^04997 五、新型說明： 【新型所屬之技術領域】 2作係-種散熱模組，其係提供—種導熱管直接接 ^人政熱之電子^件’以使電子元件具有較佳 之散熱模組。 政…议禾 【先前技術】 —隨著電腦科技的發達，電腦的處理速度與能力可說是 千里，但伴卩通著電腦效能越好，其内裝之電子元件， 1中央處理s、記憶體或其他相關零件，所產生的切 二ί了避免電子元件因過熱而毀損，故將電子元 元^散熱模組結合，以達到散熱之效果，進而保護電子 的散熱模組，其具有m —㈣與多根導 ::二熱！的一端係與底板熱接觸’導熱管的另端係穿 叹於，.'、曰=組令，鰭片組係可選擇性設於底板的—面。 於貫際使用時’將一導熱膏塗佈於欲散熱之電子元件 白勺—面’再將底板與該面結合，故電子元件於卫 j熱就會依序經由底板、導熱管與鰭片組，而散發至* 氣中，藉此達到散熱的效果。 x工 然上述的結構，仍有其尚待改進之處，因導妖 接㈣子元件接觸，f要透過底板將熱料至導熱 故=熱管之導熱效果往往會受到底板的f彡響，而使二二 不影’進而拖累整體散熱效能，而導致電子元件之毀損。 M404997 之間設有導熱膏40，以 30A的效果。 电兀件4將熱傳導至接觸端 如圖五所示，其為本創 遍形成有-熱源接觸面3丨β，多個接觸端 高於貼近面10,此—言声#沾：：原接觸面训的高度係^04997 V. New Description: [New Technology Field] 2 is a series of heat-dissipating modules, which provide a kind of heat-conducting tube directly connected to the electronic heat of the person's heat to make the electronic components have a better heat-dissipating mold. group. Politics...Women [previous technology] - With the development of computer technology, the processing speed and ability of computers can be said to be thousands of miles, but the better the computer performance, the electronic components inside, 1 central processing s, memory The body or other related parts are cut to prevent the electronic components from being damaged by overheating. Therefore, the electronic element heat dissipation module is combined to achieve the effect of heat dissipation, thereby protecting the electronic heat dissipation module, which has m — (four) with multiple roots:: two hot! One end is in thermal contact with the bottom plate. The other end of the heat pipe is worn, and the '', 曰= group command, the fin group can be selectively disposed on the bottom surface of the bottom plate. In the continuous use, 'applying a thermal paste to the surface of the electronic component to be cooled" and then bonding the bottom plate to the surface, so that the electronic components will pass through the bottom plate, the heat pipe and the fins in sequence. The group is emitted into the air to achieve the heat dissipation effect. x work of the above structure, there is still room for improvement, because the guide demon (four) sub-component contact, f through the bottom plate to heat the heat to the heat = heat pipe heat transfer effect will often be affected by the bottom plate, and The second and the second are not affected, which in turn drags down the overall heat dissipation performance and causes damage to the electronic components. A thermal paste 40 is provided between M404997 to achieve a 30A effect. The electric component 4 conducts heat to the contact end as shown in FIG. 5, which is formed by the heat source contact surface 3丨β, and the plurality of contact ends are higher than the close surface 10, which is the same as the original contact. Height of face training
仙與電子元件4之間的^人二增加熱源接觸面 與電子元件4結合時，“二:熱源接觸面31B 產生的熱得直接藉由熱源接觸：二:至 導熱管3具有快速導熱的性能，===處，因 地經由導熱管3傳導至籍片組2 = 4 =可快速 佳的散纽果。 ❿使奸兀件4具有更 端示献其係為本創作之第三實施例售 而0C也成有一熱源接觸面ye， 係低於貼近面10之高度，此一古接觸面31C之高度 ==?子:件4結合時，部分的電子元物 的二ΐ 子元件4與底板1之間具有更佳 效果：以使元件4與熱源接觸面31C之間接觸 片Lr 於工作時所產生的熱得以傳導至轉 雖及^上所之具體實施例，僅係用於例釋本創作之特 :占二力效’而非用於限定本創作之可實施範疇，於未脫】 作上揭之精神與技術範疇下，任何運用本創作所枵干 效改變及修飾，均仍應為下When the heat source contact surface is combined with the electronic component 4, the heat generated by the heat source contact surface 31B is directly contacted by the heat source: 2: the heat pipe 3 has a rapid heat conduction performance. , ===, the ground is transmitted to the film group 2 through the heat pipe 3 = 4 = fast and good fruit. The 兀 兀 4 4 具有 具有 具有 兀 兀 兀 兀 兀 兀 兀 兀 兀 兀 兀 兀 兀The 0C also has a heat source contact surface ye, which is lower than the height of the close surface 10, and the height of the ancient contact surface 31C ==?: When the member 4 is combined, the partial electronic component of the electronic component 2 The bottom plate 1 has a better effect: the specific heat of the heat generated by the contact piece Lr between the element 4 and the heat source contact surface 31C during operation is transferred to the specific embodiment, and is only used for the explanation. The special feature of this creation: the role of the two forces is not used to limit the scope of implementation of this creation, and it is still not removed. Under the spirit and technology of the above, any use of this creation is changed and modified. Should be under
S M404997 【圖式簡單說明】 圖一係本創作之散熱模組之平面示意圖。 圖二係本創作之底板之剖面示意圖。 圖三係本創作之底板與導熱管於未加工時之局部剖面 示意圖。 圖四係本創作之底板與導熱管之第一實施例結合一具 有導熱膏之電子元件之局部剖視意圖。 圖五係本創作之底板與導熱管之第二實施例結合具有 導熱膏之電子元件之局部剖視意圖。 圖六係本創作之底板與導熱管之第三實施例結合具有 導熱膏之電子元件之局部剖視意圖。 【主要元件符號說明】 1 底板 10 貼近面 11 容置槽 12 凸肋 13 設置面 2 鰭片組 3 ^、、、 σ 30、30A、30B、30C 接觸端 31A、31B、31C 熱源接觸面 4 電子元件 40 導熱膏S M404997 [Simple description of the diagram] Figure 1 is a schematic plan view of the thermal module of the creation. Figure 2 is a schematic cross-sectional view of the bottom plate of the present creation. Figure 3 is a partial cross-sectional view of the base plate and heat pipe of the present invention when unprocessed. Figure 4 is a partial cross-sectional view of an electronic component having a thermal paste in combination with the first embodiment of the substrate and the heat pipe of the present invention. Figure 5 is a partial cross-sectional view of an electronic component having a thermally conductive paste in combination with a second embodiment of the substrate and heat pipe of the present invention. Figure 6 is a partial cross-sectional view of an electronic component having a thermal paste in combination with a third embodiment of the substrate and heat pipe of the present invention. [Main component symbol description] 1 Base plate 10 Close to the surface 11 Locating groove 12 Rib rib 13 Setting surface 2 Fin set 3 ^, , σ 30, 30A, 30B, 30C Contact end 31A, 31B, 31C Heat source contact surface 4 Electron Component 40 Thermal paste