fluoroalkylene group can be segregated near the surface of the transparent conductive film 150 efficiently.

Thus, by exposing a part of the water repellent additive 310, that is, a water repellent group such as a fluoroalkyl group or a fluoroalkylene group to the surface of the transparent conductive film 150, the water repellent additive 310 added to the transparent binder 140. Even if the addition amount is small, the water repellency of the surface of the transparent conductive film 150 can be increased, and the contact angle can be controlled to 80 degrees or more and 125 degrees or less. Further, the water repellent additive 310 can prevent the plurality of metal nanowires 120 from coming into contact with each other and becoming an inhibiting factor when forming a conductive path.

When the contact angle of the transparent conductive film 150 is larger than 125 degrees, and further when the contact angle is 130 degrees or more, it is necessary to increase the amount of the water repellent additive 310 added to the transparent binder 140. In this case, the surplus water-repellent additive 310 may form micelles or the like inside the transparent binder 140 and affect the optical properties of the transparent binder 140 in some cases.

FIG. 6 schematically illustrates the surface structure of the insulating pattern portion 270. The transparent conductive film 150 includes a transparent binder 140 and pores 260. Since some of the water repellent additive 310a is exposed on the surface of the transparent binder 140, the contact angle of the transparent binder 140 is not less than 80 degrees and not more than 125 degrees. Furthermore, a part of the water repellent additive 310 b is exposed around or inside the pores 260, or on the inner wall forming the pores 260. The effect of this will be described later.

In FIG. 6, the water repellent additive 310a added to the transparent binder 140 is exposed on the outermost surface of the transparent binder 140 so as to be oriented. The pores 260 are also exposed so that the water repellent additive 310b is oriented. As described above, the water repellent additive 310a is exposed on the surface of the transparent binder 140 and around the opening of the pore 260, and the water repellent is added around the pore 260 such as the inside (or inner wall) of the pore 260. The agent 310b is exposed. That is, by segregating the fluoroalkyl group and the fluoroalkylene group into the pores 260, it becomes difficult for moisture to enter the pores 260, and the moisture in the pores 260 can be quickly discharged to the outside. .

That is, in the state shown in FIG. 5, the water repellent additive 310 is segregated mainly on the surface in contact with the outside air (or the atmosphere). Therefore, the water repellent additive 310 is unlikely to segregate at the contact interface between the metal nanowire 120 and the transparent binder 140. However, as shown in FIG. 6, when the metal nanowire 120 is removed by etching and the pores 260 are formed, the surface in the pores 260 comes into contact with the outside air. Therefore, the driving force for minimizing the surface free energy is generated by the functions of the water repellent additive 310 such as the fluoroalkyl group and the fluoroalkylene group, and the surface of the water repellent additive 310 is formed on the surface in the pore 260. The water repellent group is oriented. As a result, an effect of suppressing moisture intrusion into the pores 260 is obtained.

As shown in FIGS. 4, 5, and 6, the water-repellent groups segregated on the surface of the conductive pattern portion 280 a, the insulating pattern portion 270, etc. are examined by an expensive surface analysis method such as SIMS (Secondary Ion Mass Spectrometry). be able to. However, such an analysis method may damage the surface of the object to be measured. On the other hand, the measurement method using the contact angle is inexpensive, can cope with a large area, and does not damage the surface of the object to be measured. Therefore, the measurement of the contact angle 190b is effective for simply examining the presence of the water-repellent group in the insulating pattern portion 270 having the pores 260.

In addition, when the shape of the insulating pattern part 270 or the conductive pattern part 280 becomes fine, a commercially available surface contact angle measuring instrument using a fine droplet of picoliter order can be used. These contact angle measuring machines using micro droplets are used for contact angles of micro ink droplets for inkjet, wettability evaluation after droplets ejected from an inkjet device land on paper, wafers and glass It is used for the purpose of measuring the contact angle on a fine pattern carved on a substrate, etc., and measuring the contact angle on the hair.

Hereinafter, the touch panel 360 and the display device 390 according to the present embodiment will be described with reference to FIG. The touch panel 360 and the display device 390 include a film with transparent wiring (hereinafter, film) 300.

The touch panel 360 includes a film 300, a semiconductor element 350, and a hard protective sheet 340. The semiconductor element 350 is electrically connected to the conductive pattern portion 280 of the film 300 through wiring or the like. The hard protective sheet 340 covers the surface of the film 300 on which the transparent wiring 290 is provided.

The touch panel 360 is, for example, a capacitive touch panel that senses the capacitance of a fingertip. As the fingertip 320 approaches the transparent conductive film 150 as indicated by an arrow 370, the semiconductor element 350 detects the capacitive component 330 of the fingertip 320 and detects position information and movement of the fingertip 320.

Further, by providing a hard protective sheet 340 such as a very thin glass plate or PET film so as to cover the insulating pattern part 270 and the conductive pattern part 280 on the transparent wiring 290, the fingertip 320 on the surface of the touch panel 360 is provided. Increases slipperiness, physical strength, reliability, etc.

Furthermore, the insulating pattern part 270 chased by the hard protective sheet 340 has a pore part 260. As shown in FIG. 6, it is preferable that the water repellent additive 310 b is exposed in the pores 260. With this configuration, the reliability of the touch panel 360 is increased.

Note that it is known that the metal nanowires 120 included in the transparent wiring 290 easily absorb water. Therefore, when the metal nanowire 120 is exposed from the transparent binder 140, the metal nanowire 120 can be removed by etching from the exposed portion. However, moisture or the like that affects reliability is likely to be deposited inside the opening 250 formed by removing the metal nanowire 120 by etching. On the other hand, on the transparent wiring 290, the hard protective sheet 340 is fixed via an adhesive or the like. And since the hard protective sheet 340 seals the surface of the pore part 260, it can prevent that a water | moisture content penetrate | invades and accumulates inside the pore part 260. FIG.

The outer surface of a general hard protective sheet 340 may be subjected to a water repellent treatment to prevent adhesion of oily dirt transmitted from the fingertip 320. Such a water repellent treatment is performed only on the surface of the hard protective sheet 340, and is not performed on the pores 260 included in the transparent wiring 290 (insulating pattern portion 270). This is because the adhesive force between the hard protective sheet 340 and the transparent wiring 290 is affected. However, in this embodiment, the water repellent additive 310b is exposed in the pores 260 as described above. Therefore, the pore 260 has water repellency.

The display device 390 is, for example, a mobile phone, a tablet terminal, or a personal computer. The display device 390 includes a touch panel 360 and a display element 380 installed to face the touch panel 360. The display element 380 is a display element such as a liquid crystal or an EL. Thus, by installing the display element 380 on one side of the touch panel 360, a highly reliable display device 390 can be provided.

In addition, in order to improve the adhesiveness with the hard protective sheet 340 in the

films

110 and 111 and the film 300, it is useful to perform wettability improvement processing such as plasma processing. In the case of the

films

110 and 111 and the film 300, even when wettability improving processing such as plasma processing is performed, the water repellent additive 310 exposed in the pores 260 is not affected. That is, such an external process does not affect the inside of the pore 260. This is because the diameter of the pore 260 is small and the length and depth of the pore 260 are large. On the other hand, the water repellent additive 310 exposed in the pores 260 is an internal treatment. That is, the water repellent additive 310 added to the transparent binder 140 is exposed in the pores 260 regardless of the size of the pores 260 by the driving force that minimizes the surface free energy.

Also, the

films

110 and 111 can be used as a transparent electromagnetic shield (transparent shield film). The transparent electromagnetic shield is attached to the surface of a liquid crystal display device or the like, and has a function of cutting or attenuating various electromagnetic waves radiated from the liquid crystal display device. An example of the transparent electromagnetic shield includes a film 111 cut in accordance with the outer shape of the liquid crystal display device, a ground wiring provided on the peripheral edge of the film 111, and the like. When used for the purpose of electromagnetic shielding, patterning of the transparent conductive film 150 is not necessary. Details of the transparent shield film will be described in Embodiment 2.

Next, the effect of this embodiment will be described in detail using a specific example.

(Formation of metal nanowire layers)
14.55 parts by mass of an acrylic resin (“A-DPH” manufactured by Shin-Nakamura Chemical Co., Ltd.) is dissolved in a mixed solvent of 34.87 parts by mass of methyl ethyl ketone and 34.86 parts by mass of methyl isobutyl ketone. Next, metal nanowire is mix | blended with this solution. Specifically, a solid solution of 3.0% by mass of metal nanowires is dispersed using methyl ethyl ketone as a dispersion medium to prepare a dispersion, and 12.0 parts by mass of this dispersion is added to the above solution and mixed well. Further, 0.72 parts by mass of 1-hydroxy-cyclohexyl-phenyl-ketone (“Irgacure 184” manufactured by Ciba Geigy Co.), which is a photopolymerization initiator, is added and mixed well, followed by stirring and mixing in a constant temperature atmosphere at 25 ° C. for 1 hour. Thus, the coating material composition for forming a metal nanowire layer is prepared.

In addition, the metal nanowire produced according to "Materials Chemistry and Physics vol. 114 p333-338" Preparation of Aganorodwith high yield poly process "" is used. The average diameter of the metal nanowire is 50 nm, the average length is 5 μm, and the material is silver.

Then, the coating material composition for forming the metal nanowire layer is applied to the surface of the PET film, which is a transparent substrate, with a coater so as to have a thickness of 100 nm, and heated and dried. In this way, a metal nanowire layer is formed. In addition, the sheet resistance of the sheet | seat with which the metal nanowire layer produced with the said mixture ratio was formed is 40 ohms / square.

Further, by adjusting the compounding amount of the metal nanowires, sheets with metal nanowire layers having sheet resistances of 10Ω / □ and 100Ω / □, respectively, are prepared.

(Formation of transparent binder)
Acrylic resin is dissolved by adding 48.3 parts by mass of methyl ethyl ketone and 48.3 parts by mass of methyl isobutyl ketone to 2.1 parts by mass of acrylic resin (manufactured by Shin-Nakamura Chemical Co., Ltd., product number U-6LPA). Thus, a mixed solution is prepared. To this mixed solution, 1.0 part by mass of OPTOOL DSX (solid content: 20% by mass) manufactured by Daikin Industries, Ltd. is added as a water repellent additive and mixed at room temperature. Further, 0.3 parts by mass of a photopolymerization initiator 1-hydroxy-cyclohexyl-phenyl-ketone (product name: Irgacure 184, manufactured by Ciba Geigy Co., Ltd.) was added to this mixed solution and mixed well, followed by stirring for 30 minutes in a constant temperature atmosphere at 25 ° C. Mix. Thereby, the overcoat liquid for forming a transparent binder is prepared.

The overcoat solution thus prepared is applied and dried on the metal nanowire layer, and a transparent binder is formed as shown in FIG. 2B to prepare a sample for evaluation. In addition, the contact angle of the sample produced with the said mixture ratio is 105 degree | times.

Furthermore, by adjusting the addition amount of the water repellent additive, evaluation samples having contact angles of 75 degrees, 80 degrees, 125 degrees, and 130 degrees are produced. Further, in the above procedure, an overcoat liquid not containing a water repellent additive is also prepared to form a transparent binder. In this case, the contact angle is 55 degrees.

As described above, three types of metal nanowire layers with different compounding amounts of metal nanowires and sheet resistances of 10Ω / □, 40Ω / □, and 100Ω / □ are prepared, and water-repellent additives are added to the transparent binder. Prepare 6 types with different quantities. 18 kinds of evaluation samples are produced and evaluated by these combinations.

(Evaluation 1-1: Etching)
The etching property is evaluated as follows. An etching resist is formed on the transparent electrode film in each evaluation sample. Subsequently, each evaluation sample is subjected to an etching treatment using an etching solution (ferric chloride aqueous solution) at 35 ° C. By this operation, the metal nanowire is removed from the region not covered with the etching resist. At this time, the time required for the etching process until the metal nanowire is removed and the insulating pattern portion is formed is measured. The case where the required time is within 1 minute is evaluated as GD (Good), the case where the required time is longer than 1 minute is OK, and the case where the etching is impossible is evaluated as NG (No Good). “GD to OK” means that there are cases of GD or OK as a result of evaluation under a plurality of types of etching conditions. That is, depending on the type and concentration of the etching solution, it may mean GD or OK.

(Evaluation 1-2: Reliability)
The reliability is that the conductive pattern part and the insulating pattern part are formed in a pattern such as a comb blade electrode by etching, and direct current (DC) is applied between the conductive pattern parts for 96 hours in an environment of 85 ° C. and humidity of 85% RH. Evaluation is based on the rate of change in resistance before and after 3 V is continuously applied. GD (Good) when the resistance change rate is less than 1.5 times, OK when 1.5 times or more and less than 2.0 times, NG (No Good) when it is 2.0 times or more It is evaluated. For reliability evaluation, JIS-C-5028 (moisture resistance reliability test of electronic parts) and JIS-Z-3284 (insulation resistance test of solder paste) are referred to.

(Evaluation 1-3: Optical characteristics)
The optical characteristics are evaluated as GD (Good) when the sample is not added with a water-repellent additive, and OK when the optical characteristics (haze, transmittance, etc.) are reduced. “GD to OK” means that when a plurality of water repellent additives to be added to the transparent binder are tested with different product numbers, concentrations, molecular weights, and the like, GD or OK may occur.

(Comprehensive evaluation 1)
The comprehensive evaluation is a comprehensive evaluation in which mass productivity is added to the quality of the sample, A is good (Good), B may have a problem to be solved (OK), and C means No Good or Poor.

The evaluation results of each evaluation sample are shown in (Table 1) to (Table 3). (Table 1) shows the evaluation results for each sample when a metal nanowire layer having a sheet resistance of 10Ω / □ is used and transparent binders having different contact angles are formed with overcoat liquids having different amounts of water repellent additives. Show. Similarly, (Table 2) and (Table 3) show the evaluation results when using metal nanowire layers with sheet resistances of 40Ω / □ and 100Ω / □, respectively.

Comparing the results of samples AC1, AC11, and AC21 having a contact angle of 55 degrees, the reliability evaluation is OK for AC1, OK to NG for AC11, and NG for AC21. This is presumably because the higher the sheet resistance, the lower the density of the metal nanowires contained in the transparent conductive film, and the greater the change in resistance value. That is, in general metal migration, adjacent electrodes are short-circuited due to the generation of dent light or the like. However, in the case of a transparent conductive film including metal nanowires, when one insulating pattern part is provided between two conductive pattern parts and a voltage is applied between the two conductive pattern parts, a short circuit occurs due to the generation of dent light. It is not (short circuit), but is a disconnection between the conductive pattern portions. In such a case, as shown in FIG. 6, in the insulating pattern portion 270, it is useful that the surface of the pore portion 260 has water repellency. In addition to the pores 260, it is useful that the inner surfaces of the pores and voids contained in the transparent binder 140 have water repellency.

That is, even if the metal material constituting the metal nanowire 120 is ionized, the conductive pattern portions 280 are insulated by the insulating pattern portion 270 having the pores 260. At that time, it is considered that a water repellent group such as a fluoroalkyl group or a fluoroalkylene group segregated on the surface of the pore 260 suppresses the movement of the ionized metal material and increases the electrical reliability.

In samples AC1, AC11, and AC21, a pore sealing process (for example, coating a thin resin layer on the surface) is performed in order to seal the pores formed by removing the metal nanowires by wet etching. The reliability is improved. For example, a thin resin layer may be applied and formed on the surface. However, adding a new pore sealing process after wet etching affects the product price.

The contact angle of samples AC2, AC12, and AC22 is 75 degrees. The reliability evaluation results are OK for AC2 with sheet resistance of 10Ω / □ and AC12 with 40Ω / □, and OK to NG for AC22 with sheet resistance of 100Ω / □. This is presumably because the water removal effect in the pores by the water repellent additive as shown in FIG. 6 was not obtained.

On the other hand, in the samples AE1 to AE23 having a contact angle of 80 degrees or more and 125 degrees or less, the reliability is GD regardless of the sheet resistance. In this way, by adjusting the blending amount of the water repellent additive so that the contact angle is 80 degrees or more and 125 degrees or less, the water removal effect in the pores 260 by the water repellent additive 310 shown in FIG. It can be seen that is sufficiently obtained.

In Samples AE1 to AE23, the optical characteristic is GD regardless of the sheet resistance. This is because the water-repellent additive 310 added to the transparent binder 140 is effectively applied to the surface of the transparent conductive film 150 within the range of the water-repellent additive in which the contact angle is 75 degrees or more and 125 degrees or less. This is thought to be due to segregation.

On the other hand, in the samples AC3, AC13, and AC23 having a contact angle of 130 degrees, the optical characteristics are GD to OK. This is because part of the water-repellent additive added to the transparent binder becomes surplus beyond the saturation state, and even in the transparent conductive film (transparent binder), it is deposited like micelles, affecting the optical properties. It is thought that gave.

(Embodiment 2)
FIG. 8A is a perspective view of transparent shield film (hereinafter referred to as film) 410 according to Embodiment 2 of the present invention. FIG. 8B is an enlarged view of a part of a cross section taken along line 8B-8B shown in FIG. 8A. One form of the film 410 has a sheet-like sheet shape as shown in FIG. 8A, but may have a long continuous roll shape as shown in FIG. 1A in the first embodiment. Good.

The film 410 includes a film-like transparent base material 130, a transparent conductive film 150, and a conductive cured product 430. The transparent substrate 130 has a first surface and a second surface opposite to the first surface. The transparent conductive film 150 includes the metal nanowire 120 and a transparent binder 140 containing a water repellent additive, and is formed on the first surface of the transparent substrate 130. The conductive cured product 430 covers at least a part of the peripheral edge of the transparent conductive film 150. Furthermore, the film 410 has an anti-blocking layer 160 formed on the second surface of the transparent substrate 130. That is, in the film 410, the transparent base material 130, the transparent conductive film 150, and the anti-blocking layer 160 constitute the film 111 with a transparent conductive film in the first embodiment. Hereinafter, since the transparent base material 130, the transparent conductive film 150, and the anti-blocking layer 160 are the same as those in Embodiment 1, detailed description may be omitted.

As shown in FIG. 8B, a part of the metal nanowire 120 exposed from the transparent conductive film 150 is in contact with the conductive cured material 430 that covers the transparent conductive film 150. Alternatively, it penetrates into the inside of the conductive cured product 430. Therefore, the transparent conductive film 150 and the conductive cured product 430 are electrically connected stably. Moreover, the adhesive force between each other is increasing.

In addition, the peripheral part of the transparent conductive film 150 is a frame-shaped part within 10 mm from the end part of the transparent conductive film 150 or the transparent base material 130. Since the conductive cured product 430 provided at the peripheral portion does not have light transmittance, when the peripheral portion is made larger than 10 mm, the area ratio of the transparent portion of the film 410 is lowered. Note that the width of the peripheral portion is preferably 5 mm or less, and more preferably 2 mm or less.

As shown in FIG. 8B, the contact angle 190 of the transparent conductive film 150 corresponds to the angle between the auxiliary line 180 drawn on the water droplet 170 dropped on the transparent conductive film 150 and the transparent conductive film 150. Similar to the first embodiment, the contact angle 190 is not less than 80 degrees and not more than 125 degrees.

Next, a transparent shield film (hereinafter referred to as film) 411 in which a protective film with an adhesive layer is provided on the surface of the transparent conductive film 150 will be described with reference to FIGS. 9A and 9B. FIG. 9A is a perspective view of the film 411. FIG. 9B is an enlarged view of a part of a cross section taken along line 9B-9B shown in FIG. 9A. The film 411 is different from the film 410 shown in FIGS. 8A and 8B in that a protective film 510 is provided on the transparent conductive film 150 with an adhesive layer 520 interposed therebetween. Other configurations are the same as those of the film 410.

In the film 411 shown in FIG. 9A, a protective film 510 is provided on the transparent conductive film 150 in the center shown in FIG. 8A. The protective film 510 protects the transparent conductive film 150. As the protective film 510, a polyester film (for example, a PET film) or a glass plate (including an extremely thin glass plate) can be used.

As shown in FIG. 9B, the central portion of the transparent conductive film 150 is covered with a protective film 510 having an adhesive layer 520. A part of the metal nanowire 120 exposed from the transparent conductive film 150 penetrates into the adhesive layer 520. Therefore, the adhesive force between the transparent conductive film 150 and the adhesive layer 520 or the protective film 510 is increased. By overlapping a part of the conductive cured product 430 on the protective film 510, occurrence of peeling from the end of the protective film 510 can be reduced.

The central portion provided with the protective film 510 is a portion excluding the peripheral portion, that is, a portion closer to the center than the position of 10 mm from the end of the transparent base material 130 or the transparent conductive film 150. The wider the central portion where the protective film 510 is provided, the larger the area of the light transmitting portion in the film 410, which is preferable.

The outer surface of a general protective film 510 may be subjected to a water repellent treatment to prevent adhesion of oily dirt transmitted from a fingertip or the like. Such a water repellent treatment is performed only on the surface of the protective film 510, and is not performed on the transparent conductive film 150. However, in this embodiment, the water repellent additive is exposed on the surface of the transparent conductive film 150 as described above. Therefore, the transparent conductive film 150 has water repellency. As a result, the long-term reliability with respect to the humidity of the transparent conductive film 150 can be improved.

Next, referring to FIG. 10, a description will be given of how individual transparent shield sheets are manufactured from large-sized multi-part members. FIG. 10 is a perspective view showing a state in which, in the present embodiment, the transparent shield film for large multi-capture is cut into individual pieces to form individual transparent shield films.

The continuous product 550 is a member for taking multiple pieces, and by cutting the continuous product 550 with a cutting line 530, a transparent shield film as a single product 560 as indicated by an arrow is obtained. If the continuous product 550 without the protective film 510 is used, the film 410 is obtained as a single product 560. If a continuous product having the protective film 510 is used, the film 411 is obtained as a single product.

By cutting the continuous product 550 with the cutting line 530, the outer shape of the transparent substrate 130, the end surface of the transparent conductive film 150, and the outer periphery of the conductive cured product 430 can be aligned. As a result, the width of the conductive cured product 430 can be narrowed.

If the protective film 510 is provided on the surface of the transparent conductive film 150 via the adhesive layer 520, it may be difficult to measure the contact angle of the surface of the transparent conductive film 150. In such a case, as shown in FIG. 11, the contact angle 190 can be measured at the end surface (or cut surface) of the film 411 when cut along the cutting line 530 of FIG. FIG. 11 shows a state in which the surface tension of the transparent conductive film 150 exposed on the cut surface of the film 411 is measured. In addition, it becomes easy to measure the surface tension of the transparent conductive film 150 by changing the cutting angle of the film 411. In order to change the cutting angle of the film 411, for example, the film 410 is cut obliquely. In addition, in order to measure the surface tension of the fine portion, a commercially available surface contact angle measuring device using fine droplets of picoliter order can be used.

The sheet resistance of the transparent conductive film 150 is preferably 10Ω / □ or more, more preferably 100Ω / □ or more and 10KΩ / □ or less. When the sheet resistance of the transparent conductive film 150 is less than 10 Ω / □, the density of the metal nanowires 120 included in the transparent conductive film 150 increases, the transparency of the film 410 may decrease, and the cost may increase. Further, when the sheet resistance is higher than 10 KΩ / □, the density and density unevenness of the metal nanowires 120 may occur, and the variation in sheet resistance in the surface may increase.

Next, the contact angle of the surface of the film 410 described in FIG. 8B and FIG. 11 will be described. As described above, the contact angle 190 is not less than 80 degrees and not more than 125 degrees. When the contact angle 190 is less than 80 degrees, there may be a problem in reliability (for example, electrical reliability in a high humidity state). When the contact angle 190 is greater than 125 degrees, the adhesion strength of the protective film 510 formed on the transparent conductive film 150 may be reduced, or the film quality of the transparent conductive film 150 may be reduced. For example, there is a possibility that the physical strength of the transparent conductive film 150 is reduced, that the transparent conductive film 150 is easily broken, or that the transparent conductive film 150 is easily aggregated.

Next, the process of printing the conductive paste composition 620 on the peripheral edge of the transparent conductive film 150 using screen printing or the like will be described with reference to FIGS. 12A and 12B. 12A is a cross-sectional view illustrating a state in which a part of the metal nanowire 120 is in contact with the conductive paste composition 620 in the process of manufacturing the film 410 illustrated in FIG. 8B. 12B is a cross-sectional view illustrating a state in which a part of the metal nanowire 120 is in contact with the conductive paste composition 620 in the process of manufacturing the film 411 illustrated in FIG. 9B.

As shown in FIG. 12A, a conductive cured product 430 can be formed as shown in FIG. 8A by applying a conductive paste composition 620 to the peripheral portion of the transparent conductive film 150 and drying and / or curing. 12B, a protective film 510 is attached to the center of the transparent conductive film 150 via an adhesive layer 520, and the conductive paste is provided between the peripheral edge of the protective film 510 and the outer periphery of the transparent conductive film 150. Composition 620 is applied, dried and / or cured. In this way, a conductive cured product 430 can be formed as shown in FIG. 9A. At this time, by applying the conductive paste composition 620 onto a part of the protective film 510, the conductive cured product 430 and the protective film 510 can be firmly bonded.

As the conductive paste composition 620, a commercially available liquid conductive paste containing silver powder or silver flakes, a thermosetting epoxy resin, or the like can be used. By using the liquid conductive paste composition 620, a part of the metal nanowire 120 exposed on the surface of the transparent conductive film 150 or protruding from the surface is easily wetted or penetrates into the conductive paste composition 620.

The conductive paste composition 620 may contain silver powder, a thermosetting binder resin, and a solvent. As the binder resin contained in the conductive paste composition 620, a one-pack type epoxy resin that is cured by a curing reaction with a curing agent may be used. Further, the curing temperature of the conductive paste composition 620 is useful from 80 ° C. to 120 ° C., but may be adjusted according to the heat resistance of the transparent substrate 130.

In addition, you may form the transparent shield film which provided the transparent conductive film 150 on both surfaces of the transparent base material 130 using the film 110 shown to FIG. 1B. However, considering cost effectiveness, it is preferable to provide the transparent conductive film 150 only on one side (first side) of the transparent substrate 130. Further, for shielding, it is necessary to connect the transparent conductive film 150 to the ground, and when the transparent conductive film 150 is provided on both surfaces of the transparent base material 130, the structure of connecting to the ground by each transparent conductive film 150 is somewhat. It is complicated.

Further, the anti-blocking layer 160 is provided in order to suppress blocking that occurs when wound in a roll shape. Therefore, as shown in FIGS. 8A and 9A, when the

films

410 and 411 have a sheet-like sheet shape, the anti-blocking layer 160 may not be provided. The same applies to the

films

110 and 111 in the first embodiment.

Hereinafter,

display devices

670A and 670B in the present embodiment will be described with reference to FIGS. 13A and 13B. Display devices 670 </ b> A and 670 </ b> B include the above-described film 410 and a liquid crystal unit 630 which is a display element provided to face the film 410. In these drawings, the anti-blocking layer 160 is not shown, but the anti-blocking layer 160 may or may not be provided as described above.

FIG. 13A shows a first structure example using the film 410. Display portion 660 </ b> A includes a liquid crystal unit 630, an upper liquid crystal glass 640, and an upper polarizing plate 650. A film 410 is provided on the upper polarizing plate 650. In the film 410, the transparent conductive film 150 is provided on the first surface of the transparent substrate 130, and the second surface is in contact with the upper polarizing plate 650.

Electromagnetic wave noise generated from the thin film transistor (TFT) portion formed in the liquid crystal portion 630 and the driving device is absorbed by the transparent conductive film 150 of the display device 670A. Therefore, the influence on the transparent touch panel (not shown) installed on the film 410 can be suppressed. With the configuration shown in FIG. 13A, the film 410 can suppress the influence of the phase difference between ordinary light and extraordinary light when light passes through a substance having birefringence, which is called retardation.

FIG. 13B shows a second structure example using the film 410. In the case of the display device 670B, the display portion 660B includes a liquid crystal unit 630 and an upper liquid crystal glass 640. A film 410 is provided on the display portion 660B, and an upper polarizing plate 650 is provided on the outermost part of the film 410. In this structure, the film 410 is closer to the noise generation source than the display device 670A. As a result, an excellent noise shielding effect can be obtained. In the case of the configuration of FIG. 13B, it is desirable to appropriately select the transparent substrate 130 and the like so as not to be affected by retardation.

(Formation of metal nanowire layers)
A coating material composition is prepared using the same material as described in the specific example in the first embodiment, applied to the surface of the PET film with a coater so as to have a thickness of 100 nm, and heated and dried. In this way, a metal nanowire layer is formed. At this time, by adjusting the blending amount of the metal nanowires, sheets each having a metal nanowire layer with a sheet resistance of 100Ω / □ are produced.

(Formation of transparent binder)
An overcoat solution having the same material and composition as described in the specific example in the first embodiment is prepared. The overcoat liquid thus prepared is applied and dried on the metal nanowire layer, and a transparent binder is formed as shown in FIG. 2B to produce a film with a transparent conductive film. At that time, the addition amount of the water repellent additive was adjusted to produce a film with a transparent conductive film having contact angles of 75 degrees, 80 degrees, 105 degrees, 125 degrees, and 130 degrees, respectively. In addition, an overcoat liquid to which no water repellent additive is added is also prepared to form a transparent binder. In this case, the contact angle is 55 degrees. As described above, six types of films with transparent conductive films having different contact angles are produced.

Next, after providing a protective film 510 with an adhesive layer 520 as shown in FIG. 12B on the surface of these films with a transparent conductive film, a conductive paste composition 620 is printed and cured at 100 ° C. for 20 minutes. In this manner, an evaluation sample of the transparent shield film shown in FIGS. 9A and 9B is produced.

(Evaluation 2-1: Fine pattern printability on transparent conductive film by conductive paste composition)
A commercially available conductive paste composition (so-called thermosetting silver paste) is printed on the periphery of the transparent conductive film with a fine pattern printing apparatus such as screen printing or intaglio offset. The printability at that time is evaluated. Here, the line width of the conductive pattern printed on the peripheral portion is 1 mm or less. If there is a problem in fine pattern printability, it is evaluated as OK, and if there is no problem at all, it is evaluated as GD.

(Evaluation 2-2: Reliability of interfacial resistance with conductive cured product)
As a reliability evaluation, the rate of change in resistance value of the connection portion between the transparent conductive film and the conductive cured material formed on the peripheral edge thereof is evaluated. At that time, in the environment of 85 ° C. and humidity 85% RH, the evaluation is performed by the rate of change of resistance before and after applying 3V direct current (DC) between the transparent conductive film and the conductive cured product for 96 hours. . GD (Good) when the resistance change rate is less than 1.5 times, OK when 1.5 times or more and less than 2.0 times, NG (No Good) when it is 2.0 times or more It is evaluated.

In addition, a contact angle is a contact angle with respect to the water (pure water) of the surface of a transparent conductive film before sticking a protective film.

From the results shown in Table 4, when the contact angle is 125 degrees or less, the printability of the conductive paste composition on the transparent conductive film is GD, but the sample BC3 with a contact angle of 130 degrees has a fine pattern printability. It can be seen that problems may arise.

Regarding the reliability of the interfacial resistance with the conductive cured product, the result of sample BC1 is considered to be NG because the transparent conductive film has water absorption. The reason why the reliability of the sample BC2 is OK is considered that the effect of adding the water repellent additive is limited. The reliability of the samples BE1 to BE3 is GD. On the other hand, the reliability of the sample BC3 is OK. The reason for this is considered to be that the reliability of the connection portion between the conductive cured product and the transparent conductive film was affected as a result of the increased amount of water repellent additive.

In addition, the result of the specific example in Embodiment 1 can be used about the optical characteristic of the part of the film with a transparent conductive film contained in the transparent shield sheet by this Embodiment, and the reliability without a protective film. Therefore, those descriptions are omitted.

(Comprehensive evaluation 2)
The comprehensive evaluation is a comprehensive evaluation in which mass productivity is added to the quality of the sample, and A means good (Good), and B means that a problem to be solved may remain (OK).

Next, with reference to FIG. 14, examples of the near electromagnetic field measurement results of various display device samples are shown. In FIG. 14, the horizontal axis represents frequency (unit: MHz), and the vertical axis represents noise level (unit: dBμV). As the measurement of noise, an electric field is measured by scanning a near electromagnetic field probe on the outermost surface of the display device while the display element is driven, and the value is regarded as noise. Samples subjected to this test are as follows.

Sample BE4 is an evaluation sample of the display device 670A having the configuration shown in FIG. 13A, which is configured using the transparent shield film 410 of the sample BE1.

Sample BE5 is an evaluation sample of the display device 670B having the configuration shown in FIG. 13B, which is configured using the transparent shield film 410 of the sample BE1.

Sample BC4 is an evaluation sample configured by replacing the transparent shield film 410 with an indium tin oxide film (ITO) having a sheet resistance of 400Ω / □ as a shield layer in the display device having the configuration shown in FIG. 13A.

Sample BC5 is an evaluation sample configured without the transparent shield film 410 in the display device having the configuration shown in FIG. 13A.

FIG. 14 shows that compared with samples BC4 and BC5, samples BE4 and BE5 have a large noise reduction effect of 10 to 20 dB particularly in a low frequency region of 1 MHz or less. In addition, it can be seen that the samples BE4 and BE5 have an excellent noise reduction effect of 5 to 10 dB even in a frequency band of 1 MHz or higher.

In addition, the lower the sheet resistance (Ω / □) of the shield layer or shield film, the higher the shielding effect. However, in the case of a shield layer made of ITO, the film is colored when the ITO is thickened to lower the sheet resistance. In addition, in order to increase the thickness of ITO, it is necessary to lengthen the sputtering time, which causes a process problem. Further, if the sputtering time is lengthened, the color filter serving as a base on which the ITO is formed is also affected.

On the other hand, when the transparent shield film 410 is used, the sheet is not colored even if the sheet resistance is lowered. Moreover, since the transparent conductive film 150 which is a shield layer using the metal nanowire 120 can be formed by coating, it can be formed by a single coating process regardless of the sheet resistance. As a result, no process problems arise.

According to the present invention, a transparent conductive film containing metal nanowires can be wet-patterned via a transparent binder, and a film with a transparent conductive film with high electrical reliability can be provided even after patterning. Moreover, the reliability of the film with a transparent wiring produced using this film with a transparent conductive film, a touch panel, and a display apparatus can be improved.

Further, according to the present invention, it is possible to improve long-term reliability against humidity in a transparent shield film containing metal nanowires and a display device using the same. Further, by using a transparent shield film having a low sheet resistance, it becomes possible to take a shield measure for a large area device such as a large digital signage in a commercial facility.

110,111 Film with transparent conductive film (film)
120 Metal nanowire 130 Transparent substrate 140 Transparent binder 150 Transparent conductive film 160

Anti-blocking layer

170, 170a, 170b, 170c Water droplet 180

Auxiliary line

190, 190a, 190b, 190c Contact angle 200

Gaps

210, 210a, 210b Binder resin part 220 Metal nanowire layer 230 Overcoat liquid 240 Resist pattern part 250 Opening part 260 Pore part 270

Insulating pattern part

280, 280a, 280b Conductive pattern part 290 Transparent wiring 300 Film with transparent wiring (film)
310, 310a, 310b Water repellent additive 320 Fingertip 330 Capacitance component 340 Hard protective sheet 350 Semiconductor element 360 Touch panel 370 Arrow 380 Display element 390

Display device

410, 411 Transparent shield film (film)
430 Conductive cured product 510 Protective film 520 Adhesive layer 530 Cutting line 550 Continuous product 560 Single product 620 Conductive paste composition 630 Liquid crystal part 640 Upper liquid crystal glass 650 Upper

polarizing plate

660A,

660B Display portion

670A, 670B Display device

Claims

A film-like transparent substrate having a first surface and a second surface opposite to the first surface;
Comprising a metal nanowire and a transparent binder containing a water repellent additive, and comprising a transparent conductive film formed on at least one of the first surface and the second surface of the transparent substrate,
A part of the metal nanowire is exposed on the surface of the transparent conductive film,
The contact angle of the surface of the transparent conductive film is 80 degrees or more and 125 degrees or less.
Film with transparent conductive film.
The increase in haze after heating the transparent substrate at 100 ° C. for 60 minutes is 0.3% or less,
The film with a transparent conductive film according to claim 1.
The transparent binder further contains at least one of a thermosetting resin and an ionizing radiation curable resin,
The water repellent additive includes a compound containing a fluoroalkyl group or a fluoroalkylene group,
The film with a transparent conductive film according to claim 1.
A part of the water repellent additive is further exposed on the surface of the transparent conductive film,
The film with a transparent conductive film according to any one of claims 1 to 3.
The sheet resistance of the transparent conductive film is 0.1Ω / □ or more and 200Ω / □ or less,
The thickness of the transparent conductive film is 20 nm or more and 300 nm or less.
The film with a transparent conductive film according to any one of claims 1 to 4.
A film with a transparent conductive film according to any one of claims 1 to 5;
A conductive cured material covering at least a part of the peripheral edge of the transparent conductive film,
Transparent shield film.
Further provided with a protective film provided on the surface of the transparent conductive film,
The transparent shield film according to claim 6.
The transparent shield film according to any one of claims 6 and 7,
A display element provided opposite to the transparent shield film,
Display device.
A film-like transparent substrate having a first surface and a second surface opposite to the first surface;
Comprising a metal nanowire and a transparent binder containing a water repellent additive, and comprising a transparent conductive film formed on at least one of the first surface and the second surface of the transparent substrate,
The transparent conductive film has a conductive pattern portion where the metal nanowires are present and an insulating pattern portion including a pore portion which is formed in the transparent binder and where the metal nanowires are not present,
A part of the metal nanowire is exposed on the surface of the conductive pattern portion in the transparent conductive film,
The contact angle of the surface of the conductive pattern portion in the transparent conductive film is 80 degrees or more and 125 degrees or less.
Film with transparent wiring.
In the transparent conductive film, the difference between the contact angle of the surface of the conductive pattern part and the contact angle of the surface of the insulating pattern part satisfies 10% or less or 10 degrees or less,
The film with transparent wiring according to claim 9.
The transparent binder further contains at least one of a thermosetting resin and an ionizing radiation curable resin,
The water repellent additive includes a compound containing a fluoroalkyl group or a fluoroalkylene group,
The film with a transparent wiring according to any one of claims 9 and 10.
A part of the water repellent additive is exposed in the pores,
The film with a transparent wiring according to any one of claims 9 to 11.
A film with a transparent wiring according to any one of claims 9 to 12,
A semiconductor element electrically connected to the conductive pattern portion;
A hard protective sheet covering the transparent wiring,
Touch panel.
A part of the water repellent additive is exposed in the pores,
The touch panel according to claim 13.
A film with a transparent wiring according to any one of claims 9 to 12,
A semiconductor element electrically connected to the conductive pattern portion;
A hard protective sheet covering the transparent wiring, and a touch panel,
A display element disposed opposite to the touch panel,
Display device.
A part of the water repellent additive is exposed in the pores,
The display device according to claim 15.