TWM400100U - Quasioptical LED package structure that can adjust brightness and lighten the light source based on the dividing zones - Google Patents

Description

M400100 V. New Description: [New Technology Field] This creation is about a mixed-light LED package structure, especially a light-mixing LED package with adjustable brightness and zone lighting source. . [Prior Art] The lighting equipment used in the market today, such as fluorescent lamps, tungsten lamps, and even the most popular energy-saving bulbs that have been widely accepted by the public, have been widely used in daily life. However, most of these lamps have the disadvantages of fast light attenuation, high power consumption, high heat generation, short life, fragile or difficult to recycle, and the traditional color of the fluorescent lamp is poor, so the pale light is not popular. . Therefore, in order to solve the above problems, a related light-emitting device using a light-emitting diode is born. [New content] The technical problem to be solved by this creation is to provide a light-mixing light-emitting diode package structure, which can adjust the brightness and partition the light source according to different requirements. In order to solve the above technical problem, according to one aspect of the present invention, a light-mixing LED package structure capable of adjusting a brightness and a partition lighting source is provided, comprising: a substrate unit, an illumination unit, a frame unit, and A package unit. The substrate unit has at least one substrate body, at least two crystallized regions disposed on an upper surface of the substrate body, and at least four power input pads disposed on an upper surface of the substrate body. The illuminating unit has at least one first illuminating module for generating a first color temperature and at least one second illuminating module for generating a second color temperature, wherein the at least one first illuminating module has a plurality of electrical properties a first light emitting diode die disposed on one of the crystallographic regions of the substrate 3/23 M400100 and electrically connected to the two power input pads, and the at least one second light emitting module has a plurality of The second LED body is electrically connected to another crystal region of the substrate unit and electrically connected to the other two power input pads. The frame unit has at least two wraparound frame colloids that are circumferentially formed on the upper surface of the substrate body, wherein the at least two wraparound frame colloids surround the at least one first light emitting module and the at least a second light emitting module to respectively form at least two colloidal limiting spaces above the substrate body. The package unit has at least one first light-transmissive encapsulant and at least one second light-transmissive encapsulant formed on the upper surface of the substrate body to cover the at least one first light-emitting module and the at least one second light-emitting module, respectively. The at least one first light-transmissive encapsulant and the at least one second light-transmissive encapsulant are respectively confined in the at least two colloidal limiting spaces. Therefore, the beneficial effect of this creation is that the creation of "light-emitting diodes capable of generating high color temperature" and "light-emitting diodes capable of generating low color temperatures" are connected in series or in parallel, and through external power supply input pads A dimming light emitting diode package structure that is used to produce an adjustable brightness and a zoned illumination source. Furthermore, the present invention forms a wraparound frame colloid (wrap-around white colloid) which can be arbitrarily shaped by a coating method, and limits the position of a light-transmitting encapsulant (fluorescent colloid) through the wraparound frame colloid. Further, since the surface shape of the light-transmitting encapsulant is adjusted, the LED package structure of the present invention can "improve the luminous efficiency of the light-emitting diode crystal grains" and "control the light-emitting angle of the light-emitting diode crystal grains". In order to further understand the characteristics and technical content of this creation, please 4/23 only:: The detailed description and drawings of this creation, however, the drawing and the system of the drawing are not intended to limit the creation. L Besch mode] 接 = = Γ Γ ί ί ί ί ί ί ί ί ί ί ί 第一 第一 第一 第一 第一 第一 第一 第一 第一 第一 第一 第一 第一 第一 第一 第一 第一 第一 第一 第一 第一 第一 第一 本 本 本 本 本 本_, which includes a substrate unit! - a light-emitting unit, one side of the frame 7L 3 and a package unit 4. The substrate unit 1 has at least a substrate body ig, at least two ΐ:=Γ; 10 a crystallized region u on the upper surface, and at least four, a f-pad 12 on the upper surface of the board body 1 (). In addition, the circuit board has a circuit board 100, a heat dissipation layer 101 disposed on the circuit board, a plurality of circuit board (10) disposed on the circuit board (10), and a surface disposed on the circuit board ι0. = the insulating layer 103 of the shaft 102. Therefore, the dissipation = 〇rrr the heat dissipation performance of the circuit 〇 plate, and the #曰, 曰 can be used to expose only the conductive pads 102. Limiting the solder resist layer of the soldering region. The first light emitting unit has at least one m2a for generating a first color temperature and at least one second illuminating panel group 2b for generating a second color temperature, wherein the dice 2; ^ 5x is set in the substrate unit i 2; ^ two hair f mo group 2a has a plurality of electric, 々 /, in a crystallized area 11 and electrically connected == power supply Α 塾 塾 之 12 first light two The polar body 20a of the US plate 'the first light-emitting module 2b has a plurality of electrical devices disposed on the substrate earlier than the first one. The pad 12 is electrically connected to the other two designers to be in the substrate-/first-polar body die. In other words, at least two predetermined sets of 5/23 M400100 are planned on the board early 70 1 The crystal region 11 is such that the first LED dipoles 20a and the second LED dipoles 20b can be electrically placed on at least two crystallized regions U of the substrate unit 1 respectively. And electrically connected to two of the power input pads 12 and the other two power input pads 12. For example, the first light-emitting diode die 20a and the second light-emitting diodes are daily. The granules 20b are electrically connected to the two morphing regions u of the substrate unit 1 by means of wire-bonding. In addition, the first illuminating diode dies 20a can pass through the circuit substrate. 1〇c of which: part of the circuit 'electrically connected to two of the power input pads 12' and # some of the second LED die can be passed through the circuit board = another part of the circuit to electricity Sexual connection to the other two power supplies into the above four power wheels with the same or different current) selective pass 20a And 第 ❸ - - % % 忒 忒 & & & & & & & & & & & & & & & & & & & & & & & & “ & “ “ “ “ “ “ “ “ “ “ “ “ “ Two through-coating methods, the i-th auxiliary (10) and the upper station-on-the-ground, form at least two of the substrate body = the optical module 2b,, , 300. In addition, depending on the colloidal limit of the different vacancies, the wrap: the rim 30 can be connected to each other in series or in parallel with the wraparound reflective colloid. Each type of frame colloid-plate body has an angle of := 6/23 Θ between 40 and 50 夕 M, and the top surface is relative to the plate cutting glue 30 30 7 mm ^ —, the twist of the clothing back h is between 〇3 to 1:5 = : f The width of the bottom of the colloidal body 30 is between the thixotropy index of the parent core-wound frame colloid 30 =:; Π:: between 4 and 6 'and each ring 2 = Photocolloid) / n Addition of white heat-hardening gelatin colloid (many packs = outer 2 filaments: a wraparound side-turning body 30 made to / including. Bai Xian, ίchen winding coating body, above table , _ 2: 1 not surrounded: = plate body 〗. The speed of the upper surface of the upper table =; 5 coating: the liquid glue on the substrate (four) carved plastic heat between dry u: mm / s, and surround The liquid is applied; the starting point and the ending point of the upper surface of the soil plate body are the same = the liquid winning material is solidified to form a wraparound frame η, and the colloid 30 is disposed around the crystallizing area. The beauty of the board is two sacral tablets (2 〇...0b) 'to form - located in the = butterfly, the temperature of the series is between 12., and the fire and the time of roasting is between 20 and 40 minutes. t two-faced early 疋 4 has a shape formed on the substrate body 10 = at least - And the at least one first light transmissive package is at least one of the first light transmissive package and the at least one first light transmissive package 4% of the winning body is respectively limited to >, two colloidal limiting spaces 300 0, and the upper surface of the at least one first 7/23 optical seal t-colloid 40b is convex. For example, The wavelengths of light generated by the first light-emitting diode grains 2 and the light-emitting diode grains 2 0 b are between a & a second and a second. 々, 4〇〇nm to 500nm, a younger brother, a light-emitting diode Where the grain is = polar body grain, the at least - the first light-transmissive sealing body is a fluorescent colloid of the first-color, and the first light-emitting diodes ^

.. ^Di light translucent colloid 40a to J

The color temperature is approximately the yellow light beam. Thus, the above structures are combined into a first group of light-emitting structures m. The first group of light emitting structures N body ίο, the ninth Λ Λ 亥 亥 知 知 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。

In addition, the first first light-emitting diode die 20b is a blue light-emitting body=pole body, and the at least-second second-packing body is a fluorescent body having a first color, and the second light-emitting body The light beam generated by the diode die 20b passes through the at least-second light-transmissive package to produce a white light beam of 6500K, so that the above structures are combined into a second group of light-emitting structures N2. The second group of light-emitting structures N2 includes: the substrate body 1〇, the second light-emitting diode chips 20b, the wraparound frame glue 30, and the second light-transmissive package knee body. ▲ Further, according to different design requirements, the first group of light-emitting structures N1 纟#N2 can be co-closed - one substrate single it 1 (as in the first example) or different substrate units respectively, and the first

Nl combines with the second group of light-emitting structures N2 to create a hybrid light-emitting diode package structure. 8/23 Referring to the second A and second figures, the second embodiment of the present invention is a light-mixing light-emitting diode structure 可 which can adjust the brightness and the partition lighting source, and includes: - a substrate The unit i frame unit and the package unit 4, wherein the light emitting unit generates a first light emitting module 2a of a first color temperature and at least one second light generating group 2b for generating t color temperatures. The greatest difference between the second embodiment of the present creation and the first = example is that in the second embodiment, the at least two % of the surrounding frame glues 30 can be arranged in parallel and connected to each other. According to the second c and second figures, depending on the design, the wraparound frame colloid 3Q can be a fluorescent colloid. In other words, the two products are selectively added with phosphor powder in each of the two framed colloids 3G, thereby reducing the package unit 4 to 4〇b light encapsulation colloid 4, such as at least one Two transparent package encapsulation. Thus, depending on the different embodiments, each of the "successful" limbs may be a fluorescent colloid or a reflective colloid. Connection: See the third to third figures E, the third embodiment of this creation is to adjust the brightness and the partition lighting system of the mixed light diode furnace 2: (Ml to Μ 5) 'and each The group of light-mixing light-emitting diode packages is bonded to Μ5) consisting of at least a first group of light-emitting structures N1 and at least one second group of light-emitting structures N2. A first group of mixed light emitting diode package structures M1 is composed of a first structure N1 and a second group of light emitting structures N2 connected in series. The 赉 light-emitting diode package structure M2 is composed of two first groups of light-emitting three groups, .θ and two second groups of light-emitting structures Ν2 alternately connected in series. The first light-emitting diode package structure Μ3 is composed of two first groups of light-emitting junctions and two second groups of light-emitting structures Ν2 alternately connected in series. The fourth 9/23 0〇〇1〇° group light-mixing light-emitting diode package structure N1 and the second group of light-emitting structures (10) group light-emitting structure light structure Ν2 are located in the above two first-group light-emitting two-group light mixing type The fifth between the LED package structure

Ni and the two second group of light-emitting structures make a first group of light-emitting structure light junctions = (10) the above two second group of light-emitting junctions two: - group of white hair J Matang 忐 colloidal body 0 for the sentence of the ancient,, with different The demand for selective 妯' 1 creation of the border colloid 3. (D) and reduce the: installed; Yuanguang with the situation. Therefore, the dark (four) between the same and the same can be the fluorescent colloid ray; ^ 'mother-position frame glue to the second figure to the figure _, the fourth embodiment of the creation = == The source of the light-mixing light-emitting diode frame unit 3 and the substrate is a light-emitting unit, and the fourth embodiment is different from the first embodiment in that the frame unit 3 has a transmissive coating. In the manner of the surrounding glue, the surrounding frame is less than n, wherein the above-mentioned group 2a surrounds the first colloid 婊a of the at least one first-light-emitting mode limiting space 30^ above the substrate body 1〇 with (4) 5 and The at least one second wraparound frame colloid 30b encloses the group % and the at least one first wraparound ridge 3〇a' to form at least one above the substrate body U) and has a position of 10/23 M40〇i〇〇1 The second body limiting space 3_ between the at least one first surrounding frame colloid 30a and the at least one second soil surrounding frame winning body 30b. In addition, the fourth package unit 4 has a top surface of the substrate body 1 to cover at least one of the first light emitting module 2a and the at least one first light emitting module 2b. And at least one second light-transmissive encapsulant 40b, wherein the at least one first light-transmissive encapsulant 40a is confined within the at least one first colloidal confining space %, and the at least one second transparent encapsulating colloid 4 b is limited to the at least one second colloidal limit space 300b. In addition, the at least one first wraparound frame body 30a and the at least one second wraparound frame colloid are arranged in a concentric circle and the at least one second light emitting module 2b is disposed on the at least one first wraparound frame colloid 30a is interposed between the at least one second wraparound frame colloid 30b. And the upper surface of the at least one first wraparound frame body 30a is a circular arc shape, and the angle of the at least one first wraparound frame colloid 3〇a is tangent to the arc of the upper surface of the substrate body 10 Between 4〇 and 5〇, the height of the top surface of the at least one first surrounding frame colloid 3〇a relative to the upper surface of the substrate body 10 is between 0.3 and 〇.7 mm, and the at least one The width of the bottom of a wraparound frame colloid 3〇a is between 3 mm, and the thixotropic index of the at least one first wraparound frame colloid 3〇a is between 4 and 6, and at least The first wraparound frame colloid 30a is a white thermosetting frame colloid mixed with an inorganic additive. In addition, the upper surface of the at least one second surrounding frame colloid 3b is a circular arc shape, and the angle of the at least one second surrounding frame colloid 3〇b is tangent to the arc of the upper surface of the substrate body 10. Between 5 and 11/23, the top surface of the at least-second wraparound frame colloid 相对 is between 0.3 and mm7 mm with respect to the upper surface of the 戎 substrate body 10, and the at least one second surround The bottom of the framed colloid 30b has a width of between 5 and 5, and the at least-second wraparound frame colloid has a thixotropic index of between 4 and 6, and the at least one of the two wraparound frames The colloidal bird's a white thermal border colloid mixed with an inorganic additive. Referring to the fifth embodiment, a fifth embodiment of the present invention provides a light-mixing LED package structure M that can adjust the brightness and the partition lighting source, and the first group of light-emitting structures N1 and the second group emit light. The structure Ν 2 is composed. Further, the greatest difference between the fifth embodiment of the present creation and the fourth embodiment is that, in the fifth embodiment, the positions of the first group of light emitting structures N1 and the second group of light emitting structures N2 are reversed from each other. Therefore, the present invention can be provided by the designer, and the low color temperature first group light emitting structure N1 is disposed on the inner ring and the high color temperature second group light emitting structure N2 is disposed on the outer ring (as shown in the fourth embodiment). Or, the low color temperature first group of light emitting structures N1 are disposed on the outer ring and the high color temperature second group of light emitting structures N2 are disposed on the inner ring (as shown in the fifth embodiment). As shown in the sixth to sixth embodiments, the sixth embodiment of the present invention provides a light-mixing LED package structure that can adjust the brightness and the partition lighting source, and includes: a substrate unit, A light emitting unit, a frame unit 3 and a package unit 4. The sixth embodiment is different from the fourth embodiment in that: in the sixth embodiment, the at least one first wraparound frame colloid 30a and the at least one second wraparound frame colloid 30b are formed according to different design requirements. All can be fluorescent colloids. In other words, the present invention can selectively add fluorescent powder to the at least one 绕 式 边 边 边 30a and the at least one second surrounding frame moon dream 12/23 M400100 〇b So that the light source can be guided to the at least one first colloid 40a and the at least one second transparent encapsulant colloid to reduce the at least one first light transmissive colloid 40a and the at least one The dark band between the two transparent encapsulants 40b.

As shown in the seventh figure, the seventh embodiment of the present invention provides a light-mixing LED package structure 可调, which can be adjusted to the 'U degree and the knife-edge light source of the knife area, and its ft! ^ — substrate unit 1. A lighting unit, a frame unit 3 and a packaging unit 4. The maximum difference between the seventh embodiment of the present invention and the fourth embodiment is: in the seventh embodiment, the at least one first wraparound frame colloid 30a is a fluorescent colloid according to different design requirements, and the at least one '^Wraparound frame colloid 3〇b is a reflective colloid. In other words, the present invention can selectively add phosphor powder to the at least one first wraparound frame body 30a according to different needs, so that the light source can be guided to the at least one first light transmissive encapsulant 40a. The dark band between the at least one first light-transmissive encapsulant 4〇a and the at least one second light-transmissive encapsulant 4〇b is further reduced between the at least one second light-transmissive encapsulant 4〇b. In addition, through the technique of "the at least one second wraparound frame colloid 3b is a reflective colloid", the light source emitted by the light-mixing LED package structure can be concentrated. Please refer to the eighth figure and the following table. The following table is the first group of light-emitting structures Ν1 (3500Κ), the second group of light-emitting structures Ν2 (6500Κ) after introducing different currents (mA) in one embodiment of the present invention, and Correlation measurement of the light source generated by the mixed light-emitting diode package g Μ (3500Κ+6500Κ): Condition Ν1 Ν2 Μ (3500Κ+6500Κ)

CIE X | CIE y CRI CCT 13/23 1 1 OmA 680mA 0.316 0.356 76 6176 2 34mA 680mA 0.314 0.352 77 6296 3 340mA 680mA 0.326 0.339 82 5812 4 680mA 680mA 0.331 0.331 84 5553 5 1020mA 680mA 0.329 0.323 85 5690 6 1360mA 680mA 0.321 0.314 85 6139 7 680mA 340mA 0.314 0.313 83 6535 where CIE χ and CIE y are CIE (International

Commission on .Illumination, International Commission on Illumination) x and y coordinates of the xy chromaticity diagram; unit of color rendering index (CRI) is Ra ( Rendering M400100)

Average), the unit of relative color temperature (CCT) is K (kelvin). Thereby, when the 3500K yellow light beam generated by the first group of light emitting structures κη is mixed with the 6500K white light beam generated by the second group of light emitting structures N2, the mixed light emitting diode package structure Μ (3500K+6500K) ), as shown in Figure 8 and the above table, the mixed light effect ~ 〆 V mountain 〇 ^ dish W, J lean and body" and "light-emitting diodes capable of producing low color temperature" (four) or Qi Qinqi, and through external connection (4) of the electric division to produce a difficult-to-light structure of a mixed-light LED that can illuminate and partition the light source. Μ In addition, this creation through the coating method to form a, round frame of colloid (wrap-around white colloid), over two: weigh the material: the position of the nine pounds of colloid (fluorescent colloid) Wei from her _ table _ shape Therefore, the illuminating 14/23 body-enclosed structure of the present invention can "improve the luminous efficiency of the illuminating-pushing smoky smog-the squirrel-day granules" and the "light-emitting angle of the fine particles". In other words, by using the surrounding body limit ^ ' money, the silk returning body is limited to the plastic bottle, and the amount of the light-transmissive package can be controlled, and the amount of the light-transmissive package can be controlled. And the position, ί encapsulates the surface shape and height of the colloid, thereby controlling the "light beam angle of the white beam produced by the grain"; in addition, the illuminating 2 can be hunted by the wraparound side (4) to make the 4 capsules The generated light beam is projected onto the structure of the surrounding frame body, and the light can further increase the "best and feasible embodiment of the creative creation of the present invention." The equivalent technical changes in this manual and the drawings are included in the scope of this creation. [Simplified description of the drawings] The first and the first drawings are schematic views of the first embodiment of the creation; B is a side cross-sectional view of the first embodiment of the present invention; A is a top view of the second embodiment of the creation; B is a side cross-sectional view of the second embodiment of the creation; Shown on a second embodiment Figure D is a side view of another second embodiment of the creation of the second embodiment. Figure A is a top view of the first type of serial connection of the third embodiment of the creation; The second schematic diagram of the second serial connection mode of the embodiment; 15/23 M400100 The third C diagram is a top view of the third _ connection mode of the third embodiment of the creation; The fourth type of the serial connection mode of the embodiment is a top view; the third E picture is a top view of the fifth serial connection mode of the third embodiment of the present invention; The top view of the sixth embodiment is a top view of the fourth embodiment of the present invention; the fourth B is a side view of the fourth embodiment of the present invention; 5 is a top plan view of a sixth embodiment of the present invention; FIG. 6B is a side cross-sectional view of the sixth embodiment of the present invention; a side view of the cross section; and the eighth figure is an embodiment of the creation Xy chromaticity coordinate diagram. [Main component symbol description] LED package structure Μ, Ml to M5 The first group of light-emitting structures N1 Second group of light-emitting structures N2 Substrate unit 1 Substrate body 10 Circuit board 100 Heat-dissipation layer 101 Conductive welding Pad 102 Insulation layer 103 Crystallization area 11 Power input pad 12 16/23 M400100 First light-emitting module 2a First light-emitting diode die 20a Second light-emitting module 2b Second light-emitting diode die 20b Frame unit 3 wraparound frame colloid 30 first wraparound frame colloid 30a second wraparound frame colloid 30b colloidal limit space 300 first colloid limit space 300a second colloid limit space 300b arc tangent T angle Θ height h package unit 4 First light transmissive encapsulant 40a second light transmissive encapsulant 40b

17/23

Claims (1)

The patent application scope is as follows: 1. A mixed light emitting diode package structure capable of a brightness and a partitioning light source, comprising: a substrate unit having at least one substrate body, at least two disposed on the substrate body a morphing region of the upper surface, and at least four power input pads disposed on the upper surface of the substrate body; a light emitting unit having at least one for generating a first color temperature: a light emitting module and at least one for a second illuminating panel group for generating a second color temperature, wherein the at least one of the at least one first illuminating module has a plurality of electric amps disposed on one of the morphing regions of the substrate unit and electrically connected to two of the power input pads The first light-emitting diode die 2 of the pad and the at least one second light-emitting module have a plurality of electrically disposed on the other-crystallized region of the substrate substrate and electrically connected to the source input pad a second light-emitting diode die; having a wraparound frame colloid that surrounds and is formed on the upper surface of the substrate body by at least two through-coating methods, at least two wraparounds Border colloid Separating the at least: the light-opening module and the at least the second light-emitting module, respectively, in two compartments; two jumper positions on the substrate body are empty, and have a shape formed on the upper surface of the substrate body to respectively be respectively The illuminating module and the at least the second illuminating package are respectively limited to a first light transmissive encapsulant and at least one upper body, and at least the first translucent encapsulant and the second encapsulant colloid are respectively limited to 18/23 M400100 2. The mixed light emitting diode package structure of the adjustable brightness and the partition lighting source according to the first aspect of the patent application, wherein each of the first light emitting diode crystal grains is a blue The light emitting diode die, the at least one first light transmitting encapsulant is a phosphor colloid having a first color; each of the second light emitting diode grains is a blue light emitting diode die, The at least one second light-transmissive encapsulant is a phosphor having a second color-color; the wavelength of the light generated by the first light-emitting diode die and the second light-emitting diode die is between Between 400nm and 500nm •. 3. The mixed light emitting diode package structure of the adjustable brightness and the partition lighting source according to claim 1, wherein the first color temperature generated by the at least one first light emitting module is less than or greater than The second color temperature generated by the at least one second light emitting module. 4. The light-mixing LED package structure of the adjustable brightness and the partition lighting source according to the first aspect of the patent application, wherein the at least two wraparound frame colloids are fluorescent colloids or reflective colloids. 5. The light-mixing LED package structure of the adjustable brightness and the partition lighting source according to claim 1, wherein the at least two wraparound frame colloids are selectively separated or connected to each other. Together, the at least two wraparound frame collins are connected to each other in series or in parallel. 6. The mixed light emitting diode package structure of the adjustable brightness and the partition lighting source according to the first aspect of the patent application, wherein the upper surface of each of the surrounding frame colloids has a circular arc shape, each surrounding The angle of the frame border colloid with respect to the arc tangent of the upper surface of the substrate body is between 40 and 50 degrees, and each of the wraparound frame colloids is a white heat hardening frame colloid mixed with an inorganic additive. 19/23 A light-mixing LED package structure capable of adjusting a brightness and a partitioning light source, comprising: a substrate unit having at least one substrate body and at least two crystallized regions disposed on an upper surface of the substrate body And at least four setting sides, a power input pad of the upper surface of the θ substrate body; and a light sheet 70 having at least one for generating a first color temperature: the light emitting module and the at least one for generating the second The second illumination group of the color temperature has a plurality of electrical sighs placed on one of the crystal regions of the substrate unit and electrically connected to two of the power supply pads The second light-emitting diode has a plurality of electrically disposed on the other crystallized region of the earth plate unit and is electrically--the two ingeniously soldered a second light-emitting diode die; in addition, it has a through-coating pattern formed thereon; at least one first wraparound frame colloid and a matte wraparound frame colloid, wherein the at least— First border gel body Surrounding the at least one first light-emitting module, the first colloidal space above the substrate body, the at least one second wraparound frame colloid surrounding the body, the group and the at least one first wraparound At least the "frame" is located above the substrate body and is located between the above-mentioned two-in-one frame-like frame colloid and the at least one second planting device, and the second body limit space between the colloids; Covering:: to the upper surface of the board body to be at least one of the optical molds and the at least one of the second light-emitting encapsulants and at least one second through 20/23 _01Ό〇' ί: At least one first light-transmissive encapsulant is disposed in the crucible-first colloidal confinement space, and the above-mentioned two to two: the Jingjing colloid is limited to the adjustable brightness and the partition point described in the above-mentioned at least-second victory The bright type 4 light-emitting diode package structure, wherein each of the first first-pole body grains is a blue light-emitting diode die, and the at least one body has a first color of fluorescent light Body particle, two-pole crystal grain is a blue light-emitting diode crystal Fluorescent colloid, the first 曰 has a 1 颜 = polar body grain produced by the wavelength of light is _ to; 9, = please adjust the brightness and partition point described in the seventh paragraph of the patent range :: Light-emitting diode package structure, wherein the above-mentioned at least: the first color temperature generated is less than or greater than the second type generated by the first to the first group of sigma rays. 1〇:= please "Scope 7th item Adjustable; bright 1 light-emitting diode structure, wherein the above-mentioned "first%" 边框-shaped frame colloid and the above 2 (four) into - concentric circles, and the above at least 41 ^ =:: set, the at least - first - wraparound The border colloid should be on; the second wrap-around frame between the colloids, and the 乂 乂 & 亮 亮 亮 亮 亮 亮 亮 亮 亮 亮 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 The frame colloid is a camping colloid, and: to the =, 21/23 two wraparound frame colloid is a fluorescent colloid or a reflective colloid. 2 = The light-receiving light-emitting diode package structure of the adjustable brightness and the partition point-light source according to Item 7 of the patent application scope, wherein the upper surface of the at least 2-way surround frame colloid is a circular arc shape, the above The angle of the first-wrap-around frame colloid relative to the tangential line of the surface arc of the substrate body is between 4 〇 and 50 degrees; the upper surface of the at least-wrap-around frame colloid has a circular arc shape, and the at least one frame The winning body is cut relative to the arc of the upper surface of the substrate body, and the angle of the surface is between 40 and 50 degrees. , a light-mixing light-emitting diode package structure capable of adjusting brightness and partitioning light source, comprising: a substrate single 7G ′ having an upper surface having at least four power input inputs, •, a unit having at least one for generating a color temperature of the first light module and at least one of the second color temperature generations of the second color: and wherein the at least one of the first light emitting modules has a plurality of electricity on the substrate unit and is electrically connected to two of the power sources a first light-emitting diode die of the pad, and the at least one first-light-emitting module has a plurality of electrodes electrically disposed on the substrate unit and electrically connected to the other two power source welding H-light emitting diodes曰 曰 , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , The first light-emitting module is configured to form at least one first colloidal limit space above the single-sided substrate, and the at least one second tight-wound frame surrounds the at least-second light-emitting module and the I 22/23 to noisy The first wraparound side cabinet colloidal substrate unit is located above and at least: at least - located between the body and the at least one first core wraparound frame colloidal limit space Γ and the H-cut body 1= The light-emitting module and the at least-second (four) light-transmissive encapsulant and at least the first-permeable encapsulation colloid are respectively formed on the upper surface of the substrate unit, wherein the at least one - first (four) limit seal = less body - second glue 4 4 = = 13 items of adjustable brightness and partition less one second:: moxibustion light-polar package structure 'where the above-mentioned to the colloid is arranged - Concentric rounded sides with two wraparound sides. : Γ 胶 colloid and the above at least - the first colloid is fluorescing ‘:: the border is fluorescent or reflective. Brother one "style border wins 23/23