M398107 五、新型說明： 【新型所屬之技術領域】 本創作涉及-種冷冰裝置，尤指一種散熱板配合 晶片且散熱板内部設有散熱片的晶片式冷;東裝置。 【先前技術】 現有小冰箱的冷凍方式是將致冷晶片置於冰箱 部，致冷晶片具有冷端以及熱端並連接電源，於致冷 的冷端結合導冷裝[又於致冷晶片的熱端結合水冷 熱交換器，借此於冰箱的内部進行熱交換，降低小冰 部空間的溫度，達到冷藏飲料或者食物的效果。 前述致冷晶片雖配合水冷的冷卻裝置能夠達到冷 效果’但現有水冷式的&交換器由於工作流體流動時 與散熱板或者散熱管内侧的壁面接觸，因此接觸面積 有效的增大，造成熱交換的散熱效果無法有效地進一 升，令致冷晶片冷端的降溫效果無法有效地發揮。 【新型内容】 致冷 的内 晶片 式的 箱内 凍的 ，僅 無法 步提 現有以致冷晶片配合水冷式熱交換器的冷凍手段 散熱板内工作流體接觸的位置僅為内側的管壁，無法 冷凍的效率。A此，本創作主要目的在於，於致冷晶 合的散熱板内設有多個散熱片 觸面積而能大幅提升冷凍效果的功效。 構造’達到提升工作流 為達到上述目的 包括： 本創作提供一種晶片式冷凍裝 一散熱板 為平板體並且於面積較大的兩面各形 由於 提升 片結 體接 置’ 成一 M398107 散熱面，又於周面相反的方向各形成一入口接頭部以及〜 .出口接頭部，於入口接頭部以及出口接頭部的外端面 吗谷朝 内穿設-人口螺孔以及—出σ ，於該散熱板的内部形 成一連接該入口螺孔以及該出口螺孔的流道，為左右曲折 迂迴的流道形悲，沿該流道延伸的方向，於該流道内間隔 设置複數個散熱片構造，各散熱片構造的兩側延伸至該涪 .道兩側的内壁，並且各以頂、底緣連接於該散熱板頂、底 .部的内壁，於各散熱片構造形成多個間隔且與該流道延伸 ^ 的方向同向延伸的流動間隙； 一致冷晶片組，包括多個致冷晶片，多個致冷晶片分 別具有一冷端以及一熱端，各以熱端結合於該散熱板的其 中—散熱面；以及 一循環構造’設有一具有兩端的循環管路，其以兩端 結合於該入口螺孔以及該出口螺孔，於該循環管路串接一 循環录’又於該循環管路的中間形成一散熱部，於該散熱 部旁設有一風扇’又於該循環管路與該流道内注滿一工作 φ 流體。 進一步，本創作所述散熱板為矩形的板體，所述流道 分為等長的三段，於相鄰兩段的流道之間各形成一彎道 部，所述複數個散熱片構造未設於各彎道部。 更進一步，本創作所述的散熱部為反覆彎折的管體形 狀’於該散熱板的另—散熱面結合另一致冷晶片組，其包 括多個致冷晶片，多個致冷晶片分別具有一冷端以及一熱 端，各以熱端結合於所述的另一散熱面。 本創作使用時’是將散熱板連同致冷晶片組饺鷺於冰 4 M398107 相或者冷凍裝置的空間内，並將各個致冷晶片以及循環泵 電源，§各個致冷晶片作用，降低冰箱或者冷凍裝置 内°卩二間溫度時，熱量會由散熱板的散熱面傳導至散熱板 身X及各個致冷晶片組，此時流動於流道的工作流體Μ 會將熱量帶出散熱板’經過散熱部的冷卻後，再輸入散熱 板内進行循環的熱交換散熱作用。M398107 V. New description: [New technical field] This creation involves a kind of cold ice device, especially a wafer type cold plate with a heat sink and a heat sink inside the heat sink; [Prior Art] The existing small refrigerator is frozen in the refrigerator section, the cold-formed wafer has a cold end and a hot end and is connected to a power supply, and the cold-cooled cold end is combined with a cold-conducting package [also in the cooling of the wafer) The hot end combines with the water-cooled heat exchanger to exchange heat in the interior of the refrigerator to reduce the temperature of the small ice space to achieve the effect of refrigerating beverages or food. Although the above-mentioned refrigerant chip can achieve a cold effect with a water-cooled cooling device, the existing water-cooled & exchanger has an effective contact with the heat sink or the inner wall surface of the heat pipe due to the flow of the working fluid, so that the contact area is effectively increased, resulting in heat. The heat dissipation effect of the exchange cannot be effectively increased by one liter, so that the cooling effect of the cold end of the cold chip cannot be effectively exerted. [New content] The cold inner wafer type box is frozen, and only the existing cold film and the water-cooled heat exchanger are used. The working fluid in the heat sink is only in the inner wall and cannot be frozen. s efficiency. A. The main purpose of this creation is to provide a plurality of fin contact areas in the cooling plate that can significantly improve the freezing effect. The construction 'to achieve the lifting workflow for the above purposes includes: This creation provides a wafer-type refrigerating device with a heat sink as a flat plate and the two sides of the larger area are connected by the lifting piece to form a M398107 heat dissipating surface, and An inlet joint portion and an outlet joint portion are formed in opposite directions of the circumferential surface, and the outer end surface of the inlet joint portion and the outlet joint portion are bored inwardly - the population screw hole and the σ are inside the heat dissipation plate. Forming a flow path connecting the inlet screw hole and the outlet screw hole, the flow path of the right and left meandering turns back, in the direction in which the flow path extends, a plurality of fin structures are arranged in the flow channel, and each fin structure is The two sides of the two sides extend to the inner wall of the two sides of the crucible, and the top and bottom edges are respectively connected to the inner wall of the top and bottom portions of the heat dissipating plate, and a plurality of intervals are formed in each fin structure and extend with the flow channel. a flow gap extending in the same direction; a uniform cold wafer set comprising a plurality of refrigerant wafers each having a cold end and a hot end, each coupled to the heat sink at a hot end The heat dissipation surface of the plate and the circulation structure are provided with a circulation pipe having two ends, which are coupled to the inlet screw hole and the outlet screw hole at both ends, and are connected in series in the circulation pipe. A heat dissipating portion is formed in the middle of the circulating pipe, and a fan is disposed beside the heat dissipating portion, and a working φ fluid is filled in the circulating pipe and the flow channel. Further, the heat dissipation plate of the present invention is a rectangular plate body, and the flow channel is divided into three segments of equal length, and a curve portion is formed between the flow channels of the adjacent two segments, and the plurality of heat dissipation fin structures are formed. Not set in each corner. Further, the heat dissipating portion described in the present invention is in the shape of a repeatedly bent tubular body. The other heat dissipating surface of the heat dissipating plate is combined with another refrigerating wafer group, and includes a plurality of refrigerating wafers, and the plurality of refrigerating wafers respectively have A cold end and a hot end are each coupled to the other heat dissipating surface with a hot end. The purpose of this creation is to use the heat sink together with the cooling chip group dumplings in the ice 4 M398107 phase or in the space of the freezer, and to use each of the cooling chips and the circulating pump power supply, § each cooling chip to reduce the refrigerator or freeze When the temperature is between the two temperatures in the device, the heat is transferred from the heat dissipation surface of the heat dissipation plate to the heat dissipation plate body X and the respective cooling chip groups. At this time, the working fluid flowing in the flow channel will carry heat out of the heat dissipation plate. After the cooling of the part, it is input into the heat dissipation plate to perform heat exchange heat dissipation.
本創作的有益效果在於，由於本創作於流道與循環管 :循環的工作流體除了接觸流道周圍的散熱板的内壁，將 政熱面傳導的熱s帶走之外，還能以各個散熱片構造大幅 :加工作流體接觸散熱板的面積，能進一步提升散熱板降 酿的效率’令各個致冷晶片能達到更佳的冷束效果。 【實施方式】 ★本創作提供-種晶片式冷陳裝置，如圖，、圖2所示 的第一較佳貫施例，包括： 一散熱板10，諳夂砉阁q 月> 看圖3至圖5,設有一底板n， 為矩形金屬板體並且於底面报# π低囟形成一散熱面i彳彳，於底板，， 的：面以金屬黏合劑結合—中層框體12，包括一周框⑵、 一所肋條122以及-後肋條123，其中隸121為金屬的 矩形框體’並且以底面έ士八认产』 ^ _ 、，，°。於底板11頂面的周緣，前肋 條1 2 2為橫向日官yg；( 申且見度小於周框121宽度的金屬條，豆 以右端結合於周框121右 J、 人 右内面則半部的中間，又以底面結 5方；底板1 1的頂面，穩力 條23為橫向延伸且寬度小於 周框121覓度的金屬條，发 ^ " U左*而結合於周框1 21左内面 後半部的中間； Π ® 於中層框體1 2的二 以金屬黏合劑結合一頂板1 3， 為與底板1 1同樣大小的矩形金屬板體並且於頂面形成〜 散熱面1 31，頂板1 3以底面的周緣結合於周框1 2 1的了貝 面’又以底面結合前肋條122與後肋條1 23的頂面，於中 層枢體12、底板11與頂板13圍成的内部形成一左右曲 折迁迴的流道14 ’其具有等長的三段，並且於相鄰的兩段 之間各形成一彎道部141 ; 於底板11、周框1 21以及頂板1 3後面的左端部以金 屬黏合劑結合一入口接頭部1 5，為矩形的金屬塊體，於入 口接頭部1 5外端面的中間朝内貫穿周框121形成一入口 螺孔151，以入口螺孔151與流道14的後端相通，又於 底板11、周框1 21以及頂板1 3前面的右端部以金屬黏合 劑結合一出口接頭部16，為矩形的金屬塊體，於出口接頭 部1 6外端面的中間朝内貫穿周框1 21形成一出口螺孔 161，出口螺孔161與流道14的前端相通，當底板11、 中層樞體1 2、頂板1 3、入口接頭部1 5以及出口接頭部16 黏合後’在散熱板1 0表面進行拋光的處理’消除各構造 之間結合的接縫； 分別沿流道14延伸的方向，於流道14内除了彎道部 141以外的部分間隔設置複數個散熱片構造1 7，各散熱片 構造1 7的兩側延伸至流道1 4兩側的中層框體1 2内壁， 並且各散熱片構造1 7的頂、底緣透過金屬黏合劑連接結 合於底板1 1的頂面以及頂板1 3的底面’各散熱片構造1 7 為反覆折曲的金屬片體’於内部形成多個間隔且與流道1 4 延伸的方向同向延伸的流動間隙1 71。 —致冷晶片組2 0，請參看圓1、圖6，包括多個方形 Μ 观 107 的致冷晶片21，多個致冷晶片21分別具有一冷端以及一 熱端’多個致冷晶片21以矩陣排列的形態各以熱端結合 ^散熱板1 0頂部的散熱面1 31。 —循環構造30 ’請參看圖1、圖2以及圖7，設有一 具有兩端的循環管路31 ’其以兩端結合於散熱板彳〇的入 螺孔1 51以及出口螺孔」6 ]，於循環管路31的中間形 JL> 政熱部31 1 ’為反覆彎折的管體形狀，又於循環管路 、1串接一循環泵32，對應散熱部3 ]彳旁設有一風扇33， j風扇33朝散熱部3彳彳吹送達到更加的散熱效果，又於 衣=路31與散熱板1 〇的流道1 4内注滿一工作流體34。 田本創作使用時，如前述第—較佳實施例，是將散熱 、連同致冷晶片組2〇設置於冰箱或者冷凍裝置的空間 内並將各個致冷晶片21以及循環泵32連接電源，當各 冷晶片21作用’降低冰箱或者冷;東裝置内部空間溫 2、’熱夏會由散熱板10的散熱面131傳導至散熱板10 本身以及各個致^s y 0。 7日日片20，此時流動於流道14的工作 流體34會將執吾册山也上 後# …出放熱板10，經過散熱部3”的冷卻 後’再輸入散熱板1〇内 1進仃循％的熱父換散熱作用； 由於本創作於流道14盥 0 Α Ή盾衣g路31循環的工作e 34除了接觸流道 衣的工作抓妝 11圍的政熱板1 〇的内壁，# q I $ 1 1 1、1 31傳導的溆旦册丄 J 1 土，將放熱面 勺·、，、里▼走，達到钕值莫 還能以各個散熱片構造 ‘”、“的效果之外， 板10的面積，因 ^姐34接觸散熱 h 匕進—步提升散熱板1 〇降加 令各個致冷晶片21 At ^皿的效率， .„ , 21月匕達到更佳的冷凍效果。 本創作除前述第一較 佳只％例，僅於散熱板1 〇頂部 7 聊8107 的放熱面131結合致冷晶片組20以外，如圖8、圖9的 第二較佳實施例，亦可於所述散熱板彳〇底部的散熱面1】， 結合另一致冷晶片組20A，提升整體的冷凍效果，另一致 冷晶片組20A包括多個致冷晶片21A，多個致冷晶片21A 分別具有一冷端以及一熱端，個致冷晶片21A以矩陣排列 的形態各以熱端結合於散熱板1 〇底部的散熱面1彳彳；由於 珂述第二較佳實施例其餘的構造以及所能達到的功效與第 一較佳實施例所述相同’故本創作在此不加以贅述。 【圖式簡單說明】 圖1是本創作第一較佳實施例的立體圖。 圖2是本創作第一較佳實施例的示意圖。 圖3是本創作第一較佳實施例散熱板的立體圖。 圖4是本創作第一較佳實施例散熱板的分解圖。 圖5是本創作第一較佳實施例散熱板的剖面圖。 圖6是本創作第一較佳實施例的平面圖。 圖7是本創作第一較佳實施例的剖面圖。 圖8是本創作第二較佳實施例的立體圖。 圖9是本創作第二較佳實施例的側視圖。 【主要元件符號說明】 11底板 1 2中層框體 122前肋條 1 3頂板 1 4流道 1 0散熱板 111散熱面 1 2 1周框 1 2 3後肋條 1 31散熱面 8 M398107The beneficial effect of the present invention is that, due to the creation of the flow channel and the circulation tube: the circulating working fluid not only contacts the inner wall of the heat dissipation plate around the flow channel, but also carries away the heat s conducted by the political heating surface, and can also dissipate heat. The structure of the sheet is large: adding the working fluid to the area of the heat sink can further improve the efficiency of the heat sink, so that each of the cooled wafers can achieve a better cold beam effect. [Embodiment] ★ This creation provides a wafer type cold device, as shown in the figure, the first preferred embodiment shown in Fig. 2, comprising: a heat sink 10, 谙夂砉阁q月> 3 to FIG. 5, a bottom plate n is provided as a rectangular metal plate body and a heat dissipating surface i 囟 is formed on the bottom surface of the π 囟 low surface, and the surface of the bottom plate is combined with a metal adhesive—the middle frame 12, including A one-week frame (2), a rib 122, and a rear rib 123, wherein the 121 is a metal rectangular frame 'and is recognized by the bottom of the gentleman's 』, _,,, °. On the periphery of the top surface of the bottom plate 11, the front ribs 1 2 2 are transverse yg; (the metal strips having a width less than the width of the square frame 121, the right ends of the beans are joined to the right side of the circumference frame 121, and the right inner side is half. In the middle, the bottom surface is 5 sides; the top surface of the bottom plate 1 1 , the stability strip 23 is a metal strip extending laterally and having a width smaller than the width of the circumference frame 121, and is combined with the peripheral frame 1 21 In the middle of the rear half of the left inner surface; Π ® in the middle frame 12 is combined with a top plate 13 by a metal adhesive, which is a rectangular metal plate of the same size as the bottom plate 1 1 and a heat dissipation surface 1 31 is formed on the top surface. The top plate 13 is joined to the top surface of the front frame rib 122 and the rear rib 1 23 by the peripheral edge of the bottom frame at the periphery of the bottom surface, and is surrounded by the middle layer 12, the bottom plate 11 and the top plate 13 Forming a left and right zigzag-returned flow path 14' having three segments of equal length, and forming a curve portion 141 between adjacent two segments; behind the bottom plate 11, the peripheral frame 121, and the top plate 13 The left end portion is combined with an inlet joint portion 15 by a metal adhesive, and is a rectangular metal block outside the inlet joint portion 15 An inlet screw hole 151 is formed in the middle of the surface, and an inlet screw hole 151 is formed in the middle, and the inlet screw hole 151 communicates with the rear end of the flow channel 14 and is bonded to the right end of the bottom plate 11, the peripheral frame 121 and the front surface of the top plate 13 The agent is combined with an outlet joint portion 16, which is a rectangular metal block. An outlet screw hole 161 is formed in the middle of the outer end surface of the outlet joint portion 116, and the outlet screw hole 161 communicates with the front end of the flow passage 14. After the bottom plate 11, the middle layer body 12, the top plate 13, the inlet joint portion 15 and the outlet joint portion 16 are bonded, 'the surface of the heat sink 10 is polished" to eliminate the joints between the respective structures; In the direction in which the flow path 14 extends, portions of the flow path 14 other than the curved portion 141 are spaced apart from each other to form a plurality of fin structures 17. Both sides of each fin structure 17 extend to the middle layer on both sides of the flow path 14. The inner wall of the frame body 1 2, and the top and bottom edges of each fin structure 17 are joined to the top surface of the bottom plate 1 1 and the bottom surface of the top plate 13 through a metal adhesive. Each heat sink structure 17 is a metal that is repeatedly bent. The sheet body forms a plurality of spaces inside and is extended with the flow channel 14 The direction of the flow gap 71 is extended in the same direction. - Cooling chip set 20, see circle 1, Fig. 6, including a plurality of cooling wafers 21 having a square shape 107, each of which has a cold The end and the hot end 'the plurality of refrigerating wafers 21 are arranged in a matrix, each of which is coupled to the heat dissipating surface 1 31 at the top of the heat dissipating plate 10 by a hot end. - Circulating structure 30', please refer to FIG. 1, FIG. 2 and FIG. A circulation line 31' having two ends is provided, and the screw holes 151 and the outlet screw holes 6 are joined to the heat dissipation plate 两端 at both ends, and the intermediate shape of the circulation line 31 is JL> In order to repeatedly bend the shape of the pipe body, and in the circulation pipeline, 1 in series with a circulating pump 32, a fan 33 is arranged beside the heat dissipating portion 3, and the fan 33 is blown toward the heat radiating portion 3 to achieve a more heat dissipation effect. And a working fluid 34 is filled in the flow channel 14 of the clothing plate 31 and the heat dissipation plate 1 . When the present invention is used, as in the foregoing first preferred embodiment, the heat dissipation, together with the cooling chip set 2, is disposed in the space of the refrigerator or the freezer, and the respective refrigerant chips 21 and the circulation pump 32 are connected to the power source. Each of the cold wafers 21 acts to reduce the refrigerator or the cold; the internal space of the east device is 2, and the hot summer is conducted by the heat radiating surface 131 of the heat radiating plate 10 to the heat radiating plate 10 itself and each of the wires sy 0. On the 7th day of the film 20, at this time, the working fluid 34 flowing in the flow path 14 will be discharged from the heat release plate 10, after being cooled by the heat dissipation portion 3", and then input into the heat dissipation plate 1 Into the 热 的 的 的 热 热 热 % % % % % % % % % % % % % % % % % % % % % % % % % % % % % % % % % % % % % % % % % % % % The inner wall, # q I $ 1 1 1 , 1 31, the transmission of the 溆 丄 丄 丄 J 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 In addition to the effect, the area of the board 10 is improved due to the contact heat dissipation of the sister 34. The step of lifting the heat sink 1 reduces the efficiency of each of the chilled wafers 21 At, and achieves better freezing in the 21st month. effect. In addition to the first preferred embodiment of the present invention, only the heat radiating surface 131 of the heat sink 1 〇 top 7 Talk 8107 is combined with the cooling chip set 20, as shown in the second preferred embodiment of FIGS. 8 and 9 The cooling surface 1 at the bottom of the heat sink ,, combined with the other chilled wafer set 20A, enhances the overall freezing effect. The other chilled wafer set 20A includes a plurality of chilled wafers 21A, and the plurality of chilled wafers 21A have a cold end and a hot end, a cooling chip 21A is arranged in a matrix arrangement with a heat end bonded to the heat dissipating surface 1 of the bottom of the heat dissipating plate 1; the rest of the structure and the second preferred embodiment are described The achievable effect is the same as that described in the first preferred embodiment, and the present invention will not be described herein. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view of a first preferred embodiment of the present invention. Figure 2 is a schematic illustration of a first preferred embodiment of the present invention. 3 is a perspective view of a heat dissipation plate of the first preferred embodiment of the present invention. 4 is an exploded view of the heat dissipation plate of the first preferred embodiment of the present invention. Figure 5 is a cross-sectional view showing a heat dissipation plate of the first preferred embodiment of the present invention. Figure 6 is a plan view of the first preferred embodiment of the present invention. Figure 7 is a cross-sectional view showing a first preferred embodiment of the present invention. Figure 8 is a perspective view of a second preferred embodiment of the present invention. Figure 9 is a side elevational view of a second preferred embodiment of the present invention. [Main component symbol description] 11 bottom plate 1 2 middle frame body 122 front rib 1 3 top plate 1 4 flow path 1 0 heat sink 111 heat dissipation surface 1 2 1 week frame 1 2 3 rear rib 1 31 heat dissipation surface 8 M398107
1 41彎道部 151入口螺孔 1 61出口螺孔 171流動間隙 21致冷晶片 31循環管路 32循環泵 34工作流體 2 1 A致冷晶片 1 5入口接頭部 1 6出口接頭部 1 7散熱片構造 20致冷晶片組 30循環構造 31 1散熱部 33風扇 20A致冷晶片組1 41 curve portion 151 inlet screw hole 1 61 outlet screw hole 171 flow gap 21 refrigerant wafer 31 circulation line 32 circulation pump 34 working fluid 2 1 A refrigerant chip 1 5 inlet joint portion 1 6 outlet joint portion 1 7 heat dissipation Sheet construction 20 cold chip set 30 cycle configuration 31 1 heat sink 33 fan 20A cold chip set