M440437 五、新型說明： 【新型所屬之技術領域】 本創作係與高頻測試訊號傳輸結構有關，更詳而言之是扑 一種高頻探針之空間轉換模組。 【先前技術】 以探針卡作為_測試機與—待測電子物之間的高頻測試 訊號傳輸介_技術雖已普紐使用。惟，該已知探針卡結構 經常面臨以下問題： 其-、受制於電子產品迷你化，且使用功能日趨增加的趨 勢’使得待測電子物的測試點間距（pitch)越來越*，相對造 成許多既有的探針卡結構難以再適用。 其二、如晶圓類之待測電子物’隨著其面積的加大（如十 -时超大型晶圓）’相對使得探針卡結構巾的電路板尺寸被放 大以承載更多的探針，惟大面積的電路板易因载重過多而有彎 曲（bending)之虞，致有檢測接觸不良的情形發生。 雖然在我國公告第M423836號「電路測試探針卡及其探 針基板結構」之新型專财’ f提出❹數導線暴露於一基板 主體上表面之間距，以大於導線暴露於該基板主體下表面之間 距的技術，期使探針卡可適用於測試點間距小的待測電子物檢 測用。且該專利技術中曾提及其導線可選用同轴線㈤㈣議 _dal eable) ’ _於如何解離抗__銳號傳輸品 3 質’該新型專利僅為一語帶過而無明確的技術揭露。 【新型内容】 有鏗於此，本創作之主要目的在於提供一種高頻探針之空 曰轉換拉組’係具體揭露可解決阻抗問題的結構，以確保高頻 訊號傳輸品質。 本創作之人要目的在於提供一種高頻探針之空間轉換模 組’係使得探針卡可_於檢靡距小的待難子物， 且使得多數探針的針尖可維持在同一平面。 緣以達成上述目的，本創作所提供高頻探針之空間轉換模 組包含有-上板、-下板、複數訊號線與—阻抗匹配結構。其 中，該上板具有複數個上穿孔；該下板與該上板保持固定距 離’該下板具有複數個下穿孔，且相鄰下穿孔之間距小於該上 板之相鄰上穿孔的間距；該些訊號線係互不接觸地設置於該上 板與該下板之間，各該訊號線具有兩端，且各別穿過一對應的鲁 上穿孔與一對應的下穿孔；該阻抗匹配結構包括有一接地線與 至少一導電單元，其中該接地線電性連接至接地電位該導電 單元與該訊號線電性隔離設置，且該導電單元與該接地線電性 連接。 其中’該空間轉換模組包括有複數絕緣層，各該絕緣層係 包覆一對應的訊號線，以使訊號線與導電單元電性隔離。 其中，該至少一導電單元的數量為複數個，各該導電單元M440437 V. New description: [New technical field] This creation is related to the high-frequency test signal transmission structure. More specifically, it is a space conversion module with a high-frequency probe. [Prior Art] The high-frequency test between the probe card and the electronic object to be tested is used as a signal transmission technology. However, the known probe card structure often faces the following problems: - it is subject to the miniaturization of electronic products, and the tendency to use functions is increasing - making the test point pitch of the electronic object to be tested more and more *, relative Many existing probe card structures are difficult to apply. Second, the electronic object to be tested, such as wafers, 'as the area increases (such as ten-time ultra-large wafers), the relative size of the board of the probe card structure towel is enlarged to carry more probes. Needle, only a large area of the board is prone to bending due to excessive load, resulting in detection of poor contact. Although in our country, M423836 "circuit test probe card and its probe substrate structure" of the new special wealth 'f proposed that the number of wires exposed to the upper surface of a substrate body, to be larger than the wire exposed to the lower surface of the substrate body The technique of the distance between the probes can be applied to the detection of the electronic object to be tested with a small test point spacing. And the patented technology mentioned that its wire can be used coaxial cable (5) (four) _ dal eable) ' _ in how to dissociate anti-_ sharp transmission goods 3 quality 'this new patent is only a word with no clear technology Revealed. [New content] For this reason, the main purpose of this creation is to provide a high-frequency probe air-to-air conversion pull group, which specifically discloses a structure that can solve the impedance problem to ensure high-frequency signal transmission quality. The object of the present invention is to provide a spatial conversion module of a high frequency probe so that the probe card can be used to detect a small distance of the object, and the tips of most of the probes can be maintained in the same plane. In order to achieve the above objectives, the space conversion module of the high frequency probe provided by the present invention comprises an upper plate, a lower plate, a complex signal line and an impedance matching structure. The upper plate has a plurality of upper perforations; the lower plate maintains a fixed distance from the upper plate. The lower plate has a plurality of lower perforations, and a distance between adjacent lower perforations is smaller than a spacing of adjacent perforations of the upper plate; The signal lines are disposed between the upper board and the lower board without contact, and each of the signal lines has two ends, and each of them passes through a corresponding upper perforation and a corresponding lower perforation; the impedance matching The structure includes a ground line and at least one conductive unit, wherein the ground line is electrically connected to the ground potential. The conductive unit is electrically isolated from the signal line, and the conductive unit is electrically connected to the ground line. The space conversion module includes a plurality of insulating layers, each of which is covered with a corresponding signal line to electrically isolate the signal line from the conductive unit. Wherein the number of the at least one conductive unit is plural, and each of the conductive units
S 4 為圓官體且分縣設—對應的訊號線，每-®管體與-對應訊 號線之間具有一該絕緣層。 其中，該空間轉換模組包括有至少一導體’該導體位於該 上板與該下板之間，並連接該接地線與該些圓管體。 其中，上述導體為設置於該上板與該下板的至少其中之一 者之内表面的導電膠。 其中，該空間轉換模、組包括有一不具有導電性的膠體，該 膠體填充於該上板與該下板之間。 其中，上述導體為金屬膠或金屬粉。 其中，ό玄導電單元為填充於該上板與該下板之間的金屬勝 或金屬粉。 藉此，可確保訊號線的高頻測試訊號傳輸品質，且該空間 轉換模組為高雜針卡敝成之—時，可使得高聰針卡的多 數探針之_排觸距縮小化，以及使得彡麟針的針尖維持 在同一平面。 【實施方式】 為能更清楚地說明本創作，兹舉較佳實施例並配合圖示詳 細說明如后。 圖1所不為本創作第一較佳實施例之高頻探針空間轉換 模組10 ’其包括有-上板12、一下板14、一外框16、複數訊 號線18 '複數個銲塾2G、複數絕緣層22、—阻抗匹配結構、 M440437 二以導電膠28為例的導體與一膠體3〇，其中： 該上板12、該下板14與該外框16共同組合成一個具有中 空谷至的剛性體，且該上板12與該下板14之間保持固定距 離。該上板12具有複數個上穿孔12a，該下板14具有複數個 下穿孔14a，且相鄰下穿孔14a之間距小於該上板12之相鄰上 穿孔12a的間距。此外’該上板12、該下板14可以設計成包 含該外框16的部份，即該上板12、該下板14呈门字型共同 組合成一個具有中空容室的剛性體。 該些訊唬線18是以互不接觸的方式設置於該上板12與該 下板14之間，因該上板12的上穿孔12&間距大於該下板14 下穿孔14a的間距，使得訊號線18的兩端需以彎折方式製作 以便穿設-對應社穿孔12a與—對翻下穿孔⑷，且訊號 線18的兩端再各別與設置在該上板12及該下板14外表面的 -個銲塾20連結。而該些絕緣層22貝各別包覆一對應的訊號 線18。 雜抗匹配結構包括有一接地線24與複數個以圓管體26 為例的導電單元。其巾，接地線24的峨各射過—對應的 上穿孔12a與一對應的下穿孔Ha後，再分別與一個銲墊20 連結並電性連接至—接地電位；該些®管體26分別套設-對 應的訊號線18，且每管體26與-職訊號線18之間具 有該、邑緣層22 ’易言之’絕緣層22係使得訊號線18與圓 管體26呈電性隔離。各圓管體％的表面具有導電性質的結 6 構，例如金屬表面。 該-導電膠28為層狀結構且分別設置於該上板12與該下 板的内表面，其等同時連結並接觸著該接地線與各圓管 ^ % ’使得各圓管體26亦電性連接至接地電位。必須說明的 是’縱為單一導電谬28設置於該上板12或是該下板14的内 表面時亦可達成電性連接該接地線24與圓管體26的目的。 該膠體3〇為不具有導電特性，其填充於該二導電膠Μ之 間以支禮各該訊號、線18及該阻抗&配結構，並雜彼此不 易晃動。 以上即為“麵針之m轉換模組的各部結構敎 述。其使財式係安裝於—電路板與複數根探針之間（圖未 丁）月|J述電路板、空間轉換模组1〇及複數探針的組合即構成 -局頻探針。_設置在該上板12外表_數贿整⑽分 别與該電路㈣s峨接點及接地接點電輯接，以及設談 下板14外表面的數個銲墊2G分別與—對應的探針電性連接， 以達到電性傳輸目的。❿同時受制於該些上穿孔仏間距大於 下穿孔14a離的技術碰，使得該高雜針卡的多數探 針之間的排觸距縮小化，進—步地可義於檢酬試點間距 小的待測電子物。 上述每-訊號線18的外部皆套設一個圓管體％，且彼此 互為電性隔離的結構形_共_成—個_結構。在每一圓 官體26皆透過導電膠28而與接地線％連結並電性連接至接 地電位且於通電時’可對各訊號線18產生良好的阻抗匹配效 果，以確保每一訊號線18的高頻測試訊號傳輸品質良好，並 提高量測精準度。此外’訊號線18與圓管體26亦得為一個同 軸線體取代。 又，由於該上板12、該下板14與該外框16係共同組合成 一個剛性體，故不至於有超荷重而產生彎曲變形之虞，因此可 確保該空’換模組1〇下方所連結的乡數探針之針尖維持在 同一平面’以獲得良好的檢測接觸效果。 另請參_ 2所示’為本創作第二紐實補之高頻探針 空間轉換模組32，其具有相同上述第—較佳實施例之多數構 件，不同處在於： 本第二較佳實施例的空間轉換模組32並不具備有設置在 *亥上板12與該下板14内表面的該二導電膠28，而係以直接 注入金屬戰是金·於該上板12與訂板M之間的方式來 達到電性連接該接地線24及各圓管體26的目的。前述金屬膠 或疋金屬粉同時具有描及穩定各訊號線18與該阻抗匹配結 構之效，在本實施例中，是以金屬膠34為例作為該導體。 請續參_ 3解，林創作第三較佳實關之高頻探針 工間轉換模組36 ’其具有相同上述第二較佳實施例之多數構 件’不同處在於： 本第二較佳實施例的空間轉換模組36並不具備有套設在 訊號線18外部的圓管S 26，但保有絕緣層22來包覆訊^線 8再於6玄上板12與該下板14之間注入有以金屬膠或是金屬 粉為例的導f單元，_金鱗或是金屬粉來與接地線24接 觸並為電性連接至接地電位，崎減線18產生良好的阻抗 匹配放果’同時’金屬膠或是金屬粉具有穩定訊號線18與接 地線24之效。在本實施例中’是以金屬膠38為例作為該導電 單元。 圖4所示，為本創作第四較佳實施例之高頻探針空間轉換 杈組40’主要係改變電性連接至接地電位的結構設計，亦即， 本第四較佳實酬的高雜針空_觀組40之上板42與下 板44疋以具有導電性的金屬板製成，且該接地線％的兩端分 別與該上板42及下板44的穿孔内壁接觸，又，該上板犯與 下板44❺卜表面各設置—鱗層46，㈣避免峨線π及 接地線24因各該銲塾2〇直接與金屬板製成的上板^及下板 44接觸而形成不良的電性連接。 而在該上板42與下板44之間為金屬膠％ (或是金屬粉） 時’該訊號線18外部可如圖2所示之具備絕緣層22與圓管體 26或如圖3所不之僅具備絕緣層^而已；又當該上板幻與 下板44之間為不具有導電特性的膠體時，則訊號線α外部必 須具備絕緣層22顧管體26 ,利關管體％表面與金屬板 製成的上板42及下板44接觸而形成連接至接地電位，當然， 為確保良好的連接效果，亦可如圖i所示之藉由設置在上板 42與下板44内表_導電膠28而與接地線24連接。 M440437 以上所述僅為本創作較佳可行實施例而已，舉凡應用本創 作說明書及申請專利範圍所為之等效變化，理應包含在本創作 之專利範圍内。 M440437 【圖式簡單說明】 圖1為本創作第一較佳實施例之空間轉換模組的局部剖視圖； 圖2為本創作第二較佳實施例之空間轉換模組的局部剖視圖； 圖3為本創作第三較佳實施例之空間轉換模組的局部剖視圖； 圖4為本創作第四較佳實施例之空間轉換模組的局部剖視圖。 【主要元件符號說明】 10、32、36、40空間轉換模組 12上板 12a上穿孔 14下板 14a下穿孔 16外框 18訊號線 20銲墊 22絕緣層 24接地線 26圓管體 28導電膠 30膠體 34金屬膠 38金屬膠 42上板 44下板 46絕緣層S 4 is a circular body and is divided into corresponding signal lines, and each of the -® tubes and the corresponding signal line has an insulating layer. The space conversion module includes at least one conductor. The conductor is located between the upper plate and the lower plate, and connects the ground wire to the circular tubes. Wherein the conductor is a conductive paste disposed on an inner surface of at least one of the upper plate and the lower plate. Wherein, the space conversion module and the group comprise a colloid having no conductivity, and the glue is filled between the upper plate and the lower plate. Wherein, the conductor is a metal glue or a metal powder. Wherein, the Xuan Xuan conductive unit is a metal win or metal powder filled between the upper plate and the lower plate. In this way, the transmission quality of the high-frequency test signal of the signal line can be ensured, and the space conversion module is made up of a high-stitching card, which can reduce the tapping distance of most probes of the Gaocong card. And keeping the tip of the unicorn needle in the same plane. [Embodiment] In order to explain the present invention more clearly, the preferred embodiment will be described in detail with reference to the accompanying drawings. 1 is not the high-frequency probe space conversion module 10' of the first preferred embodiment of the present invention. It includes an upper plate 12, a lower plate 14, an outer frame 16, and a plurality of signal lines 18'. 2G, the plurality of insulating layers 22, the impedance matching structure, the M440437 two conductors and the colloids 3 exemplified by the conductive adhesive 28, wherein: the upper plate 12, the lower plate 14 and the outer frame 16 are combined into one A rigid body to the valley, and a fixed distance between the upper plate 12 and the lower plate 14. The upper plate 12 has a plurality of upper perforations 12a having a plurality of lower perforations 14a and a spacing between adjacent lower perforations 14a that is less than the spacing of adjacent upper perforations 12a of the upper plate 12. Further, the upper plate 12 and the lower plate 14 may be designed to include the outer frame 16, that is, the upper plate 12 and the lower plate 14 are collectively combined to form a rigid body having a hollow chamber. The signal wires 18 are disposed between the upper plate 12 and the lower plate 14 in a non-contact manner, because the upper perforation 12& spacing of the upper plate 12 is greater than the spacing of the lower perforations 14a of the lower plate 14 Both ends of the signal line 18 are formed by bending to pass through the corresponding perforation 12a and the inverted perforation (4), and the two ends of the signal line 18 are separately disposed on the upper plate 12 and the lower plate 14 The outer surface of the solder joint 20 is connected. The insulating layers 22 are each covered with a corresponding signal line 18. The hybrid anti-matching structure includes a ground line 24 and a plurality of conductive units in the form of a circular tube 26 as an example. The towel, the grounding wire 24 is sprayed through each other - the corresponding upper perforation 12a and a corresponding lower perforation Ha are respectively connected to one of the pads 20 and electrically connected to the ground potential; the ® tubes 26 respectively The corresponding signal line 18 is disposed, and each of the tube body 26 and the service signal line 18 has the edge layer 22 'easy to say' the insulating layer 22 is such that the signal line 18 and the round tube body 26 are electrically connected. isolation. The surface of each of the round tubes has a conductive structure such as a metal surface. The conductive paste 28 is a layered structure and is respectively disposed on the inner surface of the upper plate 12 and the lower plate, and is simultaneously connected to and in contact with the ground line and each of the round tubes, so that the round tubes 26 are also electrically Connected to ground potential. It should be noted that the purpose of electrically connecting the grounding wire 24 and the tubular body 26 can be achieved when the single conductive cymbal 28 is disposed on the inner surface of the upper plate 12 or the lower plate 14. The colloid 3 has no conductive property, and is filled between the two conductive capsules to support the signals, the lines 18 and the impedance & structure, and the impurities are not easily shaken. The above is the structure description of the various parts of the m-switching module of the face pin. It is installed between the circuit board and the plurality of probes (Figure 12). The circuit board and space conversion module The combination of 1〇 and complex probes constitutes a local frequency probe. _ is set on the upper board 12 appearance _ number bribes (10) respectively with the circuit (four) s峨 contact and ground contact electrical connection, and set the next board The plurality of pads 2G on the outer surface of the 14 are respectively electrically connected to the corresponding probes for electrical transmission purposes. The ❿ is also subject to the technical interference that the spacing of the upper perforations is larger than that of the lower perforations 14a, so that the high impurity The contact distance between the majority of the probes of the needle card is reduced, and the electrons to be tested with a small pilot pitch can be determined in advance. The outer circumference of each of the signal lines 18 is set to a round body %. And each of the structural bodies is electrically isolated from each other. Each of the circular bodies 26 is electrically connected to the grounding wire by the conductive paste 28 and electrically connected to the ground potential. Each signal line 18 produces a good impedance matching effect to ensure high frequency test of each signal line 18. The transmission quality is good, and the measurement accuracy is improved. In addition, the signal line 18 and the circular tube body 26 are also replaced by a coaxial body. Moreover, since the upper plate 12, the lower plate 14 and the outer frame 16 are combined It is a rigid body, so there is no excessive load and the bending deformation occurs. Therefore, it can be ensured that the needle tip of the township probe connected under the empty module 1〇 is maintained in the same plane to obtain good detection contact. The effect is also shown in Fig. 2, which is a high-frequency probe space conversion module 32 of the second creation of the present invention, which has the same components as the above-mentioned first preferred embodiment, and the difference lies in: The space conversion module 32 of the preferred embodiment is not provided with the two conductive adhesives 28 disposed on the inner surface of the upper plate 12 and the lower plate 14, and is directly injected into the metal to be gold. The purpose of the electrical connection between the grounding wire 24 and the respective tubular bodies 26 is achieved by the manner of the bonding board M. The metal glue or the bismuth metal powder simultaneously has the effect of stabilizing the signal lines 18 and the impedance matching structure. In this embodiment, the metal glue 34 is taken as an example. The conductor is continued. The third preferred embodiment of the high-frequency probe inter-work conversion module 36' has the same components as the second preferred embodiment described above. The difference lies in: The space conversion module 36 of the second preferred embodiment does not have the circular tube S 26 disposed outside the signal line 18, but retains the insulating layer 22 to cover the signal line 8 and then the upper layer 12 and the lower portion. A f-unit, such as a metal glue or a metal powder, is injected between the plates 14. The gold scale or the metal powder is in contact with the ground line 24 and electrically connected to the ground potential, and the sacrificial line 18 produces a good impedance. The matching fruit 'simultaneous' metal glue or metal powder has the effect of stabilizing the signal line 18 and the ground line 24. In the present embodiment, 'the metal glue 38 is taken as an example as the conductive unit. The high frequency probe space conversion group 40' of the fourth preferred embodiment mainly changes the structural design of electrically connecting to the ground potential, that is, the fourth preferred paid high-heavy needle empty-view group 40 The upper plate 42 and the lower plate 44 are made of a metal plate having conductivity, and the two ends of the ground wire are respectively The upper plate 42 and the lower plate 44 are in contact with the inner wall of the perforation, and the upper plate is disposed with the squama layer 46 on the surface of the lower plate 44. (4) avoiding the π line π and the ground line 24 directly contacting each of the welding wires 2 The upper plate and the lower plate 44 made of a metal plate are in contact with each other to form a poor electrical connection. When the upper plate 42 and the lower plate 44 are metal glue% (or metal powder), the external portion of the signal line 18 may be provided with the insulating layer 22 and the circular tube body 26 as shown in FIG. 2 or as shown in FIG. If there is only a layer of insulating layer between the upper plate and the lower plate 44, then the signal line α must have an insulating layer 22 outside the tube body 26, and the tube body is closed. The surface is in contact with the upper plate 42 and the lower plate 44 made of a metal plate to form a connection to the ground potential. Of course, in order to ensure a good connection effect, the upper plate 42 and the lower plate 44 may be disposed as shown in FIG. The inner surface_conductive paste 28 is connected to the ground line 24. M440437 The above description is only for the preferred embodiment of the present invention, and equivalent changes to the scope of application of this invention and the scope of the patent application are included in the scope of the patent. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a partial cross-sectional view of a space conversion module according to a first preferred embodiment of the present invention; FIG. 2 is a partial cross-sectional view of a space conversion module according to a second preferred embodiment of the present invention; A partial cross-sectional view of the space conversion module of the third preferred embodiment of the present invention; FIG. 4 is a partial cross-sectional view of the space conversion module of the fourth preferred embodiment of the present invention. [Main component symbol description] 10, 32, 36, 40 space conversion module 12 upper plate 12a perforation 14 lower plate 14a lower perforation 16 outer frame 18 signal line 20 pad 22 insulation layer 24 ground line 26 round tube 28 conductive Glue 30 colloid 34 metal glue 38 metal glue 42 upper plate 44 lower plate 46 insulation layer