CN101521985A - Shielding structure and flexible printed circuit board provided with the shielding structure - Google Patents
Shielding structure and flexible printed circuit board provided with the shielding structure Download PDFInfo
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- CN101521985A CN101521985A CN200810082225A CN200810082225A CN101521985A CN 101521985 A CN101521985 A CN 101521985A CN 200810082225 A CN200810082225 A CN 200810082225A CN 200810082225 A CN200810082225 A CN 200810082225A CN 101521985 A CN101521985 A CN 101521985A
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- circuit board
- printed circuit
- flexible printed
- shielding construction
- shielding structure
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Abstract
The invention discloses a shielding structure and a flexible printed circuit board provided with the shielding structure, and comprises the flexible printed circuit board and the shielding structure that is arranged on the flexible printed circuit board; wherein the shielding structure comprises a metal layer and a polyimide layer, the thickness of the metal layer lies between 1 and 20 microns, and the thickness of the polyimide layer lies between 1 and 15 microns. The shielding structure has excellent flexibility, and is especially applicable to electronic products such as flip cellphones, slide cellphones and so on.
Description
Invention field
The present invention relates to a kind of shielding construction, more particularly, relate to a kind of shielding construction that is used for flexible printed circuit board.
Background technology
Because electronic product is to compact type, multifunction and change development at a high speed, therefore, its wiring material adopt mostly design freedom height, flexible printed circuit board that bendability is good (Flexible Printed Circuit, FPC).Yet, different electronic products will produce different electromagnetic waves, easily cause electromagnetic interference (EMI) and cause electronic product to damage, even be detrimental to health, in this case, the film-type flexible printed circuit board that will have a screened film is applied to electronic products such as mobile phone, digital camera, digital camera for extensively adopting.
In known technology, adopt the screened film of plastic material as electromagnetic interference, its manufacture method can be the fiber or the particle of conductive doped property in plastic material, in order to form the conductivity type plastic material, or plate conducting metal at plastic material surface by paillon foil mounting method, ion beam method, vacuum vapour deposition, galvanoplastic etc., by conducting metal shielding electromagnetic waves efficient is reduced electromagnetic interference.
In plastic material, add conducting metal or plate conducting metal to form the screen of electronic product though utilize on its surface, it is simple, in light weight, attractive in appearance or the like that it has processing, yet, because the coefficient of expansion, the glass transition temperature characteristic differences such as (Tg) of plastic material and conducting metal easily cause problems such as associativity is not good, conductivity reduces, flexibility is not good.
Therefore, how to propose a kind of shielding material that overcomes the prior art many disadvantages, real having become demanded the difficult problem that overcomes at present urgently.
Summary of the invention
In view of the various shortcoming of above-mentioned known technology, main purpose of the present invention is to provide a kind of have high flexibility and the good shielding construction of pliability.
Another object of the present invention is to provide a kind of flexible printed circuit board with the good shielding construction of high flexibility and pliability.
For reaching above-mentioned and other purpose, the present invention discloses a kind of shielding construction, comprise metal level and be formed on polyimide layer on this metal level, and above-mentioned metal layer thickness is between 1-20 μ m, and the thickness of this polyimide layer is between 1-15 μ m.Above-mentioned shielding construction has excellent flexibility and flexible good, is particularly suitable for renovating, in the electronic product such as slide phone.
The present invention also discloses a kind of flexible printed circuit board with above-mentioned shielding construction, the shielding construction that comprises flexible printed circuit board and be arranged on this flexible printed circuit board, wherein, above-mentioned shielding construction comprises metal level and polyimide layer, and this metal layer thickness is between 1-20 μ m, and the thickness of this polyimide layer is between 1-15 μ m.
Description of drawings
Fig. 1 is the schematic diagram of shielding construction of the present invention; And
Fig. 2 is the schematic diagram that the present invention has the flexible printed circuit board of shielding construction.
110,210 shielding constructions
112,212 metal levels
114,214 polyimide layers
200 flexible printed circuit boards
220 conducting resinls
Embodiment
Below by particular specific embodiment explanation embodiments of the present invention.
Fig. 1 shows the specific embodiment of shielding construction of the present invention.This shielding construction 110 comprises metal level 112 and the polyimide layer 114 that is formed on this metal level.Use copper as metal level in above-mentioned specific embodiment, the embodiment of this copper metal comprises cathode copper, calendering copper etc.In the shielding construction of the present invention, above-mentioned metal layer thickness is usually in the scope of 1-20 μ m, preferably in the scope of 1-6 μ m; The thickness of above-mentioned polyimide layer is usually between 1-15 μ m, preferably in the scope of 3-10 μ m.
Above-mentioned shielding construction 110 can utilize rubbing method to form.For example, be base material with the Copper Foil, (Polyamic acid) is coated on this Copper Foil with polyamic acid, through oven drying and imidizate (Imidization), do not have the bilayer copper clad paper tinsel film of glue to form single face.
Fig. 2 shows the specific embodiment that the present invention has the flexible printed circuit board of shielding construction, comprises flexible printed circuit board 200; And be arranged on shielding construction 210 on this flexible printed circuit board.This shielding construction 210 comprises metal level 212 and polyimide layer 214, sees through conducting resinl 220 and is arranged on the above-mentioned flexible printed circuit board.Usually, metal layer thickness is in the scope of 1-20 μ m, preferably in the scope of 1-6 μ m in the above-mentioned shielding construction; The thickness of above-mentioned polyimide layer is usually between 1-15 μ m, preferably in the scope of 3-10 μ m.
Embodiment
Details are as follows for support plate used in embodiment and the comparative example:
Embodiment 1 to 6:
Use rubbing method that polyimides parent (Precursor)-polyamic acid (PAA) or polyimides coating (Polyimide Varnish) are uniformly coated on the Copper Foil to form semi-finished product shielding construction layer.Above-mentioned semi-finished product shielding construction stratification is gone into the closed nitrogen oven, the oxygen content of nitrogen oven need be controlled at and be lower than 0.5%, best, can remain on below 0.2% or lower, and its heating-up temperature be 50 ℃～350 degree (℃), stoving time is 15 to 240 minutes.Then, dehydrate and imidizate (Imidization) but or convection drying be made into bilayer copper clad paper tinsel film.Finish the copper foil membrane that covers of different-thickness by above-mentioned processing procedure, make and directly use on the flexible printed circuit board of finishing the line part layout by aeolotropic conductive film (ACF), in order to form different-thickness and to have the support plate of shielding construction, its result is as shown in table 1.
Comparative example 1:
Use plastic material as the shielding construction layer, and put on printed circuit board (PCB) by the aeolotropic conductive film is sticking.
Table 1
| Embodiment 1 | Embodiment 2 | Embodiment 3 | Embodiment 4 | Embodiment 5 | Embodiment 6 | Comparative example 1 | |
| Polyimide layer (μ m) | 13 | 13 | 13 | 8 | 5 | 5 | |
| Plastic layer (μ m) | 5 | ||||||
| Metal level (μ m) | 18 | 12 | 9 | 5 | 3 | 1 | 0.1 |
| Conducting resinl | 17 | 17 | 17 | 17 | 17 | 17 | 17 |
| (μm) | |||||||
| Circuit board (μ m) | 34.2 | 34.2 | 34.2 | 34.2 | 34.2 | 34.2 | 34.2 |
| Gross thickness (μ m) | 82.2 | 73.2 | 73.2 | 74.2 | 59.2 | 57.2 | 56.3 |
Respectively the circuit board sample of above-mentioned made different-thickness is cut into the test sample of suitable size, carry out flexibility, slide unit test and bending test, and calculate resistance varying-ratio in slide unit test and bending test back.By the flexibility (gf) of reagency flexibility tester test sample, its test condition is that voltage is that AC220V, measuring range are that 410 grams, readability are 0.001 gram and test 2.35 millimeters at angle of R (mm); Calculate its resistance varying-ratio by slide unit tester test sample, its test condition is that voltage is AC220V, spacing 3.0mm, the R angle 1.5mm of place and speed=400 (rotating speed) rpm; Calculate its resistance varying-ratio by bending experimental machine test sample, its test condition is that voltage is that AC220V, angle of bend are that 0 to 160 degree, rate of bending are 40 times/minute and crooked R angle: 1.5 millimeters (radius), its result is as shown in table 2.
Table 2
By the test result of table 2 as can be known, the flexible printed circuit board of tool shielding construction of the present invention has high flexibility and flexibility, the resistance varying-ratio of its slide unit test be lower than 3.1% below the mark, bending test through 160,000 times, the resistance varying-ratio of its bending test can be lower than below 2.9%, that is the resistance varying-ratio of its bending test can be lower than standard value below 15%.
The foregoing description is illustrative principle of the present invention and effect thereof only, but not is used to limit the present invention.Any person of ordinary skill in the field all can not break away from the spirit and scope of the present invention, and the foregoing description is modified and changed.Therefore, the scope of the present invention, claims are listed as the aforementioned.
Claims (10)
1, a kind of flexible printed circuit board with shielding construction comprises:
Flexible printed circuit board; And
Be arranged on the shielding construction on the described flexible printed circuit board, it is characterized in that, described shielding construction comprises metal level and polyimide layer, and described metal layer thickness is between 1-20 μ m, and the thickness of described polyimide layer is between 1-15 μ m.
2, flexible printed circuit board according to claim 1 is characterized in that, described metal layer thickness is between 1-6 μ m.
3, flexible printed circuit board according to claim 1 is characterized in that, the thickness of described polyimide layer is between 3-10 μ m.
4, flexible printed circuit board according to claim 1 is characterized in that, described metal is a copper.
5, flexible printed circuit board according to claim 1 is characterized in that, described metal is calendering copper or cathode copper.
6, a kind of shielding construction comprises:
Metal level; And
Be formed at the polyimide layer on the described metal level;
It is characterized in that described metal layer thickness is between 1-20 μ m, and the thickness of described polyimide layer is between 1-15 μ m.
7, shielding construction according to claim 6 is characterized in that, described metal layer thickness is at 1-6 μ m Zhi Inter.
8, shielding construction according to claim 6 is characterized in that, the thickness of described polyimide layer is between 3-10 μ m.
9, shielding construction according to claim 6 is characterized in that, described metal is a copper.
10, shielding construction according to claim 6 is characterized in that, described metal is calendering copper or cathode copper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810082225A CN101521985A (en) | 2008-02-26 | 2008-02-26 | Shielding structure and flexible printed circuit board provided with the shielding structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810082225A CN101521985A (en) | 2008-02-26 | 2008-02-26 | Shielding structure and flexible printed circuit board provided with the shielding structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101521985A true CN101521985A (en) | 2009-09-02 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200810082225A Pending CN101521985A (en) | 2008-02-26 | 2008-02-26 | Shielding structure and flexible printed circuit board provided with the shielding structure |
Country Status (1)
| Country | Link |
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| CN (1) | CN101521985A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103547132A (en) * | 2012-07-17 | 2014-01-29 | 昆山雅森电子材料科技有限公司 | Electromagnetic interference shielding structure and flexible printed circuit board with same |
| CN106604623A (en) * | 2016-12-13 | 2017-04-26 | 苏州城邦达力材料科技有限公司 | Electromagnetic shielding film and preparation method thereof |
| CN106793727A (en) * | 2016-12-13 | 2017-05-31 | 苏州城邦达力材料科技有限公司 | A kind of electromagnetic shielding film and preparation method thereof |
-
2008
- 2008-02-26 CN CN200810082225A patent/CN101521985A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103547132A (en) * | 2012-07-17 | 2014-01-29 | 昆山雅森电子材料科技有限公司 | Electromagnetic interference shielding structure and flexible printed circuit board with same |
| CN103547132B (en) * | 2012-07-17 | 2017-03-22 | 昆山雅森电子材料科技有限公司 | Electromagnetic interference shielding structure and flexible printed circuit board with same |
| CN106604623A (en) * | 2016-12-13 | 2017-04-26 | 苏州城邦达力材料科技有限公司 | Electromagnetic shielding film and preparation method thereof |
| CN106793727A (en) * | 2016-12-13 | 2017-05-31 | 苏州城邦达力材料科技有限公司 | A kind of electromagnetic shielding film and preparation method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| ASS | Succession or assignment of patent right |
Owner name: KUNSHAN YASHEN ELECTRON MATERIAL SCIENCE CO., LTD. Free format text: FORMER OWNER: ASIA ELECTRIC WORKS CO., LTD. Effective date: 20090821 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20090821 Address after: Two hundred and fifteen thousand and three hundred No. 169 Huangpu Road South, Kunshan Economic Development Zone, Jiangsu, china, Postal Code: 215300 Applicant after: Asia Electronic Materials Co., Ltd. Address before: Hsinchu County, Taiwan, China Applicant before: Asia Electronic Material Co., Ltd. |
|
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20090902 |