M414656 五、新型說明： 【新型所屬之技術領域】 在現今，電子元件於製作完成後，均合銘澈$ ^ ，上進行電性測試作業或外觀檢測作業等:子元件檢測 3^品品質，由於部份電子元件會應用於品’而 提升測試品質，·請參閱第i圖，係為測試作業，以 試機，其係於機台1 1上配置有測試袭置ϋ，、、電子元件測 熱測室14，該測試裝置i 2係於機^ ^运裝置13及 2 2之測試電路板1 2 1，並以測試器（具測試座1 傳輸至中央控制單元（圖未示出），々:出^將測試結果 動，該輸送裝置1 3係於峨裝置i 置作 向位移（即為X軸向位移）之入料載台，又；7可作第-轴 f子元件’並於另-側設有-可作X軸向位移之 位移(即為Y一⑶)1以方設二 #13 3、13 4，用以於入、出料載A m = 一移料 座122間移載待測/完測之電子元件了 ^ ，2及測試 1 1上設有外罩i 4工，並於外罩^ 至1 4係於機台 2 ’以使室内升溫至預設溫度，而成為—模擬溫^ 1 4 之侧方時，第一移料臂丄3 3即於以:==2 2 電子元件1 5 ’並移載至測試座i 2 使電=== 擬之尚f境中進行測試作業，於測 、第 二移料臂1 3 4係於測試座i 2 2内取出完工第 並:多=出料载台i 3 2上出料;惟，由於測試 二:留 觉損電子元狀翻絲鱗異物，在不轉奴航^易使 M414656 子兀件因壓抵到異物而陸續受損，且該異物亦會影 2之探針接觸，造成電Β件損壞率增加及^ ^如何設計一種可檢知測試座内是否具有異物，以降低带 件損壞率之檢測機，即為業者設計之標的。 _电 【新型内容】 巧作之目的-’係提供一種具取像裝置之電子元件 2，/、係於機台上配置有測試裝置及輸送裝置，該測試裝置係$ ，，少一具測試座之測試電路板，用以測試電子元件，輸送 =有至少-人、出料載台’用以載送待測/完測之電子元^， j设有至少一具取放器之移料臂，用以於測試座及入、出料 待測/完測之電子元件’其中’該測試裝置之周側係設； ^像裝置，該取像裝置係以機架架設有至少一取像器，並以取 ，取像測試座；藉此，可利用取像器取像測試座内是否殘留有異 以防止後續置人之電子元件受損’達到降低損壞率及節省成 本之實用效益。 t創作之目的二，係提供-種具取像裝置之電子元件檢測 機，其係於機台上配置有測試裝置、輸送裝置及熱測室，該測試 裝置係設有至少一具測試座之測試電路板，用以測試電子元件， 輸送裝置係設有至少-人、出料載台，用峨送铜/完測之電 子元件，並设有至少一具取放器之移料臂，用以於測試座及入、 出料載台間移載待測/完測之電子元件，該熱測室係以外罩將測 試裝置罩置並設有升溫器，峨室内升溫至預設溫度，而 成為一模擬應用場所之高溫環境，其中，該熱測室内係裝配有一 位於測5裝置側方之取像裝置，該取像裝置係以機架架4有至少 二取像器，並以取像器取像測試座；藉此，可利用取像器取像測 試座内是否殘留有異物，以防止後續置入之電子元件受損，達到 降低損壞率及節省成本之實用效益。 ' 本創作之目的三，係提供一種具取像裝置之電子元件檢測 機，當取像裝置裝配於熱測室時，該取像裝置係以機架架設一可 4 M414656 ，配取像f之承’並於承置箱上 止損壞，達到提升使用效能之實忿益 實二作有更進-步之瞭解’兹舉-較佳 路板3、f 3 f j Q上設有至少—具測試座i 2之測試電 Q Q I於本實粑例_，係於測試電路板31上設有二測續成 (圖未Hi (圖未示出）將測試結果傳輸至中央控制ίί 詈=央控制單元控制各裝置作動，該輸送裝置^ 你於剃试裝置3 〇之兩側分別設有至少一 υ ’料送脚鞭ΐ子元 測試座3 2之一側設有一可似轴向位移 軸向位移）之入料載台4工，用以载送待測之 送完：ίϊ側Ϊ有軸向位移之出料載台42 ’用以載 C Γ i?向位移且具有取放器之移料S 2 出科載台4 1、42及測試座32間移載待測/完測之電 -’於本實關巾，係於測試裝置3 Q之上方設有二可作Y 移（即為第二、三軸向位移)且具有取放器： Π '二4 3 ' 4 4 ’第一移料臂4 3係於入料 則;測試座3 2間移載待測之電子元件，第二移料臂4 4 F ^ 載台4 2及測試座3 2間移載完測之電子元件，該取像 22係?激測試裝置3 0之周側，並具有至少:取像器 2 0上以ΐϊ座3 Li於本實施例中，該取像裝置5◦係於機台 器5 ^機* 5 1架設有二為^1^取像器5 2，並使二取像 像器^於測試裝置3Q之側方’用以取像測試座32，另於取 度之側方裝额統5 3，以增加測試座3 2四周之明亮 升取像品質，因此，該取像裴置5 〇之取像器5 2可每次 5 M414656 取像測試座3 2 ’亦或隨機取像測試座3 2，而將取像訊號傳輸 至中央控制單元，以判別測試座3 2内是否殘留有異物，於本實 施例中，該取像裝置5 0之取像器5 2係每次取像測試座3 2， 並將取像訊號傳輸至中央控制單元，以判別測試座3 2内是否殘 留有異物。 請參閱第4、5圖，於檢測電子元件6〇時，輸送裝置4〇 ί入ΐί台寺測之電子元件6 〇至測試裝置3 0之側 並以取放31取出待測之電子元件6 〇，此時，該m 5 2之取像II 5 2即先制試座3 2進行取像作業，並^ 號傳輸至中央控制單元’以判別測試座3 2有。 若發現有異物’則控制停機進行異常排除；請異t 3式裝置30之測試座32内並益異物日丰，#坌^ 田“ Υ-ζ轴向位移’以取放器 f试座3 2 ’錢抵電子元件6 0執行測試作f = 載台41則承載下一待測之電子元件;來 7 ~ '斗 試座3 2執行測試作業完畢後，人料載° ^ 圖=測 電子元件6 1至測試座3 2之側方，帛一下，測之 座3 2，並位移至入料載台41處，以取放器4 ^=開測試 一待測之電子元件61，而第二移料臂4 4係載下 至測試座3 2處，並以取放器4 4丄 ，位移 ΓΓί π4Γ位移至測試座3 2之側方第 各測試座3 2，亦即當第二移料臂4 4 =次取像檢查 電子讀6 0移出測試座3 2後，並於第 將完測之 431尚未將下-待測之電子元件 ^43之取放器 ，置5 0之取像器5 2係每次對座3 2之前’取 像訊號傳輸至中央控制單it，以判別像作業， ΪΞί物，當取像I置5◦之取像器5 2檢杳ίί3J是否殘 異物後’第一移料臂4 3之取放器⑶即;將 6 5 電子元件6 Q移叙出之取放以4 1係將完測之 之電子元件6 0。 42上’出料载台42係載出完測 請參閱第1 1、工2 機台2◦上配置有測試裝為本巧作之第二實施例，其係於 取像裝置8 0，該測試^ 輸送裝置4〇、熱測室7 0及 試座3 2之測試電路板=3⑽於機台2◦上設有至少一具測 1上設有二測試座3 2，^、’於本實施射，係於測試電路板3 輸至中央控制單元（、_以測試器（圖未示出）將測試結果傳 動，該輸送裝置4 〇係於&^ 3 單元控制各裝置作 作第-軸向位移之人、裝置3◦之兩側分別設有至少-可 件，於本實施例中，卜^載台，用以載送待測/完測之電子元 可作X軸向位移（即^裳置4 Q係於測試座3 2之-側設有-送待測之電子元件，二认—軸向位移）之入料载台41，用以載 台4 2，用以載送〜則側設有一可作x軸向位移之出料載 裝置3 0之上方,電子兀件，另該輸送裝置4 0係於測試 之移料臂，用以= 向位移且具有取放器 制/完測之電子h/峰台41、42及職座3 2間移載 方設有二可作Y—7f，於本實施例中，係於測試裝置3 0之上 取放器43 1、43向位移（即為第二、三轴向位移）且具有 臂43係於入料^，第-、二移料臂43、“ ’第-移料 篦-菸料#= D 41及測試座3 2間移載待測之電子元件， ΐ: 2賴完測之電 1，並於外星7 f Γ 〇係於測忒裝置3 0之上方裝設有外罩7 --田产，、之内部裝配有升溫器72，以使室内升溫至預 ί二熱測S3擬應用場所之高溫環境，該取像裝置8 0係 Ϊ取像器並位於測試裝置3 Q之周側，而具有至少 像機座3 2 ’於本實施例中，係於熱測室7 .#〇 c.，頂面以機架8 1架設有一可裝配二取像器8 2之 相 取像器8 2係為C C D，用以分別取像測試座3 M414656 2 ’另於承置箱8 3上設餅溫結構，用叫低取似8 2之溫 度，於本實施例中，該降溫結構係於承置箱8 3上設有入風管8 4及^風官8 5 ’並狀風％*8 4連接-冷源供應器8 6，用以 吹送冷空氣至承置箱83内，出風f85則輸出冷岭換後之升 溫，氣’另於取像器8 2之側方裝設有光源δ 7，以增加測試座 3四周之明壳度而提升取像品質，因此，該取像器8 2可每次 取像試座3 2 ’亦魏機轉職座3 2，於本實施例中，各 jϋ8 2係於每次取制試座3 2，並將轉罐傳輸至中央 控制早70，以判別測試座3 2内是否殘留有異物。 μ參閱第13、14圖’於檢測電子元件時，該熱測室7 〇 ^之Ϊ'皿t7 2可使室内升溫至預設溫度，而成為—模擬應用場 ί皿壤境’由於取像裝置8 ◦之取像11 8 2係裝配於熱測室 2 使用時’該取像裝置8 0之人風管8 4係將冷源供應 器8 6供應之冷空氣輸送絲置箱8 3 _作—冷較換，再由 出升溫之空氣，以降低取像器8 2之溫度而確保使 送裝置4 〇之人料載台4 1係、載送待測之電子元件 3 至7 ◦’並位於測試裝置3 Q之側方，第-移料臂 4 3 1即位移至人料載台4 1處，並以取放器4 3 ==2==像:像裝置8 0之取像器8 ,,« ,、二0 J進仃取像作業，並將取像訊號傳輸至中央控 ^座3 2内是否殘留有異物，若發現有異物， :則3 吊思排除；請參閱第1 5圖，當測試裝置3 0之 移:並物時，該第一移料臂4 3作γ—ζ軸向位 内，並將待測之電子元件6 q移載至測試座3 2 :承②’此時，該入料載台41 2執行測試作業完:閱；1 6圖,主於測試座3 件6 1至測試座3 Π，，4 1已承載下一待測之電子元 . 0 j之側方，第一移料臂4 3之取放器4 3 1係 離開膝式座3 2 ’並位移至入料 出移載下-待測之電子元件6ί 料^ 8 M414656 軸向位移至測試座3 2處，並以取放4彳％山 子元件6 0，該出料载台42係位移 ^移載完測之電 料；請參閱第17、i 8、i 9園，#f3 2之側方以便載 ，每次取像檢查各測試座3 2，抑;當像= 器4 41將完測之電子元件6 〇移出測試座後 ^ 料臂4 3嫩器4 3 χ尚未將下一待測之電件^^ 測试座3 2之前，取像裝置8 〇之取像5|β 9总—，1置、； 3 2進行取像作業’並將取像訊號傳輸至控各：：M414656 V. New description: [New technology field] In today's electronic components, after the completion of the production, they are all in accordance with the Ming ^ ^, on the electrical test operation or appearance inspection operations, etc.: sub-component detection 3 ^ product quality, Since some electronic components will be applied to the product and the test quality is improved, please refer to the i-th picture, which is a test operation, and the test machine is equipped with a test set on the machine 1 1 , and electronic components. The thermal testing chamber 14 is connected to the test circuit board 112 of the computer 13 and 22 and is transmitted to the central control unit (not shown) by the tester 1 , 々: output ^ will test the results, the conveyor device 13 is placed in the 峨 device i placed displacement (that is, X-axis displacement) of the loading stage, and; 7 can be used as the first-axis f sub-component ' And on the other side - can be used for the displacement of the X-axis displacement (that is, Y - (3)) 1 to set the two #13 3, 13 4 for the input and discharge load A m = a shifting seat 122 pieces of electronic components to be tested/tested are tested ^, 2 and test 1 1 are provided with a cover i 4 work, and the outer cover ^ to 1 4 is attached to the machine 2 ' to make the indoor When the temperature is raised to the preset temperature and becomes the side of the analog temperature ^ 1 4 , the first transfer arm 丄 3 3 is replaced by: == 2 2 electronic component 1 5 ' and transferred to the test socket i 2 === In the case of the test, the test operation is carried out. In the test, the second transfer arm 1 3 4 is taken out in the test stand i 2 2 and the completion is completed: more = the discharge stage i 3 2 is discharged; However, due to the test 2: the damage of the electronically-shaped wire-shaped scales and foreign bodies, the M414656 sub-pieces are damaged by the pressure of the foreign objects, and the foreign objects are also contacted by the probes of the shadows 2 , resulting in an increase in the rate of damage to the electrical components and how to design a detector that can detect whether there is foreign matter in the test socket to reduce the damage rate of the belt, which is designed for the industry. _Electric [new content] The purpose of the present invention is to provide an electronic component 2 with an imaging device, which is equipped with a test device and a transport device on the machine table. The test device is a test circuit board with less test stand for testing. Electronic component, transport = at least - person, discharge carrier 'for carrying the electronic component to be tested / completed ^, j is provided with at least one pick-and-place device The transfer arm is used for the test socket and the electronic component of the input and output to be tested/tested, wherein the peripheral side of the test device is provided; and the image capture device is provided with at least one frame rack The image taking device is taken to take the image test stand; thereby, the image pickup device can be used to take a picture of whether there is any difference in the test seat to prevent damage of the electronic components that are subsequently placed, so as to reduce the damage rate and save the cost. The purpose of the creation is to provide an electronic component inspection machine with an image capturing device, which is equipped with a test device, a conveying device and a thermal testing room, and the testing device is provided with at least one test. a test circuit board for testing electronic components, the transport device is provided with at least a person, a discharge carrier, a copper/finished electronic component, and at least one transfer arm for the pick and place device For transferring the electronic component to be tested/tested between the test socket and the loading and unloading stage, the thermal testing room is covered by the test device and is provided with a temperature riser, and the temperature is raised to a preset temperature in the chamber. And become a high-temperature environment for a simulated application place, among them, The heat measuring chamber is equipped with an image capturing device located on the side of the measuring device 5, and the image capturing device has at least two image capturing devices in the rack frame 4, and the image capturing device is taken as an image capturing device; Whether the foreign object remains in the image bearing test chamber to prevent damage to the electronic components that are subsequently placed, thereby achieving the practical benefit of reducing the damage rate and saving cost. The purpose of the present invention is to provide an electronic component detecting machine with an image capturing device. When the image capturing device is assembled in the heat measuring chamber, the image capturing device is erected with a frame of 4 M414656, which is matched with f. Cheng's damage to the container, to improve the performance of the use of the two benefits have a more advanced - step by step understanding - the best road board 3, f 3 fj Q with at least - with test The test electric QQI of the i 2 is in the actual example _, which is provided with two test continuous on the test circuit board 31 (the figure is not Hi (not shown), the test result is transmitted to the central control ίί 詈 = central control unit Controlling the operation of each device, the conveying device is provided with at least one 两侧 on the two sides of the shaving device 3, and one side of the material feeding foot whip sub-tester seat 3 2 is provided with an axial displacement similar to axial displacement The feeding stage 4 is used to carry the delivery to be tested: 出 出 ϊ Ϊ Ϊ Ϊ 42 42 ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' S 2 out of the station 4 1 , 42 and the test stand 32 transfer the power to be tested / completed - 'in this real off towel, is placed above the test device 3 Q Y shift (ie, second and third axial displacement) and with pick and place: Π '2 4 3 ' 4 4 'first transfer arm 4 3 is attached to the feed; test block 3 2 transfer to be tested The electronic component, the second transfer arm 4 4 F ^ between the stage 4 2 and the test stand 32, the electronic component is transferred, and the image 22 is on the circumferential side of the test device 30, and has at least: In the present embodiment, the image pickup device 5 is mounted on the machine 5 5 machine * 5 1 frame is provided with two cameras 1 2 and 2 Taking the imager ^ on the side of the test device 3Q is used to take the image test stand 32, and the side of the measure is installed on the side of the measure 5 3 to increase the brightness of the image of the brightness of the test stand around 32 2, therefore, The image capturing device 52 of the image capturing device 5 can take the image test stand 3 2 ' or the random image test stand 3 2 at 5 M414656 each time, and transmit the image capturing signal to the central control unit to determine the test seat. In the present embodiment, the image capturing device 52 of the image capturing device 50 takes the image bearing block 32 every time, and transmits the image capturing signal to the central control unit for discriminating the test. Is there any difference in seat 3 2? . Referring to Figures 4 and 5, when the electronic component 6 is detected, the transport device 4 ΐ ΐ 电子 台 寺 测 测 测 测 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 并 〇 并 并 并 并 并 并〇 At this time, the m 5 2 image II 5 2 is the first test stand 3 2 to perform the image capturing operation, and the ^ number is transmitted to the central control unit 'to determine the test block 32. If there is any foreign matter found, then control the shutdown to eliminate the abnormality; please use the test block 32 of the different t 3 type device 30 and benefit the foreign matter, and the #坌^ field "Υ-ζ axial displacement" to the picker f test stand 3 2 'The money to the electronic component 6 0 to perform the test for f = the stage 41 carries the next electronic component to be tested; to 7 ~ 'the test stand 3 2 after the completion of the test operation, the human load ° ^ Figure = electronic measurement The component 6 1 is to the side of the test socket 3 2, smashed, the seat 3 2 is measured, and is displaced to the loading stage 41, and the pick-up device 4 ^=opens the test of an electronic component 61 to be tested, and The second transfer arm 4 4 is carried down to the test seat 32, and is displaced by the picker 4 4 丄, the displacement ΓΓί π4 至 to the side of the test seat 32, the first test seat 3 2, that is, when the second shift Arm 4 4 = secondary image inspection electronic reading 60 0 after the test stand 3 2 is removed, and the 431 of the electronic component ^43 that has not been tested yet will be set to take the image of 50 The device 5 2 transmits the image capture signal to the central control unit before each pair of 3 2 to determine the image job, ΪΞ 物 , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , 'First move The pick-and-place device (3) of the arm 4 3; the pick-and-place of the 6 5 electronic component 6 Q is taken and the electronic component 60 of the finished system is turned off by the 4 1 system. Please refer to the first embodiment of the first and second machine 2, which is equipped with a test device, which is attached to the image capturing device 80, the test device 4, the thermal chamber 70 and Test bench 3 2 test circuit board = 3 (10) on the machine 2 设有 on at least one test 1 on the second test stand 3 2, ^, 'in this implementation, on the test circuit board 3 to the central control The unit (, _ is driven by a tester (not shown), and the conveying device 4 is tied to the & ^ 3 unit to control each device as the first-axis displacement, and on both sides of the device 3 The at least one component is provided. In this embodiment, the loading platform for carrying the electronic component to be tested/tested can be X-axis displacement (ie, the device is placed in the test socket 3 2 - the side is provided with - the electronic component to be tested, the second identification - the axial displacement) of the loading stage 41, and is used for the carrier 4 2 for carrying the ~ side with a x-axis displacement Above the loading device 30, the electronic device In addition, the conveying device 40 is connected to the moving arm of the test, and is used for the shifting of the electronic h/peak stage 41, 42 and the position of the shifting device with the displacement/measurement/testing. It can be used as Y-7f. In this embodiment, the pickers 43 1 and 43 are displaced (ie, the second and third axial displacements) on the test device 30, and the arm 43 is attached to the feed ^. The first and second transfer arms 43 and the electronic components to be tested are transferred between the 'th-shift material 烟-tobacco material#=D 41 and the test socket 32, ΐ: 2 Star 7 f Γ 〇 is equipped with a cover 7 - Tian production above the measuring device 30, and is equipped with a temperature riser 72 inside to warm the room to the high temperature environment of the intended application site. The image capturing device 80 is an image capturing device and is located on the circumferential side of the testing device 3 Q, and has at least a camera holder 3 2 ' in the present embodiment, which is attached to the thermal chamber 7 . #〇c., top surface The image pickup device 8 2 of the frame 8 1 is equipped with a second image pickup device 8 2 as a CCD for respectively taking the image test stand 3 M414656 2 ' and the cake temperature structure is set on the receiving box 8 3 . Using a temperature lower than 8 2, in this embodiment The cooling structure is provided on the receiving box 8 3 with an air inlet pipe 8 4 and a wind officer 8 5 'and a wind-like wind**4 4 connection-cold source supplier 8 6 for blowing cold air to the bearing In the box 83, the air outlet f85 outputs the temperature rise after the cold ridge is replaced, and the gas is additionally provided with the light source δ 7 on the side of the image finder 8 2 to increase the brightness of the surrounding of the test seat 3 and improve the image quality. Therefore, the image pickup unit 8 2 can take the image test stand 3 2 ', and the machine can be transferred to the seat 3 2 in this embodiment. In this embodiment, each jϋ 8 2 is taken every time the test stand 3 2 is taken, and The transfer tank is transferred to the central control 70 to discriminate whether or not foreign matter remains in the test seat 32. μ Refer to Figures 13 and 14 for the detection of electronic components, the thermal chamber 7 〇 ^ Ϊ ''t t2 2 can warm the room to a preset temperature, and become - simulation application field 皿 壤 ' ' The device 8 is assembled in the thermal chamber 2 when used. The air duct 8 of the image capturing device 8 is a cold air conveying wire supplied by the cold source supplier 8 8 _ For the cold-changing, the air is heated up to lower the temperature of the image pickup unit 8 2 to ensure that the feeding station 4 1 of the feeding device 4 is carried, and the electronic components 3 to 7 to be tested are carried. And located on the side of the test device 3 Q, the first transfer arm 4 3 1 is displaced to the human loading table 4 1 , and the image pickup device 4 3 == 2 == image: image device 80 8 , , « , , 2 0 J enters the image capture operation, and transmits the image capture signal to the central control block 3 2 whether there is any foreign matter remaining. If any foreign matter is found, then: 3 is considered to be excluded; 1 5, when the test device 30 moves: the object, the first transfer arm 43 is in the γ-ζ axial position, and the electronic component 6 q to be tested is transferred to the test seat 3 2 : At this time, the loading stage 41 2 performs the test. Finished: read; 1 6 picture, mainly in the test seat 3 pieces 6 1 to the test stand 3 Π,, 4 1 has carried the next electronic element to be tested. 0 j side, the first transfer arm 4 3 The pick-and-placer 4 3 1 is separated from the knee seat 3 2 ' and displaced to the loading and unloading - the electronic component to be tested 6 ί ^ 8 M414656 is axially displaced to the test seat 3 2 and is placed for 4 彳%山子元件60, the discharge stage 42 is the displacement ^ transfer of the completed electrical material; please refer to the side of the 17th, i8, i 9 park, #f3 2 for loading, each image inspection Test stand 3 2, when; like the = 4 41 move the finished electronic component 6 出 out of the test stand ^ arm 4 3 4 4 χ χ χ 下一 下一 下一 下一 下一 下一2, before taking image device 8 取 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5
查測試座3 2内並無異物後，第一移料臂4 3:以$ 元件61載送至測試座3 2内 業二進而可防止電子元件6 i受損，此時，第二移料臂 取 放器4 41係將完測之電子元件β 〇移載至出料載 料载台4 2係載出完測之電子元件6 〇。付戰口 4 2上出 一據，，本創作可檢查測試座内是否殘留有異物，以降低電子 疋件損壞率及節省成本，實為一深具實用性及進步性之設計，然 未見有相同之產品及刊物公開，從而允符新型專利申嗜 宴 依法提出”。 $ 【圖式簡單說明】 第1圖：習式電子元件測試分類機之熱測室示意圖。 第2圖：本創作第一實施例之各裝置配置圖。 第3圖：本創作第一實施例之側視圖。 第4圖：本創作第一實施例之使用示意圖（一）。 第5圖：本創作第一實施例之使用示意圖（二）。 第6圖：本創作第一實施例之使用示意圖（三）。 第7圖：本創作第一實施例之使用示意圖（四）。 第8圖：本創作第一實施例之使用示意圖（五）。 第9圖：本創作第一實施例之使用示意圖（六）。 第1 0圖：本創作第一實施例之使用示意圖（七）。 第11圖：本創作第二實施例之各裝置配置圖。 9 M414656 第1 2圖：本創作第二實施例之側視圖。 第1 3圖：本創作第二實施例之使用示意圖（一）。 第1 4圖：本創作第二實施例之使用示意圖（二）。 第1 5圖：本創作第二實施例之使用示意圖（三）。 第1 6圖：本創作第二實施例之使用示意圖（四）。 第1 7圖：本創作第二實施例之使用示意圖（五）。 第1 8圖：本創作第二實施例之使用示意圖（六）。 第1 9圖：本創作第二實施例之使用示意圖（七）。After checking that there is no foreign matter in the test seat 3 2, the first transfer arm 4 3: is carried by the component 61 to the test socket 3 2 to prevent the electronic component 6 i from being damaged, and at this time, the second transfer material The arm picker 4 41 transfers the completed electronic component β 〇 to the discharge carrier stage 4 2 to carry out the measured electronic component 6 〇. According to the evidence of the battle port 4 2, this creation can check whether there is any foreign matter in the test seat to reduce the damage rate of electronic components and save costs. It is a practical and progressive design. The same product and publication are published, so that the new patent application banquet is legally proposed." [Simplified illustration of the drawing] Figure 1: Schematic diagram of the thermal measurement room of the analog electronic component test classification machine. Figure 2: This creation Fig. 3 is a side view of the first embodiment of the present invention. Fig. 4 is a schematic view showing the use of the first embodiment of the present invention (1). Fig. 5: First implementation of the present creation Schematic diagram of the use of the example (2). Fig. 6: Schematic diagram of the use of the first embodiment of the present creation (3). Fig. 7: Schematic diagram of the use of the first embodiment of the present creation (4). Fig. 8: First of the creation Schematic diagram of the use of the embodiment (5). Fig. 9: Schematic diagram of the use of the first embodiment of the present creation (6). Fig. 10: Schematic diagram of the use of the first embodiment of the present creation (7). Fig. 11: This creation Device configuration diagram of the second embodiment 9 M414656 Figure 12: Side view of the second embodiment of the present creation. Fig. 13: Schematic diagram of the use of the second embodiment of the present creation (1). Fig. 14: Schematic diagram of the use of the second embodiment of the present creation (2) Figure 15: Schematic diagram of the use of the second embodiment of the present creation (3). Figure 16: Schematic diagram of the use of the second embodiment of the present creation (4). Figure 17: Second implementation of the creation Schematic diagram of the use of the example (5). Figure 18: Schematic diagram of the use of the second embodiment of the present creation (six). Figure 19: Schematic diagram of the use of the second embodiment of the present creation (7).
【主要元件符號說明】 〔習式〕 機台：1 1 測試電路板：121 輸送裝置：13 出料載台：13 2 第二移料臂：13 4 外罩：141 電子元件：15 〔本創作〕 機台：2 0 測試裝置：3 0 測試座：3 2 輸送裝置：40 出料載台：42 取放器：4 31 取放器：4 41 取像裝置：5 0 取像器：5 2 電子元件：6 0、61 熱測室：7 0 升溫器：7 2 測試裝置：12 測試座：12 2 入料載台：131 第一移料臂：13 3 熱測室：14 升溫器：14 2 測試電路板：31 入料載台.41 第一移料臂：4 3 第二移料臂：4 4 機架：5 1 光源：5 3 外罩：7 1 M414656 取像裝置：8 Ο 取像器：8 2 入風管：8 4 冷源供應器：8 6 機架=8 1 承置箱=8 3 出風管：8 5 光源：8 7[Main component symbol description] [Law] Machine: 1 1 Test circuit board: 121 Conveying device: 13 Discharge station: 13 2 Second transfer arm: 13 4 Cover: 141 Electronic components: 15 [This creation] Machine: 2 0 Test set: 3 0 Test stand: 3 2 Conveying device: 40 Discharge station: 42 Pick and place: 4 31 Pick and place: 4 41 Image taking device: 5 0 Image finder: 5 2 Electronics Components: 6 0, 61 Thermal chamber: 7 0 Warmer: 7 2 Test set: 12 Test stand: 12 2 Feeding station: 131 First transfer arm: 13 3 Thermal chamber: 14 Warmer: 14 2 Test board: 31 Feeding station. 41 First moving arm: 4 3 Second moving arm: 4 4 Rack: 5 1 Light source: 5 3 Cover: 7 1 M414656 Image taking device: 8 取 Image finder :8 2 Inlet duct: 8 4 Cold source supply: 8 6 Rack = 8 1 Supporting box = 8 3 Outlet duct: 8 5 Light source: 8 7