TWM520451U - Packaging mold structure and product thereof - Google Patents

Packaging mold structure and product thereof Download PDF

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Publication number
TWM520451U
TWM520451U TW104219372U TW104219372U TWM520451U TW M520451 U TWM520451 U TW M520451U TW 104219372 U TW104219372 U TW 104219372U TW 104219372 U TW104219372 U TW 104219372U TW M520451 U TWM520451 U TW M520451U
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Taiwan
Prior art keywords
mold
package
branch
mold structure
main
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TW104219372U
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Chinese (zh)
Inventor
Jing-Yu Zhuo
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Single Well Ind Corp
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Priority to TW104219372U priority Critical patent/TWM520451U/en
Publication of TWM520451U publication Critical patent/TWM520451U/en

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  • Injection Moulding Of Plastics Or The Like (AREA)

Description

封裝模具結構及其製品Packaging mold structure and its products

本創作係有關於一種模具有關,尤指一種封裝模具結構及其製品。This creation is related to a mold, especially a package mold structure and its products.

按,習知如應用於LED的封裝模具,其主要係具有一注膠口,並由該注膠口朝外延伸有複數相連通的澆道,再由各澆道分叉而連通有複數模穴。當由注膠口內注入封膠塑料後,即可透過各澆道將封膠塑料導引至各模穴內,以完成LED的封裝作業。According to the conventional packaging mold for LED, it mainly has a glue injection port, and a plurality of gates are connected to the outside by the glue injection port, and the gates are connected by a plurality of gates. hole. When the sealant plastic is injected into the glue injection port, the sealant plastic can be guided into each cavity through each runner to complete the LED packaging operation.

然而,由於封裝模具往往係由上、下模具相蓋合而成,故在合模面間容易產生間隙而使溢出的膠料形成殘膠,以致殘膠殘留於成品上。而在一些如LED封裝後的製程中,若殘膠被成品帶到後續的加工設備上,經過如震動或碰撞等因素而使殘膠與成品脫落時,掉落的殘膠有可能會影響到加工設備在運作上的精確性、甚而造成機台的當機或誤判等嚴重問題。而為了解決此一問題,以往封裝成型的成品必須透過一道除膠的作業程序,亦即透過人工等方式刮除成品上的殘膠,以避免殘膠被成品帶至後續製程中而產生上述問題。However, since the package mold is often formed by the upper and lower molds being closed, a gap is easily formed between the mold clamping surfaces to cause the overflowed rubber to form a residual glue, so that the residual glue remains on the finished product. In some processes such as LED packaging, if the residual glue is brought to the subsequent processing equipment by the finished product, the residual glue may be affected when the residual glue and the finished product fall off due to factors such as vibration or collision. The operational accuracy of the processing equipment, and even serious problems such as the machine crash or misjudgment. In order to solve this problem, in the past, the packaged finished product must pass through a glue removing operation procedure, that is, scraping the residual glue on the finished product by manual means, so as to avoid the residual glue being brought into the subsequent process by the finished product, thereby causing the above problem. .

惟,由於在刮除殘膠的作業上,並無法確保每一個成品上的殘膠皆被除淨。尤其如LED等體積較小的封裝成品,難免仍有殘膠存留於成品上,再加上殘膠往往為不規則形狀與局部大小,難以於斷料時確實裁切或刮除除去,故無法有效確保成品的殘膠被除淨,以致仍有可能使殘膠隨著成品而被帶往後續的加工設備上等問題的發生。However, due to the scraping of the residual glue, it is not possible to ensure that the residual glue on each finished product is removed. Especially for small-sized packaged products such as LEDs, it is inevitable that residual glue remains on the finished product, and the residual glue is often irregular shape and partial size, which is difficult to cut or scrape off when it is broken. Effectively ensuring that the residual glue of the finished product is removed, so that it is still possible to cause the residual glue to be carried to the subsequent processing equipment along with the finished product.

有鑑於此,本創作人係為改善並解決上述之缺失,乃特潛心研究並配合學理之運用,終於提出一種設計合理且有效改善上述缺失之本創作。In view of this, the creator is trying to improve and solve the above-mentioned shortcomings, and he has devoted himself to researching and cooperating with the application of theory, and finally proposed a creation that is reasonable in design and effective in improving the above-mentioned defects.

本創作之主要目的,在於可提供一種封裝模具結構及其製品,其係透過封裝模具的設計,使殘膠可形成於該封裝模具上並能透過切除等方式有效切除;由於該封裝模具刻意使殘膠作為灌膠後所成型的一部分,因此所構成的殘膠具有一定的形狀並位於特定位置,故可以裁切等方式有效去除之,以達到避免封裝成品上殘留殘膠之目的。The main purpose of the present invention is to provide a package mold structure and a product thereof, which are formed by the design of the package mold, so that the residual glue can be formed on the package mold and can be effectively removed by cutting or the like; since the package mold is deliberately made The residual glue is formed as part of the glue filling, so the residual glue has a certain shape and is located at a specific position, so it can be effectively removed by cutting or the like, so as to avoid the residual glue remaining on the packaged product.

為了達成上述之目的,本創作係提供一種封裝模具結構,包括一第一模、以及一第二模,第一模具有一第一合模面,並於第一合模面上設有主澆道、連通主澆道的複數分支澆道、以及連通各分支澆道的第一模穴,且各第一模穴連通於各分支澆道的一側為注澆側,而第二模具有一第二合模面,並對應設於第一合模面上;其中,第一合模面上更設有連通各分支澆道的注膠溝道,且注膠溝道與各第一模穴的注澆側間形成一除膠間距。In order to achieve the above object, the present invention provides a package mold structure including a first mold and a second mold. The first mold has a first mold surface and a main runner is disposed on the first mold surface. a plurality of branch runners connected to the main runner, and a first cavity communicating with each of the branch runners, and one side of each of the first die holes communicating with each of the branch runners is a pouring side, and the second die has a second The mold clamping surface is correspondingly disposed on the first mold clamping surface; wherein the first mold clamping surface is further provided with a glue injection channel connecting the branch runners, and the injection molding channel and the injection of each first mold cavity A gap between the casting sides is formed.

為了達成上述之目的,本創作係提供一種封裝模具結構之製品,包括一主料段、以及複數封裝件,主料段設有複數分支料段,各封裝件則分別連接於各分支料段上,且各封裝件連接於各分支料段的一側為鄰接側;其中,主料段上更設有連通各分支料段的第一除膠部,且所述第一除膠部與各封裝件的鄰接側間形成一除膠間距。In order to achieve the above object, the present invention provides an article for packaging a mold structure, comprising a main material section and a plurality of packaging parts, wherein the main material section is provided with a plurality of branching sections, and each of the packaging parts is respectively connected to each branch material section. And a side of each of the package members connected to each of the branch segments is an abutting side; wherein the main material segment is further provided with a first de-bonding portion that connects the branch segments, and the first de-bonding portion and each package A stripping distance is formed between adjacent sides of the piece.

為了能更進一步揭露本創作之特徵及技術內容,請參閱以下有關本創作之詳細說明與附圖,然而所附圖式僅提供參考與說明用,並非用來對本創作加以限制者。In order to further disclose the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings are only for reference and description, and are not intended to limit the creation.

請參閱圖1及圖2,係分別為本創作封裝模具結構合模前、後之局部剖面示意圖。本創作係提供一種封裝模具結構及其製品,該封裝模具結構係可用於封裝LED,包括一第一模1、以及一與該第一模1相對應設置的第二模2;其中:Please refer to FIG. 1 and FIG. 2 , which are partial cross-sectional views of the original package mold structure before and after clamping. The present invention provides a package mold structure and an article thereof, which can be used to package LEDs, including a first mold 1 and a second mold 2 corresponding to the first mold 1; wherein:

該第一模1可為一下模,並具有一第一合模面10,且於該第一合模面10上設有至少一主澆道11、連通該主澆道11的複數分支澆道12、以及連通各分支澆道12的第一模穴13,該等分支澆道12可位於主澆道11的任一側、或分別位於主澆道11的二側而延著其長度間距設置,且各第一模穴13連通於各分支澆道12的一側為一注澆側130,而所述第一模穴13則用以構成封裝成品(即封裝件4,如圖4所示)的一部或全部。The first die 1 can be a lower die and has a first die face 10, and the first die face 10 is provided with at least one main runner 11 and a plurality of branch runners communicating with the main runner 11 12, and a first cavity 13 connecting the branch runners 12, the branch runners 12 may be located on either side of the main runner 11, or respectively located on two sides of the main runner 11 and extending along the length spacing thereof And one side of each of the first cavity 13 communicating with each branch runner 12 is a pouring side 130, and the first cavity 13 is used to form a packaged product (ie, the package 4, as shown in FIG. 4 One or all of them.

該第二模2可為一上模,用以與上述第一模1相互蓋合,且該第二模2亦具有一第二合模面20,該第二合模面20對應設於該第一模1之第一合模面10上,並於該第二合模面20上設有與該第一模1之各第一模穴13相對應的第二模穴21,各第一、二模穴13、21即用以構成一封裝件4的外型。因此,每一第一模穴13即對應一所述分支澆道12,以供封膠塑料(圖略)注入後,通過主澆道11而分流至各分支澆道12,進而填滿於每一第一、二模穴13、21內,藉以能獲得所述封裝件4。The second mold 2 can be an upper mold for covering the first mold 1 , and the second mold 2 also has a second mold surface 20 , and the second mold surface 20 is correspondingly disposed on the second mold 2 . a first mold face 10 of the first mold 1 and a second mold cavity 21 corresponding to each of the first mold cavities 13 of the first mold 1 are disposed on the second mold surface 20, each first The two mold holes 13, 21 are used to form the outer shape of a package 4. Therefore, each of the first cavities 13 corresponding to one of the branch runners 12 is filled with the sealant plastic (not shown), and then branched to the branch runners 12 through the main runner 11 to fill each of the branch runners 12 The first and second cavities 13, 21 are used to obtain the package 4.

本創作主要係上述第一模1之第一合模面10上更設有連通各分支澆道12的注膠溝道14,所述注膠溝道14可為一V形槽,並可位於主澆道11任一側或二側,以沿著主澆道11的長度延伸設置而貫通該等分支澆道12,且所述注膠溝道14與各第一模穴13的注澆側130間形成一除膠間距d。所述除膠間距d係位於第一模1之第一合模面10上,且第一、二模1、2相蓋合時,第一、二合模面10、20於所述除膠間距d上實質相貼合。據此,當封膠塑料注入後,封膠塑料可在除膠間距d上形成完整的溢膠薄膜,並於脫模後可透過如裁切等方式有效去除,以有效去除封裝件4上的殘膠問題。The present invention is mainly characterized in that the first mold clamping surface 10 of the first mold 1 is further provided with a glue injection channel 14 connecting the branch runners 12, and the glue injection channel 14 can be a V-shaped groove and can be located. Either side or both sides of the main runner 11 extend through the length of the main runner 11 to penetrate the branch runners 12, and the injection molding channel 14 and the pouring side of each of the first cavities 13 130 sets a debonding distance d. The debonding distance d is located on the first clamping surface 10 of the first mold 1, and when the first and second molds 1 and 2 are covered, the first and second mold faces 10 and 20 are used for the degumming. The spacing d is substantially conformable. Accordingly, when the sealant plastic is injected, the sealant plastic can form a complete overflow film on the glue removal distance d, and can be effectively removed after being demolded by cutting, etc., to effectively remove the package 4 Residual rubber problem.

另,如圖3所示,本創作亦可進一步於上述第一模1之第一合模面10上,設有一位於任二第一模穴13間的間鄰接溝道14’,且任二第一模穴13間彼此相鄰的一側為一鄰接側131,而所述鄰接溝道14’與任一第一模穴13的鄰接側131間亦形成一除膠間距d’,如此亦可具有上述相同的目的及效果。In addition, as shown in FIG. 3, the present invention may further include a first adjacent channel 14' between the first and second first cavities 13 on the first clamping surface 10 of the first die 1, and any two A side adjacent to each other between the first cavity 13 is an abutting side 131, and a gap between the adjacent channel 14' and the adjacent side 131 of any of the first cavities 13 forms a debonding distance d'. The same objects and effects as described above can be achieved.

再者,如圖4所示,經由上述本創作封裝模具結構所獲得的製品,包括一主料段3、以及複數上述封裝件4;其中,該主料段3係由主澆道11所構成,且該主料段3上設有複數分支料段30、以及連接各分支料段30的第一除膠部31,各分支料段30由分支澆道12所構成、所述第一除膠部31由注膠溝道14所構成,並可位於主料段3的任一側、或分別位於主料段3的二側而延著其長度間距設置,各封裝件4即分別連接於各分支料段30上,且各封裝件4由第一、二模穴13、21所構成,各封裝件4連接於各分支料段30的一側為第一側40、彼此相鄰的一側為第二側41,而所述第一除膠部31係與各封裝件4的第一側40間形成一所述除膠間距d(如圖5所示)。另,上述鄰接溝道14’構成一第二除膠部32,第二除膠部32與各封裝件4的第二側41間形成一所述除膠間距d’ (如圖5所示)。Furthermore, as shown in FIG. 4, the article obtained by the above-described inventive package mold structure comprises a main material section 3 and a plurality of the above-mentioned package members 4; wherein the main material section 3 is composed of a main runner 11. And the main section 3 is provided with a plurality of branch sections 30, and a first degreasing part 31 connecting the branch sections 30, each branch section 30 is composed of branch runners 12, the first degumming The portion 31 is formed by the glue injection channel 14 and may be located on either side of the main material section 3 or on both sides of the main material section 3 and extending along the length thereof, and each package member 4 is respectively connected to each On the branching section 30, each of the packages 4 is composed of first and second cavities 13, 21, and one side of each of the packages 4 connected to each branch section 30 is a first side 40 and a side adjacent to each other The second side 41 is formed, and the first de-bonding portion 31 forms a stripping distance d between the first side 40 of each package 4 (as shown in FIG. 5). In addition, the abutting channel 14' constitutes a second de-bonding portion 32, and the second de-bonding portion 32 forms a debonding distance d' between the second side 41 of each package 4 (as shown in FIG. 5). .

又,如圖6所示,本創作封裝模具結構亦可進一步具有一注膠口100,該注膠口100係可設於第一模1或第二模2上,並與主澆道11相連通。且在本創作所舉之實施例中,該主澆道11係為複數,並於任二主澆道11鄰近該注膠口100間設有一連接溝道110,以使二主澆道11與注膠口100間構成一a區域。請一併參閱圖7所示,所述連接溝道110係位於第一模1之第一合模面10上,故當封膠塑料由注膠口100注入後,可因溢膠而於所述a區域上形成溢膠薄膜,並於脫膜時使其於所述a區域所產生的溢膠薄膜殘留於模具上,而不會與製品一併被取下,如此亦可使殘膠不致於隨製品移往下一個加工站,同樣可達到避免殘留殘膠之目的與功效。Moreover, as shown in FIG. 6 , the original package mold structure may further have a glue injection port 100 , which may be disposed on the first die 1 or the second die 2 and connected to the main runner 11 . through. In the embodiment of the present invention, the main runner 11 is plural, and a connecting channel 110 is disposed between the two main runners 11 adjacent to the glue injection port 100, so that the two main runners 11 and The injection port 100 constitutes an area a. As shown in FIG. 7 , the connecting channel 110 is located on the first clamping surface 10 of the first die 1 , so that when the sealing plastic is injected from the glue injection port 100 , An overflow film is formed on the area a, and the film of the overflow film generated in the area a remains on the mold when the film is removed, and is not removed together with the product, so that the residual glue is not caused. The purpose and effect of avoiding residual glue can also be achieved by moving the product to the next processing station.

是以,藉由上述之構造組成,即可得到本創作封裝模具結構及其製品。Therefore, the composition of the present invention and the article thereof can be obtained by the above-mentioned structural composition.

綜上所述,本創作實為不可多得之新型創作產品,其確可達到預期之使用目的,而解決習知之缺失,又因極具新穎性及進步性,完全符合新型專利申請要件,爰依專利法提出申請,敬請詳查並賜准本案專利,以保障創作人之權利。In summary, this creation is a rare new creative product, which can achieve the intended use, but solve the lack of knowledge, and because of its novelty and progress, it fully meets the requirements of new patent applications. To file an application in accordance with the Patent Law, please check and grant the patent in this case to protect the rights of the creator.

惟以上所述僅為本創作之較佳可行實施例,非因此即拘限本創作之專利範圍,故舉凡運用本創作說明書及圖式內容所為之等效結構變化,均同理皆包含於本創作之範圍內,合予陳明。However, the above description is only a preferred and feasible embodiment of the present invention, and thus the scope of the patent of the present invention is not limited thereby, and therefore equivalent structural changes made by using the present specification and the contents of the drawings are equally included in the present invention. Within the scope of creation, he is given to Chen Ming.

<本創作><this creation>

1‧‧‧第一模1‧‧‧ first model

10‧‧‧第一合模面10‧‧‧First clamping surface

100‧‧‧注膠口100‧‧‧ injection port

11‧‧‧主澆道11‧‧‧main runner

110‧‧‧連接溝道110‧‧‧Connected channel

12‧‧‧分支澆道12‧‧‧Split runner

13‧‧‧第一模穴13‧‧‧ first cavity

130‧‧‧注澆側130‧‧‧ pouring side

131‧‧‧鄰接側131‧‧‧Adjacency side

14‧‧‧注膠溝道14‧‧‧Injection channel

14’‧‧‧鄰接溝道14'‧‧‧ Adjacent channel

2‧‧‧第二模2‧‧‧ second mode

20‧‧‧第二合模面20‧‧‧Second mold surface

21‧‧‧第二模穴21‧‧‧Second cavity

3‧‧‧主料段3‧‧‧Main section

30‧‧‧分支料段30‧‧‧Subsection

31‧‧‧第一除膠部31‧‧‧The first degreasing department

32‧‧‧第二除膠部32‧‧‧Second rubber removal department

4‧‧‧封裝件4‧‧‧Package

40‧‧‧第一側40‧‧‧ first side

41‧‧‧第二側41‧‧‧ second side

圖1係本創作封裝模具結構合模前之局部剖面示意圖。FIG. 1 is a partial cross-sectional view of the mold structure of the present invention before being clamped.

圖2係本創作封裝模具結構合模後之局部剖面示意圖。FIG. 2 is a partial cross-sectional view of the mold structure of the present invention after the mold is closed.

圖3係本創作封裝模具結構另一視角合模前之局部剖面示意圖。FIG. 3 is a partial cross-sectional view of the original packaging mold structure before the mold is closed.

圖4係本創作製品之局部外觀示意圖。Figure 4 is a partial schematic view of the present article.

圖5係圖4之局部放大詳圖。Figure 5 is a partial enlarged detail view of Figure 4.

圖6係本創作第一合模面另一實施例之平面示意圖。Fig. 6 is a plan view showing another embodiment of the first mold clamping surface of the present invention.

圖7係圖6之6-6斷面剖視圖。Figure 7 is a cross-sectional view taken along line 6-6 of Figure 6.

1‧‧‧第一模 1‧‧‧ first model

10‧‧‧第一合模面 10‧‧‧First clamping surface

11‧‧‧主澆道 11‧‧‧main runner

12‧‧‧分支澆道 12‧‧‧Split runner

13‧‧‧第一模穴 13‧‧‧ first cavity

130‧‧‧注澆側 130‧‧‧ pouring side

14‧‧‧注膠溝道 14‧‧‧Injection channel

2‧‧‧第二模 2‧‧‧ second mode

20‧‧‧第二合模面 20‧‧‧Second mold surface

21‧‧‧第二模穴 21‧‧‧Second cavity

Claims (11)

一種封裝模具結構,包括: 一第一模,具有一第一合模面,並於該第一合模面上設有主澆道、連通該主澆道的複數分支澆道、以及連通各該分支澆道的第一模穴,且各該第一模穴連通於各該分支澆道的一側為注澆側;以及 一第二模,具有一第二合模面,並對應設於該第一模之第一合模面上; 其中,該第一合模面上更設有連通各該分支澆道的注膠溝道,且所述注膠溝道與各該第一模穴的注澆側間形成一除膠間距。A package mold structure comprising: a first mold having a first mold surface, and a main runner, a plurality of branch runners connected to the main runner, and each of the first mold surface a first cavity of the branch runner, and a side of each of the first cavity communicating with each of the branch runners is a pouring side; and a second die having a second clamping surface, and correspondingly disposed on the a first mold clamping surface; wherein the first mold surface is further provided with a glue injection channel connecting each of the branch runners, and the glue injection channel and each of the first mold holes A glue removal interval is formed between the injection sides. 如申請專利範圍第1項所述之封裝模具結構,其中該第一模係為一下模,而該第二模則為一上模。The package mold structure of claim 1, wherein the first mold is a lower mold and the second mold is an upper mold. 如申請專利範圍第1項所述之封裝模具結構,其中該第一模或該第二模上係具有一注膠口,該注膠口與該主澆道相連通。The package mold structure according to claim 1, wherein the first mold or the second mold has a glue injection port, and the glue injection port is in communication with the main runner. 如申請專利範圍第3項所述之封裝模具結構,其中所述主澆道係為複數,並於任二所述主澆道鄰近該注膠口間設有一連接溝道。The package mold structure according to claim 3, wherein the main runner is plural, and a connection channel is disposed between the main runners adjacent to the injection gate. 如申請專利範圍第1項所述之封裝模具結構,其中該第一模之第一合模面上係設有位於任二該第一模穴間的間鄰接溝道,且任二該第一模穴間彼此相鄰的一側為鄰接側,而所述鄰接溝道與任一該第一模穴的鄰接側間亦形成一所述除膠間距。The package mold structure according to claim 1, wherein the first mold surface of the first mold is provided with an adjoining channel between any two of the first cavities, and the first one is first The side adjacent to each other between the cavities is an abutting side, and the abutting channel and abutting side of any of the first cavities also form a debonding pitch. 如申請專利範圍第1項所述之封裝模具結構,其中該等分支澆道係位於該主澆道的一側、或分別位於該主澆道的二側而延著其長度間距設置。The package mold structure according to claim 1, wherein the branch runners are located on one side of the main runner or on two sides of the main runner and are disposed along a length thereof. 如申請專利範圍第1項所述之封裝模具結構,其中該第二模之第二合模面上係設有與該第一模之各該第一模穴相對應的第二模穴。The package mold structure of claim 1, wherein the second mold surface of the second mold is provided with a second mold cavity corresponding to each of the first mold cavities of the first mold. 如申請專利範圍第1項所述之封裝模具結構,其中所述注膠溝道係為一V形槽。The package mold structure of claim 1, wherein the glue injection channel is a V-shaped groove. 如申請專利範圍第1項所述之封裝模具結構,其中所述注膠溝道係沿著該主澆道一側的長度延伸設置。The package mold structure of claim 1, wherein the glue injection channel extends along a length of one side of the main runner. 一種封裝模具結構之製品,包括: 一主料段,設有複數分支料段;以及 複數封裝件,分別連接於各該分支料段上,且各該封裝件連接於各該分支料段的一側為第一側; 其中,該主料段上更設有連接各該分支料段的第一除膠部,且所述第一除膠部與各該封裝件的鄰接側間形成一除膠間距。An article for packaging a mold structure, comprising: a main material section, a plurality of branch material segments; and a plurality of package members respectively connected to the branch material segments, and each of the package members is connected to one of the branch material segments The side is a first side; wherein the main material section is further provided with a first de-bonding portion connecting the branch segments, and the first de-bonding portion forms a de-gluing between the adjacent sides of each of the packages spacing. 如申請專利範圍第10項所述之封裝模具結構之製品,其中各該封裝件彼此相鄰的一側為第二側,且各該封裝件彼此間設有一第二除膠部,所述第二除膠部與各該封裝件的第二側間亦形成一所述除膠間距。The article of the packaged mold structure of claim 10, wherein a side of each of the packages adjacent to each other is a second side, and each of the packages is provided with a second glue removing portion, the first The stripping distance is also formed between the second de-bonding portion and the second side of each of the packages.
TW104219372U 2015-12-02 2015-12-02 Packaging mold structure and product thereof TWM520451U (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108828719A (en) * 2018-07-16 2018-11-16 福建海创光电有限公司 A kind of optical isolator
CN108873173A (en) * 2018-07-16 2018-11-23 福建海创光电有限公司 A kind of optoisolator and optical circulator
CN108919425A (en) * 2018-07-16 2018-11-30 福建海创光电有限公司 A kind of optical circulator

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108828719A (en) * 2018-07-16 2018-11-16 福建海创光电有限公司 A kind of optical isolator
CN108873173A (en) * 2018-07-16 2018-11-23 福建海创光电有限公司 A kind of optoisolator and optical circulator
CN108919425A (en) * 2018-07-16 2018-11-30 福建海创光电有限公司 A kind of optical circulator

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