五、新型說明： 【新型所屬之技術領域】 本創作係關於一種感測裝置總成，詳言之，係關於一種 具有溫控功能之感測裝置總成。 【先前技術】 習知感測裝置(例如：光學感測器、聲音感測器 '壓力 感測裔或太陽能電池模組等）通常很容易受溫度改變而影 響其量測特性(例如物理特性，特別是電性特性)，因此其 僅在特定皿度時所到的量測值才是可信賴的。舉例而 "習知電流感測器在溫度1G°C時所量到的電流值是可 L賴」而田，皿度變為2〇°C _，該習知電流感測器所量到 的電流值便不可罪’此時必須加人—個偏差值（⑽如）計 算後才值得參考。 有鑑於此種改善方式為增設一個溫控裝置。但是傳 統的溫控裝置係為降溫裝置且其構件十分複雜。此外，在 實際操作時’該傳統溫控裝置必須將量到的實際溫度值不 斷的回饋微調（Feedbaek Fine τ_)才有辦法達到溫控效 果，十分麻煩。 【新型内容】 本創作提供一種具有溫控功能之感測裝置總成，其& -感測裝置及一溫控裝置。該感測裝置之量測特性會受》: 度改變而影響。該溫控裝置係、連.接至該感測裝置’且提^ ,、I至該感測裝置直到該溫控裝置及該感測裝置之溫度专 達到-固定溫度為止’俾使該溫控裝置及該感測裝置之廷 156830.doc 1料丄8282 度皆維持在該固定溫度。藉此 調即可達到優良的溫控效果。 【實施方式】 考圖1及圖2 ’分別顯示本創作中具有溫控功能之感 測裝置總成之-實施例之立體分解及立體組合示意圓。請 參考圖3，顯示圖2之侧雜m。分曰士 見圖該具有溫控功能之感測裝置 總成1，包括一感測裝置2及一溫控裝置3。V. New description: [New technical field] This creation is about a sensing device assembly. In detail, it relates to a sensing device assembly with temperature control function. [Prior Art] Conventional sensing devices (eg, optical sensors, sound sensors, pressure sensing or solar cell modules, etc.) are generally susceptible to temperature changes that affect their measurement characteristics (eg, physical properties, In particular, electrical properties), so the measured values that are only available at a particular degree are reliable. For example, the conventional current sensor can measure the current value at a temperature of 1 G ° C. The field is changed to 2 ° ° C _, which is measured by the conventional current sensor. The current value is not guilty. At this time, it is necessary to add people - a deviation value ((10), for example) is worthy of reference. In view of this improvement, a temperature control device is added. However, the conventional temperature control device is a cooling device and its components are very complicated. In addition, in the actual operation, the conventional temperature control device must adjust the amount of the actual temperature value to the fine adjustment (Feedbaek Fine τ_) to achieve the temperature control effect, which is very troublesome. [New Content] This creation provides a sensing device assembly with temperature control function, a & sensing device and a temperature control device. The measurement characteristics of the sensing device are affected by the change in degree. The temperature control device is connected to the sensing device and raised to the sensing device until the temperature of the temperature control device and the sensing device reaches a fixed temperature. The device and the sensing device are maintained at the fixed temperature. With this adjustment, excellent temperature control can be achieved. [Embodiment] FIG. 1 and FIG. 2' respectively show a three-dimensional decomposition and a three-dimensional combination schematic circle of a sensing device assembly having a temperature control function in the present invention. Referring to Figure 3, the side m of Figure 2 is shown. The sensor device assembly 1 having a temperature control function includes a sensing device 2 and a temperature control device 3.
該感測裝置2(例如：一光學感測器、 壓力感測器或-太陽能電池模組)之量測特性二 變而影響。該溫控裝置3連接至該感測裝置2,且提供熱能 至該感測裝置2直到該溫控裝置3及該感測裝置2之溫度皆 達到-固定溫度為止’俾使該溫控裝置3及該感測裝置2之 溫度皆維持在該固定溫度。 該溫控裝置3可以是一熱敏電阻（Themist〇r)或一電阻式 溫度感測器（Resistance Temperature Detector’ RTD)，其電The measurement characteristics of the sensing device 2 (for example, an optical sensor, a pressure sensor, or a solar battery module) are affected by the change. The temperature control device 3 is connected to the sensing device 2, and provides thermal energy to the sensing device 2 until the temperature of the temperature control device 3 and the sensing device 2 reaches a fixed temperature. And the temperature of the sensing device 2 is maintained at the fixed temperature. The temperature control device 3 can be a thermistor (Themist〇r) or a Resistivity Temperature Detector (RTD), which is electrically
該溫控裝置不需要回饋微 阻會隨著溫度改變而變化。然而，可以理解的{，該溫控 裝置3也可以是其他可發熱且可維持在一固定溫度之 置。 在本創作中’該固定溫度係高於室溫及該感測裝置正常 使用時之溫度’例如7(TC、8〇t、9〇t或12代。換言 之，該溫控裝置3並非用以對該感測裝置2進行降溫至室、田 或室溫以下，而是對該感測裝置2加熱進行升溫且維持2 一固定溫度。 在本實施例中，該感測裝置2更包括至少一導線21，用 156830.doc M418282 以電性連接至-待測物（圖中未示）或—電源（圖中未示）。 該溫控裝4 3係為-正溫度係數（pGshive by處eThe temperature control device does not require feedback and the micro-resistance changes with temperature. However, it can be understood that the temperature control device 3 can also be other heat-generating and can be maintained at a fixed temperature. In the present creation, 'the fixed temperature is higher than room temperature and the temperature at which the sensing device is normally used', for example, 7 (TC, 8 〇 t, 9 〇 t or 12 generations. In other words, the temperature control device 3 is not used The sensing device 2 is cooled to a room, a field or a room temperature or lower, and the sensing device 2 is heated and heated to maintain a fixed temperature. In the embodiment, the sensing device 2 further includes at least one The wire 21 is electrically connected to the object to be tested (not shown) or the power source (not shown) by 156830.doc M418282. The temperature control device is a positive temperature coefficient (pGshive by e
Coefficient，PTC)熱敏電阻，其包括—電阻本體μ、一外 圍層32及至少-導線33。該外圍心係環繞該電阻本體 η，以保㈣電阻本體31。科線33係心電性連接至一 外接電源（时未示），該外接電源係提供電流至該溫 置3。 請參考圖4,顯*本創作中正溫度係數熱敏電阻之電阻 與溫度之關係圖。正溫度係數熱敏電阻之電阻值會在很小 的溫度範圍内急劇增加幾個至十幾個數量級，而呈現非線 I·生曲線#圖所不’當該正溫度係數熱敏電阻之溫度超過 -開關溫度Μ，其電阻會急遽增加；當其溫度達到一固 定溫度丁贿時，其電阻達到一極大值而幾乎不再增加。 因此，每-個正溫度係數熱敏電阻都有其值溫的 定溫度了叫該特定值取決於其材料㈣）特性 最大電阻值的大小。 ::施例之操作原理如下。首先，參考圖 測裝置2(太陽能電池模组 w 琢 電阻“ （正溫度係數熱敏 該溫控裝置3i 2及圖3’將該感測裝置2直接置放於 裝置2:下表面’且該溫控裝置3之上表面直接接觸該感測 以得該溫控裝置3及該感測襄置2之間可 下表面利用n技 -戈1該感測裝置2之 裝置3之上表面° 鐸錫或黏膠等)貼合於該溫控 156830.doc M418282 接著’將該感測裝置2之導線21電性連接至一待測物（圖 中未示）或一電源（圖中未示），且將該溫控裝置 電性連接至-外接電源（时未示）。藉由導通該外^ = 之電流，該溫控裝置3(正溫度係數熱敏電阻）本身會產生熱 & ;另外，可能因光的照射，該感測裝置2(太陽能電池模 . 組）本身也會產生熱能。上述二種熱能之產生會使得該溫 控裝置3(正溫度係數熱敏電阻）不斷的增溫，參考圖4，當 # 】度超過開關溫度TS時，該溫控裝置3(正溫度係數熱敏; 阻）的電阻瞬間會劇增，最終到達一個極大值。此時，由 於其電阻達到極大值，流經該溫控裝置3(正溫度係數熱敏 電阻）之電流迅速減至很小，所以整個該溫控裝置3(正溫度 係數熱敏電阻）幾乎不再繼續產生熱能，其溫度趨於一個 特定值（即該固定溫度Tmax)，藉此達到控溫（控制該感測 裝置2的溫度）之目的。 虽該溫控裝置3(正溫度係數熱敏電阻）的溫度低於上述 馨 溫度Tmax時（基本上不會發生，除非是該感測裝置2 需加溫的數量遽增或環境溫冑突然大降），纟電阻也相同 下降；此時通過之電流增加，溫度又上升，最後使得電阻 — *又上升至該極大值’導致該溫控裝置3(正溫度係數熱敏 電阻）的溫度又回到該特定值（即該固定溫度Tmax)。 簡。之，該溫控裝置3係先藉由溫度提升其電阻值，最 、電阻值到達極限，溫度也到達一個特定值不再變化（除 非有特殊狀況，不然是不會變化）。 本實施例中，該正溫度係數熱敏電阻的規格約會控制該 156830.doc 感測裝置2到一個比較理想的溫度，如7〇度、8〇度、9〇度 或120度，而該溫度是環境溫度基本上不可能超過的溫 度，或是說該溫度為不管該感測裝置2怎麼使用或光怎麼 照射都不會超過。 本創作之優點為，該溫控裝置3之構造簡單且價格便 宜’不需要回饋微調即可達到優良的溫控效果。 »月參考圖5及圖6，分別顯示本創作中具有溫控功能之感 測裝置總成之另一實施例之立體分解及立體組合示意圖。 請參考圖7，顯示圖6之側視圖。本實施例之感測裝置總成 4與圖1至圖3之感測裝置總成丨大致相同，其中相同之元件 賦予相同之編號。本實施例之感測裝置總成4與圖丨至圖3 之感測裝置總成1之不同處在於，在本實施例中，該感測 裝置總成4更包括一中間導熱元件5，夾設於該溫控裝置3 及該感測裝置2之間。換言之，該感測裝置2之下表面接觸 該中間導熱元件5之上表面，該溫控裝置3之上表面接觸該 中間導熱7L件5之下表面。由於該中間導熱元件5係為熱的 良導體材質，因此可以達到更好的導熱效果。 上述實施例僅為說明本創作之原理及其功效，並非限制 本創作。因此習於此技術之人士對上述實施例進行修改及 變化仍不脫本創作之精神。本創作之權利範圍應如後述之 申請專利範圍所列。 【圖式簡單說明】 圖1顯示本創作中具有溫控功能之感測裝置總成之一實 施例之立體分解示意圖； 156830.doc M418282 圖2顯示本創作中具有溫控功能之感測裝置總成之一實 施例之立體組合示意圖； 圖3顯示圖2之側視圖； 圖4顯示本創作中正溫度係數熱敏電阻之電阻與溫度之 關係圖； 圖5顯示本創作中具有溫控功能之感測裝置總成之另一 實施例之立體分解示意圖； 圖6顯示本創作中具有溫控功能之感測裝置總成之另一 實施例之立體組合示意圖；及 圖7顯示圖6之側視圖。 【主要元件符號說明】 1 具有温控功能之感測裝置總成 2 感測裝置 3 溫控裝置 4 具有溫控功能之感測裝置總成 5 中間導熱元件 21 導線 31 電阻本體 3 2 外圍層 33 導線 156830.docThe Coefficient (PTC) thermistor comprises a resistor body μ, an outer layer 32 and at least a wire 33. The peripheral core surrounds the resistor body η to protect the (four) resistor body 31. The cord 33 is electrically connected to an external power source (not shown), and the external power source supplies current to the temperature 3. Please refer to Figure 4 for a comparison of the resistance and temperature of the positive temperature coefficient thermistor in this creation. The resistance value of the PTC thermistor will increase sharply by a few to ten orders of magnitude in a small temperature range, while the non-line I·sheng curve# is not shown as the temperature of the PTC thermistor. When the temperature exceeds the - switch temperature, its resistance will increase sharply; when its temperature reaches a fixed temperature, its resistance reaches a maximum value and hardly increases. Therefore, each positive temperature coefficient thermistor has its own temperature at a fixed temperature called the specific value depending on its material (4)) characteristics of the maximum resistance value. :: The operating principle of the example is as follows. First, referring to the mapping device 2 (solar battery module w 琢 resistance " (positive temperature coefficient thermal sensing the temperature control device 3i 2 and FIG. 3 'the sensing device 2 is directly placed on the device 2: lower surface' and The upper surface of the temperature control device 3 directly contacts the sensing to obtain a lower surface between the temperature control device 3 and the sensing device 2, and the upper surface of the device 3 of the sensing device 2 is used. Tin or adhesive, etc.) is attached to the temperature control 156830.doc M418282, then 'the wire 21 of the sensing device 2 is electrically connected to a test object (not shown) or a power source (not shown) And electrically connecting the temperature control device to an external power source (not shown). By turning on the current of the external ^=, the temperature control device 3 (positive temperature coefficient thermistor) itself generates heat & In addition, the sensing device 2 (solar battery module group) itself may generate thermal energy due to the irradiation of light. The generation of the above two kinds of thermal energy causes the temperature control device 3 (positive temperature coefficient thermistor) to continuously increase. Temperature, referring to Figure 4, when the degree exceeds the switching temperature TS, the temperature control device 3 (positive temperature coefficient thermal; resistance) The resistance will increase sharply in an instant and eventually reach a maximum value. At this time, since the resistance reaches a maximum value, the current flowing through the temperature control device 3 (positive temperature coefficient thermistor) is rapidly reduced to a small value, so the entire temperature The control device 3 (positive temperature coefficient thermistor) hardly continues to generate thermal energy, and its temperature tends to a specific value (ie, the fixed temperature Tmax), thereby achieving temperature control (controlling the temperature of the sensing device 2). Although the temperature of the temperature control device 3 (positive temperature coefficient thermistor) is lower than the above-mentioned scent temperature Tmax (substantially does not occur unless the amount of the sensing device 2 needs to be heated or the ambient temperature suddenly rises Great drop), the 纟 resistance also drops; the current through the increase, the temperature rises again, and finally the resistance - * rises to the maximum value 'causes the temperature of the temperature control device 3 (positive temperature coefficient thermistor) Returning to the specific value (that is, the fixed temperature Tmax). In short, the temperature control device 3 first raises its resistance value by temperature, and the resistance value reaches the limit, and the temperature also reaches a specific value and does not change (unless Have The special condition, otherwise it will not change. In this embodiment, the specification of the positive temperature coefficient thermistor controls the 156830.doc sensing device 2 to a relatively ideal temperature, such as 7 degrees, 8 degrees, 9 degrees or 120 degrees, and the temperature is a temperature that the ambient temperature is substantially impossible to exceed, or the temperature is not exceeded regardless of how the sensing device 2 is used or how the light is irradiated. The advantage of this creation is that The temperature control device 3 has a simple structure and is inexpensive. 'The temperature control effect can be achieved without the need for feedback fine adjustment. » Referring to FIG. 5 and FIG. 6 respectively, the sensing device assembly having the temperature control function in the present creation is respectively shown. A perspective exploded view and a perspective view of another embodiment. Referring to Figure 7, a side view of Figure 6 is shown. The sensing device assembly 4 of the present embodiment is substantially the same as the sensing device assembly of Figures 1 through 3, wherein the same components are given the same reference numerals. The difference between the sensing device assembly 4 of the present embodiment and the sensing device assembly 1 of FIG. 3 is that, in the embodiment, the sensing device assembly 4 further includes an intermediate heat conducting component 5, and the clip It is disposed between the temperature control device 3 and the sensing device 2. In other words, the lower surface of the sensing device 2 contacts the upper surface of the intermediate thermally conductive element 5, and the upper surface of the temperature control device 3 contacts the lower surface of the intermediate thermally conductive 7L member 5. Since the intermediate heat conducting element 5 is a good conductor material of heat, a better heat conduction effect can be achieved. The above embodiments are merely illustrative of the principles and functions of the present invention and are not intended to limit the creation. Therefore, those skilled in the art can revise and change the above embodiments without departing from the spirit of the present invention. The scope of the rights of this creation shall be as set forth in the scope of the patent application described later. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective exploded view showing an embodiment of a sensing device assembly having temperature control function in the present invention; 156830.doc M418282 FIG. 2 shows a total sensing device with temperature control function in the present creation. FIG. 3 shows a side view of FIG. 2; FIG. 4 shows a relationship between resistance and temperature of a positive temperature coefficient thermistor in the present creation; FIG. 5 shows a sense of temperature control function in the present creation. A perspective exploded view of another embodiment of the measuring device assembly; FIG. 6 shows a perspective assembled view of another embodiment of the sensing device assembly having temperature control function in the present creation; and FIG. 7 shows a side view of FIG. [Main component symbol description] 1 Sensing device assembly with temperature control function 2 Sensing device 3 Temperature control device 4 Sensing device assembly with temperature control function 5 Intermediate heat conduction element 21 Conductor 31 Resistance body 3 2 Peripheral layer 33 Wire 156830.doc