CN203194011U - Paper-free chipless printing ink protection film - Google Patents
Paper-free chipless printing ink protection film Download PDFInfo
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- CN203194011U CN203194011U CN 201320161560 CN201320161560U CN203194011U CN 203194011 U CN203194011 U CN 203194011U CN 201320161560 CN201320161560 CN 201320161560 CN 201320161560 U CN201320161560 U CN 201320161560U CN 203194011 U CN203194011 U CN 203194011U
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- China
- Prior art keywords
- printing ink
- paper
- chipless
- adhesion layer
- release film
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Abstract
The utility model discloses a paper-free chipless printing ink protection film. A printing ink layer is disposed on a double-sided release film in a coated manner, and an adhesion layer is disposed on the surface of the printing ink layer by using a coating method, and therefore the paper-free chipless printing ink protection film constituted by the double-sided release film, the printing ink layer, and the adhesion layer can be formed. After the paper-free chipless printing ink protection film is rolled up, one surface of the double-sided release film is the printing ink layer, and the other surface is contacted with the adhesion layer, namely the double-sided release film can be used to protect the printing ink layer and the adhesion layer at the same time, and therefore the release paper is not required, and the step of attaching the release paper can be saved. The paper-free chipless printing ink protection film is advantageous in that the costs and the time can be saved, and the severe problems of the release paper such as chip jumping and curling can be prevented.
Description
Technical field
The utility model relates to a kind of printing ink diaphragm, particularly a kind of do not have the paper chipless, have excellent anti voltinism, electrical characteristic and flexibility, be applicable to the printing ink diaphragm of the printed circuit board (PCB) of high flexible.
Background technology
Polyimide resin has been widely used in the electronic material, wherein, is used for the polyimide copper foil substrate of flexible printed wiring board, generally divides into single sided board or double sided board.Usually, the problem of polyimide copper foil substrate on using is subject to composition and the thickness thereof of polyimide material.The wiring material of small-sized electronic product adopts design freedom height, flexible printed wiring board (Flexible Printed Circuit that bendability is good mostly, hereinafter to be referred as FPC), and in the countermeasure of constantly having formulated all thickness, operation in high-speedization, the high deflection development.In this case, released traditional PI diaphragm (the thin PI of thin glue), photosensitive type PI(or acryl system in the market) diaphragm, non-photosensitive type PI diaphragm (photoresistance on the need) be widely adopted.
These small-sized electronic products not only will be to more small-sized, lightweight development, and the design that has more the degree of freedom also is a big key element.In the FPC field, be not only the intelligent mobile phone to main flow, to the new demand of contact panel design also in continuous expansion.
The utility model content
In order to overcome above-mentioned defective; the utility model provides a kind of no paper chipless printing ink diaphragm; characteristics such as no paper chipless printing ink diaphragm of the present utility model has the no paper chipless feature of environmental protection, chemical resistance is good, electrical characteristic is good, high flexibility and covering property are applicable to the flexible printed wiring board of ultrathin high flexible.
The utility model for the technical scheme that solves its technical problem and adopt is:
A kind of no paper chipless printing ink diaphragm, by two-sided release film, be formed at the lip-deep ink lay of described two-sided release film and be formed at the lip-deep adhesion layer of described ink lay and constitute, described two-sided release film is the release film that the two sides all has mould release, and described ink lay is folded between described adhesion layer and the described two-sided release film; After the rolling of described no paper chipless printing ink diaphragm, the one side of described two-sided release film is that described ink lay and another side are described adhesion layer.
Say that further the gross thickness of described ink lay and described adhesion layer is 9～85 microns.
Be preferably, described two-sided release film is moulded release film, PET for the PET fluorine and is contained a kind of in silicone oil release film and the PE release film, and thickness is 25～100 microns.
Be preferably, the thickness of described ink lay is 1～25 micron.
Be preferably, the thickness of described adhesion layer is 8～60 microns.
Be preferably, described adhesion layer is resin bed.
Be preferably, described ink lay is the resin bed that contains coloured female additive.
The beneficial effects of the utility model are: the utility model is at two-sided release film coating one deck ink lay; with rubbing method adhesion layer is formed on the ink lay surface again; make by two-sided release film; the no paper chipless printing ink diaphragm that ink lay and adhesion layer constitute; after this no paper chipless printing ink diaphragm rolling; the one side of its two-sided release film is that ink lay and another side contact with adhesion layer; namely this two-sided release film is protected ink lay and adhesion layer simultaneously; therefore do not need to use release liners; can save the step of applying release liners; the cost of saving and the advantage of time are arranged; the jumping bits that can avoid release liners to bring again; serious problems such as curl; to sum up; no paper chipless printing ink diaphragm of the present utility model has no paper chipless; ultrathin; flexibility is good; color masking; chemical resistance is good; electrical characteristic is good; pliability is good; be better than traditional PI diaphragm (the thin PI of thin glue); photosensitive type PI(or acryl system) diaphragm; non-photosensitive type PI diaphragm (photoresistance on the need); be applicable to clamshell phone; slide phone; digital camera; digital camera; the lithographic plate computer; application such as intelligent mobile phone are used for replacing general diaphragm material.
Description of drawings
Fig. 1 is structural representation of the present utility model.
Embodiment
Below in conjunction with accompanying drawing preferred embodiment of the present utility model is described in detail, thereby so that advantage of the present utility model and feature can be easier to be it will be appreciated by those skilled in the art that protection range of the present utility model is made more explicit defining.
At (the lightness of lightness described in the utility model, claim the L value again) refer to the definition to the bright-dark degree of color according to Commission Internationale De L'Eclairage (International Commission on Illumination), usually, white lightness is the highest, and the black lightness is minimum.Glossiness described in the utility model (Gloss) refers to the reflective degree on the ink lay surface of ultra-thin printing ink diaphragm, and glossiness does not have unit, but its numerical value is more big; it is more strong to represent its catoptrical intensity; otherwise numerical value is more little, and it is more weak to represent its catoptrical intensity.
Embodiment: as shown in Figure 1, it is no paper chipless printing ink diaphragm of the present utility model, by two-sided release film 1, be formed at the lip-deep ink lay 2 of described two-sided release film and be formed at the lip-deep adhesion layer 3 of described ink lay and constitute, described two-sided release film 1 is the release film that the two sides all has mould release, and described ink lay 2 is folded between described adhesion layer 3 and the described two-sided release film 1; After the rolling of described no paper chipless printing ink diaphragm, the one side of described two-sided release film 1 is that described ink lay 2 and another side are described adhesion layer 3.
The manufacture method of above-mentioned no paper chipless printing ink diaphragm, undertaken by following step:
Step 1: be coated with printing ink at described two-sided release film, adopt 150 ℃～180 ℃ low-temperature settings to form ink lay (conventional PI film curing temperature need reach 350 ℃);
Step 2: adhesion layer is formed on the ink lay surface with rubbing method;
Step 3: directly rolling.
Wherein, the gross thickness of described ink lay and described adhesion layer is 9～85 microns.
Wherein, described two-sided release film is moulded release film, PET for the PET fluorine and is contained a kind of in silicone oil release film and the PE release film, and thickness is 25～100 microns.
Wherein, the thickness of described ink lay is 1～25 micron, considers the simplicity of processing, and optimum thickness is 5 microns.Described ink lay is the resin bed that contains coloured female additive, can be shades of colours such as black, redness, orange, yellow, blueness.The resin material of described ink lay be epoxy resin, acrylic resin, amido formate be resin, silicon rubber be resin, poly-be at least a in resin and the polyimide resin to ring diformazan benzene series resin, bismaleimides.The female additive of the look of described ink lay comprises at least a in material with carbon element, titanium dioxide, pigment, dyestuff and the toner.Pigment can comprise that organic material and inorganic material are prepared.
Wherein, the thickness of described adhesion layer is 8～60 microns.Described adhesion layer is resin bed.The resin material of described adhesion layer be epoxy resin, acrylic resin, amido formate be resin, silicon rubber be resin, poly-be at least a in resin and the polyimide resin to ring diformazan benzene series resin, bismaleimides.
No paper chipless printing ink diaphragm of the present utility model adopts the two sides all to have the two-sided release film of mould release; after the rolling; the one side of two-sided release film is that ink lay and another side are adhesion layers; can save the step of applying release liners; have and save cost and the advantage of time, the jumping bits that can avoid again being brought by release liners, serious problems such as curl.
With regard to the black ink layer of no paper chipless printing ink diaphragm, lightness is for being less than or equal to 25, and glossiness is for being less than or equal to 20, and then the thickness of this black ink layer should be 1～25 micron.In addition, lightness of the present utility model is except passing through by the thickness of adjusting black ink layer, also can adjust the content of the contained additive of this black ink layer, usually, the additive content that makes an addition to this black ink layer is 3～25 wt% that account for the black ink layer solid content, is good with 5～15 wt% again, for example, if the black ink layer solid content is 100 g, then additive content is 3～25 g.Glossiness of the present utility model can make the reflective degree difference of ink pellet surface reach different Gloss values by the release film of selecting different surface roughness for use.
Glossiness of the present utility model (Gloss value), blackness test, flexibility test are tested as follows with flexibility:
One, glossiness (Gloss value) test
Use the glossiness tester to carry out.
Test condition:
Angle: 60 °
Specimen size: greater than length * wide=10cm * 4cm
Directly reading gets final product.
Two, blackness test
Use the blackness tester to carry out.
Test condition:
Angle: 45
Specimen size: greater than length * wide=4m * 4cm
Directly reading gets final product.
Three, flexibility test
Use the flexibility tester to carry out.
Test condition:
Voltage: AC220V
Measuring range: 410 grams
Readable: 0.001 gram
Test R angle: 2.35 mm
Testing procedure
1, adjusts two feets of tester, make air level be positioned at the leveling instrument center.
2, connect instrument power source, with the instrument zero clearing.
3, open glass door, test piece (size 10 mm * 30 a mm) end is fixed on the holder of pallet top, the other end is stuck on the deck at pallet center, makes test piece become one " U " font, shuts glass door after finishing.
4, rotary apparatus right-hand member knob slowly counterclockwise slowly descends deck, contacts with following square washer until it, and the R of test piece at this moment angle is 2.35 mm.
5, lamp to be instructed bright after, both can read contravariant power reading.
6, after test finishes, the knob dextrorotation to original position, is opened glass door, take off test piece.
7, repeat steps 3-6 suddenly, test other test pieces.
Four, flexibility test
Use the slide unit tester to carry out.
Test condition:
Use voltage: AC220V
Test R angle: 1.0 mm
Testing procedure:
1, adjusts two feets of tester, test piece is fixed on the tester table;
2, connect instrument power source, with the instrument zero clearing;
Set: test condition:
Spacing H:2.0 mm, place, R angle: 0.8 mm
Frequency: 30 times/minute
Shift motion: 32 mm
3, lamp to be instructed bright after, can record the experimental test data;
4, after test finishes, the knob dextrorotation to original position, is taken off test piece;
5, repeat above-mentioned steps, test other test pieces.
Comparative example 1: (Teijin Advanced Films Ltd. is produced used thickness by 12.5 microns black polyamide thin film, PI film with trade name Kapton sale) as cover layer, utilize epoxy resin to coat on this polyimide film cover layer as adhesion layer.According to the thickness of the listed cover layer of table 1, adhesion layer, be cut into the flexible printed wiring board specimen test piece of 10 ㎜ * 30 ㎜, carry out glossiness, blackness, flexibility and flexibility test, repeat three times, calculating mean value, test result is embedded in table 1.
Comparative example 2: be coated with printing ink at release film, adopt low-temperature setting (150 ~ 180 ℃) to form ink lay, with rubbing method adhesion layer is formed on the ink lay surface, get release liners, off-style paper layer is covered on the adhesion layer, obtain ultra-thin printing ink diaphragm.According to the thickness of the listed cover layer of table 2, adhesion layer, be cut into the flexible printed wiring board specimen test piece of 10 ㎜ * 30 ㎜, carry out glossiness, blackness, flexibility and flexibility test, repeat three times, calculating mean value, test result is embedded in table 2.
Table 1
| | Embodiment | 1 | |
Embodiment 3 | Comparative example 1 |
| Cover layer | Black ink | Black ink | Black ink | Black PI | |
| Overburden cover (um) | 3 | 3 | 5 | 12.5 | |
| Adhesion layer thickness (um) | 8 | 60 | 60 | 8 | |
| Gross thickness (um) | 11 | 63 | 65 | 20.5 | |
| The Gloss value | 17.9 | 17.9 | 17.9 | 43 | |
| Blackness | 36.3 | 31.2 | 30.8 | 63.3 | |
| Flexibility (gf) | 1.3 | 4.8 | 5.0? | 6.4 | |
| Flexibility (ten thousand times) | 67 | 55 | 54 | 43 |
According to the result demonstration of embodiment 1～3 with comparative example 1, the utility model uses ultra-thin ink lay as the cover layer of diaphragm, can use the simple material of low cost and manufacture method to reach the Gloss value that is more suitable for than existing polyimide film.On the other hand, use ink lay to be cover layer, also can further reduce integral thickness, make flexible printed wiring board have preferable flexibility and flexibility, after the specimen test piece was carried out simulating the flexibility test of slide phone slip up to 60 or 650,000 times, its circuit still can keep normal electrical property efficiency.Under the same thickness condition, embodiment data of the present utility model obviously are better than comparative example.
Table 2
According to the result demonstration of embodiment 1～3 with comparative example 2, the utility model uses two-sided release film, and directly rolling (release liners of not fitting) can reduce cost on the one hand, shortens the process time; On the other hand, the release liners of not fitting, the jumping bits that can either avoid being caused by release liners, burr, serious problems such as curl can reach the modernization development demand of environmental protection again.Can be found out fully that by table 2 embodiment data of the present utility model obviously are better than comparative example.
Above-described embodiment is illustrative principle of the present utility model and effect thereof only, but not is used for restriction the utility model.Protection range of the present utility model should be listed as claims.
Claims (5)
1. no paper chipless printing ink diaphragm, it is characterized in that: by two-sided release film, be formed at the lip-deep ink lay of described two-sided release film and be formed at the lip-deep adhesion layer of described ink lay and constitute, described two-sided release film is the release film that the two sides all has mould release, and described ink lay is folded between described adhesion layer and the described two-sided release film; After the rolling of described no paper chipless printing ink diaphragm, the one side of described two-sided release film is that described ink lay and another side are described adhesion layer.
2. no paper chipless printing ink diaphragm according to claim 1, it is characterized in that: the gross thickness of described ink lay and described adhesion layer is 9～85 microns.
3. no paper chipless printing ink diaphragm according to claim 2, it is characterized in that: the thickness of described ink lay is 1～25 micron.
4. no paper chipless printing ink diaphragm according to claim 2, it is characterized in that: the thickness of described adhesion layer is 8～60 microns.
5. no paper chipless printing ink diaphragm according to claim 1, it is characterized in that: described adhesion layer is resin bed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320161560 CN203194011U (en) | 2013-04-02 | 2013-04-02 | Paper-free chipless printing ink protection film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320161560 CN203194011U (en) | 2013-04-02 | 2013-04-02 | Paper-free chipless printing ink protection film |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203194011U true CN203194011U (en) | 2013-09-11 |
Family
ID=49110831
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320161560 Expired - Lifetime CN203194011U (en) | 2013-04-02 | 2013-04-02 | Paper-free chipless printing ink protection film |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203194011U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104105331A (en) * | 2013-04-02 | 2014-10-15 | 昆山雅森电子材料科技有限公司 | Paperless and no-scrap ink protective film and manufacturing method thereof |
-
2013
- 2013-04-02 CN CN 201320161560 patent/CN203194011U/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104105331A (en) * | 2013-04-02 | 2014-10-15 | 昆山雅森电子材料科技有限公司 | Paperless and no-scrap ink protective film and manufacturing method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20130911 |
|
| CX01 | Expiry of patent term |