M413109 五、新型說明： 【新型所屬之技術領域】 一種環路熱管結構改良，尤指可大幅降低蒸發器之高度，藉 以克服使用空間受限，同時有效防止熱漏問題的環路熱管結構改 【先前技術】 1 隨著半導體科技的進步，積體電路（1C)已被大量地使用於個 人電腦、筆記型電腦及網路伺服器等電子裝置的晶片中。然而， 由於積體電路的處理速度和功能顯著提高，使得積體電路對應產 生的廢熱亦顯著增加，若不能有效地將此廢熱排除，則容易造成 電子裝置失效◊因此，各種散熱方式乃被提出，以使可迅速地將 積體電路產生的廢熱排除’避免發生電子裝置失效之情事。 就傳統環路熱管（Loop Heat Pipe，LHP)設計有貯存器或補 * 充室（reservoirs/compensation chamber)以儲存適量工作流體 (fluid)，使蒸發器(evaporator)能得到適當流體補充能容工作流 體因為密度變化而引起的體積變化，並進一步濾過氣體(gas)或氣 泡(bubble)，使其不致受其干擾破壞。 儘管環路熱管（Loop Heat Pipe，LHP)具有眾多優點，但由 於傳統環路熱管採用圓柱型結構蒸發器，使環路熱管的蒸發器需 要較大的空間，同時由於其圓柱外表面為圓弧面，故無法直接與 熱源接觸。有鑑於此係開發另一平板式環路熱管，該補充室 (compensation chamber)結構設於蒸發器之毛細結構之上方，但 該環路熱管(Loop Heat Pipe，LHP)之結構容易出現嚴重的熱漏問 3 M413109 題，從而令啟動變得較困難，將會產生較高的總熱阻。 另外，傳統平板式環路熱管殼體材料-般係與該底板為相同 材質，而蒸發器底板追求高導熱性，再者，該平板式環路熱管結 構的特殊性，故當蒸發器底板受熱時，其透過除底板外的其他= 面的熱傳導加熱補充室(reservoirs/c〇mpensati〇n chamber)内部 的工作流㈣題非常嚴重，有時該部分熱甚至可以和紐器内部 透過芯（Wide)結構所產生之熱漏現象相#，當上述兩種情況综 合作用T時平板式魏鮮賴雜變雜差，完全發揮不出平 板式環路熱管之優點。 再者’現行電子設備設計越來越輕薄短小，故内部空間相對 於變小許多’故產生空間上受限，散絲置整體大小過大 過厚則成為首要改善之問題。 又 【新型内容】 本創作之主要目的在提供一種可防止熱漏現象影響環路熱管 之政熱效能的環路熱管結構改良。 本創作之次要目的在提供一種可降低環路熱管整體高度藉以 適應較窄使用空間的環路熱管結構改良。 為達上述目的本創作係提供一種環路熱管結構改良，係包 含：一本體、一第一管體； 所述本體具有一第一腔室及一第一毛細層及〆底部及至少一 屢槽第4*細層设於前述第一腔室内並界定一第一主腔室及一 2-^腔室’所述第—毛細層填充有工作流體，所述溝槽係選擇 ;1述第毛細層及該底部其中任一；該第一管體具有一第一 M413109 端具有一第二腔室並穿設前 該第一出口端穿設於前述本 入口端及一第一出口端，該第一入口 述本體一側並與該第一毛細層連通， 體另一側，並連通前述第一副腔室。 透過將第二腔贿於該本體棒不财纽防止來自第 -毛細層的熱漏將第二腔室内的工作流體加熱至很高之溫度產生 過尚溫之汽液_平衡，且在第二腔_產生過高之餘和蒸汽 壓’阻止該蒸汽動管_的液體回流至第二腔室内，更可大幅 降低該本體之@度’進而有效適餘何空間受限之場合。 【實施方式】 本創作之上述目的及其結構與魏上的雜，據所附圖M413109 V. New description: [New technical field] A loop heat pipe structure improvement, especially the height of the evaporator can be greatly reduced, so as to overcome the limitation of the use space, and effectively prevent the heat leakage of the loop heat pipe structure [ Prior Art] 1 With the advancement of semiconductor technology, integrated circuits (1C) have been widely used in wafers of electronic devices such as personal computers, notebook computers, and network servers. However, due to the significant increase in the processing speed and function of the integrated circuit, the waste heat generated by the integrated circuit is also significantly increased. If the waste heat cannot be effectively removed, the electronic device is likely to be ineffective. Therefore, various heat dissipation methods are proposed. So that the waste heat generated by the integrated circuit can be quickly eliminated to avoid the occurrence of electronic device failure. A conventional loop heat pipe (LHP) is designed with a reservoir or a reservoir chamber to store an appropriate amount of working fluid, so that the evaporator can be properly fluid-filled. The volume change of the fluid due to the change in density, and further filtering the gas or bubble so that it is not damaged by its interference. Although the Loop Heat Pipe (LHP) has many advantages, since the conventional loop heat pipe uses a cylindrical structure evaporator, the evaporator of the loop heat pipe requires a large space, and at the same time, the outer surface of the cylinder is an arc. It is impossible to directly contact the heat source. In view of the development of another flat-plate loop heat pipe, the compensation chamber structure is disposed above the capillary structure of the evaporator, but the structure of the loop heat pipe (LHP) is prone to severe heat. Leaking 3 M413109 questions makes starting more difficult and will result in higher total thermal resistance. In addition, the conventional flat-type loop heat pipe shell material is generally made of the same material as the bottom plate, and the evaporator bottom plate pursues high thermal conductivity, and further, the flat-type loop heat pipe structure is special, so when the evaporator bottom plate is heated At the time, the work flow inside the reservoirs/c〇mpensati〇n chamber (4) through the heat conduction of the other surface except the bottom plate is very serious. Sometimes the heat can even pass through the core inside the new device. The heat leakage phenomenon phase # produced by the structure, when the above two cases are combined with T, the flat type Wei Xianlai heterogeneous miscellaneous, completely unable to exert the advantages of the flat loop heat pipe. Furthermore, the current electronic device design is becoming lighter and thinner, so the internal space is much smaller than that. Therefore, it is limited in space. The overall size of the loose filament is too large and too thick, which is the primary improvement problem. [New content] The main purpose of this creation is to provide a loop heat pipe structure that can prevent the heat leakage from affecting the thermal efficiency of the loop heat pipe. The secondary objective of this creation is to provide an improved loop heat pipe structure that reduces the overall height of the loop heat pipe to accommodate narrower usage spaces. In order to achieve the above object, the present invention provides a loop heat pipe structure improvement, comprising: a body and a first pipe body; the body has a first chamber and a first capillary layer and a bottom portion and at least one repeating groove a fourth thin layer is disposed in the first chamber and defines a first main chamber and a 2-^ chamber. The first capillary layer is filled with a working fluid, and the groove is selected; Any one of the layer and the bottom portion; the first tube body has a first M413109 end having a second chamber and the first outlet end is disposed at the front inlet end and a first outlet end before the threading An inlet side of the body and communicates with the first capillary layer, the other side of the body, and communicates with the first sub-chamber. Preventing the heat from the first capillary layer from heating the working fluid in the second chamber to a very high temperature by causing the second chamber to bribe the body rod to prevent the heat from leaking from the first capillary layer to a very high temperature. The cavity_produces excessively high and the vapor pressure 'stops the liquid of the steam moving tube_ from flowing back into the second chamber, and the space of the body can be greatly reduced, so that the space is limited. [Embodiment] The above purpose of the creation and its structure are different from those of Wei Shang, according to the drawings.
管結構改良之第一實施例立體分解及組合與A_A及BB及c_c剖 式之較佳實施例予以說明。 面圖’如圖所示，所述環路熱管結構改良，係包含：一本體i、一 第一管體2; 所述本體1具有一第一腔室11及一第一毛細層12及—底部 13及至少一溝槽14;其中第一毛細層12設於前述第一腔室u内， 並界定一第一主腔室111及一第一副腔室112,所述第一毛細層 12填充有工作流體3 ’所述溝槽14係可選擇設於前述第一毛細層 12 (如第3a圖所示）及該底部13 (如第3b圖所示）其中任一， 所述溝槽14間隔排列設置於該底部13 (如第3c圖所示）。 所述第一管體2具有一第一入口端21及一第一出口端22，今 5 M413109 第一入口端21具有一第二腔室211並穿設前述本體1 一側，並與 該第一毛細層12連通，該第一出口端22穿設於前述本體1另一 側，並連通前述第一副腔室112 (如第4a圖所示），所述第二腔室 211亦可設有一第二毛細層2111 (如第4b圖所示）。 所述第一毛細層12係可選擇為燒結粉末體及網格體及碳纖維 及石墨其中任一，本實施例係以燒結粉末體作為說明但並不引以 為限。 所述本體1更具有一工作管體15,該工作管體15 一端連通該 第一腔室11。 請參閱第5a、5b、6圖，係為本創作環路熱管結構改良之第 二實施例之立體分解及組合圖，如圖所示，本實施例部分結構係 與前述第-實施例_，故在此將不再贅述，惟本實施例與前述 第—實施例不同之處係為所述本體丨更具有一蓋體la及一底板 比，所述蓋體la與該底板lb對應蓋合，前述第一毛細層12係設 於前述底板ib上，並共同界定前述第一主腔室U1及該第一副腔 至112，並所述溝槽14係選擇設於底板lb(如第5a圖所示）及第 一毛細層12(如第5b圖所示）其中任一。 請參閱第7圖，係為本創作環路熱管結構改良之第三實施例 之立體組合圖’如騎本實施解分結構係與前述第一實施 例相同，故在此將*再贅述，惟本實施例與前料—實施例不同 之處係為所述第一管體2串套複數散熱鰭片4。 請參閱第8、9a、9b圖’係為本創作環路熱管結構改良之第 M413109 •四實施例之組合圖及D-D剖視圖，如圖所示，本實施例部分結構 係與前述第-實施例相同，_此將不再贅述，惟本實施例:前 述第-實施例不同之處係為本實施例更具有—第二管體5具有一 第二入口端51及-第二出卩端52 ’該第二人口端51具有二第三 腔室5H，並穿設前述本體i -侧與該第一毛細層12連通，該第 二出口端52係穿設於該本體丨另―侧’並連通前述第一副腔室 ·♦ 112，所述第三腔室511係亦可設有一第三毛細層512 (如^沘 圖所示）。 請參閱第10圖，係為本創作環路熱管結構改良之第五實施例 之立體分解圖，如圖所示，本實施例部分結構係與前述第二實施 例相同，故在此將不再贅述，惟本實施例與前述第二實施例不同 之處係為本實施例更具有-第四毛細層16，所述第四毛細層16 設於前述第一毛細層12 —侧。 ·.請參閱第U圖，係為本創作環路熱管結構改良之第六實施例 之立體組合圖，如圖所示，本實施例部分結構係與前述第四實施 例相同’故在此將不再贅述’惟本實施例與前述第—實施例不同 之處係為本實關所述第—倾2及第二錄5麟-冷凝裝置 6 ° 請參閱第12圖，本創作觀絲結觀良之第七實施例 贿述第四實施 例相同，故在麟不再贅述，惟本實施顺前述第—實施例不同 之處係為本實施例所述第一、二普辦<)c 一镫2、5接設一水冷裝置7。 7 M4l3i〇9 綜前述各實酬之卿第二、三毛_ 2⑴、512之滲透率 了以大於等於該第—毛細層12，該第―、二人口端、η呈扁平 狀。 請參閱第13圖，係為本創作環路熱管結構改良之第八實施例 之立體組合圖，如圖所示，本實施卿分結構係與前述第一實施 例相同’故在此將不再贅述，惟本實施例與前述第__實施例不同 之處係為本實施例之所述第一副腔室112具有一第一端1121及一 第二端1122，所述第一端1121與該第二端1122相連通，並該第 一副腔室112由該第二端1122向該第-端1121逐漸漸縮。 所述第二毛細層2Π1之有效毛細半徑大於或等於該第一毛細 層丨2，所述第二毛細層2111導熱係數低於該第一毛細層。 清覆參閱第1至13圖’如圖所示，當所述環路熱管結構改良 使用時’前述第一毛細層12之毛細半徑（有效毛細半徑）係較小 於或等於第二毛細層2111之毛細半徑（有效毛細半徑），且選用 導熱係數較低於該第-毛細層12的第二毛細層2111可增加該本 體1與第二腔室211之間的熱阻，進而降低該本體丨工作時從本 體1反向滲透到第二腔室211的熱量；又由於第二腔室Μ〗設於 本體1外部有效防止第-腔室u内之第—毛細層12之熱量進入 第二腔室211内的熱漏情形發生，因而將第二腔室211内的工作 二體3加熱至面溫，令第二腔室211内形成過高溫度的汽液兩相 平衡，因而產生過高的飽和蒸氣壓，阻止第一管體2内的工作流 體3回到第二腔室211之中。 M413109 綜上所述之結構設計可以產生較佳的熱鎖（heat lock)效果。 此一結構不僅可滿足提供該環路熱管結構改良整體所需的毛 細力，又可使環路熱管結構改良可於標準之下或反重力之條件下 順利運作，並產生較小的局部熱阻。 本創作主要優點如下述： 1. 本體1内部只有第一毛細層12 (芯（Wick))和溝槽π，而環 路熱管（LoopHeat Pipe ’ LHP)的第二腔室211及第三腔室511 卻被設置在環路熱管（Loop ^1?丨口6，哪)本體1的外侧部， 即垂直於環路熱管（Loop Heat Pipe，LHP)的溝槽14方向的兩 個外壁面之外。 2. 所述第二腔室211及第三腔室511可以設置於環路熱管A preferred embodiment of the three-dimensional decomposition and combination of the tube structure improvement and the A_A and BB and c_c profiles will be described. As shown in the figure, the loop heat pipe structure is improved, comprising: a body i, a first pipe body 2; the body 1 has a first chamber 11 and a first capillary layer 12 and a bottom portion 13 and at least one groove 14; wherein the first capillary layer 12 is disposed in the first chamber u and defines a first main chamber 111 and a first sub-chamber 112, the first capillary layer 12 The trench 14 filled with the working fluid 3' may be optionally disposed on any of the first capillary layer 12 (as shown in FIG. 3a) and the bottom portion 13 (shown in FIG. 3b). 14 spaced apart is arranged at the bottom 13 (as shown in Figure 3c). The first tube body 2 has a first inlet end 21 and a first outlet end 22, and the first inlet end 21 of the M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M A capillary layer 12 is connected. The first outlet end 22 is disposed on the other side of the body 1 and communicates with the first sub-chamber 112 (as shown in FIG. 4a). The second chamber 211 may also be provided. There is a second capillary layer 2111 (as shown in Figure 4b). The first capillary layer 12 may be selected from the group consisting of a sintered powder body and a mesh body, and carbon fibers and graphite. The present embodiment is described as a sintered powder body, but is not limited thereto. The body 1 further has a working tube body 15, one end of which is connected to the first chamber 11. Please refer to the figures 5a, 5b, and 6 for the perspective decomposition and combination diagram of the second embodiment of the heat pipe structure improvement of the creation loop. As shown in the figure, the partial structure of the embodiment is the same as the foregoing first embodiment. Therefore, the present embodiment is different from the foregoing first embodiment in that the body 丨 has a cover body la and a bottom plate ratio, and the cover body 1a is correspondingly covered with the bottom plate lb. The first capillary layer 12 is disposed on the bottom plate ib, and collectively defines the first main chamber U1 and the first sub-cavity 112, and the groove 14 is selectively disposed on the bottom plate lb (eg, 5a) Shown in the figure) and any of the first capillary layer 12 (as shown in Figure 5b). Please refer to FIG. 7 , which is a three-dimensional combination diagram of the third embodiment of the improvement of the heat pipe structure of the creation loop. The solution structure of the rider is the same as that of the first embodiment described above, and therefore, the description will be repeated here. The difference between this embodiment and the pre-material-embodiment is that the first tube body 2 is sleeved with a plurality of heat dissipation fins 4. Please refer to Figures 8, 9a, and 9b for the improvement of the heat pipe structure of the creation loop. M413109. The combination diagram of the fourth embodiment and the DD cross-sectional view. As shown in the figure, the partial structure of the embodiment is the same as the foregoing embodiment. The same, this will not be described again, but the embodiment: the foregoing first embodiment differs from the present embodiment in that the second pipe body 5 has a second inlet end 51 and a second outlet end 52. The second population end 51 has two third chambers 5H, and the body i-side is connected to the first capillary layer 12, and the second outlet end 52 is disposed on the other side of the body. The first sub-chamber ♦ 112 is connected to the first sub-chamber 511, and the third chamber 511 is also provided with a third capillary layer 512 (as shown in FIG. Please refer to FIG. 10 , which is a perspective exploded view of the fifth embodiment of the heat pipe structure improvement of the creation loop. As shown in the figure, the partial structure of the embodiment is the same as the foregoing second embodiment, and therefore will not be used here. It is to be noted that the difference between the present embodiment and the foregoing second embodiment is that the fourth capillary layer 16 is provided in the present embodiment, and the fourth capillary layer 16 is disposed on the side of the first capillary layer 12. Please refer to the figure U, which is a three-dimensional combination diagram of the sixth embodiment of the improvement of the heat pipe structure of the creation loop. As shown in the figure, the structure of the embodiment is the same as that of the fourth embodiment described above. I will not repeat them here. However, the difference between this embodiment and the above-mentioned first embodiment is that the first-pour 2 and the second recording 5 lining-condensing device 6 °, please refer to Fig. 12, the creation of the silk knot The seventh embodiment of Guanliang is the same as the fourth embodiment, so it will not be described in detail. However, the difference between the present embodiment and the first embodiment is the first and second general offices of the present embodiment. A water-cooling device 7 is connected to one, two, and five. 7 M4l3i〇9 The above-mentioned respective remunerations of the second and third hairs _ 2 (1), 512 have a permeability equal to or greater than the first-thin layer 12, and the first and second population ends and η are flat. Please refer to FIG. 13 , which is a perspective assembled view of the eighth embodiment of the heat pipe structure improvement of the creation loop. As shown in the figure, the embodiment of the present embodiment is the same as the first embodiment described above, and thus will not be used here. The first sub-chamber 112 of the present embodiment has a first end 1121 and a second end 1122. The first end 1121 is different from the foregoing embodiment. The second end 1122 is in communication, and the first sub-chamber 112 is gradually tapered from the second end 1122 toward the first end 1121. The effective capillary radius of the second capillary layer 2Π1 is greater than or equal to the first capillary layer 丨2, and the second capillary layer 2111 has a lower thermal conductivity than the first capillary layer. Referring to Figures 1 to 13 as shown in the figure, when the loop heat pipe structure is improved, the capillary radius (effective capillary radius) of the first capillary layer 12 is smaller than or equal to the second capillary layer 2111. The capillary radius (effective capillary radius) and the second capillary layer 2111 having a lower thermal conductivity than the first capillary layer 12 can increase the thermal resistance between the body 1 and the second chamber 211, thereby reducing the body 丨The heat from the reverse infiltration of the body 1 to the second chamber 211 during operation; and the second chamber is disposed outside the body 1 to effectively prevent the heat of the first capillary layer 12 in the first chamber u from entering the second chamber The heat leakage in the chamber 211 occurs, thereby heating the working body 3 in the second chamber 211 to the surface temperature, so that the vapor-liquid two phases forming the excessive temperature in the second chamber 211 are balanced, thereby generating excessively high The saturated vapor pressure prevents the working fluid 3 in the first pipe body 2 from returning to the second chamber 211. M413109 The structural design described above can produce a better heat lock effect. The structure not only satisfies the capillary force required to improve the overall heat pipe structure of the loop, but also improves the loop heat pipe structure to operate smoothly under standard conditions or under anti-gravity conditions, and generates a small local thermal resistance. . The main advantages of this creation are as follows: 1. The inside of the body 1 has only the first capillary layer 12 (Wick) and the groove π, and the second chamber 211 and the third chamber of the Loop Heat Pipe 'LHP 511 is placed on the outer side of the body 1 of the loop heat pipe (Loop ^1?丨6, which is perpendicular to the two outer walls of the direction of the groove 14 of the Loop Heat Pipe (LHP). . 2. The second chamber 211 and the third chamber 511 may be disposed on the loop heat pipe
Heat Pipe，LHP)之本體1非蒸汽出口的外部即可，即與第一= 腔室112連接之本體1外部的三個侧面皆可。 3. 第-管體2及第二管體5之第-入口端21與第二入口端w之 形狀可以是大圓管、壓扁管、方形腔體以及其他戴面和形狀^ 間0 ^ 4. 第-人口端21與第二人口端51内部_滿足第―毛細 (Wick))結構的設計要求。 5. 第二腔室211及第三腔室511大小設計廡六 化而引起的工質體積變化所引起的波動〜由於溫度變 M413109 6. 由於本創作是將第二腔室211及第三腔室511放置在本體1的 外部’而與本體1之外侧壁進行較小橫截面積的接觸，所以通 過本體1而洩漏到第二腔室211及第三腔室511内部的熱量將 會較小，即從當環路熱管（Loop Heat Pipe，LHP)啟動時，本 體1與第二腔室211及第三腔室511内部的飽和蒸汽壓力差能 夠滿足環路熱管（Loop Heat Pipe，LHP)的啟動需求。 7. 可以有效降低環路熱管（Loop Heat Pipe，LHP)本體1外形尺 寸’即或者是減小本體1之高度，或者是減小平行於熱源表面 方向的本體1尺寸。 8·只要將第二腔室211及第三腔室511的體積大小設計得宜，本 創作可以將該環路熱管（Loop Heat Pipe，LHP)的總熱阻控制 在較小的範圍。 9.又因為將第二腔室211設於該本體1外部，故可大幅降低該本 體之高度，對於薄型化具有大幅度的改善，進而令整體使用之 彈性隨之增加。 【圖式簡單說明】 第1圖係為本創作環路熱管結構改良之第一實施例立體分解圖； 第2圖係為本創作環路熱管結構改良之第一實施例立體組合圖； 第3a圖係為本創作環路熱管結構改良之第一實施例A_A剖面圖； 第3b圖係為本創作環路鮮結構改良之第—實施例另一 a_a剖面 回 « 圓， 第3c圖係為本創作環路熱管結構改良之第—實施例κ剖面圖； M413109 * 第4a圖係為本創作環路熱管結構改良之第一實施例B-B剖面圖； 第4b圖係為本創作環路熱管結構改良之第一實施例另一 B_B剖面 rgi · 圖， 第5a圖係為本創作環路熱管結構改良之第二實施例之立體分解 圓 · 國， 第5b圖係為本創作環路熱管結構改良之第二實施例之另一立體分 '♦解圖； ^ 第6圖係為本創作環路熱管結構改良之第二實施例之立體組合圖； 第7圖係為本創作環路熱管結構改良之第三實施例之立體組合圖； 圖係為本創作環路熱管結構改良之第四實施例之立體組合圖； 第如圖係為本創作環路熱管結構改良之第四貪施例之D_D剖視 圖； ® 9b ®係為本創作環路熱管結構改良之第四實施例之剖視 ，圖； 。 第10圖係為本創作環賴f結構改良之第五實施狀立體分解 圖， 3.11圖係為本創作環路熱管結構改良之第六實施例之立體組合 3 12圖係為本創作環路熱管結構改良之第七實施例之立體組人 圖； 、σ =13圖係為本_環路鮮結構改良之第八實_之組合剖視 M413109 【主要元件符號說明】 本體1 蓋體la 底板lb 第一腔室11 第一主腔室111 第一副腔室112 第一毛細層12 底部13 溝槽14 工作管體15 第四毛細層16 第一管體2 第一入口端21 第二腔室211 第二毛細層2111 第一出口端22 工作流體3 散熱鰭片4 第二管體5 第二入口端51 第三腔室511 M413109 第三毛細層512 第二出口端52 冷凝裝置6 水冷裝置7The body of the Heat Pipe (LHP) may be external to the non-steam outlet, that is, the three sides of the body 1 connected to the first = chamber 112 may be. 3. The shape of the first inlet end 21 and the second inlet end w of the first tube body 2 and the second tube body 5 may be a large round tube, a flattened tube, a square cavity body, and other wearing surfaces and shapes ^ 0 4 The first-population end 21 and the second population end 51 internal _ satisfy the design requirements of the first-thick (Wick) structure. 5. The fluctuations caused by the change in the volume of the working medium caused by the size of the second chamber 211 and the third chamber 511 are reduced by the temperature. M413109 6. Since the creation is the second chamber 211 and the third chamber The chamber 511 is placed on the outer portion of the body 1 to make a small cross-sectional area contact with the outer side wall of the body 1, so that heat leaking through the body 1 into the second chamber 211 and the third chamber 511 will be less. That is, when the loop heat pipe (LHP) is started, the saturated vapor pressure difference between the body 1 and the second chamber 211 and the third chamber 511 can satisfy the loop heat pipe (LHP). Start the demand. 7. It is possible to effectively reduce the size of the Loop Heat Pipe (LHP) body 1 by either reducing the height of the body 1 or reducing the size of the body 1 parallel to the surface of the heat source. 8. As long as the volume of the second chamber 211 and the third chamber 511 are appropriately designed, the present invention can control the total thermal resistance of the loop heat pipe (LHP) to a small extent. 9. Since the second chamber 211 is provided outside the main body 1, the height of the body can be greatly reduced, and the thickness can be greatly improved, and the elasticity of the entire use can be increased. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is an exploded perspective view of a first embodiment of a heat pipe structure improvement of the creation loop; FIG. 2 is a perspective view of a first embodiment of the heat pipe structure improvement of the creation loop; The figure is the cross-sectional view of the first embodiment A_A of the improvement of the heat pipe structure of the creation loop; the third figure is the first embodiment of the fresh structure improvement of the creation loop - the other a_a section back « circle, the 3c figure is the The first section of the creation loop heat pipe structure improvement is a cross-sectional view of the first embodiment of the creation of the heat pipe structure of the creation loop; the fourth section is the improvement of the heat pipe structure of the creation loop In the first embodiment, another B_B profile rgi · Fig. 5a is a three-dimensional decomposition circle of the second embodiment of the improvement of the heat pipe structure of the creation loop, and the fifth figure is the improvement of the heat pipe structure of the creation loop. Another three-dimensional part of the second embodiment is a schematic diagram; ^ Figure 6 is a three-dimensional combination diagram of the second embodiment of the heat pipe structure improvement of the creation loop; Figure 7 is a modification of the heat pipe structure of the creation loop a three-dimensional combination diagram of the third embodiment; It is a three-dimensional combination diagram of the fourth embodiment of the improvement of the heat pipe structure of the creation loop; the figure is the D_D cross-sectional view of the fourth greedy embodiment of the heat pipe structure improvement of the creation loop; the ® 9b® is the creation loop A cross-sectional view of a fourth embodiment of a heat pipe structure improvement, Fig.; Figure 10 is a three-dimensional exploded view of the fifth embodiment of the improvement of the structure of the creation of the ring. The three-dimensional combination of the third embodiment of the creation of the heat pipe structure of the creation loop is a three-dimensional combination of the creation loop heat pipe. The three-dimensional group diagram of the seventh embodiment of the structural improvement; σ = 13 is the basis of the _ loop fresh structure improvement of the eighth real _ the combination section M413109 [main component symbol description] body 1 cover la bottom plate lb First chamber 11 first main chamber 111 first sub chamber 112 first capillary layer 12 bottom portion 13 groove 14 working tube body 15 fourth capillary layer 16 first tube body 2 first inlet end 21 second chamber 211 second capillary layer 2111 first outlet end 22 working fluid 3 heat sink fin 4 second tube body 5 second inlet end 51 third chamber 511 M413109 third capillary layer 512 second outlet end 52 condensing device 6 water cooling device 7