M412470 五、新型說明： 【新型所屬之技術領域】 [0001] 本創作係與模具結構有關，特別有關於一種用於LED封膠 的模具。 【先前技術】 [0002] 射出成型（Injection Molding)是現今工業大量使用的 一種生產方式，其實施方式將塑膠粒送入射出成型機， 經料筒加熱融化後，再將熔融狀的融膠（Melt)射入模具 以形成產品外型（覆形，Shaping)，待經冷卻固化成形 完畢後，即可取出。 [0003] 上述射出成型的加工方式亦廣泛地應用在發光二極體 (LED)的封裝上，傳統LED的封膠是成型在一套相互配合 的上模具與下模具中，其中，該下模具係設有多數個凹 穴，以供容置各LED半成品，接著再將封裝膠灌入該套模 具中，以流入各凹穴，藉以封罩該些LED半成品，繼而完 成該等LED的製程。 [0004] 然而，由於時間及成本等因素的考量，習知的LED的封膠 模具灌膠時通常是利用整片式進膠，LED封膠係自模具前 方的入膠口處灌入而往後竄流，並沿著整片模具依序流 入相互連通的各凹穴，經常導致後方凹穴中的LED封膠量 不足，並造成部分LED封膠中會有氣泡產生。 [0005] 有鑑於此，本創作人為改善並解決上述之缺失，乃特潛 心研究並配合學理之運用，終於提出一種設計合理且有 效改善上述缺失之本創作。 表單編號A0101 第3頁/共16頁 [0006]M412470 【新型内容】 [0007] [0008] [0009] [0010] ^ 目的，在於提供一種具有複數獨立流道之LED 封裝換具’以減少發生模穴中LED封料足的情況，避免 在封膠的過程中I生氣泡，進而提高產品良率。 二上述之目的’本創作係為一種具有複數獨立流 、之LED封裝模具，用以封裝多數個LED半成品，LED封 裝模具^括—下模、—上模及複數阻隔結構，下模成型 有:供谷置各LED半成品的多數個模穴，上模對應壓合在 下板上ί1 且隔結構成型在下模及上模相互壓合的其中一 表面上’阻隔結獅對應位在模穴之間並高於其所成 1 ’表面其中，下模及上模相互壓合後，阻隔結構將 原本相互連通的模穴分隔成複數個獨立流道。 本創作之^_目的，在於提供—種具有複數獨立流道之 LED封裝模具，以減少LED封膠溢出並減少LE])封膠的使 用量，具有降低成本及避免資源浪費的優點。 本創作之再一目的，在於提供一種具有複數獨立流道之 LED封裝模具，其阻隔結構可藉由修改下模模具而形成， 故可減少設備開發費用。 相較於習知技術，本創作係將阻隔結構設置在下模及上 模相互壓合的其中一表面上，經由阻隔結構的設置原 本相互連通的模六可分隔成複數個獨立流道，以令Led封 膠循著該些阻隔結構而流入各獨立流道中，並填滿各桓 穴’減少LED封膝溢出或不足的機率，且因獨立流道的升/ 成可利於使用者準確地控制成型壓力及時間等參數，八 表單編號A0101 第4頁/共16頁 [0011] LED封膠穩定地流人每-獨立流道’避免在封膠的過程中 產生氣泡’達到提升產品良率的功效。 【實施方式】 有關本創作之詳細說明及技術内容，配合圖式說明如下 ，然而所附圖式僅提供參考與說明用，並非用來對本創 作加以限制者。 [0012] 請參照第一圖至第三圖，係分別為本創作具有複數獨立 流道之LED封裝模具之下模的平面示意圖、下模的剖視圖 、及上下模的組合職圖；本創作具有複數獨立流道之 LED封裝模具1係用以封裝多數個LED半成品，該led封裝 模具包括一下模10 ' —上模2〇及複數阻隔結構3〇。 [0013] 該下模10成型有可供容置各LED半成品的多數個模穴n， 亦即’各LED半成品係放置在各模穴11+，另外，該下模 10更可設有複數頂出結構（圖未示），以利於取出該些射 出成型品。該上模2 0則是對應壓合在該下模丨〇上當該 下模10及該上模m目互蓋合後，即可在該下額及該上 模20之間灌注封膠。於本實施例中，該些模穴^係呈矩 陣排列’實際實施時不以此為限。 [0014] 該些阻隔結構30係成型在該下模1〇及該上模2〇相互壓合 的其中一表面上，該些阻隔結構3〇可與該下模1〇及該上 模20分隔設置，也可利用一體成型的方式而成型在該下 模10及該上模2〇相互壓合的其中—表面上。該些阻隔結 構30係對應位在該些模穴n之間，並高於其所成型的表 面，當該下模10及該上模20相互壓合後，言亥等阻隔結構 表單編號A0101 第5頁/共16頁 M412470 [0015] [0016] [0017] [0018] 30係將原本相互連通的該等模穴11分隔成複數個獨立流 道 100。 於本實施例中，該些阻隔結構30係為成型在各模穴^之 間的一凸肋，且該些阻隔結構3〇以一體成型的方式而成 型在該下模10的上表面。從第一圖中可看出，該些獨立 流道100係呈平行排列，且每一獨立流道1〇〇包含有呈直 線排列的複數個模穴11，據此，LED封膠即可沿著擔著該 些阻隔結構30而流入各獨立流道1〇〇中。 請續參照第四圖至第六圖，係為本創作具有複數獨立流 道之LED封裝模具的LED封膠流向示意圖、封裝模具的使 用剖視圖、及LED成品圖；請參第四圖，該封裝模具1係 具有複數膠道口 12，該些膠道口 12係分別對應有一獨立 流道100，當LED封膠2進入該等膠道口 12後會循著該些 阻隔結構30而流入各獨立流道1〇〇中，並依序填滿各獨立 流道100中的模穴11，本實施例中，由於每一獨立流道 100令所包含的模穴11數量相同，故可精確地控制成型時 所需的LED封膠2量，減少LED封膠2溢出的機率。 再者，因各獨立流道100的路徑相同，故LED封膠2自前方 膠道口 12流至各獨立流道1 〇〇後方的時間大約相同，藉此 ，使用者可準確地控制成型壓力及時間等參數，以令led 封膠2穩定地流入每一獨立流道1〇〇，並均勻地填滿每一 個模穴11，藉此減少發生模穴11中LED封膠2不足的情 況’並避免在封膠的過程中產生氣泡，影響產品良率。 請參第六圊’值得注意的是，當封膠過程完成後，該些 表單編號A0101 第6頁/共16頁 LED成品因該些阻隔結構30的設置，並依獨立流道100的 數量而成型有數條LED成品，待進行後續的切割加工，即 完成各LED成品的封裝製作。 [0019] 以上所述僅為本創作之較佳實施例，非用以限定本創作 之專利範圍，其他運用本創作之專利精神之等效變化， 均應倶屬本創作之專利範圍。 【圖式簡單說明】 [0020] 第一圖係為本創作具有複數獨立流道之LED封裝模具之下 模的平面示意圖； [0021] 第二圖係本創作具有複數獨立流道之LED封裝模具之下模 的剖視圖； [0022] 第三圖係本創作具有複數獨立流道之LED封裝模具之上下 模的組合剖視圖； [0023] 第四圖係本創作具有複數獨立流道之LED封裝模具的LED 封膠流向不意圖， [0024] 第五圖係本創作具有複數獨立流道之LED封裝模具的使用 剖視圖； [0025] 第六圖係本創作具有複數獨立流道之LED封裝模具之LED 成品圖。 【主要元件符號說明】 [0026] 1LED封裝模具 [0027] 2 LED 封膠 表單編號A0101 第7頁/共16頁 M412470 [0028] 10下模 [0029] 100獨立流道 [0030] 11模穴 [0031] 12膠道口 [0032] 20上模 [0033] 30阻隔結構 表單編號A0101 第8頁/共16頁M412470 V. New description: [New technical field] [0001] This creation is related to the mold structure, especially for a mold for LED sealing. [Prior Art] [0002] Injection Molding is a production method widely used in the industry today. In its embodiment, the plastic pellets are sent to the molding machine, and after being heated and melted by the cylinder, the molten melt is melted ( Melt) is injected into the mold to form the product shape (Shaping), which can be taken out after being solidified by cooling and solidification. [0003] The above-mentioned injection molding processing method is also widely applied to a package of a light emitting diode (LED), and the sealing of the conventional LED is formed in a set of matching upper and lower molds, wherein the lower mold A plurality of recesses are provided for accommodating the LED semi-finished products, and then the encapsulant is poured into the set of molds to flow into the recesses, thereby enclosing the LED semi-finished products, and then completing the processes of the LEDs. [0004] However, due to considerations such as time and cost, the conventional LED sealing mold is usually filled with a whole piece of glue, and the LED sealing is poured into the glue inlet from the front of the mold. After the turbulence, and sequentially flowing into the mutually connected pockets along the entire mold, the LED sealing amount in the rear pocket is often insufficient, and bubbles are generated in some LED sealants. [0005] In view of this, in order to improve and solve the above-mentioned shortcomings, the present creator has devoted himself to research and cooperates with the application of the theory, and finally proposes a creation that is reasonable in design and effective in improving the above-mentioned defects. Form No. A0101 Page 3 of 16 [0006] M412470 [New Content] [0007] [0009] [0010] The purpose is to provide an LED package changer with multiple independent flow paths to reduce occurrence In the case of the LED sealing material in the cavity, it is avoided that I bubble in the process of sealing, thereby improving the product yield. The purpose of the above-mentioned 'This creation is a multi-independence flow, LED package mold, used to package a plurality of LED semi-finished products, LED package molds ^ - lower mold, - upper mold and complex barrier structure, the lower mold is formed: a plurality of mold cavities for each LED semi-finished product, the upper mold is correspondingly pressed on the lower plate ί1 and the partition structure is formed on one of the surfaces of the lower mold and the upper mold which are pressed together to block the lions corresponding between the cavities and Above the 1' surface formed by it, after the lower mold and the upper mold are pressed together, the barrier structure separates the originally communicating cavities into a plurality of independent flow paths. The purpose of this creation is to provide an LED package mold with multiple independent flow paths to reduce the LED sealant overflow and reduce the amount of seals used by LE]), which has the advantages of reducing cost and avoiding waste of resources. A further object of the present invention is to provide an LED package mold having a plurality of independent flow paths, the barrier structure of which can be formed by modifying a lower mold, thereby reducing equipment development costs. Compared with the prior art, the present invention places the barrier structure on one of the surfaces of the lower mold and the upper mold which are mutually pressed, and the plurality of independent flow passages can be separated into a plurality of independent flow passages through the arrangement of the barrier structures. Led sealant follows these barrier structures and flows into the separate flow channels and fills the various acupoints to reduce the probability of overflow or insufficient LED sealing, and the rise/conformity of the independent flow channel can facilitate the user to accurately control the molding. Pressure and time parameters, eight form number A0101 Page 4 of 16 [0011] LED sealant stably flows every person - independent flow channel 'avoids bubbles in the process of sealing" to improve product yield . [Embodiment] The detailed description and technical contents of the present invention are described below with reference to the drawings, but the drawings are only for reference and explanation, and are not intended to limit the creation. [0012] Please refer to the first to third figures, which are respectively a schematic plan view of the lower mold of the LED package mold with multiple independent flow channels, a sectional view of the lower mold, and a combined job diagram of the upper and lower molds; The LED package mold 1 of the plurality of independent flow channels is used to package a plurality of LED semi-finished products, and the LED package mold includes a lower mold 10'-upper mold 2' and a plurality of barrier structures 3'. [0013] The lower mold 10 is formed with a plurality of mold holes n for accommodating each of the LED semi-finished products, that is, 'each LED semi-finished product is placed in each cavity 11+, and the lower mold 10 can be provided with a plurality of tops. The structure (not shown) is taken out to facilitate the removal of the injection molded articles. The upper mold 20 is correspondingly pressed onto the lower mold. When the lower mold 10 and the upper mold m are covered with each other, the sealant can be poured between the lower portion and the upper mold 20. In the present embodiment, the mold holes are arranged in a matrix, and the actual implementation is not limited thereto. [0014] The barrier structures 30 are formed on one surface of the lower mold 1 and the upper mold 2, and the barrier structures 3 are separable from the lower mold 1 and the upper mold 20. The arrangement may also be formed on the surface of the lower mold 10 and the upper mold 2 which are pressed against each other by means of integral molding. The barrier structures 30 are correspondingly located between the mold holes n and higher than the surface on which they are formed. When the lower mold 10 and the upper mold 20 are pressed against each other, the barrier structure form number A0101 5 pages/16 pages M412470 [0017] [0018] The 30-series partitions 11 that are originally connected to each other are divided into a plurality of independent flow paths 100. In the present embodiment, the barrier structures 30 are formed as ribs between the cavities, and the barrier structures 3 are integrally formed on the upper surface of the lower mold 10. As can be seen from the first figure, the independent flow channels 100 are arranged in parallel, and each of the independent flow channels 1 〇〇 includes a plurality of cavity 11 arranged in a straight line, according to which the LED sealing can be along The barrier structures 30 are carried and flow into the individual flow channels 1〇〇. Please refer to the fourth to sixth figures, which is a schematic diagram of the LED seal flow direction of the LED package mold with multiple independent flow channels, a sectional view of the package mold, and a finished LED product; please refer to the fourth figure, the package The mold 1 has a plurality of glue passages 12, and the glue passages 12 respectively have a separate flow passage 100. When the LED sealant 2 enters the rubber passages 12, the barriers 30 are followed to flow into the independent flow passages 1 . In the middle, and sequentially filling the cavity 11 in each of the independent flow channels 100, in this embodiment, since each of the independent flow channels 100 has the same number of the cavity 11 included, the molding can be precisely controlled. The amount of LED sealant 2 required reduces the probability of LED sealant 2 overflowing. Moreover, since the paths of the independent flow channels 100 are the same, the time for the LED sealant 2 to flow from the front glue pass port 12 to the rear of each independent flow channel 1 is about the same, whereby the user can accurately control the molding pressure and Time and other parameters, so that the LED sealant 2 stably flows into each of the independent flow channels 1〇〇, and uniformly fills each of the mold holes 11, thereby reducing the occurrence of insufficient LED sealant 2 in the cavity 11' Avoid creating bubbles during the sealing process and affect product yield. Please refer to the sixth 圊 'It is worth noting that when the sealing process is completed, the form number A0101 page 6 / 16 pages of LED products are set by the barrier structures 30, and according to the number of independent flow channels 100 A plurality of finished LED products are formed, and the subsequent cutting processing is performed, that is, the packaging of the finished LED products is completed. The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the patent of the present invention, and other equivalent variations of the patent spirit of the present invention are all within the scope of the patent of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS [0020] The first figure is a schematic plan view of a lower mold of an LED package mold having a plurality of independent flow channels; [0021] The second figure is an LED package mold having a plurality of independent flow channels. [0022] The third figure is a combined sectional view of the lower die of the LED package mold having multiple independent flow paths; [0023] The fourth figure is the LED package mold of the present invention having a plurality of independent flow channels [0024] The fifth figure is a cross-sectional view of the LED package mold having a plurality of independent flow channels; [0025] The sixth figure is an LED finished product of an LED package mold having a plurality of independent flow channels. Figure. [Main component symbol description] [0026] 1LED package mold [0027] 2 LED seal form number A0101 Page 7 / Total 16 pages M412470 [0028] 10 lower mold [0029] 100 independent flow channel [0030] 11 cavity [ 0031] 12 glue channel [0032] 20 upper mold [0033] 30 barrier structure form number A0101 Page 8 of 16