M423285M423285
五、新型說明： 【新型所屬之技術領域】 一種散熱元件之固定結構’尤指一種散熱元件的固定結構， 其設置時不破壞該散熱元件，進而可防止該散熱元件内部之腔室 產生滲漏影響熱傳效率的散熱元件之固定結構。 【先前技術】 隨現行電子設備逐漸以輕薄作為標榜之訴求，故各項元件皆 • 須隨之縮小其尺寸，但電子設備之尺寸縮小伴隨而來產生的熱變 成電子設備與系統改善性能的主要障礙。無論形成電子元件的半 導體尺寸不斷地縮小’仍持續地要求增加性能。 當半導體尺寸縮小，結果熱通量增加，熱通量增加所造成將 產品冷卻的挑戰超過僅僅是全部熱的增加，因為熱通量的增加造 成在不同時間和不同長度尺寸會過熱，可能導致電子故障或損毀。 按，均溫板係為一種較大範圍面與面之熱傳導應用，其有別 φ 於熱管之點對點的熱傳導方式，並適用於空間較為窄小之處使用。 均溫板具有一受熱面與一冷凝面及一真空腔室並填充有工作 流體，該真空腔室内具有複數支撐柱及毛細結構，該等支撐柱連 接該均溫板之受熱面與冷凝面並支#該真级室，均溫板係透過 5亥夂熱面與熱源貼設，該均溫板另一側之冷凝面則與另一散熱元 件連接傳導熱量，並該工作流體於受熱面處吸附熱量產生蒸發轉 換成汽態之工作流體，該汽態工作流體於該冷凝面處產生冷凝， 轉換為液態’贿態之工作流體透碰室_之毛崎構回流至 1002,15301; a〇D33;l；7.441:-0V. New type of description: [New technical field] A fixed structure of a heat dissipating component, especially a fixing structure of a heat dissipating component, which is disposed without damaging the heat dissipating component, thereby preventing leakage of a chamber inside the heat dissipating component A fixed structure of a heat dissipating component that affects heat transfer efficiency. [Prior Art] With the current electronic devices gradually becoming the slogan, all components must be reduced in size, but the heat generated by the shrinking of electronic devices becomes the main performance improvement of electronic devices and systems. obstacle. Regardless of the size of the semiconductor forming the electronic component, the size continues to shrink, which continues to require increased performance. As semiconductors shrink in size, the resulting heat flux increases, and the increase in heat flux causes the challenge of cooling the product more than just the increase in total heat, as the increase in heat flux causes overheating at different times and lengths, possibly leading to electrons. Failure or damage. According to the uniform temperature plate, it is a kind of heat transfer application with a wide range of surface and surface. It has different point-to-point heat conduction mode of heat pipe and is suitable for narrow space. The temperature equalizing plate has a heating surface and a condensation surface and a vacuum chamber filled with a working fluid. The vacuum chamber has a plurality of supporting columns and a capillary structure, and the supporting columns are connected to the heating surface and the condensation surface of the temperature equalizing plate.支# The true-level room, the uniform temperature plate is attached to the heat source through the 5 夂 hot surface, and the condensing surface on the other side of the temperature equalizing plate is connected to another heat-dissipating element to conduct heat, and the working fluid is at the heating surface The heat of adsorption generates a working fluid that is vaporized and converted into a vapor state, and the vaporous working fluid generates condensation at the condensation surface, and is converted into a liquid-brittle working fluid flooding chamber, and the flow is returned to 1002, 15301; D33;l;7.441:-0
交熱面’工作流體於該腔室内形成汽液循環傳導熱量。 習知係將均溫板與—基板結合使用並透過均溫板傳導該基板 上之發熱元件之熱量，習知技齡要係於均溫板避_腔室之部 位’即該均溫板之四耗處各穿設一具有内螺牙之銅柱，基板相對 該均溫板設置鋼柱之位置係開設至少—孔洞，再透過—螺鎖元件 以螺鎖之方式同時穿設該等銅柱及孔洞將該均溫板固定於該基板 上，但此-HJ定方式因她設置於該均溫板之四械，與該發熱 元件距離較遠，網溫板岐後與賴元件無法f無合，進而 產生熱阻現象；為改善前述無法緊密貼合之_，則業者將銅柱 直接對應設置於該均溫板與發熱元件貼設之部位之鄰近處，故該 等銅柱係直接貫穿均溫板具有腔室之雜，雖可增加組裝時緊密 度防止熱阻現象產生，但該均溫板之腔室受該等銅柱貫穿破壞後 失去氣密性，其腔室内部不再具有真空狀態，並且因銅柱貫穿破 壞該腔至，則其内部之工作流體之流動路徑可能因此受阻礙影響 流體流動造成熱傳效率降低，甚至嚴重亦可能產生洩漏，進而令 該均溫板失去熱傳效用；故習知技術具有下列缺點： 1. 易產生熱阻現象； 2. 熱傳效率降低。 【新型内容】 爰此，為解決上述習知技術之缺點，本創作之主要目的，係 提供一種可提升組合緊密度防止熱阻現象產生的散熱元件之固定 結構。 100215301 1003317441-0 M423285 1{%8·月3〇曰!正, 本到作-人要目的，係提供一種製造時不破壞散熱元—二. 工腔至之真空度的散航件之固定結構。 ,二述之目的，本創作係提供—種散熱元件之固定結構， 係包含·—本體、複數@定元件； 所述本體具有—腔室及一第一側及一第二側，該腔室具有複 數支樓體及工作流體及一毛細結構層該等支樓體連接前述第 一、二侧。 該等固定元件具有一孔洞，並一端貫穿前述本體之第一側及 該支撐體與該本體結合。 ，透過本_之散熱元狀峡結财僅可增加概熱元件與 待散熱物組合時之緊密貼合效果避免熱阻現象產生外，更因為本 創作之固定元件與該本體組設係貫穿於該支樓體，並未破壞該本 體之腔至之氣密性’故該腔室仍保有真空度且内部工作流體不 產生茂漏；故本創作具有下列優點： 1. 結合度佳無熱阻現象； 2. 不產生洩漏； 3. 使用壽命較長。 【實施方式】 本創作之上述目的及其結構與功能上的特性，將依據所附圖 式之較佳實施例予以說明。 請參閱第卜2、3圖，係為本創作散熱元件之固定結構之第 -實施例立體分解及組合圖及A_A剖視圖，如圖所示^創作之 .100215301 100331:7.4^1:-The heat transfer surface' working fluid forms a vapor-liquid circulation in the chamber to conduct heat. Conventionally, the temperature equalizing plate is used in combination with the substrate and the heat of the heating element on the substrate is transmitted through the temperature equalizing plate. The conventional technical age is to be in the portion of the uniform temperature plate avoiding the chamber, that is, the temperature equalizing plate. Each of the four consuming places is provided with a copper column having an internal thread, and the position of the substrate relative to the temperature plate is at least a hole, and the copper element is simultaneously threaded through the screw-locking element. And the hole fixes the temperature equalizing plate on the substrate, but the -HJ setting method is disposed on the temperature equalizing plate, and the distance from the heating element is far, and the mesh temperature plate cannot be combined with the Lai element. In addition, in order to improve the above-mentioned inability to closely adhere to the _, the operator directly places the copper column adjacent to the portion where the temperature equalizing plate and the heating element are attached, so the copper column directly penetrates the uniform temperature The plate has a cavity, which can increase the tightness during assembly to prevent thermal resistance. However, the chamber of the uniform plate loses airtightness after being broken by the copper columns, and the chamber is no longer in a vacuum state. And because the copper column penetrates the cavity, it is inside The flow path of the working fluid may be hindered to affect the fluid flow, resulting in a decrease in heat transfer efficiency, and even a serious leak may occur, thereby causing the temperature-average plate to lose heat transfer effect; therefore, the prior art has the following disadvantages: 1. It is easy to generate heat. Resistance phenomenon; 2. Heat transfer efficiency is reduced. [New content] In order to solve the above-mentioned shortcomings of the prior art, the main purpose of the present invention is to provide a fixing structure for a heat dissipating component which can improve the tightness of the combination and prevent the occurrence of thermal resistance. 100215301 1003317441-0 M423285 1{%8·月3〇曰! 正,本到作-人的目的, is to provide a fixed structure of the flying parts that do not destroy the heat-dissipating element during manufacturing - II. . For the purpose of the two descriptions, the present invention provides a fixed structure of a heat dissipating component, comprising: a body, a plurality of components; the body has a chamber and a first side and a second side, the chamber The plurality of branch bodies and the working fluid and a capillary structure layer are connected to the first and second sides. The fixing elements have a hole and one end extends through the first side of the body and the support body is coupled to the body. Through the heat dissipation of the finite elementary gorge, the close-fitting effect of the combination of the heat-generating component and the heat-dissipating material can be increased to avoid the occurrence of thermal resistance, and the fixing component of the creation and the body assembly system are The building body does not damage the airtightness of the cavity of the body. Therefore, the chamber still maintains a vacuum and the internal working fluid does not leak; therefore, the creation has the following advantages: 1. Good coupling and no thermal resistance Phenomenon; 2. No leakage; 3. Long service life. [Embodiment] The above object of the present invention, as well as its structural and functional features, will be described in accordance with the preferred embodiments of the drawings. Please refer to the second and third figures, which are the three-dimensional decomposition and combination diagram of the first embodiment of the fixed structure of the heat-dissipating component, and the cross-sectional view of A_A, as shown in the figure. ^100215301 100331:7.4^1:-
政熱7G件之i]定結構，係包含：—本體卜複數固定元件2 所述本體1具有一腔室π及一第一側12及一第二側13，診 腔室Η具有複數支稽體14及工作流體3及至少一毛細結这 15，該等支 14係連接前述第—、二侧12、13，所述毛細結= 層15係完整附著於前述腔室Μ 該等固定元件2具有一孔洞21，並該固定元件2 -端貫穿前 述本體1之第-側12及該切體14與該本體丨結合該等固= 元件2之孔洞21内具有内螺紋21卜 所述固^元件2係透過焊接加卫及尖端放電加工及機械加工 及超音波焊接其巾任—與前述本體丨及固定元件2結合，其中該 固定元件2貫穿前述本體丨之第一側12及該支樓體14主要係透 過機械加工所完成，所述機械加工係可以沖壓及搪孔及鑽孔等其 中任一加工但並不引以為限。 由於所述固定元件2係貫穿於該本體1具有支撑體14之部位 與該本體1結合，故並不影響該本體1之腔室U整體之氣密性， 令該腔室11内仍呈真空狀•態，使該腔室u内部之工作流體3亦 不向外洩漏。 凊參閱第4圖，係為本創作之散熱元件之固定結構之第二實 施例之立體組合圖，如圖所示，本實施例部分結構係與前述第一-實施例相同，故在此將不再贅述，惟本實施例與前述第一實施例 之不同處係為所述本體1外部凸設至少一受熱區16 ,所述受熱區 16相鄰該等固定元件2。 100215301 1003317.441-0 M423285 年8•月30曰 請參閱第5、6圖，係為本創作之散熱元件之固定結構之第三 實施例之立體分解及組合圖，如圖所示，本實施例部分結構係與 前述第一實施例相同，故在此將不再贅述，惟本實施例與前述第 一實施例之不同處係為所述本體1對應與一基板4貼設，該本體i 凸6又至少一受熱區π並與該基板4上之至少一熱源41接觸，所 述熱源41周侧設有複數孔洞42，該等孔洞42與前述固定元件2 相對應，所述本體1相反該受熱區16 一側連接一散熱器5，並且 • 透過至少一鎖固元件6穿設前述固定元件2之孔洞42將所述本體 1及基板4固定。 凊參閱第7、8圖，係為本創作之散熱元件之固定結構之第四 實施例之立制及Β-Β剖棚，如騎示，本實施例部分結構係 與前述第-實施例相同，故在此將不再贅述，惟本實施例與前述 第-實施例之不同處係為所述本體丨更具有一第一板體Μ及一第 一板體lb對應蓋合並共同界定前述腔室11。 • 請參閱第9圖’係為本創作之散熱元件之固定結構之第五實 施狀組合顺® ’如圖所*，本實施例部分結構躲前述第一 實施例相同’故在此將不再贅述，惟本實施例與前述第—實施例 之不同處係為所述固^元件2係貫穿前述本體丨之第—側η，並 同時貫穿該支撐體14整體，但並不貫穿該本體i之第二侧13。 【圖式簡單說明】 例立體分解圖; 例立體組合圖; 第1圖係為本創作散熱元件之固定結構之第一實施 第2圖係為本創作散熱元件之固定結構之第一實施 100215301. ::1003317.441 M423285The iG of the 7G piece of the political structure includes: - the body of the plurality of fixed elements 2 the body 1 has a chamber π and a first side 12 and a second side 13, the diagnosis chamber has a plurality of a body 14 and a working fluid 3 and at least one capillary junction 15, the branches 14 are connected to the first and second sides 12, 13, and the capillary knot = layer 15 is completely attached to the chamber Μ the fixing members 2 a hole 21 is formed, and the fixing member 2 - end penetrates the first side 12 of the body 1 and the body 14 is coupled with the body 丨. The solid 21 of the element 2 has an internal thread 21 The component 2 is coupled to the body body and the fixing component 2 by means of soldering and tip discharge machining and machining and ultrasonic welding, wherein the fixing component 2 extends through the first side 12 of the body body and the branch The body 14 is primarily formed by machining, which can be stamped, boring and drilling, but is not limited. Since the fixing member 2 is coupled to the body 1 through the portion of the body 1 having the support body 14, the airtightness of the entire chamber U of the body 1 is not affected, so that the chamber 11 is still vacuumed. In the state, the working fluid 3 inside the chamber u is not leaked outward. 4 is a perspective assembled view of a second embodiment of the fixed structure of the heat dissipating component of the present invention. As shown in the figure, the partial structure of the present embodiment is the same as that of the first embodiment described above, and therefore The difference between this embodiment and the foregoing first embodiment is that at least one heated zone 16 is protruded from the outside of the body 1 , and the heated zone 16 is adjacent to the fixing elements 2 . 100215301 1003317.441-0 M423285 8•月30曰 Please refer to Figures 5 and 6, which are the three-dimensional decomposition and combination diagram of the third embodiment of the fixed structure of the heat dissipating component of the present invention, as shown in the figure. The structure is the same as that of the first embodiment, and therefore will not be described here. However, the difference between the embodiment and the first embodiment is that the body 1 is correspondingly attached to a substrate 4, and the body i is convex 6 Further, at least one heated zone π is in contact with at least one heat source 41 on the substrate 4. The heat source 41 is provided with a plurality of holes 42 on the circumferential side thereof, the holes 42 corresponding to the fixing member 2, and the body 1 is oppositely heated. A heat sink 5 is connected to one side of the region 16, and the body 1 and the substrate 4 are fixed by the holes 42 of the fixing member 2 through the at least one locking member 6.第References 7 and 8 are the stand-up and Β-Β shed of the fourth embodiment of the fixed structure of the heat dissipating component of the present invention, such as riding, the partial structure of this embodiment is the same as that of the above-mentioned first embodiment Therefore, the description of the embodiment is different from that of the foregoing embodiment. The main body has a first plate body and a first plate body lb corresponding to the cover to jointly define the cavity. Room 11. • Refer to Figure 9 for the fifth embodiment of the fixed structure of the heat-dissipating component of this creation. As shown in the figure, the structure of this embodiment is the same as the first embodiment. Therefore, it will no longer be used here. As described above, the difference between the present embodiment and the foregoing first embodiment is that the solid element 2 penetrates the first side η of the body , and penetrates the whole of the support body 14 at the same time, but does not penetrate the body i The second side 13 is. [Simplified illustration of the figure] Example of the three-dimensional exploded view; Example of the three-dimensional combination of the first embodiment of the first embodiment of the fixed structure of the heat-dissipating component of the first embodiment of the present invention is the first implementation of the fixed structure of the heat-dissipating component 100215301. ::1003317.441 M423285
第3圖係為本創作散熱元件之議構之第—實施例組合a 視圖； 第4圖係為本創作之散熱元件之固定結構之第二實施例之立 合圖； / 第5圖係為本創作之散熱元件之固定結構之第三實施例之 解圖； 第6圖係為本創作之散熱元件之固定結構之第三實施例之立體组 合圖； 第7圖係為本創作之散熱元件之固定結構之第四實施例之立雜 第8圖係為本創作之散熱元件之固定結構之第四實施例之Β·Β剖 視圖； 第9圖係為本_之憾元件之固定結構之第五實_之組合剖 視圖。 【主要元件符號說明】 本體1 第一板體la 第二板體lb 腔室11 第一側12 第二側13 支撐體14 毛細結構層15 1002.15301 1003317.441-0 M423285Figure 3 is a view of the combination of the embodiment of the present invention for the creation of the heat dissipating component; Figure 4 is a view of the second embodiment of the fixed structure of the heat dissipating component of the present invention; The third embodiment of the fixed structure of the created heat dissipating component; FIG. 6 is a three-dimensional combination diagram of the third embodiment of the fixed structure of the heat dissipating component of the present invention; FIG. 7 is the heat dissipating component of the present invention. The fourth embodiment of the fixed structure of the fourth embodiment is a cross-sectional view of the fourth embodiment of the fixed structure of the heat dissipating component of the present invention; the fifth figure is the fifth of the fixed structure of the component A cross-sectional view of the combination of real_. [Main component symbol description] Main body 1 First plate body la Second plate body lb Chamber 11 First side 12 Second side 13 Support body 14 Capillary structure layer 15 1002.15301 1003317.441-0 M423285
年8·月3〇曰雙正補无 受熱區16 固定元件2 孔洞21 内螺紋211 工作流體3 基板4 熱源41 孔洞42 散熱器5 鎖固元件6 ；1002;153αΐ; 1:003317.441-0Year 8 · month 3 〇曰 double positive complement heat zone 16 fixed component 2 hole 21 internal thread 211 working fluid 3 substrate 4 heat source 41 hole 42 heat sink 5 locking component 6; 1002; 153αΐ; 1:003317.441-0