TWM421457U - Non-disposable LED lamp with laminated heat dissipation - Google Patents

Non-disposable LED lamp with laminated heat dissipation Download PDF

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Publication number
TWM421457U
TWM421457U TW100212376U TW100212376U TWM421457U TW M421457 U TWM421457 U TW M421457U TW 100212376 U TW100212376 U TW 100212376U TW 100212376 U TW100212376 U TW 100212376U TW M421457 U TWM421457 U TW M421457U
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TW
Taiwan
Prior art keywords
heat dissipation
substrate
heat
led
lamp
Prior art date
Application number
TW100212376U
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English (en)
Inventor
Hui-Min Wang
Original Assignee
Ceramate Technical Co Ltd
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Publication date
Application filed by Ceramate Technical Co Ltd filed Critical Ceramate Technical Co Ltd
Priority to TW100212376U priority Critical patent/TWM421457U/zh
Priority to US13/208,407 priority patent/US8398266B2/en
Priority to EP11179725A priority patent/EP2565516A1/en
Priority to JP2011005442U priority patent/JP3172019U6/ja
Priority claimed from JP2011005442U external-priority patent/JP3172019U6/ja
Publication of TWM421457U publication Critical patent/TWM421457U/zh

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Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20Light sources comprising attachment means
    • F21K9/23Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/89Metals
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00Globes; Bowls; Cover glasses
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00Globes; Bowls; Cover glasses
    • F21V3/04Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
    • F21V3/06Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material
    • F21V3/062Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material the material being plastics
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/105Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening using magnets
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00Arrangement of electric circuit elements in or on lighting devices
    • F21V23/06Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Description

M421457 五、新型說明: 【新型所屬之技術領域】 本創作係有關於-種LED燈具,特別是指一種具有多層散熱之筒 體’而使散熱絲佳且兼具節能減碳麟色環叙積層絲熱之非抛 棄型LED燈。 【先前技術】 按,一般日光燈官之使用壽命較短,而且照明時的亮度不佳,為 了增加照明的亮度,使用者通常會需要使用較高瓦數的日光燈管或是 增加日光燈管的數量來使用,進而使得日光燈管耗電量遽增,並且習 知日光燈管内含有會對人體造成傷害之汞蒸氣及螢光粉,故近年來以 LED製作而成的燈具產品已逐漸取代一般日光燈管及省電燈泡,眾所 周知,LED具有節能、省電、高效率、反應時間快、壽命週期長、且 不含汞具環保等優點,可大量節省照明燈具的用電量。 惟,不論是何種類型之LED,其使用壽命及可靠度主要受溫度的 影響’以rij功率LED為例’其當該LED接受電能後,其輸入功率約只 有15〜20%電能轉換成光,近80〜85%的電能轉換為熱能,故,以LED 為發光源之燈具’經過長時間使用後,容易造成LE:D溫度過熱,若LED 發光時所產生的熱能若無法導出,會使LED界面溫度過高,影響發光 效率、穩定性與使用壽命,溫度愈高其使用壽命愈低,因此,導致LED 燈具中較易故障者往往僅侷限於發光源部份之LE:D模組,因此,如何 提升LED燈具的散熱效果,以避免熱能累積造成LED之損害,乃當前 業者亟思解決之一重要課題。 3 敗 421457 又由於LED發光模組因故障等因素欲置換時,往往須連同電源部 份-起更換’神須整組燈具拋棄錢換,造成制者不必要之浪費, 及環境垃圾量之增加。 ' 【新型内容】
本創作主要目的在提供—種積層式散熱之非拋棄型LED燈,該LED 燈散熱效果佳、壽命長及發光效率良好,進而具有節能減碳與綠 色環保之優點。 本創作次要目的在提供-種積層式散熱之非拋棄型⑽燈,係將 電源部份之構件錢源部份之構賴由磁吸方式形成相互結合定位, 故亦可輕H離更換’可大幅減少環境之垃圾量,具有環保節能之優 點。 為達上述之目的’本創作之積層式散熱之非拋棄型㈣燈,其主 要係包含有-燈座、-LED發光顯、—燈罩及—散熱單元,其中, 該燈座係具有-巾空殼體’該巾线體之-端設有—敎段,且該中 空殼體另端係組設有-固定板,該固定板對應於該螺紋段之—側係設 有一電源轉換單元,而該LED發光模組係組設於該燈座上,其係具有 一易導熱之屬材質所製成之基板,該基板上另嵌設有一電路板,該 電路板之一側裝設有多數個LED,而該燈罩係以透光壓克力材質一體 製作而成之罩體,並組設於該LED發光模組上,而該散熱單元係包覆 於該燈座之周側,其係以易導熱之金屬材質所製成,並沿軸向形成數 散熱層,使該等散熱層概呈數個直徑不相同之筒體所構成,並層層包 覆於該燈座之周側外,其中,該散熱單元於相鄰之散熱層間皆形成有 4 M421457 間隙,且每一散熱層其相對之兩端係分別與其相鄰但位於不同側之另 一散熱層之相對應端形成相接,且該散熱單元位於最内層之散熱層之 自由端並與LED發光模組之基板相接,而使LED可經由該基板導熱至 該散熱單7C上,達到散熱之效果。 藉此,該LED燈之led發光模組所產生之熱源可傳遞至該散熱單 疋’亚藉由該等散熱層之設置,而增加該LED燈與外部空氣接觸之散 熱面積及散熱轉,獅可提升該LED燈之㈣壽命、發光效率、減 少電子垃圾及綠色環保之優點。 【實施方式】 、’月 > 閱第圖至第二圖所示,分別為本創作較佳實施例之 立體圖、分解圖及剖棚,其係揭露—種積層式散熱之非拋棄型⑽ 燈100,該LED燈100係包含有: •燈座10,係以塑膠所製成 —-^ 丁主敢瓶ii,钱甲空殼
-jl下方之端形成一直練小之螺紋段,於該螺紋段12上依序 έ、二有^緊壤13及一電源接頭14,而該中空殼體11上方之另端則 有鋁金屬之固疋板15,於本實施例中,該中空殼體^上方之 =緣係沿轴向且料隔凸伸有四個第_卡榫ui,而制定板π周緣 應於鱗第-卡榫⑴係韻有四個第—定位孔i5i,該等第一卡 中* 1可卡°洗轉第一定位孔151内,俾使棚定板15可固定於該 工殼體u上’又’該固歧15相對於該歡段12之—侧設有多數 四力磁鐵152及-第—連接部153,於本實施例中,本創作係具有 強力磁鐵152,該等強力磁鐵152係嵌設於該固定板15上,而該 5 M421457
連接部153係為-同軸環形之金屬座,其内部設有接點,以形成 …、極杜之接頭,且該m定板15之另側連接有—電轉換單元μ, 該電源轉換單元16係分別與該第一連接部153與該電源接頭Μ形成 電性連接’於本實施例巾,該電_換單元16可採電容降壓式、變壓 ρ合式、Κ:降壓供應式或電阻直接降壓式,俾將—市用交流電源轉 換成直流電源補電源接頭14係—金屬螺接頭,或者亦可為一刪 接頭(圖未示),本創作實施態樣並不侷限之。 一⑽發光模組20,係為一圓盤狀,係可拆卸式地設於該燈㈣ 之固定板15上’該LED發光模組2〇係具有易散熱之叙金屬材質所製 成之-基板21,祕板21之—側向峨設有—電路板22,該電路板 2之-侧絲設有多數飢腹21及—電路驅解元嫩,該等⑽⑵ :以螺旋方式排列於該電路板22上,而該基板21另側對應於該等強 力磁鐵152及該第-連接部153係設有一環形鐵片2ιι及一第 ,於本實施例中,該第二連接部212係為—同轴環形之錢端 可”該弟-連接部153相接合並形成電性相通,且該第二連 212係與該電路板22電性相通,而_發光模組2〇係透過該_ 鐵片211與該燈座10之強力磁鐵152相互磁吸固定,此外, 發光模組20與該麵1Q之結合方式除了制上述磁财式/ 可使用_或是卡合方式相互結合,糊作實施態樣並不之,又、, 該led發光模組20於該基板21周緣係等間隔穿設有三個第二定位孔 213。 燈罩3〇 ’細透賴克讀f—雜作而叙球科體,並固 6 « 她亥LED發光模組20之基板21上,於本實施例中該燈罩2〇開口 *周緣對應於轉第二定位孔213係沿軸向且等間隔設有三個第二 itl。亚可卡固於該等第二粒孔⑽内,_於該⑽發光模 —散熱單元40 ’係包覆於贿座1()之關,其係料導熱之銘 =材貝所製成,並沿軸向形成三層之散熱層41,該等散熱層^概 皆不相同之筒體所構成,且相鄰之散熱層41間皆形成有間隙, 每I,、層41其相對之兩端係分別與其相鄰但位於不同側之另一 散熱層41之相對應端形成相接,使該散熱單元40沿軸向之剖視,形 成連、,'之s狀,且該等散熱層41於朝向螺紋段12之一端皆朝内形 成收束#又41卜使該等散熱層41之收束段4ΐι可藉由該迫緊淨η 之迫緊而相疊細定於燈座1G上,進而使該等散熱層Μ層層包覆 於燈座10之周侧外’惟相鄰之散熱層41於不形成連接之收束段411 門係夾》又有|^離% 42 ’又該散熱單元4〇位於最内層之散熱層^之 自由端並與.亥LED發光模組2〇之基板21利用散熱膠之黏結而形成相 接’而使腹21可經鍵基板2丨導熱至錄熱單元4Q上,達到散埶 之效果,另該散熱單元40之散熱層41於上、下端側皆環設有數個散 熱孔412。 為供進一步瞭解本發明構造特徵、運用技術手段及所預期達成之 力j a將本0之使財式加崎述’相信當可由此*對本發明有 更冰入且具體之瞭解,如下所述· 請繼續參閱第三圖所示 當該LED燈1〇〇之le:D發光模組2〇開始 7 m421457 而不會影響發叙均勾度。 良Τ、上所述,本創作在同類產品中實有其極佳之進步實用性,同時 遍查國内外關於_'結構之技術資料,文獻中亦未發現有相同的構造 存在在先’是以,本創作實已具備新型專利要件,爰依法提出 惟,以上所述者,僅係本創作之 ° 應用本創作制纽巾料概1^了4_已,故舉凡 本創作之專利範圍内。 、之等效結構變化,理應包含在 M421457 【圖式簡單說明】 第一圖係為本創作較佳實施例之立體圖。 第二圖係為本創作較佳實施例之分解圖。 第三圖係為本創作較佳實施例之剖視圖。 第四圖係為本創作另一較佳實施例之剖視圖。 【主要元件符號說明】 100 積層式散熱之非拋棄型LED燈
10 燈座 11 中空殼體 111 第一卡榫 12 螺紋段 13 迫緊環 14 電源接頭 15 固定板 151 第一定位孔 152 強力磁鐵 153 第一連接部 16 電源轉換單元 20 LED發光模組 21 基板 211 環形鐵片 212 第二連接部 213 第二定位孔 22 電路板 221 LED 222 電路驅動單元 30 燈罩 31 第二卡榫 40 散熱單元 41 散熱層 411 收東段 412 散熱孔 413 葉片 42 隔離環 43 定位架

Claims (1)

  1. m^l457 六、申請專利範圍: 1、一種積層式散熱之非拋棄型LED燈,其主要係包含有: 一燈座,其具有一中空殼體,該中空殼體之一端設有一螺紋段, 且該中空殼體另端係組設有一固定板,該固定板對應於該螺紋段之一 侧係設有一電源轉換單元; 、 一 LED發光模組,係組設於該燈座上,其係具有一易導熱之金屬 . 材貝所製成之基板,該基板上另嵌設有一電路板,該電路板之一侧裝 鲁設有多數個LED; 一燈罩,係以透光壓克力材質一體製作而成之罩體,並組設於該 LED發光模組上; 一散熱單元,係包覆於該燈座之周側,其係以易導熱之金屬材質所 製成,並沿軸向形成數散熱層,使該等散熱層概呈數個直徑不相同之 筒體所構成,並層層包覆於燈座之周側外,其中,該散熱單元於相鄰 之政熱層間白形成有間隙,且每一散熱層其相對之兩端係分別與其相 ♦鄰但位於不同側之另一散熱層之相對應端形成相接,且該散熱單元位 於最内層之散熱層之自由端並與該L]ED發光模組之基板相接,而使㈣ 可經由δ亥基板導熱至該散熱單元上,達到散熱之效果。 2依據申明專利範圍第1項所述之一種積層式散熱之非拋棄型 LED燈其中,δ亥固定板相對於該螺紋段之另側設有至少一強力磁鐵 及-第-連接部,該第—連接部係無電雜換單元連接,而該 LED發光模組之基板鑛應定㈣設有—環_片及—第二連接 部’該第二連接部係與該電路板電性連接,且該第—連接部與該第二 12 LED 申料利範圍第1項所述之—種積層式散熱之非拋棄型 足其中,該燈罩開口端之周緣係設有複數個第二卡榫,而該基 板周緣對應料二卡榫係穿設有複數個第 二定位孔,俾使該燈罩可組 設於該LED發光模組之基板上。
TW100212376U 2011-07-06 2011-07-06 Non-disposable LED lamp with laminated heat dissipation TWM421457U (en)

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TW100212376U TWM421457U (en) 2011-07-06 2011-07-06 Non-disposable LED lamp with laminated heat dissipation
US13/208,407 US8398266B2 (en) 2011-07-06 2011-08-12 Laminated heat-dissipating and non-disposable LED lamp
EP11179725A EP2565516A1 (en) 2011-07-06 2011-09-01 Laminated heat-dissipating and non-disposable LED lamp
JP2011005442U JP3172019U6 (ja) 2011-09-16 積層式放熱構造を有する非使い捨て型ledランプ

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TW100212376U TWM421457U (en) 2011-07-06 2011-07-06 Non-disposable LED lamp with laminated heat dissipation
US13/208,407 US8398266B2 (en) 2011-07-06 2011-08-12 Laminated heat-dissipating and non-disposable LED lamp
EP11179725A EP2565516A1 (en) 2011-07-06 2011-09-01 Laminated heat-dissipating and non-disposable LED lamp
JP2011005442U JP3172019U6 (ja) 2011-09-16 積層式放熱構造を有する非使い捨て型ledランプ

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JP3172019U (ja) 2011-12-01

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