JP3169587U - Loop heat pipe structure - Google Patents

Abstract

Provided is a loop heat pipe structure that prevents a heat leakage phenomenon from affecting the heat dissipation performance of the loop heat pipe. The loop heat pipe structure includes a pipe, a chamber, a first capillary layer, a second capillary layer, and a plurality of grooves. The pipe communicates with the chamber, and the chamber is a first chamber. A chamber, a second chamber, a working fluid, and a bottom, wherein the first capillary layer and the second capillary layer are placed on the bottom, and the groove selects either the first capillary layer or the bottom. The first capillary layer and the second capillary layer that are installed prevent the generation of vapor pressure that is too high in the chamber and improves the heat dissipation efficiency of the entire loop heat pipe. [Selection] Figure 2

Description

  The present invention relates to a loop heat pipe, and in particular, a plurality of capillary layers having different heat transfer coefficients and permeability are installed in the chamber to avoid excessively high vapor pressure generated in the chamber and The present invention relates to a loop heat pipe structure that improves heat dissipation efficiency.

  With the advance of semiconductor technology, a large number of integrated circuits (ICs) are already used in chips of electronic devices such as personal computers, notebook computers, and network servers. However, the processing speed and function of the integrated circuit are remarkably improved, and the waste heat generated by the integrated circuit is remarkably increased. If this waste heat cannot be effectively eliminated, the electronic device is liable to expire. For this reason, various heat dissipation methods have been proposed, and waste heat generated by the integrated circuit is quickly eliminated to avoid the occurrence of electronic device expiration.

  A conventional loop heat pipe (LHP) design includes a reservoir / compensation chamber in which an appropriate amount of working fluid (fluid) is stored and an evaporator is suitable. A change in volume caused by a change in the density of the working fluid can be allowed by replenishing the fluid, and further, gas and bubbles are filtered so as not to be interfered or destroyed.

  Loop Heat Pipe (LHP) has many advantages, but the conventional loop heat pipe uses a cylindrical evaporator, and requires a relatively large space for the loop heat pipe evaporator At the same time, since the outer surface of the cylinder is a circular arc surface, it cannot be brought into direct contact with the heat source. In view of this, another flat loop heat pipe has been developed, and a single type of capillary structure is adopted as the wick structure, but this single type of capillary structure is used as the wick (Wick). In this structure, the heat of the heating evaporator is made to enter the compensation chamber very easily, so that a serious heat leakage phenomenon occurs. In order to prevent this serious heat leakage, a capillary structure having a low heat conduction coefficient must be adopted in the Wick structure, which causes a very large local thermal resistance in the evaporator, and a high heat conductivity. If a single-layer capillary structure is adopted as the Wick structure, the initial startup of the flat loop heat pipe becomes very difficult, the startup power threshold becomes excessive, and it cannot be started under some special work conditions. There is even a thing.

  In addition, the conventional flat plate loop heat pipe housing material is generally the same material as the bottom plate, and the bottom plate of the evaporator pursues high thermal conductivity. Therefore, when the bottom plate of the evaporator receives heat, the problem that the working fluid inside the compensation chamber is heated by heat conduction through the other wall surface other than the bottom plate is very serious. The heat performance of the flat loop heat pipe becomes very poor under the combined action of the above two situations, and the heat leakage phenomenon is equivalent to the heat leakage phenomenon that occurs through the wick structure inside the evaporator. The advantages of the flat loop heat pipe may not be exhibited at all.

  The main object of the present invention is to provide a loop heat pipe structure that prevents the heat leakage phenomenon from affecting the heat dissipation performance of the loop heat pipe.

  To achieve the above object, a loop heat pipe structure of the present invention includes a pipe, a chamber, a first capillary layer, a second capillary layer, and a plurality of grooves, wherein the pipe has a first end and a second end, and A passage communicating with the first end and the second end, wherein the chamber includes a first chamber chamber and a second chamber chamber, a working fluid and a bottom, and the first chamber chamber includes a first connecting hole; The two-chamber chamber is provided with a second connecting hole, and a column is provided by extending one side of the second chamber chamber. The first connecting hole and the second connecting hole are respectively the first end and the second end of the pipe. Connected to the end, the first capillary layer is placed on the bottom of the chamber, the second capillary layer covers the first capillary layer, and the groove is either the bottom or the first capillary layer. One is selected and provided.

  The first capillary layer provides sufficient capillary force necessary for operation of the loop heat pipe structure, and suppresses pressure loss when the working fluid flows through the first capillary layer. The second capillary layer effectively serves to contain heat in the loop heat pipe structure, and heat leakage from the first capillary layer heats the working fluid in the second chamber chamber to a very high temperature and The effect of preventing the vapor pressure from preventing the liquid in the pipe from circulating in the second chamber chamber by generating a vapor-liquid two-phase equilibrium and generating a saturated vapor pressure that is too high in the second chamber chamber. Prevent it. With the loop heat pipe structure, it is possible to avoid generation of a vapor pressure that is too high in the chamber and to increase the heat dissipation efficiency of the entire loop heat pipe.

It is a three-dimensional exploded view of Example 1 of the loop heat pipe structure of the present invention. It is assembly perspective drawing of Example 1 of the loop heat pipe structure of this invention. It is sectional drawing in the AA line of FIG. 2 of Example 1 of the loop heat pipe structure of this invention. It is sectional drawing in another AA line of FIG. 2 of Example 1 of the loop heat pipe structure of this invention. It is a three-dimensional exploded view of Example 2 of the loop heat pipe structure of the present invention. It is sectional drawing in the BB line of FIG. 4 of Example 2 of the loop heat pipe structure of this invention. It is sectional drawing in another BB line of FIG. 4 of Example 2 of the loop heat pipe structure of this invention. It is a three-dimensional assembly drawing of Example 3 of the loop heat pipe structure of the present invention. It is a three-dimensional assembly drawing of Example 4 of the loop heat pipe structure of the present invention. It is a three-dimensional assembly drawing of Example 5 of the loop heat pipe structure of the present invention.

  The above-mentioned object of the present invention and its structural and functional characteristics will be described based on the best embodiment shown in the drawings.

  1, 2, and 3 show a three-dimensional exploded view, an assembled perspective view, and a cross-sectional view taken along line AA of the first embodiment of the loop heat pipe structure of the present invention. As shown in these drawings, the loop heat pipe structure 1 of the present invention includes a pipe 11, a chamber 12, a first capillary layer 121, a second capillary layer 122, and a plurality of grooves 13.

  The pipe 11 includes a first end 111 and a second end 112, and a passage 113 communicating with the first end 111 and the second end 112.

  The chamber 12 includes a first chamber chamber 123 and a second chamber chamber 124, and a working fluid 2 and a bottom 125. The first chamber chamber 123 has a first connection hole 1231, and the second chamber chamber 124 has a second connection. And a column 1242 is provided by extending one side of the second chamber chamber 124, and the first connecting hole 1231 and the second connecting hole 1241 are the first end 111 of the pipe 11, respectively. It is connected to the second end 112.

  The first capillary layer 121 is installed above the bottom 125.

  The second capillary layer 122 is provided so as to cover the upper side of the first capillary layer 121, and the groove 13 is provided by selecting either the first capillary layer 121 or the bottom portion 125. Although the groove part 13 of the present embodiment is described as being provided on the bottom part 125, the present invention is not limited to this, and the groove part 13 may be installed on one side of the first capillary layer 121 (see FIG. 3a). As shown).

  As the first capillary layer 121 and the second capillary layer 122, any one of a sintered powder body, a mesh body, carbon fiber, and graphite can be selected, and this embodiment will be described as a sintered powder body, but is not limited thereto. Not.

  The permeability of the second capillary layer 122 is greater than that of the first capillary layer 121, and the thermal conductivity coefficient of the second capillary layer 122 is lower than that of the first capillary layer 121.

  The chamber 12 further includes an operating pipe 126. The operating pipe 126 is in communication with each other by selecting either the first chamber chamber 123 or the second chamber chamber 124. Although it is connected, it is not limited to this. When manufacturing the loop heat pipe structure 1, operations such as vacuum pump operation and working fluid 2 injection can be performed on the chamber 12 through the working pipe 126, and finally the working pipe 126 is opened. Seal one end.

  4 and 5 show a three-dimensional exploded view and a sectional view taken along line BB of Example 2 of the loop heat pipe structure of the present invention. As shown in these drawings, since the partial structure of the present embodiment is the same as that of the first embodiment, the description thereof is omitted here, but the differences between the present embodiment and the first embodiment are different from those of the first embodiment. The chamber 12 further includes a cover body 12a and a bottom plate 12b, and the cover body 12a and the bottom plate 12b are correspondingly closed to form the first chamber chamber 123 and the second chamber chamber 124. The first capillary layer 121 and the second capillary layer 122 are installed on the bottom plate 12b, and the groove 13 can be provided by selecting either the first capillary layer 121 or the bottom plate 12b. The example will be described on the assumption that the groove 13 is installed on the bottom plate 12b, but the present invention is not limited to this, and the groove 13 may be installed on one side of the first capillary layer 121 (as shown in FIG. 5). ).

  The cover body 12a and the bottom plate 12b can be either a different material or the same material. In this embodiment, the cover body 12a and the bottom plate 12b will be described as different materials, but the present invention is not limited to this. The cover body 12a can be made of any material such as stainless steel, carbon steel, and a polymer material. In this embodiment, it is assumed that a low heat conductive material such as a stainless steel material compatible with the working fluid 2 is selected. However, the present invention is not limited to this, and the bottom plate 12b will be described assuming that a metal material having high thermal conductivity such as a copper material is selected.

  FIG. 6 shows a three-dimensional assembly diagram of Example 3 of the loop heat pipe structure of the present invention. As shown in this figure, the partial structure of the present embodiment is the same as that of the first embodiment, and therefore the description thereof is omitted here. The difference between this embodiment and the first embodiment is that the pipe 11 of this embodiment passes through the plurality of heat radiation fins 3.

  FIG. 7 shows a three-dimensional assembly diagram of Embodiment 4 of the loop heat pipe structure of the present invention. As shown in this figure, the partial structure of the present embodiment is the same as that of the first embodiment, and therefore the description thereof is omitted here. The difference between the present embodiment and the first embodiment is that the condensing device 4 is connected to the pipe 11 of the present embodiment.

  FIG. 8 shows a three-dimensional assembly diagram of Embodiment 5 of the loop heat pipe structure of the present invention. As shown in this figure, the partial structure of the present embodiment is the same as that of the first embodiment, and therefore the description thereof is omitted here. The difference between the present embodiment and the first embodiment is that the water cooling device 5 is connected to the pipe 11 of the present embodiment.

  Reference is again made to FIGS. As shown in these drawings, when the loop heat pipe structure 1 is used, the capillary radius (effective capillary radius) of the first capillary layer 121 is smaller than the capillary radius (effective capillary radius) of the second capillary layer 122. And, by selecting and using the second capillary layer 122 having a thermal conductivity coefficient lower than that of the first capillary layer 121, the thermal resistance of the first chamber chamber 123 and the second chamber chamber 124 in the chamber 12 is increased, The pressure loss when the working fluid 2 passes through the second capillary layer 122 is further reduced, and a heat lock effect is formed in the second capillary layer 122 so that the heat of the first capillary layer 121 is in the second chamber chamber. A situation of heat leakage entering the inside 124 occurs, whereby the working fluid 2 in the second chamber chamber 124 is heated to a high temperature, and a high-temperature gas-liquid two-phase equilibrium is formed in the second chamber chamber 124. ,too expensive Saturated resulting vapor pressure, pipe working fluid 2 in the liquid state in 11 to prevent it so that it can not be prevented effectively back into the second chamber compartment 124. This structure not only provides the capillary force required by the entire loop heat pipe structure 1 but also allows the loop heat pipe structure 1 to operate smoothly under standard or weightless conditions and to provide local thermal resistance. Can be made smaller.

1 loop heat pipe structure 11 pipe 111 first end 112 second end 113 passage 12 chamber 12a cover body 12b bottom plate 121 first capillary layer 122 second capillary layer 123 first chamber chamber 1231 first connecting hole 124 second chamber chamber 1241 2nd connection hole 1242 Support | pillar 125 Bottom 126 Working pipe 13 Groove 2 Working fluid 3 Radiation fin 4 Condensing device 5 Water cooling device

Claims (12)

A loop heat pipe structure,
A pipe having a first end and a second end, and a passage communicating with the first end and the second end;
A first chamber chamber, a second chamber chamber, a working fluid, and a bottom; the first chamber chamber includes a first connecting hole; the second chamber chamber includes a second connecting hole; and A chamber in which a column is provided extending on one side, and the first connecting hole and the second connecting hole are connected to the first end and the second end of the pipe, respectively.
A first capillary layer installed over the bottom, and
A second capillary layer installed over the first capillary layer;
A plurality of the grooves provided in any of the first capillary layer and the bottom of the chamber;
A loop heat pipe structure characterized by comprising:   The chamber further includes a cover body and a bottom plate, and the cover body and the bottom plate are closed in correspondence with each other to form the first chamber chamber and the second chamber chamber, and the first capillary layer and the second capillary layer are formed. 2. The loop heat pipe structure according to claim 1, wherein the loop heat pipe structure is installed on the bottom plate, and the groove is installed on either the first capillary layer or the bottom plate of the chamber.   2. The loop heat pipe structure according to claim 1, wherein the chamber further includes an operation pipe, and the operation pipe communicates with one of the first chamber chamber and the second chamber chamber.   The loop heat pipe structure according to claim 1, wherein the first capillary layer and the second capillary layer are any of a sintered powder body, a mesh body, carbon fiber, and graphite.   The loop heat pipe structure according to claim 1, wherein an effective capillary radius of the second capillary layer is larger than that of the first capillary layer.   The loop heat pipe structure according to claim 1, wherein a thermal conductivity coefficient of the second capillary layer is lower than that of the first capillary layer.   The loop heat pipe structure according to claim 1, wherein the pipe is penetrated by a plurality of radiating fins.   The loop heat pipe structure according to claim 2, wherein the cover body and the bottom plate are made of different materials or the same material.   The loop heat pipe structure according to claim 2, wherein a material of the cover body is any one of stainless steel, carbon steel, and a polymer material.   The loop heat pipe structure according to claim 1, wherein a permeability of the second capillary layer is larger than that of the first capillary layer.   The loop heat pipe structure according to claim 1, wherein a condenser is connected to the pipe.   The loop heat pipe structure according to claim 1, wherein a water cooling device is connected to the pipe.

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