M375895 五、新型說明： 【新型所屬之技術領域】 本創作係有關一種光源裝置，特指一種資訊光纖傳輸 技術中所運用之光訊號發射模組。 【先前技術】 利用光纖傳送資訊為一種具多種效益優勢的傳輸技 術’其為利用一包含如雷射二極體（LD，l_aser Diode)元件 之光發射模組經過電光轉換發射光訊號至配置妥善之光纖 線路上’將資訊傳輸到遠方。 在很多光纖通訊技術的運用情況上如長距離，或高速 傳輸，或大操作溫度範圍（如_4(TC〜 + 85°C)，為確保電光轉 換元件之光電元件（如雷射二極體）之光電特性可符合運用 要求，必須使用電致冷器（TEC, Thermal Electric Cooler) 對光電元件降溫或昇溫’使其穩定於特定溫度。如美國專 利號US4803689及日本專利號」ρ2〇〇2-〇94171兩案中所 .揭示之光訊號發射模組，其為利用蝴蝶式構裝（Butterf|y package)作為組裝主軸技術之光發射模組，及美國專利號 US7037001B2、US7118292B2 與 US7263112B2 等三案中 所揭示之利用同軸式構裝（Coaxial package)作為組裝主軸 技術之光發射模組。 然而此兩類之組裝技術於實施應用上各有其問題。蝴 蝶式構裝在光電及散熱特性上可達優越表現，但其體積過 大無法使用於趨於縮小化之光傳接模組（〇ptica| MJ/5895 transceiver)内，且其材料與製造成本較高。同軸式構裝可 滿足Μ小化及降低成本之要求，但上述幾種及其他習知之 同軸式構裝有不易進行高速傳輸（如]QGb/s)及散熱較差之 問題。 … 上述既有專利資料所示之同軸式構裝技術作法中，高 頻接腳穿設於基板正、反面之間作為高頻電信號自模組外 導入到光電光件之線路。此高頻接腳與在基座之穿設一般 ‘必須考慮高頻效應與阻抗匹配。❼自光電元件到高頻接腳 • 之引線連接需越短越好以避免對高頻響應之干擾。基本上 上述之同軸式構裝技術作法，在這方面都有此高頻特性不 易優化的問題。 另一方面，上述之同軸式構裝技術作法之散熱路徑都 必須經過模組外殼再導熱到光傳接模組外殼。由於此類光 源模組之構裝常需要以雷射焊接方式做精密固定，故其可 選用之材料往往非良好熱導材值，不像蝴蝶式構裝使用高 • 導熱材值底板直接散熱到光傳接模組外殼，故上述之同軸 式構裂技術作法大致都有散熱較差之問題，此亦限制雷射 --一極體之最終出光功率。 【新型内容】 為解決上述之現有技術不足之處，本創作目的在提供 一種於構造上改良的光源裝置，以期克服現有技術中之難 處。 為達上述之目的，本創作係提供一種光訊號發射模 組’其包括： ' M375895 一基座（header)，其為一板體（非導電材質如三氧化二 鋁）’基座上貫穿設有一容孔，且容孔周圍設有複數電訊接 點或接腳及至少一高頻傳輸線或接腳，且基座背面設有一 分裂式可撓電路板（Split Flexible Printed Circuit - FPC)，其連接基座上之接腳至外部光傳接模組之 電路板，將與高頻有關之接腳連接部分做分裂式設計，以 大幅降低其他一般電訊接腳對高頻傳輸性能的干擾； 一導熱板’其設於基座之底面’且對應封閉基座之容 孔並與容孔配合形成一容納空間，且該導熱板為高散熱材 質； 一散熱件（heat sink)，其為高熱傳導材質所製，且其 固定於導熱板之底面以提供散熱功能； 一電致冷器（TEC) ’其為一藉pe|tjer效應通電流而作 為加溫、冷卻用途之裝置’對應設於基座之容孔與導熱板 所包圍之容納空間内； 一光發訊組件，其對應設於電致冷器（TEC)上端，且其 包括一元件承座（com ponent submount)，其中負責電/光轉 換發訊元件（如雷射二極體）及其他配合元件配置於元件承 座上。光發訊組件配設有數條引線對應連接於基座之電訊 接腳及高頻接腳上； 一包覆殼組件’其設於基座之上表面，且包覆並保護 光發訊組件。 而本創作之光源裝置除了具有電/光轉換而將電訊轉 換為光訊號以透過光纖作傳輸之功能外，其因為將光發訊 6 M375895 組件埋設於基座之容孔中，因此直接地縮短了光發訊組件 之兀件與基座接點平面間之高度差，如此一來元件與高頻 接腳間之引線長度可得到有效縮短，再者因本創作之基座 向頻傳輸線與接腳之設計，再配合設計分裂式可撓電路 板，故可讓本創作適合於高頻傳輸資料之操作 再者’本創作中因為將光發訊組件搭配應用之電致冷 器（TEC)埋設於基座之容孔中，並於容孔底面設有高導熱效 率之導熱板，且再進一步於導熱板下設以散熱件，較之現 鲁有技術之光訊號發射裝置而言，其因為具有最短的導熱路 控，故可以提供一種十分創新且效率極高之散熱手段，散 熱完全無須透過不鏽鋼或其他材質之套殼，將可期大幅改 善邊技術領域之散熱問題，而隨著該導熱技術手段所帶來 之優勢，本創作搭配應用之電致冷器（TEC)之性能與功率需 求將可以大幅地降低，對於整體之生產成本降低以及成品 耗電率皆有很好之效盈。故可預期本創作將因為結構上之 • 創新而可透過較低廉之生產成本達到高效能之產品製作。 【實施方式】 * 為利貝番查委員瞭解本創作之創作特徵、内容與優點 及其所能達成之功效，茲將本創作配合附圖，並以實施例 之表達形式詳細說明如下，而其中所使用之圖式，其主旨 僅為示意及輔助說明書之用，未必為本創作實施後之真實 比例與精準配置，故不應就所附之圖式的比例與配置關係 侷限本創作於實際實施上的專利範圍，合先敘明。 請配合參看第-至三圖所示，本創作光源裝置於一較 M375895 佳之貫施方式中可包括有一基座（1〇)、一導熱板（2〇)、一散 熱件（30)、一電致冷器（TEC)(4〇)、一光發訊組件（5〇)及一 包覆殼組件（6 0)。 則述之基座（1 0)可為任何幾何形式，其上貫穿設有一 谷孔（1 1 )，且谷孔（1 1)周圍設有複數支電訊接腳（1 2)及一或 者兩支高頻接腳（1 3)，而本說明書中係以一四邊型板體之 基座（10)及一支高頻接腳（13)作為實例說明，且基座（10) 可為陶瓷材料所製，此外，基座（10)背面進一步設有一分 裂式可撓電路板（FPC, Flexible Printed Circmt)(14)以供 將本創作連接至使用本創作之光傳接模組之訊號電路板 (90)之連接端上（請進一步配合參看第六至八圖所示），其中 4分裂式可撓電路板（14)連接於電訊接腳（12)與高頻接腳 (13)上，且於板體結構上於根部處分割為三分離之片體且 呈現彎曲弧面，藉此可加強與接腳（1 2)(1 3)間之連接強度， 以於組裝後不易因外力而產生連接鬆弛、脫落等不良變 因，但又能綠保尚頻信號在高頻接腳（1 3)與分裂式可撓電 路板（14)上的傳輸處於優化的效果。 刖述之導熱板（20)貼合固定於基座（1〇)之底面，且對應 封閉基座（10)之容孔（1 1)以與容孔（11)配合形成一容納空 間’且遠導熱板（2 0)為尚散熱材質，例如銅翻合士。 前述之散熱件（Heat sink)(30)為高熱傳導材質所製， 其連接固定於導熱板（20)之底面以提供散熱功能。 前述之電致冷器（40)為一可藉Pemer效應通電流而作 為加溫、冷卻用之裝置，其對應設於基座（1〇)之容孔（11) M375895 與導熱板（20)所包圍之容納空間内，且貼靠配置於導熱板 (20)之上。 ' 請進一步配合參看第四及第五圖所示，此、+. W不别述之光發訊 組件（50)對應設於電致冷器（40)上，且兑治& "巴枯一元件承座 (component SUbm〇Unt)(51)’該元件承座（51)對應設於電 致冷器（40)之上端以為相關元件組合之旯雄， 、 , 土庀，儿光發訊組 -.件（5〇)上配設有數條引線（511)，該些引線（511)對應連接於 -基座（1〇)之電訊接腳（12)及高頻接腳（13)上，且光發訊組件 • (50)進一步包括有光發訊元件（如雷射二極體）、反射鏡、光 感二極體（Photo diode)等等光電轉換發訊與感測監控元 件’該些元件配置於元件承座（51)上，然其中諸光電轉換 發訊元件之配置方式可視為該技術領域中具有通常知識者 所熟知且可輕易替換、應用之技術手段，且非本創作之創 作精髓所在，故不於此就該部分細節多加贅述，惟不論光 發訊組件（50)中之各光電轉換發訊元件如何配置，舉凡搭 φ 配應用本創作之揭露技術者，皆應屬本創作之創作範圍所 ' 涵蓋。 ， 前述之包覆殼組件（60)設於基座（1〇)之上表面，且包覆 並保護光發訊組件（50)，其中包覆殼組件（6〇)可進一步包含 一套殼（61)及一光發射端（62)，其中套殼（61)内部具有容納 空間，且藉此容納空間罩設於基座（1〇)上表面，對應包覆 光發訊組件（50)，且光發射端（62)固定設於套殼（61)之一端 且對應與光發訊組件（50)進行光耦合以將經電/光轉換後之 光訊號輸出至配置妥善之光纖線路上。 M375895 本創作之光源裝置除了具有電/光轉換而將電訊號轉 換為光訊號以透過光纖作傳輸之功能外，其因為將光發訊 且件（50)搭配應用之電致冷器（TEC)(4〇)埋設於基座（1〇) 之容礼（11)中，因此直接地縮短了光發訊組件（50)之元件承 座（51)與基座（10)接腳點平面間之高度差，如此一來光發訊 組件（50)與高頻接腳（13)間之引線（511)長度可得到有效縮 短，再配合分裂式可撓電路板（14)之設計將可令本創作適 合於高頻傳輸資料之操作。 ，本創作於容孔（11)底面端設有高導熱效率之丨 熱板（2〇)，且再進一步於導熱板（2〇)下設以散熱件（30)’ I 之現有技術之同軸式構裝裝置而言，其因為具有最师 熱路位，故可以提供一種十分創新且效率極高之散熱」 段’散熱完全無須透過不鑛鋼或其他材質之套殼（61)，弟 可誠幅改善該技術領域之散熱問L著該導熱技# 手&所π來之優勢’本創作搭配應用之電致冷器（4〇)之^ 能與功率需求將可以大幅地降低，對於整體之生產成本降 低以及成品耗電率tb右 2 有很好之效並。故可預期本-創作將因 …上之創新而制可與_式構資 輸與散熱效果，卻且旧…姑 〜貞貝㈣ 除後者不易作言頻:： 產成本優勢而消 — 间頻負訊傳輸與散熱較差之劣勢。 •已：：上述可知，本創作在突破先前之技術結構下，確 :及再：欲增進之功效’且也非熟悉該項技藝者所易於 ;用二:’本劍作申請前未曾公開，其所具之進步性： 、 _符合創作專叙申請要件，爰依法提出創作 10 M375895 申明，懇凊.貴局核准本件創作專利申請案，以勵創作，至 感德便。 斤义之實施例僅係為說明本創作之技術思想及特 點、，其目的在使熟習此項技藝之人士能夠瞭解本創作之内M375895 V. New Description: [New Technology Field] This creation is about a light source device, especially an optical signal transmission module used in information fiber transmission technology. [Prior Art] The use of optical fiber to transmit information is a multi-efficiency transmission technology. It uses a light-emitting module including a laser diode (LD, l_aser Diode) component to transmit optical signals through electro-optical conversion to a properly configured configuration. On the fiber line, 'transmit information to a distant place. In many fiber optic communication technologies, such as long distance, high speed transmission, or large operating temperature range (such as _4 (TC ~ + 85 ° C), to ensure the optoelectronic components of the electro-optical conversion components (such as laser diodes) The photoelectric characteristics of the device can meet the application requirements, and the electric cooler (TEC, Thermal Electric Cooler) must be used to cool or warm the photovoltaic element to make it stable to a specific temperature. For example, U.S. Patent No. 4,083,689 and Japanese Patent No. ρ2〇〇2 - 〇94171, in the case of the optical signal transmitting module, which is a light-emitting module using a butterfly-type package (Butterf|y package) as an assembly spindle technology, and US Patent Nos. US7037001B2, US7118292B2 and US7263112B2, etc. The Coaxial package disclosed in the present invention is used as a light-emitting module for assembling a spindle technology. However, the two types of assembly techniques have their own problems in implementation and application. The butterfly-type assembly is on the photoelectric and heat-dissipating characteristics. Excellent performance, but its size is too large to be used in the optical transmission module (〇ptica| MJ/5895 transceiver) which tends to be reduced, and its material and manufacturing cost The coaxial structure can meet the requirements of miniaturization and cost reduction, but the above-mentioned several and other conventional coaxial structures are difficult to carry out high-speed transmission (such as QGb/s) and poor heat dissipation. In the coaxial structure technology method shown in the prior patent data, the high-frequency pin is disposed between the front and back sides of the substrate as a high-frequency electric signal from the outside of the module to the line of the optoelectronic member. In general, it must be considered for high-frequency effects and impedance matching. The connection from the optoelectronic component to the high-frequency pin should be as short as possible to avoid interference with high-frequency response. Basically the above-mentioned coaxial In the aspect of the structure, the high-frequency characteristics are difficult to optimize. On the other hand, the heat dissipation path of the above-mentioned coaxial structure technology must be thermally conducted through the module housing to the optical transmission module housing. Since the construction of such a light source module often requires precision soldering by means of laser welding, the materials that can be used are often not of good thermal conductivity value, unlike the butterfly construction, which is high in use. The above-mentioned coaxial structure cracking technique generally has the problem of poor heat dissipation, which also limits the final light output power of the laser--one body. [New content] In order to solve the above-mentioned prior art Insufficient, the purpose of the present invention is to provide a light source device with improved structure in order to overcome the difficulties in the prior art. For the above purpose, the present invention provides an optical signal transmitting module which includes: 'M375895-based a header, which is a plate body (non-conductive material such as aluminum oxide). A through hole is formed in the base, and a plurality of telecommunication contacts or pins and at least one high frequency transmission line are arranged around the hole or The pin is provided with a split flexible printed circuit (FPC) on the back of the base, which connects the pin on the base to the circuit board of the external optical transmission module, and is connected to the high frequency. The foot connection portion is split-type to greatly reduce the interference of other general telecommunication pins on high-frequency transmission performance; a heat-conducting plate 'is disposed on the bottom surface of the base' and corresponds to the hole of the closed base and The hole is formed to form a receiving space, and the heat conducting plate is a high heat dissipating material; a heat sink is made of a high heat conductive material, and is fixed on the bottom surface of the heat conducting plate to provide a heat dissipating function; (TEC) 'It is a device for heating and cooling by the pe|tjer effect current' corresponding to the receiving space surrounded by the hole and the heat conducting plate of the base; a light transmitting component, Corresponding to the upper end of the electric cooler (TEC), and including a component ponent submount, wherein the electric/optical conversion transmitting component (such as a laser diode) and other mating components are disposed in the component bearing On the seat. The light emitting component is provided with a plurality of leads corresponding to the telecommunications pins and the high frequency pins of the base; a cladding component ' is disposed on the upper surface of the base and covers and protects the optical signal transmitting component. In addition to the function of converting the telecommunication to the optical signal for transmission through the optical fiber, the light source device of the present invention directly reduces the optical signal 6 M375895 component in the hole of the base. The height difference between the component of the light-transmitting component and the plane of the pedestal of the pedestal is such that the length of the lead between the component and the high-frequency pin can be effectively shortened, and the pedestal to the frequency transmission line is connected The design of the foot, together with the design of the split flexible circuit board, makes this creation suitable for the operation of high-frequency transmission of data. In this creation, the electric cooler (TEC) is used in conjunction with the application of the light-emitting component. In the hole of the pedestal, a heat conducting plate with high thermal conductivity is arranged on the bottom surface of the hole, and further, a heat sink is disposed under the heat conducting plate, compared with the conventional optical signal emitting device, With the shortest heat conduction path, it can provide a very innovative and extremely efficient heat dissipation method. The heat dissipation does not need to pass through the casing of stainless steel or other materials, which will greatly improve the heat dissipation in the technical field. With the advantages brought by the thermal conduction technology, the performance and power requirements of the electric cooler (TEC) with this application can be greatly reduced, and the overall production cost is reduced and the finished product power consumption rate is There is a good effect. Therefore, it is expected that this creation will achieve high-performance product production through low-cost production costs due to structural innovation. [Embodiment] * For the Libefancha members to understand the creative features, contents and advantages of the creation and the effects they can achieve, the author will cooperate with the drawings and explain the following in the form of the examples, and The schematics used are for the purpose of illustration and supplementary instructions. They are not necessarily true proportions and precise configurations after the implementation of the creation. Therefore, the proportions and configuration relationships of the attached drawings should not be limited. The scope of the patents above is described in advance. Please refer to the first to third figures. The light source device can include a base (1〇), a heat conducting plate (2〇), a heat sink (30), and a better one. An electric cooler (TEC) (4 〇), a light transmitting component (5 〇), and a cladding shell assembly (60). The pedestal (10) can be any geometric form, and a valley hole (1 1 ) is disposed therethrough, and a plurality of telecommunications pins (1 2) and one or two are arranged around the valley hole (11). A high-frequency pin (1 3) is used, and in this specification, a base (10) of a quadrilateral plate body and a high-frequency pin (13) are taken as an example, and the base (10) can be The ceramic substrate is further provided with a flexible printed circuit board (FPC) (14) for connecting the creation to the optical transmission module using the present invention. The connection end of the circuit board (90) (please refer to the sixth to eighth figures further), wherein the 4-split flexible circuit board (14) is connected to the telecommunication pin (12) and the high frequency pin (13) And on the plate body structure is divided into three separate pieces at the root portion and presents a curved curved surface, thereby strengthening the connection strength with the pins (1 2) (13), so as to be difficult to assemble after assembly External force causes loose connection, looseness, etc., but it can transmit the green frequency signal on the high-frequency pin (1 3) and the split flexible circuit board (14). In optimization. The heat conducting plate (20) is attached to the bottom surface of the base (1), and corresponds to the hole (1 1) of the closed base (10) to cooperate with the hole (11) to form a receiving space' The far heat conduction plate (20) is a heat-dissipating material, such as a copper flipper. The aforementioned heat sink (30) is made of a highly heat conductive material, and is connected and fixed to the bottom surface of the heat conducting plate (20) to provide a heat dissipating function. The electric refrigerator (40) is a device for heating and cooling by the Pemer effect, and is corresponding to the hole (11) of the base (1) M375895 and the heat conducting plate (20). The enclosed space is disposed on the heat conducting plate (20). Please refer to the fourth and fifth figures for further cooperation. The light transmission component (50) of the +. W is not provided on the electric cooler (40), and it is treated with &" Component SUbm〇Unt (51) 'The component holder (51) is correspondingly disposed on the upper end of the electric cooler (40) to be the relevant component combination of the male, the, the bandits, the children's hair A plurality of leads (511) are arranged on the device group (5), and the lead wires (511) are correspondingly connected to the telecommunication pin (12) and the high frequency pin (13) of the base (1). The optical signal transmission component (50) further includes a photoelectric conversion component (such as a laser diode), a mirror, a photo diode, and the like, and photoelectric conversion signaling and sensing monitoring components. The components are disposed on the component holder (51). However, the configuration of the photoelectric conversion transmitting components can be regarded as a technical means well known to those skilled in the art and can be easily replaced and applied, and is not The essence of the creation of the creation, so it is not to mention this part of the details, but regardless of the optical signal transmission component (50) in each photoelectric conversion How to configure the element, with application of the present Jufan take φ Creation art that disclosure, also belong to the scope of the creation of the creation 'covered. The foregoing cladding shell assembly (60) is disposed on the upper surface of the base and covers and protects the light signaling component (50), wherein the cladding shell assembly (6〇) may further comprise a set of shells (61) and a light emitting end (62), wherein the casing (61) has a receiving space therein, and the receiving space is disposed on the upper surface of the base (1〇), corresponding to the light-emitting component (50) And the light emitting end (62) is fixedly disposed at one end of the casing (61) and optically coupled to the optical transmitting component (50) to output the electrically/optically converted optical signal to the properly configured optical fiber line. . M375895 In addition to the electrical/optical conversion, the light source device converts the electrical signal into an optical signal for transmission through the optical fiber. The electric cooler (TEC) is used for the light transmission and the component (50). (4〇) is embedded in the pedestal (11) of the pedestal (1〇), thus directly shortening the plane between the component holder (51) and the pedestal (10) of the light transmitting component (50) The height difference is such that the length of the lead (511) between the optical transmitting component (50) and the high-frequency pin (13) can be effectively shortened, and the design of the split flexible circuit board (14) can be This creation is suitable for the operation of transmitting data at high frequencies. The present invention is provided with a heat-conducting plate (2〇) having a high thermal conductivity at the bottom end of the hole (11), and further a coaxial structure of the prior art with a heat dissipating member (30)' I under the heat conducting plate (2〇) As far as the structure is installed, it can provide a very innovative and highly efficient heat dissipation because it has the most hot position." The heat dissipation of the segment does not need to pass through the casing of non-mineral steel or other materials (61). Honestly improve the heat dissipation of this technology field. L. The thermal conductivity technology #手& π Advantages 本 The power and power requirements of the electric cooler (4〇) of this creation can be greatly reduced. The overall production cost reduction and the finished product power consumption rate tb right 2 have a good effect. Therefore, it can be expected that this-creation will be based on the innovation of the system and the _-type structure of the transmission and cooling effect, but the old... Gu ~ Mussel (four), in addition to the latter is not easy to make a speech:: cost of production and consumption - inter-frequency negative The disadvantage of poor transmission and heat dissipation. • Already: As mentioned above, this creation breaks through the previous technical structure, and it is: and then: the effect of the desire to improve 'and is not familiar with the artist; 2: 'This sword has not been published before the application, Its progressive nature: _ meets the requirements for the creation of specializations, and proposes the creation of 10 M375895 declarations according to law, 恳凊. You have approved the creation of this patent application for this article, to encourage creation, to the sense of virtue. The embodiment of Jinyi is only for explaining the technical ideas and characteristics of this creation, and its purpose is to enable those who are familiar with the art to understand the creation.
谷並據以實施，當不能以$ Jjp A A 此以之限疋本創作之專利範圍’即大 凡依本創作所揭示之精神所作 望扁太名勺4變化或修飾’仍應涵 盍在本創作之專利範圍内。 . 【圖式簡單說明】According to the implementation of the valley, when it is not possible to use the $ Jjp AA to limit the scope of the patent creation of this creation, that is, the change or modification of the "sense of the sacred name" in the spirit revealed by this creation should still be included in this creation. Within the scope of the patent. [Simplified illustration]
第一圖為本創作之外觀圖。 第二圖為本創作之外觀分解圖。 第三圖為本創作之側視剖面圖。 第四圖為本創作之局部外觀圖。 第五圖為本創作之局部外觀分解圖。 第六至八圖為本創作之應用實施例圖。 【主要元件符號說明】 基座（10) 容孔 電訊接腳（12) 高頻接腳（13) 分裂式可撓電路板（14) 導熱板（20) 散熱件（30) 電致冷器（40) 雷射二極體組件光發訊組件（50) M375895 元件承座（51) 引線（511) 包覆殼組件（60) 套殼（61) 光發射端（62) 訊號電路板（9 0)The first picture is the appearance of the creation. The second picture is an exploded view of the creation of the creation. The third picture is a side cross-sectional view of the creation. The fourth picture is a partial appearance of the creation. The fifth picture is an exploded view of the partial appearance of the creation. The sixth to eighth figures are diagrams of application examples of the creation. [Main component symbol description] Base (10) Hole telecommunications pin (12) High frequency pin (13) Split flexible circuit board (14) Thermal plate (20) Heat sink (30) Electric cooler ( 40) Laser diode component optical transmitter component (50) M375895 component holder (51) lead (511) cladding shell assembly (60) housing (61) light emitting end (62) signal board (9 0 )