M408571 五、新型說明： 【新型所屬之技術領域】 本新型係有關於一種電鍍裝置，且特別是有關於一種 電鍍槽中的電極板結構。 【先前技術】 印刷電路板(Printed Circuit Board, PCB)是根據電子 元件相互間配線的電路設計而在基板上形成導體的印刷 配線板。一般而言，印刷電路板是在絕緣板的表面上，對 應配線圖案來形成必要的電路佈線，如此一來，就可在印 刷電路板上密集地配置積體電路、電容器、電阻等各種電 子元件。 為了在絕緣板上形成電路佈線，需要反覆進行數次的 電解電鍍。此時，基板上電鍍厚度的均勻與否，代表了印 刷電路板品質的好壞，其中電鍍厚度均勻的印刷電路板品 質較佳。 然而，在電鍍槽中的陽極上會產生一種現象，也就是 在陽極板的周邊部分會形成高電流區，而在周邊部分之外 的低電流部分會形成低電流區，如此一來，由於電鍍速率 的不同，將導致基板上的電鍍厚度不均勻。 因此，在電鍍裝置的配置上，仍有進一步改善的空間。 【新型内容】 本新型内容之一目的是在提供一種電鍍槽中的電極 4 :構藉以改善電鑛槽中的陽極板上電流分佈不均，從 二於電鍍速率的不同而導致軟性基板上電鍍厚度不均 達上逑目的，本新型内容之一技術樣態係關於一種 s中的電極板結構，其包含至少一陽極以及至少一框 至^罩β至少一陽極包含第一區與第二區。第一區係位於 —1陽極的周邊部分。第二區相對於第一區而位於至少 〜陽極的周邊部分以内之中央部分。第—區對軟性基板進 =鑛的速率高於第二區對軟性基板進行電鍵的速率。至 二。框形遮罩與至少一陽極的第一區相對應配置，使得第 —區相對於軟性基板為框形遮罩所遮蔽。 根據本新型一實施例，框形遮罩的寬度可調整。 根據本新型另一實施例，至少一陽極之第二區係用以 對軟性基板進行電鑛。 小，據本新型再一實施例，當軟性基板進行電鍍時，至 ^陽極之第二區對軟性基板進行電鍍，而至少一陽極之 第一區不對軟性基板進行電鍍。 根據本新型又一實施例，框形遮罩包含塑膠。 為達上述目的，本新型内容之另一技術樣態係關於一 種可控制電流均一性的捲對捲電鍍裝置，其包含第一滾筒 ^置、第二滾筒裝置以及電鍍槽。第一滾筒裝置與第二滚 筒裝置之間形成一輸送路徑。電鍍槽配置於第一滾筒裝置 和第二滾筒裝置之間而位於輸送路徑上。 此外，電鍍槽包含至少一陽極與至少一框形遮罩。至 少一陽極包含第一區與第二區，其中第一區係位於至少一 M408571 陽極的周邊部分，第二區相對於第一區位於至少一陽極的 周邊部分以内之中央部分’第一區對軟性基板進行電鍍的 速率高於第二區對軟性基板進行電鍍的速率。至少一框形 遮罩，與至少一陽極的第一區相對應配置使得第一區為框 形遮罩所遮蔽。 根據本新型一實施例，框形遮罩的寬度可調整，以使 軟性基板的厚度相同。 根據本新型另一實施例’至少一陽極之第二區係用以 φ 對軟性基板進行電鍍。 根據本新型再一實施例，電鍍裝置係為直立式電鍍裝 置或水平式電鍍裝置。 根據本新型又一實施例，至少一陽極係為可溶性陽極 V 或不溶性陽極。 根據本新型另再一實施例，至少一陽極係為鈦板或鈦 網〇 ^據本新型另又—實施例，框形遮罩包含塑膠。 供一種麵新型之技術内容，本新型實施例藉由提 板上電流電極板結構’藉以改善電鍍槽中的陽極 基板上電鍍基於讀速率的不同而導致軟性 与度不均勻的問題。 【貝施方式】 之實施例丄非=例配合所附圖式作詳細說明，但所提供 之描述非用以限制2制，新型所涵蓋的範圍，而結構運作 、執行之順序’任何由元件重新組合之 6 M408571 結構，所產生具有均等功效的裝置，皆為本新型所涵蓋的 範圍。其中圖式僅以說明為目的，並未依照原尺寸㈣。 第1圖係依照本新型一實施例繪示—種可押制電3 均一性的捲對捲電鍍裝置100的外觀示意圖。可=制電 均一性的捲對捲電鑛裝置100包含第—滾筒裝置^1〇、^ 二滚筒裝置120以及電鐘槽130。其中，可控制電流均一 性的捲對捲電鍵裝置100可視實際需求而為直立^電鑛 裝置或水平式電鍍裝置。在本實施例中，可控制電=均二 性的捲對捲電鍍裝置1〇〇為直立式電鍍骏置，然本新型並 不以此為限。 ‘ 於操作上，可控制電流均一性的捲對捲電鍍裝置100 ：主要用來進行軟性基板200的電鍍製程。藉由可控制電流 ；均一性的捲對捲電鍍裝置1⑻在軟性基材鍍2一層銅 箔，便可以形成軟性銅箔基板（Flexible Copper &ad Laminate，FCCL)，然而本新型並不以此為限，可控制電流 均一性的捲對捲電鍍裝置100亦可用在各種基材與不同 鲁電鑛材料的應用中。此外，軟性基板亦可為軟性印刷電路 板’可控制電流均一性的捲對捲電鍍裝置1〇〇可在印刷電 路板上形成特定的電鍍層或電鍍圖案（如金屬線路等）。 仏1本實施例中，第一滾筒裝置Π0為軟性基板200的 端:而第二滾筒裝置120為軟性基板200的收料端， 一滾筒裳i 110與第二滾筒裝置12〇之間形成軟性基板 〇，輸送路徑。於操作上，軟性基板200的兩端分別由 兩滾筒袭置牵引，並由第一滾筒裝置11〇向第二滚筒裝置 120方向移動，但本新型並不以此特定方向為限。 M408571 如第1圖所示，電鍍槽130配置於第—滾筒裴置u〇 和第二滾筒裝置120之間而位於輸送路徑上，軟性美板 2〇〇由兩滾筒裝置牽引而經過輸送路徑，從而藉由電二槽 130對軟性基板200進行電鍍❶以下將對電鍍槽中的 板結構進行詳細說明。 請參照第2圖，第2圖係依照本新型一實施例繪示一 種電鍍槽中的電極板結構示意圖。電極板結構包含至=一 陽極132以及至少一框形遮罩134。在此需先說明的是， • 以下僅以一組陽極132與框形遮罩134來介紹電極板結 構’然本新型並不以此為限。 … 在陽極132上基於電流分佈密度的不同，可將陽極 :132劃分為第一區與第二區。由圖中可知，第一區是位於 ；陽極132的周邊部分，而第二區相對於第一區是位於陽極 132的周邊部分以内之中央部分。 首先，先說明在電極板結構中未配置框形遮罩134的 狀況。由於陽極132的第一區所具有的電流密度較其第二 φ 區為高，據此，當利用電鍍槽130中的陽極132對軟性基 板200進行電鍍時，陽極132之第一區對軟性基板2〇〇的 電鍍速率高於其第二區對軟性基板2〇〇的電鍍速率。如此 一來，會導致軟性基板200周圍部分的電鍍厚度較其中央 邛分為大，亦即電鍵厚度不均勻，而影響印刷電路板的品 質。 因此，本新型實施例提供如第2圖所示之框形遮罩 134，其與陽極132的第一區相對應配置，這樣的話，就 可以藉由框形遮罩134來將陽極132的第一區（也就是高 8 M408571 電流區）遮蔽起來。換言之，在利用具有框形遮罩134的 電極板結構時’已將電鍍速率較快的第一區遮蔽，藉使電 極板結構利用其陽極132之第二區來對軟性基板2〇〇進行 電鍵而極132之第一區則不會對軟性基板2〇〇進行電 鍍，如此一來，即可改善電鍍厚度不均勻的問題。 需特別注意的是，框形遮罩134的寬度可以調整。在 任選的一實施例中，框形遮罩134可為一可伸縮結構，如 此一來，在本新型實施例之電極板結構對第i圖所示之軟 • 性基板200進行電鍍後的成品厚度不均時，可依據實際需 求來調整框形遮罩134以改變框形遮罩134的寬度。舉例 而5，當發現成品（經電鍍後之軟性基板2〇〇)的厚度不均 :時，可藉由調寬相應於成品較厚部位的框形遮罩134，以 ；遮蔽原本會讓成品較厚的區域，從而使成品的厚度相同。 於製作上’陽極132可視實際需求而採用可溶性陽極 或不溶性陽極。在一實施例中，陽極132可為鈦板或鈦 網，框形遮罩134則可包含塑膠，然本新型並不以此為 • 限，任何熟習此技藝者，在不脫離本新型之精神和範圍 内，可採用任何得用以進行電鍍的材料或結構來作為陽極 132，而框形遮罩可採用任何得用以阻擋陽極132之 第一區對軟性基板200進行電錄的材料。 由上述本新型實施方式可知，應用本新型具有下列優 f。本新型實施例藉由提供一種電鍍槽中的電極板結構， 藉以改善電鍍槽中的陽極上電流分佈不均，從而造成電鍍 速率的不同而導致軟性基板上電鍍厚度不均勻的問題β 雖然本新型已以實施方式揭露如上，然其並非用以限 9 M408571 定本新型，任何熟習此技藝者，在不脫離本新型之精神和 範圍内，當可作各種之更動與潤飾，因此本新型之保護範 圍當視後附之申請專利範圍所界定者為準。 【圖式簡單說明】 為讓本新型之上述和其他目的、特徵、優點與實施例 能更明顯易懂，所附圖式之說明如下： 第1圖係繪示依照本新型一實施例的一種可控制電 φ 流均一性的捲對捲電鍵裝置的外觀示意圖。 第2圖係繪示依照本新型另一實施例的一種電鍍槽 中的電極板結構示意圖。 ； 【主要元件符號說明】 100 :可控制電流均一性的捲對捲電鍍裝置 110 :第一滾筒裝置 • 120 :第二滾筒裝置 130 :電鍍槽 132 :陽極 134 :框形遮罩 200 :軟性基板M408571 V. New description: [New technical field] The present invention relates to a plating apparatus, and in particular to an electrode plate structure in a plating tank. [Prior Art] A printed circuit board (PCB) is a printed wiring board in which a conductor is formed on a substrate in accordance with a circuit design in which electronic components are wired to each other. In general, a printed circuit board is formed on a surface of an insulating board to form a necessary circuit wiring corresponding to a wiring pattern, so that various electronic components such as an integrated circuit, a capacitor, and a resistor can be densely arranged on the printed circuit board. . In order to form a circuit wiring on an insulating plate, electrolytic plating is required to be repeated several times. At this time, the uniformity of the plating thickness on the substrate represents the quality of the printed circuit board, and the printed circuit board having a uniform plating thickness is better. However, a phenomenon occurs in the anode in the plating bath, that is, a high current region is formed in the peripheral portion of the anode plate, and a low current portion is formed outside the peripheral portion, thereby forming a low current region. The difference in rate will result in uneven plating thickness on the substrate. Therefore, there is still room for further improvement in the configuration of the plating apparatus. [New content] One of the contents of the present invention is to provide an electrode 4 in a plating bath to improve the uneven current distribution on the anode plate in the electro-mine tank, and to electroplate on the soft substrate from the difference in plating rate. One aspect of the present invention relates to an electrode plate structure in an s, comprising at least one anode and at least one frame to a cover β, at least one anode comprising a first region and a second region . The first zone is located at the periphery of the -1 anode. The second zone is located at a central portion within at least the peripheral portion of the anode relative to the first zone. The rate of the first zone to the soft substrate is higher than the rate at which the second zone conducts a bond to the flexible substrate. To two. The frame-shaped mask is disposed corresponding to the first region of the at least one anode such that the first region is shielded from the flexible substrate by the frame-shaped mask. According to an embodiment of the invention, the width of the frame-shaped mask can be adjusted. According to another embodiment of the present invention, at least one second region of the anode is used to electrominee the flexible substrate. According to still another embodiment of the present invention, when the flexible substrate is plated, the flexible substrate is plated to the second region of the anode, and the first region of at least one of the anodes is not plated with the flexible substrate. According to yet another embodiment of the present invention, the frame-shaped mask comprises plastic. In order to achieve the above object, another technical aspect of the present invention relates to a roll-to-roll plating apparatus capable of controlling current uniformity, comprising a first roller, a second roller device, and a plating tank. A conveying path is formed between the first roller device and the second roller device. The plating tank is disposed between the first roller device and the second roller device and located on the conveying path. In addition, the plating bath includes at least one anode and at least one frame-shaped mask. At least one anode comprises a first zone and a second zone, wherein the first zone is located at a peripheral portion of the at least one M408571 anode, and the second zone is located at a central portion within the peripheral portion of the at least one anode relative to the first zone. The rate at which the flexible substrate is plated is higher than the rate at which the second substrate is plated on the flexible substrate. At least one frame-shaped mask is disposed corresponding to the first region of the at least one anode such that the first region is shielded by the frame-shaped mask. According to an embodiment of the present invention, the width of the frame-shaped mask can be adjusted so that the thickness of the flexible substrate is the same. According to another embodiment of the present invention, at least one of the second regions of the anode is used to electroplate the flexible substrate. According to still another embodiment of the present invention, the plating apparatus is an upright plating apparatus or a horizontal plating apparatus. According to yet another embodiment of the present invention, at least one of the anodes is a soluble anode V or an insoluble anode. According to still another embodiment of the present invention, at least one of the anodes is a titanium plate or a titanium mesh. According to another embodiment of the present invention, the frame-shaped mask comprises plastic. For a new type of technical content, the present embodiment improves the softness and degree of non-uniformity caused by the difference in read rate of electroplating on the anode substrate in the plating bath by means of the current electrode plate structure on the board. [Bei Shi method] The embodiment is not described in detail with reference to the drawings, but the description provided is not intended to limit the scope of the 2 system, the new type, and the sequence of structure operation and execution 'any component Recombining the 6 M408571 structure, resulting in an equivalent device, is covered by the new model. The drawings are for illustrative purposes only and are not in accordance with the original dimensions (4). 1 is a schematic view showing the appearance of a roll-to-roll plating apparatus 100 capable of making a chargeable 3 uniformity according to an embodiment of the present invention. The coil-to-coil ore apparatus 100 that can be used for uniformity includes a first roller device, a second roller device 120, and an electric clock slot 130. Among them, the roll-to-roll key device 100 capable of controlling current uniformity may be an upright electro-metal or horizontal plating device depending on actual needs. In the present embodiment, the roll-to-roll plating apparatus 1 which can control the electric=uniformity is an upright electroplating apparatus, but the present invention is not limited thereto. In operation, the roll-to-roll plating apparatus 100 capable of controlling current uniformity is mainly used for performing an electroplating process of the flexible substrate 200. A flexible copper foil substrate (Flexible Copper & ad Laminate, FCCL) can be formed by a controllable current; uniform roll-to-roll plating apparatus 1 (8) by plating a layer of copper foil on a soft substrate, but the present invention does not To be limited, the roll-to-roll plating apparatus 100, which can control current uniformity, can also be used in applications of various substrates and different materials. Further, the flexible substrate may be a flexible printed circuit board. A roll-to-roll plating apparatus 1 capable of controlling current uniformity may form a specific plating layer or plating pattern (e.g., metal wiring or the like) on the printed circuit board. In the present embodiment, the first roller device Π0 is the end of the flexible substrate 200: and the second roller device 120 is the receiving end of the flexible substrate 200, and a softness is formed between the roller skirt i 110 and the second roller device 12〇. Substrate 〇, transport path. In operation, the two ends of the flexible substrate 200 are respectively pulled by the two rollers and moved by the first roller device 11 toward the second roller device 120, but the present invention is not limited to this particular direction. M408571 As shown in Fig. 1, the plating tank 130 is disposed between the first drum unit u〇 and the second drum unit 120 and located on the conveying path, and the soft board 2 is pulled by the two drum units and passes through the conveying path. Therefore, the flexible substrate 200 is plated by the electric two grooves 130. The structure of the plate in the plating tank will be described in detail below. Referring to FIG. 2, FIG. 2 is a schematic view showing the structure of an electrode plate in a plating bath according to an embodiment of the present invention. The electrode plate structure includes an anode 132 and at least one frame mask 134. It should be noted here that: • The electrode plate structure is described below with only one set of anode 132 and frame-shaped mask 134. However, the present invention is not limited thereto. The anode: 132 can be divided into a first zone and a second zone on the anode 132 based on the difference in current distribution density. As can be seen from the figure, the first zone is located at the peripheral portion of the anode 132, and the second zone is located at a central portion within the peripheral portion of the anode 132 with respect to the first zone. First, the state in which the frame-shaped mask 134 is not disposed in the electrode plate structure will be described. Since the first region of the anode 132 has a higher current density than the second φ region, accordingly, when the flexible substrate 200 is plated by the anode 132 in the plating bath 130, the first region of the anode 132 is paired with the flexible substrate. The plating rate of 2〇〇 is higher than the plating rate of the second region to the flexible substrate 2〇〇. As a result, the plating thickness of the portion around the flexible substrate 200 is larger than that of the central portion, that is, the thickness of the key is not uniform, which affects the quality of the printed circuit board. Therefore, the present embodiment provides a frame-shaped mask 134 as shown in FIG. 2, which is disposed corresponding to the first region of the anode 132, so that the anode 132 can be replaced by the frame-shaped mask 134. One zone (that is, the high 8 M408571 current zone) is shielded. In other words, when the electrode plate structure having the frame-shaped mask 134 is utilized, the first region having a faster plating rate has been shielded, so that the electrode plate structure uses the second region of the anode 132 to perform a key bond on the flexible substrate 2 In the first region of the pole 132, the flexible substrate 2 is not plated, so that the problem of uneven plating thickness can be improved. It is important to note that the width of the frame mask 134 can be adjusted. In an optional embodiment, the frame mask 134 can be a telescopic structure, such that after the electrode plate structure of the present embodiment is electroplated to the soft substrate 200 shown in FIG. When the thickness of the finished product is uneven, the frame-shaped mask 134 can be adjusted according to actual needs to change the width of the frame-shaped cover 134. For example, when the thickness of the finished product (the soft substrate 2电镀 after electroplating) is found to be uneven: the frame-shaped mask 134 corresponding to the thicker portion of the finished product can be adjusted to cover the original product. Thicker areas so that the thickness of the finished product is the same. In the fabrication, the anode 132 can be made of a soluble anode or an insoluble anode depending on actual needs. In an embodiment, the anode 132 may be a titanium plate or a titanium mesh, and the frame-shaped cover 134 may comprise a plastic. However, the present invention is not limited thereto, and any person skilled in the art may not deviate from the spirit of the present invention. And a range of materials or structures that can be used for electroplating can be used as the anode 132, and the frame-shaped mask can employ any material that is used to block the first substrate of the anode 132 from electrically recording the flexible substrate 200. It can be seen from the above-described embodiments of the present invention that the application of the present invention has the following advantages. The present invention provides a method for forming an electrode plate in a plating bath, thereby improving the uneven current distribution on the anode in the plating bath, thereby causing a problem of uneven plating thickness on the flexible substrate due to the difference in plating rate. The above description has been made in the above embodiments, but it is not intended to limit the scope of the present invention. Any one skilled in the art can make various changes and retouchings without departing from the spirit and scope of the present invention. This is subject to the definition of the scope of the patent application. BRIEF DESCRIPTION OF THE DRAWINGS In order to make the above and other objects, features, advantages and embodiments of the present invention more obvious, the description of the drawings is as follows: FIG. 1 is a diagram showing an embodiment according to an embodiment of the present invention. A schematic diagram of the appearance of a roll-to-roll key device capable of controlling the uniformity of electrical φ flow. Figure 2 is a schematic view showing the structure of an electrode plate in a plating bath according to another embodiment of the present invention. [Main component symbol description] 100: Roll-to-roll plating apparatus capable of controlling current uniformity 110: First roller device • 120: Second roller device 130: Plating tank 132: Anode 134: Frame-shaped mask 200: Flexible substrate