201221702 六、發明說明： 【發明所屬之技術領域】 本發明係有關於一種電鍍裝置，且特別是有關於一種 電鍍槽中的電極板結構。 【先前技術】 印刷電路板(Printed Circuit Board, PCB)是根據電子元 件相互間配線的電路設計而在基板上形成導體的印刷配線 板。一般而§ ’印刷電路板是在絕緣板的表面上，對應配 線圖案來形成必要的電路佈線，如此一來，就可在印刷電 路板上密集地配置積體電路、電容器、電阻等各種電子元 件。 為了在絕緣板上形成電路佈線，需要反覆進行數次的 電解電鑛。此時’基板上電鐘厚度的均句與否，代表了印 板品質的好壞’其中電錄厚度均勻的印刷電路板品 然而，在電鍍槽中的陽極上會產生一種現象 在陽極板的料部分會形成高電流區， ^ 的低電流部分會形成低電流區，如此-來，由ί電:2 的不同，將導致基板±㈣鍍厚度科勻。、電鍍速率 因此’在電錄裝置的配置上，仍有進—步改善的空間。 【發明内容】 的是在提供一種電鍍槽中的電極板 本發明内容之一目 201221702 汪=:===:=: 電铲料广的’本發明内容之一技術樣態係關於-種 中的電極板結構，其包含至少一陽極以及至少一框201221702 VI. Description of the Invention: [Technical Field] The present invention relates to a plating apparatus, and more particularly to an electrode plate structure in a plating tank. [Prior Art] A printed circuit board (PCB) is a printed wiring board in which a conductor is formed on a substrate in accordance with a circuit design in which electronic components are wired to each other. Generally, the printed circuit board is formed on the surface of the insulating board to form necessary circuit wirings corresponding to the wiring pattern, so that various electronic components such as integrated circuits, capacitors, and resistors can be densely arranged on the printed circuit board. . In order to form a circuit wiring on an insulating board, it is necessary to perform electrolytic electrolysis several times. At this time, the uniformity of the thickness of the electric clock on the substrate represents the quality of the printed board. The printed circuit board in which the thickness of the printed circuit is uniform. However, a phenomenon occurs in the anode of the plating bath on the anode plate. The material portion will form a high current region, and the low current portion of ^ will form a low current region. Thus, the difference between ί: 2 will result in a substrate ± (four) plating thickness. , plating rate Therefore, there is still room for improvement in the configuration of the electric recording device. SUMMARY OF THE INVENTION An electrode plate in an electroplating bath is provided. One of the contents of the present invention 201221702 Wang =:===:=: The electric shovel has a wide range of technical aspects of the present invention. An electrode plate structure comprising at least one anode and at least one frame
一 =少—陽極包含第—區與第二區。第—區係位於 ^ 極的周邊部分。第二區相對於第一區而位於 =的周邊部分以内之中央部分。第一區對軟性基板進 二’又的速率向於第二區對軟性基板進行電鍍的速率。至 二框形遮罩與至少—陽極的第—區相對應配置，使得第 一區相對於軟性基板為框形遮罩所遮蔽。 根據本發明一實施例，框形遮罩的寬度可調整。 根據本發明另一實施例，至少一陽極之第二區係用以 對軟性基板進行電鍍。 根據本發明再一實施例，當軟性基板進行電鍍時，至 ,)陽極之第二區對軟性基板進行電鑛，而至少一陽極之 第一區不對軟性基板進行電鍍。 根據本發明又一實施例，框形遮罩包含塑膠。 為達上述目的，本發明内容之另一技術樣態係關於一 種可控制電流均一性的捲對捲電鍍裝置，其包含第一滾筒 ，置、第二滾筒裝置以及電鍍槽。第一滾筒裝置與第二滾 筒裝置之間形成一輸送路徑。電鍍槽配置於第一滾筒裝置 和第二滾筒裝置之間而位於輸送路徑上。 此外’電鑛槽包含至少一陽極與至少一框形遮罩。至 少一陽極包含第一區與第二區，其中第一區係位於至少一 201221702 =的周邊部分，第二區相對於第—區位於至少一陽極的 分㈣之中央部分’第—區對軟性基板進行電鍵的 連率尚於第二區對軟性基板進行電鍍的速率。至少一框形 遮罩，與至少一陽極的第一區相對應配置使得第一區為框 形遮罩所遮蔽。 根據本發明一實施例，框形遮罩的寬度可調整，以使 軟性基板的厚度相同。 根據本發明另—實施例，至少一陽極之第二區係用以 對軟性基板進行電錢。 根據本發明再一實施例，電鑛裝置係為直立式電鍍裝 置或水平式電鍍裝置。 根據本發明又一實施例，至少_陽極係為可溶性陽極 或不溶性陽極。 根據本發明另再一實施例，至少一陽極係為欽板或鈦 網0 根據本發明另又一實施例，框形遮罩包含塑膠。 因此，根據本發明之技術内容，本發明實施例藉由提 :共-種電鍍槽中的電極板結構，藉以改善電鍍槽中的陽極 板上電流分佈不均’從而基於_速率的不同而導致軟性 基板上電鑛厚度不均勻的問題。 【實施方式】 下文係舉實施例配合所附圖式作詳細說明，但所提供 2 = ϊ非用：限制本發明所涵蓋的範圍，而結構運作 田达非限制其執行之順序，任何由元件重新組合之 201221702 結構，所產生具有均等功效的裝置，皆為本發明所涵蓋的 範圍。其中圖式僅以說明為目的，並未依照原尺寸作圖。 第1圖係依照本發明一實施例繪示一種可控制電流均 一性的捲對捲電鍍裝置100的外觀示意圖。可控制電流均 一性的捲對捲電鍍裝置100包含第一滚筒裝置110、第二 滚筒裝置120以及電鍍槽130。其中，可控制電流均一性 的捲對捲電鍍裝置100可視實際需求而為直立式電鍍裝置 或水平式電鍍裝置。在本實施例中，可控制電流均一性的 鲁 捲對捲電鑛裝置1〇〇為直立式電鍛裝置，然本發明並不以 此為限。 於操作上，可控制電流均一性的捲對捲電鍍裝置100 主要用來進行軟性基板200的電鍍製程。藉由可控制電流 均一性的捲對捲電鍍裝置100在軟性基材鍍上一層銅箔， 便可以形成軟性銅f|基板（Fiexibie Copper Clad Laminate，FCCL)，然而本發明並不以此為限，可控制電流 均一性的捲對捲電鍍裝置1〇〇亦可用在各種基材與不同電 • 鍍材料的應用中。此外，軟性基板亦可為軟性印刷電路板， 可控制電流均一性的捲對捲電錢裝置丨可在印刷電路板 上形成特定的電鍍層或電鍍圖案（如金屬線路等）。 在本實施例中，第一滾筒裝置110為軟性基板200 給料端，而第二滾筒裝置120為軟性基板200的 第一滾筒裝置H0與第二滾筒敬置120之間形成軟性 2〇〇的輸送路控。於操作上，軟性基板2〇〇的兩端分^ 兩滾筒裝置牽引，並由第一滾筒裝置11〇向第二 120方向移動，但本發明並料此特定方向為限。 201221702 如第1圖所示，電鍍槽13〇配置於第一滾筒裝置uo 和第一滚筒裝置120之間而位於輸送路徑上，軟性基板200 由兩滾筒裝置牵引而經過輸送路徑，從而藉由電鍍槽13〇 對軟性基板200進行電鍍。以下將對電鍍槽中的電極板結 構進行詳細說明。 請參照第2圖’第2圖係依照本發明一實施例繪示一 種電鍍槽中的電極板結構示意圖。電極板結構包含至少一 陽極132以及至少一框形遮罩134。在此需先說明的是， % 以下僅以一組陽極132與框形遮罩134來介紹電極板結 構’然本發明並不以此為限。 在陽極132上基於電流分佈密度的不同，可將陽極132 劃分為第一區與第二區。由圖中可知，第一區是位於陽極 132的周邊部分，而第二區相對於第一區是位於陽極ι32 的周邊部分以内之中央部分。 首先’先說明在電極板結構中未配置框形遮罩134的 狀況。由於陽極132的第一區所具有的電流密度較其第二 馨 區為高’據此，當利用電鍍槽130中的陽極132對軟性基 板200進行電鍍時，陽極132之第一區斜軟性基板2〇〇的 電錢速率高於其第二區對軟性基板200的電鍍速率。如此 來’會導致軟性基板200周圍部分的電鍍厚度較其中央 部分為大，亦即電鍍厚度不均勻，而影響印刷電路板的品 質。 因此，本發明實施例提供如第2圖所示之框形遮罩 134,其與陽極132的第一區相對應配置，這樣的話，就可 以藉由框形遮罩134來將陽極132的第一區（也就是高電流 201221702 區）遮蔽起來。換s之’在利用具有框形遮罩的電極板 、u冓時’已將魏速率較快的第—區遮蔽，藉使電極板結 構，用其陽極132之第二區來對軟性絲進行電鑛， 而陽極I32之第-區則不會對軟性基板綱進行電鑛，如 此一來’即可改善電鍍厚度不均句的問題。 需特別注意的是，框形遮罩134的寬度可以調整。在 任選的-實施例中，框形遮軍134可為一可伸縮結構，如 此-來’在本發明實施例之電極板結構對第i圖所示之軟 籲性基板200進行電錢後的成品厚度不均時，可依據實際需 求來調整框形遮罩134以改變框形遮罩134的寬度。舉例 而言’當發現成品（經電鍍後之軟性基板細)的厚度不均 時，可藉由調寬相應於成品較厚部位的框形遮罩134，以 遮蔽原本會讓成品較厚的區域，從而使成品的厚度相同。 於製作上，陽極132可視實際需求而採用可溶性陽極 或不溶性陽極。在-實施例中，陽極132可為鈦板或欽網， 框形遮罩134則可包含塑膠，然本發明並不以此為限，任 • 何熟習此技藝者，在不脫離本發明之精神和範圍内，可採 用任何得用以進行電鍍的材料或結構來作為陽極132， 框形遮罩134可採用任何得用以阻擋陽極132之第一區 軟性基板200進行電鍍的材料。 °〇〇對 由上述本發明實施方式可知，應用本發明具有下 點。本發明實施例藉由提供一種電鍍射的電極板姓構， 藉以改善電鍍槽中的陽極上電流分佈不均，從而造^電錄 速率的不同而導致軟性基板上電鍍厚度不均勻的問題。又 雖然本發明已以實施方式揭露如上，然其並非用以限 201221702 定本發明，任何熟習此技藝者，在不脫離本發明之精神和 範圍内，當可作各種之更動與潤飾，因此本發明之保護範 圍當視後附之申請專利範圍所界定者為準。 【圖式簡單說明】 為讓本發明之上述和其他目的、特徵、優點與實施例 能更明顯易懂，所附圖式之說明如下： 第1圖係繪示依照本發明一實施例的一種可控制電流 •均一性的捲對捲電鍍裝置的外觀示意圖。 第2圖係繪示依照本發明另一實施例的一種電鍍槽中 的電極板結構不意圖。 【主要元件符號說明】 100 :可控制電流均一性的捲對捲電鍍裝置 110 :第一滚筒裝置 • 120 :第二滾筒裝置 130 :電鍍槽 132 :陽極 134 :框形遮罩 200 :軟性基板One = less - the anode contains the first zone and the second zone. The first zone is located in the peripheral part of the ^ pole. The second zone is located at a central portion within the peripheral portion of = with respect to the first zone. The rate at which the first region is on the flexible substrate is toward the rate at which the second region is plated on the flexible substrate. The second frame mask is disposed corresponding to at least the first region of the anode such that the first region is shielded from the frame by the flexible substrate. According to an embodiment of the invention, the width of the frame-shaped mask can be adjusted. According to another embodiment of the invention, at least one second region of the anode is used to electroplate the flexible substrate. According to still another embodiment of the present invention, when the flexible substrate is plated, the second region of the anode is subjected to electromineralization, and the first region of at least one anode is not plated with the soft substrate. According to yet another embodiment of the invention, the frame-shaped mask comprises plastic. In order to achieve the above object, another aspect of the present invention relates to a roll-to-roll plating apparatus capable of controlling current uniformity, comprising a first roller, a second roller device, and a plating tank. A conveying path is formed between the first roller device and the second roller device. The plating tank is disposed between the first roller device and the second roller device and located on the conveying path. Further, the electric ore tank comprises at least one anode and at least one frame-shaped mask. At least one anode comprises a first zone and a second zone, wherein the first zone is located at a peripheral portion of at least one 201221702=, and the second zone is located at a central portion of the at least one anode (four) relative to the first zone. The connection rate of the substrate for the electric bond is still at the rate at which the soft substrate is plated in the second region. At least one frame-shaped mask is disposed corresponding to the first region of the at least one anode such that the first region is shielded by the frame-shaped mask. According to an embodiment of the invention, the width of the frame-shaped mask can be adjusted so that the thickness of the flexible substrate is the same. According to another embodiment of the invention, the second zone of at least one anode is used to make money for the flexible substrate. According to still another embodiment of the present invention, the electric ore device is an upright plating device or a horizontal plating device. According to a further embodiment of the invention, at least the anode is a soluble anode or an insoluble anode. According to still another embodiment of the present invention, at least one of the anodes is a slab or a titanium mesh. According to still another embodiment of the present invention, the frame-shaped mask comprises plastic. Therefore, according to the technical content of the present invention, the embodiment of the present invention improves the current distribution unevenness on the anode plate in the plating bath by raising the electrode plate structure in the common plating tank, thereby causing the difference based on the _ rate. The problem of uneven thickness of the electric ore on the flexible substrate. [Embodiment] Hereinafter, the embodiments are described in detail in conjunction with the drawings, but the provided 2 = ϊ is not used: limiting the scope covered by the present invention, and the structural operation of Tada is not limited to the order of its execution, any component Recombining the 201221702 structure, resulting in devices with equal efficiency, are within the scope of the present invention. The drawings are for illustrative purposes only and are not drawn to the original dimensions. 1 is a schematic view showing the appearance of a roll-to-roll plating apparatus 100 capable of controlling current uniformity according to an embodiment of the invention. The roll-to-roll plating apparatus 100, which can control current uniformity, includes a first roll unit 110, a second roll unit 120, and a plating tank 130. Among them, the roll-to-roll plating apparatus 100 capable of controlling current uniformity may be an upright plating apparatus or a horizontal plating apparatus depending on actual needs. In the present embodiment, the unwinding electric power unit 1 which can control the current uniformity is an upright electric forging device, but the present invention is not limited thereto. In operation, the roll-to-roll plating apparatus 100 capable of controlling current uniformity is mainly used for performing an electroplating process of the flexible substrate 200. A soft copper substrate (Fixibie Copper Clad Laminate, FCCL) can be formed by coating a soft substrate on a soft substrate by a roll-to-roll plating apparatus 100 capable of controlling current uniformity. However, the present invention is not limited thereto. The roll-to-roll plating apparatus, which can control current uniformity, can also be used in various substrates and different electroplating materials. In addition, the flexible substrate can also be a flexible printed circuit board, and a roll-to-roll type money control device capable of controlling current uniformity can form a specific plating layer or plating pattern (such as a metal line or the like) on the printed circuit board. In the present embodiment, the first roller device 110 is a feeding end of the flexible substrate 200, and the second roller device 120 is a flexible 2〇〇 conveying between the first roller device H0 of the flexible substrate 200 and the second roller 200. Road control. In operation, the two ends of the flexible substrate 2 are pulled by the two roller devices and moved by the first roller device 11 to the second 120 direction, but the present invention is limited to this particular direction. 201221702 As shown in Fig. 1, the plating tank 13 is disposed between the first roller device uo and the first roller device 120 and located on the transport path, and the flexible substrate 200 is pulled by the two roller devices and passes through the transport path, thereby being plated by the plating device. The flexible substrate 200 is plated by the grooves 13A. The electrode plate structure in the plating bath will be described in detail below. 2 is a schematic view showing the structure of an electrode plate in a plating bath according to an embodiment of the invention. The electrode plate structure includes at least one anode 132 and at least one frame-shaped mask 134. It should be noted that the electrode plate structure is described below with only a set of anodes 132 and frame-shaped masks 134. However, the invention is not limited thereto. The anode 132 can be divided into a first zone and a second zone on the anode 132 based on the difference in current distribution density. As can be seen from the figure, the first zone is located at the peripheral portion of the anode 132, and the second zone is located at a central portion within the peripheral portion of the anode ι32 with respect to the first zone. First, the state in which the frame-shaped mask 134 is not disposed in the electrode plate structure will be described first. Since the first region of the anode 132 has a higher current density than the second region thereof, the first region of the anode 132 is a flexible substrate when the flexible substrate 200 is plated by the anode 132 in the plating bath 130. The rate of electricity of 2 turns is higher than the rate of plating of the second region to the flexible substrate 200. As a result, the plating thickness of the portion around the flexible substrate 200 is larger than that of the central portion, that is, the plating thickness is not uniform, which affects the quality of the printed circuit board. Therefore, the embodiment of the present invention provides a frame-shaped mask 134 as shown in FIG. 2, which is disposed corresponding to the first region of the anode 132. Thus, the anode 132 can be replaced by the frame-shaped mask 134. One zone (that is, the high current 201221702 zone) is covered. In the case of using the electrode plate with a frame-shaped mask, u冓, the first region with a faster Wei rate has been shielded. With the electrode plate structure, the second region of the anode 132 is used to perform the soft wire. The electric ore, and the first region of the anode I32 will not conduct electromineralization on the soft substrate, so that the problem of uneven plating thickness can be improved. It is important to note that the width of the frame mask 134 can be adjusted. In an optional embodiment, the frame-shaped shield 134 can be a telescopic structure, such that after the electrode plate structure of the embodiment of the present invention is applied to the soft-call substrate 200 shown in FIG. When the thickness of the finished product is uneven, the frame mask 134 can be adjusted according to actual needs to change the width of the frame mask 134. For example, when the thickness of the finished product (the thin flexible substrate after plating) is found to be uneven, the frame-shaped mask 134 corresponding to the thicker portion of the finished product can be widened to mask the area which would otherwise make the finished product thicker. So that the thickness of the finished product is the same. In fabrication, the anode 132 may employ a soluble anode or an insoluble anode depending on actual needs. In the embodiment, the anode 132 may be a titanium plate or a mesh, and the frame mask 134 may comprise a plastic. However, the invention is not limited thereto, and those skilled in the art may, without departing from the invention. Any material or structure that can be used for electroplating can be used as the anode 132 in the spirit and scope. The frame mask 134 can employ any material used to block the first region of the flexible substrate 200 of the anode 132 for electroplating. According to the embodiment of the present invention described above, the application of the present invention has the following points. The embodiment of the present invention provides an electroplating electrode plate structure to improve the uneven current distribution on the anode in the plating bath, thereby causing a problem that the electroplating rate is different, resulting in uneven plating thickness on the flexible substrate. While the invention has been described above by way of example only, the invention is not intended to be limited to the scope of the invention, and the invention may be modified and modified without departing from the spirit and scope of the invention. The scope of protection is subject to the definition of the scope of the patent application. BRIEF DESCRIPTION OF THE DRAWINGS The above and other objects, features, advantages and embodiments of the present invention will become more <RTIgt; A schematic view of the appearance of a roll-to-roll plating apparatus capable of controlling current and uniformity. Fig. 2 is a view showing the structure of an electrode plate in a plating bath according to another embodiment of the present invention. [Description of main component symbols] 100: roll-to-roll plating apparatus capable of controlling current uniformity 110: first roller device • 120: second roller device 130: plating tank 132: anode 134: frame-shaped mask 200: flexible substrate